CN213398670U

CN213398670U - Chip testing seat

Info

Publication number: CN213398670U
Application number: CN202120939515.3U
Authority: CN
Inventors: 张勇文; 袁小云
Original assignee: Sichuan Ruiyuan Integrated Circuit Technology Co ltd
Current assignee: Sichuan Ruiyuan Integrated Circuit Technology Co ltd
Priority date: 2021-05-06
Filing date: 2021-05-06
Publication date: 2021-06-08
Anticipated expiration: 2031-05-06

Abstract

The utility model discloses a chip testing seat, relating to the technical field of chip testing, which comprises a connecting seat connected on a testing circuit board, a fixed seat connected with the connecting seat and a mounting seat; the fixing seat is provided with an elastic part, and the mounting seat is fixed on the elastic part and is provided with a chip. The connecting seat is installed directly over the test circuit board, and fixing base and mount pad setting also are located the test circuit board directly over on the connecting seat, apply decurrent pressure to the mount pad, and the mount pad compression elastic component drives the chip that is located on the mount pad and removes to the direction that is close to the test circuit board for the pin of chip can contact the corresponding contact of test circuit board. The electrifying sequence of the test circuit board does not need to be strictly fixed, the test seat can not completely depend on the experience of operators when used for testing the chip, the operators with insufficient experience can also quickly enter a test state, the speed of testing the chip is relatively improved, and the influence on the test efficiency is further reduced.

Description

Chip testing seat

Technical Field

The utility model relates to a chip test technical field, concretely relates to chip test seat.

Background

After the chip finished product is produced and before the chip finished product enters the market, the chip without error in the test must be tested to enter the market. The test mode is to contact each pin of the test chip with a corresponding contact on the test circuit board, electrify the test circuit board to test the conduction condition, generally, components on the circuit board are fixedly contacted with the circuit board in a welding mode, and the test chip cannot be welded on the test circuit board for testing due to frequent replacement, so that the test chip needs to be tested by means of the test seat. The conventional auxiliary chip of the test socket has the mode that pins of a chip are inserted into pin slots formed in the test socket and fixed, the bottom of the test socket is exposed, and after the test socket is fixed right above a specified position of a test circuit board, the pins of the chip just contact corresponding contacts on the test circuit board.

However, in the actual use process of the test socket, as long as the test socket is fixed, the pins of the chip can contact the test circuit board, therefore, the test socket and the chip are fixed well before the test circuit board is powered on, and as long as the sequence is wrong, the test result can be influenced, so that the test socket can depend on the experience of an operator when the chip is tested, and the speed of the test chip can be greatly reduced for the operator with insufficient experience, thereby influencing the test efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in view of the above problems, a chip test socket independent of the experience of the operator is provided.

The utility model adopts the technical scheme as follows:

a chip test seat is positioned right above a test circuit board and comprises a connecting seat connected to the test circuit board, a fixed seat connected with the connecting seat and a mounting seat; the bottom of the connecting seat is provided with a mounting groove matched with the fixing seat, the center of the mounting groove is provided with a mounting hole which longitudinally penetrates through the connecting seat and is matched with the mounting seat, the fixing seat is fixed in the mounting groove, and the mounting seat is positioned in the mounting hole; the fixing seat is provided with an elastic part, and the mounting seat is fixed on the elastic part and is provided with a chip.

Preferably, the two sides of the fixed seat transversely extend to form pin seats; the chip testing seat also comprises a golden finger component which is arranged on the fixed seat and the mounting seat and comprises a first golden finger; the upper part of the first golden finger transversely extends to form a first contact pin, the upper part of the first golden finger longitudinally extends to form a first test pin, the first contact pin is fixed on the mounting seat and is in contact with the chip, and the first test pin is arranged on the pin seat and is opposite to the test circuit board.

Preferably, the pin base is provided with a test pin slot which longitudinally penetrates through the pin base, and the first test pin is inserted into the test pin slot.

Preferably, the mounting seat longitudinally and upwardly extends to form a chip seat, the mounting seat is provided with a contact pin groove, and the chip seat is provided with a chip pin groove communicated with the contact pin groove; the number of the contact pin grooves and the number of the chip pin grooves are matched with the number of the chip pins.

Preferably, the golden finger assembly further comprises a second golden finger which is opposite to the first golden finger and insulated from the first golden finger, a second contact pin transversely extends from the upper part of the second golden finger, a second test pin longitudinally extends from the upper part of the second golden finger, the second contact pin is fixed on the mounting seat and is in contact with the chip, and the second test pin is inserted into the test pin groove and faces the test circuit board.

Preferably, the first contact pin and the second contact pin are inserted into the contact pin groove, the pin of the chip is inserted into the chip pin groove, and the first contact pin and the second contact pin are both contacted with the pin of the chip; the number of the golden finger assemblies is matched with the number of the pins of the chip, and each pin of the chip is correspondingly contacted with one first contact pin and one second contact pin.

Preferably, a pin clamping groove is further formed in the mounting groove, and the first contact pin and the second contact pin are clamped into the pin clamping groove from bottom to top.

Preferably, the first golden finger and the second golden finger are respectively provided with a first fixing hole and a second fixing hole which are coaxial and concentric, an insulating connecting rod penetrates into the first golden finger and the second golden finger, and the first golden finger and the second golden finger are connected through the insulating connecting rod.

Preferably, the first fixing hole and the second fixing hole of each golden finger assembly are coaxial and concentric, and all the golden finger assemblies are also connected through the insulating connecting rod.

Preferably, the connecting seat is provided with a connecting hole.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that: the connecting seat is installed directly over the test circuit board, and fixing base and mount pad setting also are located the test circuit board directly over on the connecting seat, apply decurrent pressure to the mount pad, and the mount pad compression elastic component drives the chip that is located on the mount pad and removes to the direction that is close to the test circuit board for the pin of chip can contact the corresponding contact of test circuit board. The electrifying sequence of the test circuit board does not need to be strictly fixed, the test seat can not completely depend on the experience of operators when used for testing the chip, the operators with insufficient experience can also quickly enter a test state, the speed of testing the chip is relatively improved, and the influence on the test efficiency is further reduced.

Drawings

FIG. 1 is a top view of a chip test socket.

Fig. 2 is a top view of the fixing base, the mounting base, and the golden finger assembly.

Fig. 3 is a front view of the fixing base, the mounting base and the golden finger assembly.

Fig. 4 is a top view of the connecting seat.

Fig. 5 is a bottom view of the connecting seat.

Fig. 6 is a top view of the fixing base.

Fig. 7 is a bottom view of the fixing base.

Fig. 8 is a front view of the holder.

Fig. 9 is a side view of the holder.

Fig. 10 is a top view of the mount.

Fig. 11 is a bottom view of the mount.

Fig. 12 is a side view of the mount.

Fig. 13 is a front view of the gold finger assembly.

Fig. 14 is a right side view of the gold finger assembly.

Fig. 15 is a front view of the first gold finger.

Fig. 16 is a front view of the second gold finger.

The labels in the figure are: the device comprises a connecting seat-1, a mounting groove-11, a mounting hole-12, a pin clamping groove-13, a connecting hole-14, a fixing seat-2, an elastic piece-21, a pin seat-22, a test pin groove-23, a mounting seat-3, a chip seat-31, a contact pin groove-32, a chip pin groove-33, a golden finger component-4, a first golden finger-41, a first contact pin-411, a first test pin-412, a second golden finger-42, a second contact pin-421, a second test pin-422, a first fixing hole-401, a second fixing hole-402 and an insulating connecting rod-43.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 to 3, a chip test socket is located right above a test circuit board, and includes a rectangular connecting seat 1 connected to the test circuit board, a rectangular fixing seat 2 connected to the connecting seat 1, and a mounting seat 3; the bottom of the connecting seat 1 is provided with a mounting groove 11 matched with the fixing seat 2, the center of the mounting groove 11 is provided with a mounting hole 12 longitudinally penetrating through the connecting seat 1 and matched with the mounting seat 3, the fixing seat 2 is clamped in the mounting groove 11, and the mounting seat 3 is positioned in the mounting hole 12, so that a chip can be conveniently mounted on the mounting seat 3 from the upper part of the mounting hole 12; the fixing seat 2 is provided with an elastic part 21, and the mounting seat 3 is fixed on the elastic part 21 and is provided with a chip. The elastic members 21 are four springs and are fixed at four corners of the fixing base 2. Four corners of the mounting base 3 are respectively overlapped with the elastic pieces 21. The mount 3 is pressed down by applying force, and the mount 3 compresses the elastic member 21 to drive the chip to move downwards. The chip has six pins, three on each side.

Referring to fig. 2, 6 to 9 and 15, further, two lead seats 22 extend laterally from two sides of the fixing seat 2; the chip testing seat also comprises a golden finger component 4 which is arranged on the fixed seat 2 and the mounting seat 3 and comprises a first golden finger 41; the upper portion of the first gold finger 41 extends transversely to form a first contact pin 411, and extends longitudinally to form a first test pin 412, the first contact pin 411 is fixed on the mounting base 3 and contacts with a pin of a chip, after power is turned on, the first contact pin 411 is conducted with the chip, and the first test pin 412 is arranged on the pin base 22 and faces the test circuit board. The first gold finger 41 has two first test pins 412 arranged in parallel, and the first test pin 412 on the left side is shorter than the first test pin 412 on the right side.

Referring to fig. 2, 3, 6 to 9, and 13 to 16, the gold finger assembly 4 further includes a second gold finger 42 disposed opposite to the first gold finger 41 and insulated from each other, a second contact pin 421 transversely extends on an upper portion of the second gold finger 42, a second test pin 422 longitudinally extends on the upper portion of the second gold finger 42, the second contact pin 421 is fixed on the mounting base 3 and contacts with the chip, and the second test pin 422 is inserted into the test pin slot 23 and faces the test circuit board. The second gold finger 42 has two second test pins 422 arranged in parallel, and the second test pin 422 on the left side is longer than the second test pin 422 on the right side.

Referring to fig. 2, fig. 3, fig. 13 and fig. 14, further, six gold finger assemblies 4 are respectively corresponding to six pins of the chip.

Referring to fig. 2, 3, 6 to 9, further, each of the lead seats 22 is provided with three test lead slots 23 passing through longitudinally, and the first test lead 412 and the second test lead 422 of one gold finger assembly 4 are inserted into one test lead slot 23.

Referring to fig. 2, fig. 3, and fig. 10 to fig. 12, further, a chip seat 31 extends longitudinally and upwardly from the mounting seat 3, the chip seat and the mounting seat form a boss structure, the mounting seat 3 is provided with a contact pin slot 32, and the chip seat 31 is provided with a chip pin slot 33 communicated with the contact pin slot 32; three contact pin grooves 32 are respectively formed in two opposite sides of the mounting base 3, and three chip pin grooves 33 are respectively formed in two sides of the chip base 31 which are the same as the mounting base 3.

Referring to fig. 2 and 3, further, the first contact pin 411 and the second contact pin 421 of one gold finger assembly 4 are inserted into the same contact pin slot 32, the pin of the chip is inserted into the chip pin slot 33, and the first contact pin 411 and the second contact pin 421 are both in contact with the pin of the chip; each pin of the chip correspondingly contacts one first contact pin 411 and one second contact pin 421.

Referring to fig. 4 and 5, further, three pin slots 13 are respectively formed on two opposite sides in the mounting groove 11, and the first contact pin 411 and the second contact pin 421 of one gold finger assembly 4 are respectively clamped into the same pin slot 13 from bottom to top.

Referring to fig. 13 to 16, further, the first gold finger 41 and the second gold finger 42 are respectively provided with a first fixing hole 401 and a second fixing hole 402 which are coaxial and concentric, an insulating connecting rod 43 is respectively inserted into the first fixing hole 401 and the second fixing hole 402, and the first gold finger 41 and the second gold finger 42 are connected through the insulating connecting rod 43.

Referring to fig. 13 to 16, further, the first fixing hole 401 and the second fixing hole 402 of each gold finger assembly 4 are concentric, and every three gold finger assemblies 4 are connected by the same insulating connecting rod 43.

Referring to fig. 1, 4 and 5, a connection hole 14 is further formed in the connection base 1, and the connection hole 14 is a threaded hole and is used for being fixed above the test circuit board by using a bolt.

When the device is used specifically, the connecting seat 1 is fixed right above the test circuit board, pins of the chip are inserted into the chip pin grooves 33 respectively, each pin of the chip is positioned between the first contact pin 411 and the second contact pin 421 of one golden finger component 4 and is in contact with the first contact pin 411 and the second contact pin 421, the test circuit board is electrified, the chip is pressed downwards by applying force, the mounting seat 3 compresses the elastic part 21 to drive the golden finger component 4 to move downwards, the first test pin 412 and the second test pin 422 move downwards to contact with a contact of the test circuit board, and the pins of the chip and the contact of the test circuit board are in indirect contact through the golden finger component 4 to be tested.

The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to aid in understanding the methods and their core concepts. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Claims

1. A chip test seat is positioned right above a test circuit board and is characterized by comprising a connecting seat connected to the test circuit board, a fixed seat connected with the connecting seat and a mounting seat; the bottom of the connecting seat is provided with a mounting groove matched with the fixing seat, the center of the mounting groove is provided with a mounting hole which longitudinally penetrates through the connecting seat and is matched with the mounting seat, the fixing seat is fixed in the mounting groove, and the mounting seat is positioned in the mounting hole; the fixing seat is provided with an elastic part, and the mounting seat is fixed on the elastic part and is provided with a chip.

2. The die test socket according to claim 1, wherein the fixing base has pin bases laterally extending from both sides thereof; the chip testing seat also comprises a golden finger component which is arranged on the fixed seat and the mounting seat and comprises a first golden finger; the upper part of the first golden finger transversely extends to form a first contact pin, the upper part of the first golden finger longitudinally extends to form a first test pin, the first contact pin is fixed on the mounting seat and is in contact with the chip, and the first test pin is arranged on the pin seat and is opposite to the test circuit board.

3. The die test socket according to claim 2, wherein the socket has a test pin slot extending therethrough in a longitudinal direction, and the first test pin is inserted into the test pin slot.

4. The die test socket according to claim 3, wherein the mounting socket has a die pad extending longitudinally upward, the mounting socket having contact pin slots, the die pad having die pin slots communicating with the contact pin slots; the number of the contact pin grooves and the number of the chip pin grooves are matched with the number of the chip pins.

5. The die test socket according to claim 4, wherein the golden finger assembly further comprises a second golden finger disposed opposite to the first golden finger and insulated from each other, a second contact pin extending laterally from an upper portion of the second golden finger and a second test pin extending longitudinally from the upper portion of the second golden finger, the second contact pin being fixed to the mounting socket and contacting the die, the second test pin being inserted into the test pin slot and facing the test circuit board.

6. The die test socket according to claim 5, wherein the first contact pin and the second contact pin are inserted into the contact pin slot, the pin of the die is inserted into the die pin slot, and the first contact pin and the second contact pin are both in contact with the pin of the die; the number of the golden finger assemblies is matched with the number of the pins of the chip, and each pin of the chip is correspondingly contacted with one first contact pin and one second contact pin.

7. The chip testing socket according to claim 6, wherein a pin slot is further formed in the mounting groove, and the first contact pin and the second contact pin are respectively clamped into the pin slot from bottom to top.

8. The socket according to any of claims 5 to 7, wherein the first golden finger and the second golden finger are respectively provided with a first fixing hole and a second fixing hole which are coaxial and concentric, and an insulating connecting rod penetrates through the first golden finger and the second golden finger, and the first golden finger and the second golden finger are connected through the insulating connecting rod.

9. The die test socket according to claim 8, wherein the first fixing hole and the second fixing hole of each golden finger assembly are concentric and coaxial, and all the golden finger assemblies are also connected through an insulating connecting rod.

10. The chip testing socket according to any one of claims 5 to 7, wherein the connecting socket has a connecting hole.