CN211957624U - SMD diode chip that restraines in twinkling of an eye that heat dissipation is good - Google Patents
SMD diode chip that restraines in twinkling of an eye that heat dissipation is good Download PDFInfo
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- CN211957624U CN211957624U CN202020671892.9U CN202020671892U CN211957624U CN 211957624 U CN211957624 U CN 211957624U CN 202020671892 U CN202020671892 U CN 202020671892U CN 211957624 U CN211957624 U CN 211957624U
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Abstract
The utility model relates to a SMD instantaneous suppression diode chip with good heat dissipation, which comprises a substrate frame, wherein a heat dissipation part is glued at the middle position of the top of the substrate frame, the front side and the back side of the heat dissipation part are connected with heat dissipation fins, the top of the heat dissipation part is glued with a chip, the left side and the right side of the heat dissipation part are provided with fixing devices, a pressing plate is connected between the fixing devices, the pressing plate is arranged above the chip, the bottom of the pressing plate is fixedly connected with a compression resistant part, the bottom of the compression resistant part is tightly pressed on the chip, the utility model is provided with the heat dissipation fins, heat generated when the chip operates is transmitted through the heat dissipation part, then the heat dissipation is carried out through the heat dissipation fins, the heat dissipation of the chip can be facilitated, the service life of the chip is prolonged, the chip, can prevent to cause the damage to the chip when touching the clamp plate, protect the chip.
Description
Technical Field
The utility model relates to a SMD diode chip that restraines in twinkling of an eye that the heat dissipation is good belongs to chip technical field.
Background
The chip, also called microcircuit, microchip, integrated circuit, mean the silicon chip containing integrated circuit, the volume is very small, often a part of the computer or other electronic equipment, the chip is the general name of the semiconductor component product, it is the carrier of the integrated circuit, the existing chip with chip-type instant suppression diode generally adopts the adhesive fixation, this kind of fixation mode is not firm, the contact that is apt to happen between diode and the chip is not real, and the existing chip with chip-type instant suppression diode has high heat generating rate, the working time is a long time and produces a large amount of heat to cause the influence to the normal work of the chip.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a SMD that dispel heat restraines diode chip in twinkling of an eye, through being equipped with radiating fin, the heat that produces when the chip moves transmits through the radiating piece, then dispels the heat through radiating fin, the heat dissipation of chip of can being convenient for, improve the life of chip, through being equipped with the clamp plate, fix the chip, be equipped with the compression resistant spare between clamp plate and the chip simultaneously, can prevent to cause the damage to the chip when touching the clamp plate, protect the chip, in order to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a good SMD diode chip that restraines in twinkling of an eye that dispels heat, includes the base plate frame, the top intermediate position of base plate frame is glued there is the radiating piece, both sides are connected with radiating fin around the radiating piece, the top of radiating piece is glued there is the chip, the left and right sides of radiating piece is equipped with fixing device, be connected with the clamp plate between the fixing device, the top at the chip is established to the clamp plate, the bottom fixedly connected with compression resistant piece of clamp plate, the bottom of compression resistant piece compresses tightly on the chip, the louvre has been seted up to the top intermediate position of clamp plate, there is the diode that restraines in the twinkling of an eye through the pin connection on the chip, the diode that restraine.
Further, a heat dissipation piece placing groove is formed in the top of the substrate frame, and the heat dissipation piece is installed in the heat dissipation piece placing groove.
Furthermore, the fixing device comprises a vertical plate, a transverse plate and a fastening screw, the vertical plate is vertically connected and glued to the top of the base plate frame, the transverse plate is glued to the top of the vertical plate and is parallel to the base plate frame, and the fastening screw is in threaded connection with the transverse plate.
Furthermore, threaded holes are formed in the transverse plate, and the fastening screws are connected to the transverse plate through the threaded holes in a threaded mode.
Furthermore, the length of the pressing plate is the same as the distance between the fixing devices, and the fastening screws are tightly pressed on the tops of the left end and the right end of the pressing plate.
Furthermore, the compression resistant part is Z-shaped, the bottom of the compression resistant part is connected with a rubber pad, and the rubber pad is arranged between the compression resistant part and the chip.
The utility model has the advantages that:
1. by arranging the radiating fins, heat generated when the chip operates is transferred through the radiating piece and then radiated through the radiating fins, so that the radiating of the chip can be facilitated, and the service life of the chip is prolonged;
2. through being equipped with the clamp plate, fix the chip, be equipped with the compression resistant piece between clamp plate and the chip simultaneously, can prevent to cause the damage to the chip when touching the clamp plate, protect the chip.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic view of the overall structure of a chip of the instant suppression diode of the present invention with good heat dissipation;
fig. 2 is a side view of a chip of the present invention with good heat dissipation and instant suppression;
fig. 3 is a schematic structural view of the fixing device for a chip-on-chip instant suppressor of the present invention with good heat dissipation;
fig. 4 is a schematic view of a pressure-resistant component of a chip of the instant-suppression diode of the present invention with good heat dissipation;
reference numbers in the figures: 1. a substrate frame; 2. a heat sink; 3. a heat dissipating fin; 4. a chip; 5. a fixing device; 6. pressing a plate; 7. a compression resistant part; 8. heat dissipation holes; 9. a transient suppressor diode; 10. a pin; 11. a vertical plate; 12. a transverse plate; 13. fastening screws; 14. and (7) a rubber pad.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
a surface-mounted instantaneous suppression diode chip with good heat dissipation comprises a substrate frame 1, wherein a heat dissipation part 2 is adhered to the middle position of the top of the substrate frame 1, heat dissipation fins 3 are connected to the front side and the rear side of the heat dissipation part 2, the heat dissipation parts 2 and the heat dissipation fins 3 are made of copper metal, heat generated when the chip 4 runs is transferred through the heat dissipation part 2 and then dissipated through the heat dissipation fins 3, the heat dissipation of the chip 4 can be facilitated, the chip 4 is adhered to the top of the heat dissipation part 2, fixing devices 5 are arranged on the left side and the right side of the heat dissipation part 2, a pressing plate 6 is connected between the fixing devices 5 and fixed through the fixing devices 5, the pressing plate 6 is arranged above the chip 4, a compression-resistant part 7 is fixedly connected to the bottom of the pressing plate 6, the bottom of the compression-resistant part 7 is tightly pressed on the chip, the texture is comparatively soft, receives the extrusion when clamp plate 6, and resistance to compression piece 7 can warp, cushions pressure, can prevent to cause the damage to chip 4 when touching clamp plate 6, protects the chip, louvre 8 has been seted up to the top intermediate position of clamp plate 6, there is suppression diode 9 in the twinkling of an eye through the pin connection on chip 4, it is connected with pin 10 through the lead wire to suppress diode 9 in the twinkling of an eye, pin 10 welds the edge at base plate frame 1.
Specifically, as shown in fig. 1 and 2, a heat dissipation member 2 placing groove is formed in the top of the substrate frame 1, the heat dissipation member 2 is installed in the heat dissipation member 2 placing groove, so that the heat dissipation member 2 is fixed conveniently, the length of the pressing plate 6 is the same as the distance between the fixing devices 5, the fastening screws 13 are tightly pressed on the tops of the left end and the right end of the pressing plate 6, the pressing plate 6 is fixed through the fastening screws 13, and the chip 4 is fixed through the pressing plate 6.
Specifically, as shown in fig. 3, the fixing device 5 includes a vertical plate 11, a horizontal plate 12 and a fastening screw 13, the vertical plate 11 is vertically connected and glued to the top of the substrate frame 1, the horizontal plate 12 is glued to the top of the vertical plate 11 and is parallel to the substrate frame 1, the fastening screw 13 is screwed to the horizontal plate 12, a threaded hole is formed in the horizontal plate 12, the fastening screw 13 is screwed to the horizontal plate 12 through the threaded hole, the fastening screw 13 is moved down by rotating the fastening screw 13, and two ends of the pressing plate 6 are fixed.
Specifically, as shown in fig. 4, the compression resistant member 7 is Z-shaped, the bottom of the compression resistant member 7 is connected with a rubber pad 14, and the rubber pad 14 is arranged between the compression resistant member 7 and the chip 4 to protect the chip 4.
The utility model discloses the theory of operation: the heat that produces when chip 4 moves transmits through radiating piece 2, then dispel the heat through radiating fin 3, the heat dissipation of chip 4 of can being convenient for, when fixing chip 4, fastening screw 13 through fixing device 5 compresses tightly the both ends of clamp plate 6, make the resistance to compression piece 7 of clamp plate 6 bottom compress tightly at the top of chip 4, be convenient for fix chip 4, simultaneously when clamp plate 6 receives the extrusion, resistance to compression piece 7 can warp, cushion pressure, can prevent to cause the damage to chip 4 when touching clamp plate 6, protect the chip, and is convenient and practical.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.
Claims (6)
1. The utility model provides a good SMD diode chip that restraines in twinkling of an eye dispels heat, includes substrate frame (1), its characterized in that: a heat dissipation piece (2) is glued at the middle position of the top of the base plate frame (1), the front side and the rear side of the heat dissipation piece (2) are connected with heat dissipation fins (3), a chip (4) is glued on the top of the heat dissipation piece (2), fixing devices (5) are arranged on the left side and the right side of the heat dissipation piece (2), a pressure plate (6) is connected between the fixing devices (5), the pressure plate (6) is arranged above the chip (4), the bottom of the pressure plate (6) is fixedly connected with a compression resistant piece (7), the bottom of the compression resistant piece (7) is pressed on the chip (4), a heat dissipation hole (8) is arranged in the middle of the top of the pressure plate (6), the chip (4) is connected with an instantaneous suppression diode (9) through a lead, the transient suppression diode (9) is connected with a pin (10) through a lead, and the pin (10) is welded on the edge of the substrate frame (1).
2. The chip of claim 1, wherein the chip comprises: the heat dissipation structure is characterized in that a heat dissipation piece (2) placing groove is formed in the top of the substrate frame (1), and the heat dissipation piece (2) is installed in the heat dissipation piece (2) placing groove.
3. The chip of claim 1, wherein the chip comprises: fixing device (5) include riser (11), diaphragm (12) and fastening screw (13), the top of gluing in base plate frame (1) is connected perpendicularly to riser (11), diaphragm (12) are glued at the top of riser (11) and parallel with base plate frame (1), fastening screw (13) threaded connection is on diaphragm (12).
4. The surface-mounted instantaneous suppression diode chip with good heat dissipation of claim 3, wherein: threaded holes are formed in the transverse plate (12), and the fastening screws (13) are connected to the transverse plate (12) through the threaded holes in a threaded mode.
5. The surface-mounted instantaneous suppression diode chip with good heat dissipation of claim 3, wherein: the length of the pressing plate (6) is the same as the distance between the fixing devices (5), and the fastening screws (13) are tightly pressed on the tops of the left end and the right end of the pressing plate (6).
6. The chip of claim 1, wherein the chip comprises: the compression resistant piece (7) is Z-shaped, the bottom of the compression resistant piece (7) is connected with a rubber pad (14), and the rubber pad (14) is arranged between the compression resistant piece (7) and the chip (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020671892.9U CN211957624U (en) | 2020-04-28 | 2020-04-28 | SMD diode chip that restraines in twinkling of an eye that heat dissipation is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020671892.9U CN211957624U (en) | 2020-04-28 | 2020-04-28 | SMD diode chip that restraines in twinkling of an eye that heat dissipation is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211957624U true CN211957624U (en) | 2020-11-17 |
Family
ID=73162233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020671892.9U Active CN211957624U (en) | 2020-04-28 | 2020-04-28 | SMD diode chip that restraines in twinkling of an eye that heat dissipation is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211957624U (en) |
-
2020
- 2020-04-28 CN CN202020671892.9U patent/CN211957624U/en active Active
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