CN213401118U - Semiconductor wafer detects rotary platform - Google Patents
Semiconductor wafer detects rotary platform Download PDFInfo
- Publication number
- CN213401118U CN213401118U CN202022919035.9U CN202022919035U CN213401118U CN 213401118 U CN213401118 U CN 213401118U CN 202022919035 U CN202022919035 U CN 202022919035U CN 213401118 U CN213401118 U CN 213401118U
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- CN
- China
- Prior art keywords
- semiconductor wafer
- air pump
- rotary platform
- wafer inspection
- bottom plate
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a semiconductor wafer detects rotary platform, including the bottom plate, the top embedding of bottom plate is provided with the revolving stage, and the bottom fixedly connected with connecting axle of revolving stage, the bearing has been cup jointed to the bottom of connecting axle, and the bearing imbeds simultaneously in the bottom plate, and the standing groove has been seted up on the surface of revolving stage, and the negative pressure recess has been seted up to the position placed in the middle of the standing groove, and the inside embedding of revolving stage is provided with first air pump. Be convenient for place semiconductor wafer through the standing groove, the second air pump of cooperation simultaneously makes to be negative pressure state in the negative pressure tank through communicating pipe, adsorbs fixedly to the wafer, carries the air current through first air pump cooperation breather pipe in to the air cushion to make the air cushion inflation, thereby the rubber head that drives the air cushion front end is outstanding, thereby presss from both sides tightly fixedly to the outside position of wafer.
Description
Technical Field
The utility model relates to the field of semiconductor technology, more specifically relates to a semiconductor wafer detects rotary platform.
Background
Wafers are the basic material for manufacturing semiconductor chips, and the most important raw material of semiconductor integrated circuits is silicon, so that the corresponding is silicon wafers.
Various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.
The wafer is positioned on the rotary platform for detection, and the wafer is difficult to be accurately positioned due to different diameters; resulting in an inaccurate detection result.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving because the diameter of wafer is different, be difficult to carry out accurate location to it, lead to the not accurate problem inadequately of testing result, provide a semiconductor wafer detects rotary platform.
In order to achieve the above object, the utility model provides a following technical scheme: a rotary platform for detecting semiconductor wafers comprises a bottom plate, wherein a rotary table is embedded into the top end of the bottom plate, a connecting shaft is fixedly connected to the bottom end of the rotary table, a bearing is sleeved at the bottom end of the connecting shaft and is embedded into the bottom plate, a placing groove is formed in the surface of the rotary table, a negative pressure groove is formed in the middle position of the placing groove, a first air pump is embedded into the rotary table, a vent pipe is fixedly connected to the front end of the first air pump, an air cushion is connected to the front end of the vent pipe in a communicating manner, a rubber head is fixedly connected to the front end of the air cushion, a toothed plate is fixedly connected to the bottom end of the rotary table, a driving motor is embedded into the bottom plate, a toothed plate is arranged at the top end of the driving motor, a shaft body is fixedly connected to, and a second air pump is arranged on one side of the driving motor, and the top end of the second air pump is connected with a communicating pipe.
Further preferred scheme: the rotating platform is arranged in a disc shape, and protrudes by half height to be embedded into the top surface of the bottom plate.
Further preferred scheme: the standing groove wholly is the setting of back taper indent, and both sides set up the outstanding opening of confession rubber head, and the surface of standing groove carries out the spraying plastics simultaneously and handles.
Further preferred scheme: the negative pressure tank is arranged in an inverted trapezoidal tank body and is communicated with the communicating pipe.
Further preferred scheme: the first air pump and the vent pipe are arranged in two groups and are positioned on two sides of the inner side of the placing groove.
Further preferred scheme: the rubber head sets up to the setting of stereoplasm rubber, and the front end transversely imbeds at the standing groove inboard.
Further preferred scheme: the air cushion is the annular setting simultaneously, sets up around the inboard of standing groove, and the pinion rack is the annular setting, and the inboard corresponds the fluted disc structure and sets up outstanding gomphosis tooth.
Further preferred scheme: the fluted disc is the level tiling setting, and the outside sets up convex pinion rack, and the bottom of fluted disc and the axis body of driving motor output are connected simultaneously.
Further preferred scheme: the second air pump and the first air pump are internally provided with matched power supplies and are connected with an external control device.
The utility model provides a semiconductor wafer detects rotary platform has following beneficial effect:
the utility model discloses a, be convenient for place semiconductor wafer through the standing groove, cooperate the second air pump simultaneously, make to be negative pressure state in the negative pressure tank through communicating pipe, adsorb fixedly to the wafer.
The utility model discloses a, carry the air current in to the air cushion through first air pump cooperation breather pipe to make the air cushion inflation, thereby the rubber head that drives the air cushion front end is outstanding, thereby presss from both sides tightly fixedly to the outside position of wafer.
The utility model discloses a, the fluted disc rotates under driving motor's drive, and the fluted disc rotates and the inboard outstanding gomphosis tooth gomphosis of pinion rack to make the pinion rack rotate around the fluted disc, drive the revolving stage and rotate.
The utility model discloses a, through the second air pump, the cooperation is produced the negative pressure in making the negative pressure groove communicating pipe to adsorb fixedly to the wafer.
Drawings
Fig. 1 is a cross-sectional view of the overall structure of the device of the present invention.
Fig. 2 is an enlarged view of the structure at a in fig. 1 of the device of the present invention.
Fig. 3 is an enlarged view of the structure at B in fig. 1 of the device of the present invention.
Fig. 4 is the utility model discloses device pinion rack connection structure sketch map.
In FIGS. 1-4: 1. a base plate; 2. a rotating table; 3. a first air pump; 4. a placement groove; 5. a toothed plate; 6. an auxiliary fluted disc; 7. a bearing; 8. a connecting shaft; 9. a fluted disc; 10. a drive motor; 11. a breather pipe; 12. an air cushion; 13. a rubber head; 14. a negative pressure tank; 15. a communicating pipe; 16. a second air pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to fig. 1-4 of the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b):
please refer to fig. 1 to 4:
the embodiment provides a further preferred scheme of a semiconductor wafer detection rotary platform, which comprises a bottom plate 1, wherein a rotary table 2 is embedded in the top end of the bottom plate 1, a connecting shaft 8 is fixedly connected to the bottom end of the rotary table 2, a bearing 7 is sleeved at the bottom end of the connecting shaft 8, the bearing 7 is embedded in the bottom plate 1 at the same time, a placing groove 4 is formed in the surface of the rotary table 2, a negative pressure groove 14 is formed in the middle position of the placing groove 4, a first air pump 3 is embedded in the rotary table 2, a vent pipe 11 is fixedly connected to the front end of the first air pump 3, an air cushion 12 is connected to the front end of the vent pipe 11, a rubber head 13 is fixedly connected to the front end of the air cushion 12, a toothed plate 5 is fixedly connected to the bottom end of the rotary table 2, a driving motor 10 is embedded in, an auxiliary fluted disc 6 is embedded into one side of the toothed plate 5, a second air pump 16 is arranged on one side of the driving motor 10, and the top end of the second air pump 16 is connected with a communicating pipe 15.
Further, the rotary table 2 is disposed in a disc shape, protruding by a half height and embedded in the top surface of the base plate 1.
Further, standing groove 4 wholly is the back taper indent setting, and both sides set up the outstanding opening that supplies rubber head 13, and the surface of standing groove 4 carries out the spraying plastics simultaneously and handles.
Further, the negative pressure tank 14 is an inverted trapezoidal tank body and is communicated with the communicating pipe 15, the semiconductor wafer is convenient to place through the placing tank 4, the second air pump 16 is matched at the same time, the negative pressure tank 14 is in a negative pressure state through the communicating pipe 15, and the wafer is fixedly adsorbed.
Further, the first air pump 3 and the air pipe 11 are provided in two sets, and are located at two inner sides of the placing groove 4.
Further, rubber head 13 sets up to the setting of hard rubber, and the front end transversely imbeds at the standing groove 4 inboardly, carries the air current through 3 cooperation breather pipes 11 of first air pump to in air cushion 12, thereby make air cushion 12 inflation, thereby it is outstanding to drive the rubber head 13 of air cushion 12 front end, thereby presss from both sides tightly fixedly to the outside position of wafer.
Further, the air cushion 12 is simultaneously annularly arranged and is arranged around the inner side of the placing groove 4, the toothed plate 5 is annularly arranged, and the inner side is provided with protruding embedded teeth corresponding to the toothed plate structure.
Further, fluted disc 9 is the level tiling setting, and the outside sets up convex pinion rack, and the bottom of fluted disc 9 and the shaft body of driving motor 10 output are connected simultaneously, and fluted disc 9 rotates under driving motor 10's drive, and fluted disc 9 rotates and 5 inboard outstanding gomphosis teeth gomphosis of pinion rack to make pinion rack 5 rotate around fluted disc 9, drive revolving stage 2 and rotate.
Further, the second air pump 16 and the first air pump 3 are both internally provided with a matched power supply and connected with an external control device, and negative pressure is generated in the negative pressure tank 14 by the second air pump 16 in a matched communication pipe 15, so that the wafer is adsorbed and fixed.
The working principle is as follows: place semiconductor wafer in standing groove 4, later 16 operations of second air pump, make through communicating pipe 15 and form the negative pressure in standing groove 4, adsorb the wafer, first air pump 3 moves simultaneously, carry the air current in to air cushion 12, air cushion 12 inflation makes the protruding marginal position that contacts the wafer of rubber head 13 of front end, press from both sides tightly fixedly to it, later driving motor 10 rotates, transfer fluted disc 9 and rotate, when fluted disc 9 rotates, rotate simultaneously with the pinion rack 5 of fluted disc 9 gomphosis, fluted disc 9 pivot this moment, make pinion rack 5 rotate around fluted disc 9 all the time, thereby drive revolving stage 2 wholly rotates.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A semiconductor wafer inspection rotary platform, includes bottom plate (1), its characterized in that: the top end of the bottom plate (1) is embedded with a rotating platform (2), the bottom end of the rotating platform (2) is fixedly connected with a connecting shaft (8), a bearing (7) is sleeved at the bottom end of the connecting shaft (8), the bearing (7) is embedded into the bottom plate (1) at the same time, a placing groove (4) is formed in the surface of the rotating platform (2), a negative pressure groove (14) is formed in the middle position of the placing groove (4), a first air pump (3) is embedded into the rotating platform (2), a vent pipe (11) is fixedly connected to the front end of the first air pump (3), an air cushion (12) is connected to the front end of the vent pipe (11), a rubber head (13) is fixedly connected to the front end of the air cushion (12), a toothed plate (5) is fixedly connected to the bottom end of the rotating platform (2), and a driving motor (10), the top of driving motor (10) is provided with fluted disc (9), the top output end fixed connection axis body of driving motor (10), one side embedding of pinion rack (5) is provided with supplementary fluted disc (6), one side of driving motor (10) is provided with second air pump (16), second air pump (16) top is connected with communicating pipe (15).
2. The semiconductor wafer inspection rotary platform of claim 1, wherein: the rotating platform (2) is arranged in a disc shape, protrudes by half height and is embedded into the top surface of the bottom plate (1).
3. The semiconductor wafer inspection rotary platform of claim 1, wherein: the whole standing groove (4) is the setting of back taper indent, and both sides set up the outstanding opening that supplies rubber head (13), and the surface of standing groove (4) carries out the plastic-blasting simultaneously and handles.
4. The semiconductor wafer inspection rotary platform of claim 1, wherein: the negative pressure groove (14) is arranged in an inverted trapezoidal groove body and is communicated with the communicating pipe (15).
5. The semiconductor wafer inspection rotary platform of claim 1, wherein: the first air pump (3) and the air pipe (11) are arranged in two groups and are positioned on two sides of the inner side of the placing groove (4).
6. The semiconductor wafer inspection rotary platform of claim 1, wherein: the rubber head (13) is arranged to be hard rubber, and the front end of the rubber head is transversely embedded into the inner side of the placing groove (4).
7. The semiconductor wafer inspection rotary platform of claim 1, wherein: air cushion (12) are the cyclic annular setting simultaneously, set up around the inboard of standing groove (4), and pinion rack (5) are the cyclic annular setting, and inboard corresponds the fluted disc structure and sets up outstanding gomphosis tooth.
8. The semiconductor wafer inspection rotary platform of claim 1, wherein: fluted disc (9) are the level setting of tiling, and the outside sets up convex pinion rack, and the bottom of fluted disc (9) and the shaft body of driving motor (10) output are connected simultaneously.
9. The semiconductor wafer inspection rotary platform of claim 1, wherein: and the second air pump (16) and the first air pump (3) are internally provided with matched power supplies and are connected with an external control device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022919035.9U CN213401118U (en) | 2020-12-08 | 2020-12-08 | Semiconductor wafer detects rotary platform |
Applications Claiming Priority (1)
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CN202022919035.9U CN213401118U (en) | 2020-12-08 | 2020-12-08 | Semiconductor wafer detects rotary platform |
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CN213401118U true CN213401118U (en) | 2021-06-08 |
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CN202022919035.9U Expired - Fee Related CN213401118U (en) | 2020-12-08 | 2020-12-08 | Semiconductor wafer detects rotary platform |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116117686A (en) * | 2021-11-15 | 2023-05-16 | 成都高真科技有限公司 | Wafer grabbing device, polishing equipment and application |
-
2020
- 2020-12-08 CN CN202022919035.9U patent/CN213401118U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116117686A (en) * | 2021-11-15 | 2023-05-16 | 成都高真科技有限公司 | Wafer grabbing device, polishing equipment and application |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210608 Termination date: 20211208 |
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CF01 | Termination of patent right due to non-payment of annual fee |