CN214771306U - Self-adjusting polishing pressure head - Google Patents
Self-adjusting polishing pressure head Download PDFInfo
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- CN214771306U CN214771306U CN202121197124.5U CN202121197124U CN214771306U CN 214771306 U CN214771306 U CN 214771306U CN 202121197124 U CN202121197124 U CN 202121197124U CN 214771306 U CN214771306 U CN 214771306U
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- pressure head
- clamping ring
- medium plate
- ring
- cab apron
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Abstract
The utility model discloses a self-interacting formula polishing pressure head, including the pressure head, its characterized in that: still cross cab apron, spacing blind rivet, pressure head medium plate, well circle clamping ring, elasticity glued membrane, outer lane clamping ring, inner circle clamping ring and regulation quick connector plug including the pressure head, the pressure head crosses the cab apron and is connected with drive spindle through fastening bolt and packing ring, fastening bolt follows the bottom that the cab apron was crossed to the pressure head upwards passes the packing ring and the pressure head crosses the cab apron through-hole and is connected with drive spindle, pressure head medium plate fixed mounting is in the downside of cab apron is crossed to the pressure head, the downside of pressure head medium plate sets up the elasticity glued membrane, the downside of elasticity glued membrane sets up the pressure head, adjust quick connector plug fixed mounting be in the upside of pressure head medium plate, be used for the elasticity glued membrane fills the gassing. The workpiece is ensured to be closely contacted with the large disc, and the processing precision and the processing efficiency are improved.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing and manufacturing technique and specifically relates to a self-interacting formula polishing pressure head is related to.
Background
The model of polishing pressure head is various, but the polishing pressure head can not adjust machining precision, and the market needs a polishing pressure head that can adjust machining precision urgently, and the problem that prior art exists is: at present, various polishing pressure heads exist in the market, and most polishing pressure heads are not adjustable through one-step assembly molding, so that a lot of uncertainty is increased during processing, the processing effect is not adjustable, and the processed data can be determined only by observing and monitoring visually by people during processing, so that the processing efficiency is reduced.
The utility model discloses an overcome above-mentioned defect, carried out profitable improvement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve the above-mentioned not enough among the prior art, provide a self-interacting formula polishing pressure head.
In order to achieve the above purpose, the present invention adopts the following technical solution.
A self-adjusting polishing pressure head comprises a pressure head and is characterized in that: still cross cab apron, spacing blind rivet, pressure head medium plate, well circle clamping ring, elasticity glued membrane, outer lane clamping ring, inner circle clamping ring and regulation quick connector plug including the pressure head, the pressure head crosses the cab apron and is connected with drive spindle through fastening bolt and packing ring, fastening bolt follows the bottom that the cab apron was crossed to the pressure head upwards passes the packing ring and the pressure head crosses the cab apron through-hole and is connected with drive spindle, pressure head medium plate fixed mounting is in the downside of cab apron is crossed to the pressure head, the downside of pressure head medium plate sets up the elasticity glued membrane, the downside of elasticity glued membrane sets up the pressure head, adjust quick connector plug fixed mounting be in the upside of pressure head medium plate, be used for the elasticity glued membrane fills the gassing.
Further: the lower part of spacing blind rivet runs through pressure head medium plate and fixed mounting be in the upside of mesosphere clamping ring, the mesosphere clamping ring sets up the inboard of pressure head medium plate lower surface, the mesosphere clamping ring passes downwards elasticity glued membrane fixed mounting be in the upper surface of pressure head, the upper portion of spacing blind rivet is located the pressure head passes through the cab apron through-hole and is located fastening bolt's below.
Further: the outer lane clamping ring sets up the inslot of pressure head upper surface outer fringe, just the outer lane clamping ring upwards passes elastic adhesive film fixed mounting be in the lower surface of pressure head medium plate, the inner circle clamping ring sets up the inslot that pressure head upper surface central point put, just the inner circle clamping ring upwards passes elastic adhesive film fixed mounting be in the lower surface of pressure head medium plate.
Further: the self-adjusting polishing pressure head further comprises a quick wafer suction connector, and the quick wafer suction connector penetrates through the inner ring compression ring and is fixedly installed at the center of the pressure head.
Further: four circular grooves used for installing O-shaped rings are formed in the upper surface of the middle plate of the pressure head, and the diameter of the through hole of the limiting rivet is smaller than the inner diameter of each O-shaped ring when the pressure head passes through the transition plate.
Further: spacing blind rivet with adopt clearance fit between the pressure head medium plate, well ring clamping ring with adopt clearance fit between the pressure head medium plate, the inner circle clamping ring with adopt clearance fit between the pressure head.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses an adjust quick connector and aerify the elasticity glued membrane, through inhaling the quick connector of piece to pressure head evacuation absorption work piece, run through pressure head medium plate clearance fit through spacing blind rivet, well circle clamping ring and pressure head medium plate clearance fit, inner circle clamping ring and pressure head clearance fit, pressure head floats in the fine assurance course of working, and the self-interacting is in order to ensure work piece and big dish contact closely, guarantees the machining precision, has improved machining precision and machining efficiency.
2. The utility model discloses a set up pressure head medium plate upper surface and be provided with four circular trench that are used for installing O type circle, the pressure head crosses the aperture that cab apron correspondence placed spacing blind rivet and is less than O type circle internal diameter, when processing begins to aerify the elasticity glued membrane, has played sealed effect.
Drawings
Fig. 1 is a schematic structural diagram provided in the embodiment of the present invention.
Fig. 2 is an exploded view of a structure according to an embodiment of the present invention.
Fig. 3 is an exploded view of a structure provided by an embodiment of the present invention.
Fig. 4 is a structural sectional view provided in the embodiment of the present invention.
In the figure: 1. the device comprises a fastening bolt, 2, a gasket, 3, a pressure head transition plate, 4, a limiting rivet, 5, an O-shaped ring, 6, a pressure head middle plate, 7, a middle ring pressing ring, 8, an elastic adhesive film, 9, an outer ring pressing ring, 10, an inner ring pressing ring, 11, a sheet suction quick connector, 12, a pressure head, 13 and an adjusting quick connector.
Detailed Description
In order to further understand the contents, features and effects of the present invention, the following embodiments are illustrated and described in detail with reference to the accompanying drawings.
The structure of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 4, a self-adjusting polishing indenter provided by an embodiment of the present invention comprises an indenter 12, an indenter transition plate 3, a limit rivet 4, an indenter middle plate 6, a middle ring press ring 7, an elastic glue film 8, an outer ring press ring 9, an inner ring press ring 10, an adjusting quick-connect plug 13 and a suction piece quick-connect plug 11, wherein the fastening bolt 1 is used in cooperation with the washer 2 to mount a driving spindle from the bottom of the indenter transition plate 3 upwards, the adjusting quick-connect plug 13 is fixedly mounted on the upper side of the indenter middle plate 6, the indenter middle plate 6 is fixedly mounted on the lower surface of the indenter transition plate 3, the upper side of the limit rivet 4 is arranged on the inner side of the indenter transition plate, the fastening bolt 1 is arranged on the lower side of the indenter transition plate and penetrates through the indenter middle plate 6 and is fixedly mounted on the upper side of the middle ring press ring 7, the indenter middle plate 6 is fixedly mounted on the lower side of the indenter transition plate 3, the middle ring 7 is arranged on the inner side of the indenter middle plate 6, and center ring clamping ring 7 and elastic adhesive film 8 fixed mounting are on the upper surface of pressure head 12, outer lane clamping ring 9 and elastic adhesive film 8 fixed mounting are on the lower surface of pressure head middle plate 6, inner ring clamping ring 10 and elastic adhesive film 8 fixed mounting are on the lower surface of pressure head middle plate 6, inhale piece quick connector fixed mounting in the center of pressure head 12 upper surface department.
As shown in fig. 1 to 4, four circular groove positions for installing the O-ring 5 are arranged on the upper surface of the pressure head middle plate 6, and the aperture of the pressure head transition plate 3 corresponding to the position-limiting rivet 4 is smaller than the inner diameter of the O-ring 5.
Adopt above-mentioned scheme: the sealing and air tightness of the elastic rubber film 8 during the inflation in the processing can be ensured.
As shown in fig. 1 to 4, the limiting rivet 4 penetrates through the middle plate 6 of the pressure head in clearance fit, the middle ring press ring 7 is in clearance fit with the middle plate 6 of the pressure head, and the inner ring press ring 10 is in clearance fit with the pressure head 12.
Adopt above-mentioned scheme: the pressure head is guaranteed to easily float in the machining process to achieve the self-adjusting effect.
The utility model discloses a theory of operation:
when the polishing machine is used, the fastening bolt 1 is fixedly connected to a downward-pressing main shaft, the suction piece quick connector 11 is connected with an air source to vacuumize the pressing head 12 to suck a workpiece, the main shaft is pressed downwards to the polishing large disc, the adjusting quick connector 13 is connected with the air source to inflate, the air bag inflates and expands, the limiting rivet moves downwards to push the pressing head 12 to adsorb the workpiece to be attached to the polishing disc, the polishing disc is started to rotate to be machined, the elastic rubber film 8 continuously expands, the pressing head 12 and the limiting rivet 4 float up and down during machining, the workpiece is enabled to be in close contact with the large disc in a self-adjusting mode, and machining accuracy is guaranteed.
In summary, the following steps: this self-adjusting polishing pressure head, through setting up fastening bolt 1, packing ring 2, pressure head cross cab apron 3, spacing blind rivet 4, O type circle 5, pressure head medium plate 6, well circle clamping ring 7, elastic glue membrane 8, outer lane clamping ring 9, inner circle clamping ring 10, inhale piece quick connector 11, pressure head 12 and adjust the cooperation of quick connector 13 and use, the defect that has the unable self-adaptation regulation that various polishing pressure heads exist on the current market has been solved, this self-adjusting polishing pressure head, possess the advantage of the precision and the efficiency of effectual improvement processing, be worth promoting.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A self-adjusting polishing pressure head, includes the pressure head, its characterized in that: still cross cab apron, spacing blind rivet, pressure head medium plate, well circle clamping ring, elasticity glued membrane, outer lane clamping ring, inner circle clamping ring and regulation quick connector plug including the pressure head, the pressure head crosses the cab apron and is connected with drive spindle through fastening bolt and packing ring, fastening bolt follows the bottom that the cab apron was crossed to the pressure head upwards passes the packing ring and the pressure head crosses the cab apron through-hole and is connected with drive spindle, pressure head medium plate fixed mounting is in the downside of cab apron is crossed to the pressure head, the downside of pressure head medium plate sets up the elasticity glued membrane, the downside of elasticity glued membrane sets up the pressure head, adjust quick connector plug fixed mounting be in the upside of pressure head medium plate, be used for the elasticity glued membrane fills the gassing.
2. A self-adjusting polishing head according to claim 1, wherein: the lower part of spacing blind rivet runs through pressure head medium plate and fixed mounting be in the upside of mesosphere clamping ring, the mesosphere clamping ring sets up the inboard of pressure head medium plate lower surface, the mesosphere clamping ring passes downwards elasticity glued membrane fixed mounting be in the upper surface of pressure head, the upper portion of spacing blind rivet is located the pressure head passes through the cab apron through-hole and is located fastening bolt's below.
3. A self-adjusting polishing head according to claim 2, wherein: the outer lane clamping ring sets up the inslot of pressure head upper surface outer fringe, just the outer lane clamping ring upwards passes elastic adhesive film fixed mounting be in the lower surface of pressure head medium plate, the inner circle clamping ring sets up the inslot that pressure head upper surface central point put, just the inner circle clamping ring upwards passes elastic adhesive film fixed mounting be in the lower surface of pressure head medium plate.
4. A self-adjusting polishing head according to claim 1 or claim 3, wherein: the self-adjusting polishing pressure head further comprises a quick wafer suction connector, and the quick wafer suction connector penetrates through the inner ring compression ring and is fixedly installed at the center of the pressure head.
5. A self-adjusting polishing head according to claim 4, wherein: four circular grooves used for installing O-shaped rings are formed in the upper surface of the middle plate of the pressure head, and the diameter of the through hole of the limiting rivet is smaller than the inner diameter of each O-shaped ring when the pressure head passes through the transition plate.
6. A self-adjusting polishing head according to claim 3 or claim 5, wherein: spacing blind rivet with adopt clearance fit between the pressure head medium plate, well ring clamping ring with adopt clearance fit between the pressure head medium plate, the inner circle clamping ring with adopt clearance fit between the pressure head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121197124.5U CN214771306U (en) | 2021-05-31 | 2021-05-31 | Self-adjusting polishing pressure head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121197124.5U CN214771306U (en) | 2021-05-31 | 2021-05-31 | Self-adjusting polishing pressure head |
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| Publication Number | Publication Date |
|---|---|
| CN214771306U true CN214771306U (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121197124.5U Active CN214771306U (en) | 2021-05-31 | 2021-05-31 | Self-adjusting polishing pressure head |
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| CN (1) | CN214771306U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116766059A (en) * | 2023-08-18 | 2023-09-19 | 北京特思迪半导体设备有限公司 | Wafer pressing head and semiconductor polishing equipment |
-
2021
- 2021-05-31 CN CN202121197124.5U patent/CN214771306U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116766059A (en) * | 2023-08-18 | 2023-09-19 | 北京特思迪半导体设备有限公司 | Wafer pressing head and semiconductor polishing equipment |
| CN116766059B (en) * | 2023-08-18 | 2023-10-27 | 北京特思迪半导体设备有限公司 | Wafer pressing head and semiconductor polishing equipment |
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