CN217112560U - Fingerprint module test structure - Google Patents

Abstract

The utility model provides a fingerprint module test structure, be used for testing fingerprint module even board, fingerprint module test structure includes switching circuit board and support plate, the upper surface of switching circuit board and the lower surface laminating of support plate are connected, the fingerprint module is even the lower surface of board and the upper surface of support plate is laminated mutually, the fingerprint module is even to have a plurality of fingerprint modules on the board, the lower surface of every fingerprint module all is equipped with the connector, the upper surface of switching circuit board is equipped with the multiunit pad, be equipped with a plurality of thimble modules in the support plate, a plurality of thimble modules are corresponding with the connector and the multiunit pad of a plurality of fingerprint modules simultaneously, the signal of telecommunication turn-on connection between the top of every thimble module and the connector that corresponds, the signal of telecommunication turn-on connection between the bottom of every thimble module and a set of pad that corresponds. The utility model discloses a fingerprint module test structure can test a plurality of fingerprint modules at every turn, and is easy and simple to handle, work efficiency is high, has reduced manufacturing cost simultaneously.

Description

Fingerprint module test structure

Technical Field

The utility model belongs to the technical field of the fingerprint module test technique and specifically relates to a fingerprint module test structure is related to.

Background

As shown in fig. 1, the conventional fingerprint module testing structure can only be used for testing a single fingerprint module 81, and the fingerprint module testing structure includes a carrier 82, a transfer circuit board 83, a pressure head 84 and a bottom support plate 85. Fingerprint module 81 includes fingerprint chip 811 and fingerprint circuit board 812, and fingerprint chip 811 laminates in the upper surface of fingerprint circuit board 812, and the signal of telecommunication conductive connection between fingerprint chip 811 and the fingerprint circuit board 812.

The upper surface of the carrier 82 is provided with a sinking groove 822, the fingerprint circuit board 812 is mounted in the sinking groove 822, and the lower surface of the carrier 82 is attached to the upper surface of the adapting circuit board 83. One side of the carrier plate 82 is provided with a through hole 821, the lower surface of the fingerprint circuit board 812 is provided with a connector 813, the upper surface of the adapting circuit board 83 is welded with a connector buckling female seat 831, the connector buckling female seat 831 and the connector 813 are both positioned in the through hole 821, and the connector 813 is buckled with the connector buckling female seat 831, so that the electric signal conduction connection between the fingerprint circuit board 812 and the adapting circuit board 83 is realized. The adapting circuit board 83 has a flat cable interface 832, the flat cable interface 832 is connected to a test motherboard (not shown) through a wire, and the lower surface of the adapting circuit board 83 is attached to the upper surface of the bottom bracket 85.

When the pressing head 84 (including the stripe circuit pattern) presses the surface of the fingerprint chip 811, the fingerprint chip 811 obtains a corresponding image signal, and the image signal is transmitted to the test motherboard through the fingerprint circuit board 812, the connector 813, the connector fastening female seat 831, the adapting circuit board 83, and the flat cable interface 832 in sequence, thereby realizing the function test of the fingerprint module 81.

Above conventional fingerprint module test structure can only carry out the test of single fingerprint module at every turn, all need to change the fingerprint module after the test is accomplished at every turn, frequently replace the operation of fingerprint module and lead to work efficiency low, and then lead to manufacturing cost to increase.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a fingerprint module test structure aims at solving the not enough of above-mentioned background existence, can test a plurality of fingerprint modules at every turn, and is easy and simple to handle, work efficiency is high, has reduced manufacturing cost simultaneously.

The utility model provides a fingerprint module testing structure, which is used for testing a fingerprint module connecting plate and comprises a switching circuit board and a support plate, the upper surface of the transfer circuit board is jointed and connected with the lower surface of the carrier plate, the lower surface of the fingerprint module connecting plate is jointed with the upper surface of the carrier plate, the fingerprint module connecting plate is provided with a plurality of fingerprint modules, the lower surface of each fingerprint module is provided with a connector, the upper surface of switching circuit board is equipped with the multiunit pad, be equipped with a plurality of thimble modules in the support plate, it is a plurality of the thimble module simultaneously with a plurality of the connector and the multiunit of fingerprint module the pad is corresponding, every the top and one of thimble module correspond the signal of telecommunication switch-on connection between the connector, every the bottom and a set of correspondence of thimble module the signal of telecommunication switch-on connection between the pad.

Furthermore, a plurality of through holes penetrate through the carrier plate from top to bottom, the plurality of through holes correspond to the plurality of connectors of the fingerprint module and the plurality of groups of bonding pads, the plurality of through holes are equal to the plurality of thimble modules in number, and each thimble module is arranged in one corresponding through hole.

Further, every the fingerprint module includes fingerprint chip and fingerprint circuit board, the fingerprint chip with the upper surface laminating of fingerprint circuit board is connected, the connector sets up every the lower surface of fingerprint circuit board.

Further, the upper surface of support plate is equipped with first storage tank, the size of a dimension of first storage tank with the size of fingerprint module link plate is the same, fingerprint module link plate is installed in the first storage tank.

Furthermore, every the upper surface of fingerprint module all is equipped with the induction zone, every the lower surface of fingerprint module all is equipped with electrically conductive base, electrically conductive base with the induction zone is corresponding, the upper surface of support plate is corresponding to every the position of electrically conductive base is equipped with the second storage tank, electrically conductive base is located in the second storage tank.

Furthermore, the thimble module comprises a thimble die holder and a thimble, the thimble penetrates through the thimble die holder from top to bottom, the top end of the thimble is in electric signal conduction connection with the connector, and the bottom end of the thimble is in electric signal conduction connection with the pad.

Furthermore, fingerprint module test structure still includes and is used for compressing tightly the buckle gland of fingerprint module even board, the buckle gland presses fingerprint module even board top.

Further, fingerprint module test structure still includes the bottom plate board, the upper surface of bottom plate board with the lower surface laminating of switching circuit board is connected, the lower surface of lock gland one side with be equipped with the switching axle between the upper surface of bottom plate board, the lower surface of lock gland opposite side with be equipped with the actuation subassembly between the upper surface of bottom plate board.

Furthermore, a plurality of through holes are formed in the buckling gland at intervals, the number of the through holes is the same as that of the fingerprint modules, and each through hole is located above a corresponding sensing area of the fingerprint module; or, the interval is equipped with two perforation on the lock gland, two the perforation is long bar-shaped structure, and is a plurality of the fingerprint module is arranged into two lines, every the perforation is located the one line and corresponds the response region top of fingerprint module.

Further, fingerprint module test structure still includes a plurality of pressure heads, and is a plurality of the quantity of pressure head is with a plurality of the quantity of fingerprint module is the same, every the pressure head is pressed one and is corresponded the response area top of fingerprint module, it is a plurality of the pressure head is interlock structure as an organic whole.

The utility model provides a fingerprint module test structure, fingerprint module even the board has a plurality of fingerprint modules, link board surface mounting at the fingerprint module and accomplish the back, do not cut apart the processing to the fingerprint module even the board, directly link the board to whole fingerprint module and test, test a plurality of fingerprint modules promptly simultaneously. Compare and cut apart into the mode of carrying out the singlepiece test again after a plurality of fingerprint modules with fingerprint module even board among the prior art, the utility model discloses have the efficiency of software testing who promotes the fingerprint module, reduced staff's operation, reduced manufacturing cost's effect.

And simultaneously, the utility model discloses utilize thimble module to realize the signal of telecommunication turn-on connection of fingerprint module and switching circuit board, the signal is stable and need not frequent plug action, and is easy and simple to handle, and is favorable to the life of extension element.

Drawings

Fig. 1 is a schematic structural diagram of a fingerprint module testing structure in the prior art.

Fig. 2 is a schematic cross-sectional view of a fingerprint module testing structure according to a first embodiment of the present invention.

Fig. 3 is a partially enlarged view of a position a in fig. 2.

FIG. 4 is an exploded view of a fingerprint module test structure.

Fig. 5 is a top view of the assembled fingerprint module connecting plate and fingerprint module.

Fig. 6 is a bottom view of the assembled fingerprint module connecting plate and fingerprint module.

Fig. 7 is a schematic view of the structure of the adapter circuit board mounted on the bottom bracket.

Fig. 8 is a schematic structural diagram of the carrier board mounted on the patch circuit board.

Fig. 9 is a schematic view of the fingerprint module connecting board mounted on the carrier board.

Fig. 10 is a schematic structural view of the snap-fit cover mounted on the bottom bracket plate.

Fig. 11 is a schematic structural view of the pressing head pressing on the fingerprint module.

Fig. 12 is a schematic structural view of a fastening gland according to a second embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

As shown in fig. 2 to 6, the utility model discloses fingerprint module test structure that first embodiment provided for test fingerprint module even board 1's performance. The fingerprint module testing structure comprises a transfer circuit board 3 and a carrier plate 2, wherein the upper surface of the transfer circuit board 3 (as shown in fig. 2, the direction indicated by an arrow S is an upward direction) is attached to the lower surface of the carrier plate 2, and the lower surface of a fingerprint module connecting plate 1 is attached to the upper surface of the carrier plate 2. The adapting circuit board 3 is provided with a flat cable interface 33, and the flat cable interface 33 is electrically connected with a test main board (not shown) through a lead.

As shown in fig. 2 to 6, the fingerprint module connecting plate 1 includes a plurality of fingerprint modules 11, and the lower surface of each fingerprint module 11 is provided with a connector 113. The upper surface of the adapting circuit board 3 is provided with a plurality of groups of bonding pads 31, the carrier plate 2 is internally provided with a plurality of thimble modules 4, and the thimble modules 4 correspond to the connectors 113 of the fingerprint modules 11 and the groups of bonding pads 31. The top end of each thimble module 4 is in electrical signal conduction connection with a corresponding connector 113, and the bottom end of each thimble module 4 is in electrical signal conduction connection with a group of corresponding pads 31.

Further, as shown in fig. 2 to 4, a plurality of through holes 21 penetrate through the carrier 2 from top to bottom, the plurality of through holes 21 simultaneously correspond to the connectors 113 of the plurality of fingerprint modules 11 and the plurality of sets of pads 31, and each through hole 21 is located below one corresponding connector 113 and above one corresponding set of pads 31. The number of the through holes 21 is the same as that of the plurality of thimble modules 4, and each thimble module 4 is arranged in a corresponding through hole 21.

Further, as shown in fig. 2, the upper surface of the carrier plate 2 is provided with a first receiving groove 22, and the size of the first receiving groove 22 is the same as the size of the fingerprint module connecting plate 1, so that the first receiving groove 22 can just receive the whole fingerprint module connecting plate 1. Fingerprint module even board 1 is installed in first storage tank 22, and first storage tank 22 can fix a position fingerprint module even board 1 for in the through-hole 21 that corresponds can be put into very easily to connector 113 on fingerprint module even board 1, can prevent simultaneously that fingerprint module even board 1 from rocking in the test procedure, is favorable to fingerprint module even stability of signal connection between board 1 and the switching circuit board 3.

Further, as shown in fig. 5 and fig. 6, the boundary between each fingerprint module 11 is indicated by a boundary line 10 (dotted line) in the figure, each fingerprint module 11 includes a fingerprint chip 111 and a fingerprint circuit board 112, the fingerprint chip 111 is attached to the upper surface of the fingerprint circuit board 112, and the fingerprint chip 111 is electrically connected to the fingerprint circuit board 112 through an electrical signal. The fingerprint circuit board 112 of each fingerprint module 11 is separated from the fingerprint circuit board 112 of the adjacent fingerprint module 11 by the dividing line 10. The connector 113 is disposed on the lower surface of each fingerprint circuit board 112, and the lower surface of each fingerprint circuit board 112 is attached to the upper surface of the carrier 2.

Further, as shown in fig. 5 and fig. 6, the upper surface of each fingerprint module 11 (as seen from fig. 2, the upper surface of the fingerprint module 11 is the surface of the side far away from the carrier plate 2) is provided with a sensing area 114, the lower surface of each fingerprint module 11 (the lower surface of the fingerprint module 11 is the surface of the side close to the carrier plate 2) is provided with a conductive base 115, and the conductive base 115 corresponds to the sensing area 114. The conductive bases 115 extend and protrude downward from the lower surface of each fingerprint module 11, the second receiving groove 23 is disposed on the upper surface of the carrier 2 corresponding to each conductive base 115, and the conductive base 115 is disposed in the second receiving groove 23.

The second receiving groove 23 is used for receiving the conductive base 115, so that the fingerprint module connecting plate 1 can be conveniently mounted on the upper surface of the carrier plate 2, and can perform a position determination function. Specifically, when installing fingerprint module even board 1, can judge the orientation of placing of support plate 2 through arranging of second storage tank 23 and through-hole 21, the installation of the fingerprint module even board 1 of being convenient for.

Further, as shown in fig. 3, the thimble module 4 includes a thimble die holder 41 and a thimble 42, the thimble 42 is vertically disposed in the thimble die holder 41, an electrical signal is conducted between the top end of the thimble 42 and the connector 113, and an electrical signal is conducted between the bottom end of the thimble 42 and the pad 31.

Further, as shown in fig. 3, the through hole 21 has a stepped structure, the through hole 21 includes a small hole 211 and a large hole 212, and the small hole 211 communicates with the large hole 212. The small hole 211 is arranged on the upper half portion of the carrier plate 2, the large hole 212 is arranged on the lower half portion of the carrier plate 2, the size of the large hole 212 is the same as that of the thimble die holder 41, and the thimble die holder 41 is installed in the large hole 212. The connector 113 extends and protrudes downward from the lower surface of each fingerprint module 11, and the connector 113 is inserted into the small hole 211.

Specifically, as shown in fig. 3, in the present embodiment, two protruding portions (not numbered) are disposed on two sides of each connector 113, two pins 42 are disposed in each pin module 4, each group of pads 31 includes two pads 31, an upper end of each pin 42 contacts with one protruding portion of the connector 113, and a lower end of each pin 42 contacts with one pad 31, so as to implement electrical signal conduction connection between the fingerprint circuit board 112 and the adapting circuit board 3.

Further, as shown in fig. 4, the fingerprint module test structure further comprises a bottom support plate 5, the upper surface of the bottom support plate 5 is attached to the lower surface of the adapting circuit board 3, and the bottom support plate 5 is a bearing surface of the whole fingerprint module test tool. Four vertex angles of the bottom supporting plate 5 are provided with mounting holes 51, and the mounting holes 51 are used for mounting and fixing the bottom supporting plate 5.

Further, as shown in fig. 2, 4 and 10, the fingerprint module testing structure further includes a fastening cover 6, the fastening cover 6 is pressed against the top of the fingerprint module connecting plate 1, and the fastening cover 6 is used for pressing the fingerprint module connecting plate 1. The left and right ends of the fastening cover 6 (as shown in fig. 4 and 10, the direction indicated by the arrow L is the left direction) protrude outwards compared to the carrier plate 2, an opening/closing shaft 61 is disposed between the lower surface of one side of the fastening cover 6 and the upper surface of the bottom plate 5, and a suction assembly 62 is disposed between the lower surface of the other side of the fastening cover 6 and the upper surface of the bottom plate 5.

Specifically, after the fingerprint module connecting plate 1 is mounted on the upper surface of the carrier plate 2, the connector 113 is not necessarily in contact with the ejector pin 42, and the fastening gland 6 is used for further pressing the fingerprint module connecting plate 1, so that the connector 113 is in close contact with the ejector pin 42, thereby realizing stable electrical signal conduction connection between the fingerprint module 11 and the adapting circuit board 3. During testing, the suction assembly 62 is lifted to open the fastening gland 6 in a rotating manner around the opening and closing shaft 61, then the fingerprint module connecting plate 1 is installed on the carrier plate 2, at this time, the connector 113 is inserted into the through hole 21 and is just opposite to the upper side of the thimble module 4, then the fastening gland 6 is closed, the fastening gland 6 further presses the fingerprint module connecting plate 1, the connector 113 is in close contact with the thimble 42, and therefore electric signal conduction connection between the fingerprint module 11 and the adapter circuit board 3 is achieved. In addition, the downward pressure of the snap-fit cover 6 can be adjusted by adjusting the magnitude of the suction force of the suction assembly 62 to ensure the close contact between the connector 113 and the thimble 42. Simultaneously, through set up switching shaft 61 in 6 one sides of lock gland, can conveniently open and close lock gland 6 for it is more convenient that the test is changed to fingerprint module even board 1, easy operation makes things convenient for inspection and maintenance moreover.

Further, as shown in fig. 2, 4 and 10, the fastening cover 6 is provided with a plurality of through holes 63 at intervals, the number of the through holes 63 is the same as the number of the fingerprint modules 11, each through hole 63 is located above the sensing area 114 of a corresponding fingerprint module 11, that is, the sensing area 114 of each fingerprint module 11 is exposed through the corresponding through hole 63, and the sensing area 114 is not covered by the fastening cover 6, so as to facilitate the test.

Further, as shown in fig. 2, 4 and 11, the fingerprint module test structure further includes a pressure head 7, and a stripe line pattern is disposed on a lower surface of the pressure head 7. The quantity of pressure head 7 is a plurality of, and the quantity of a plurality of pressure heads 7 is the same with the quantity of a plurality of fingerprint module 11, and every pressure head 7 presses in the response area 114 top of a corresponding fingerprint module 11.

Preferably, the plurality of pressing heads 7 are in an integral linkage structure, and the plurality of pressing heads 7 are simultaneously installed on a fingerprint stitching test machine (not shown). When testing, a plurality of pressure heads 7 of fingerprint pressfitting test machine drive are pressed simultaneously on a plurality of fingerprint module 11, can improve efficiency of software testing greatly.

Specifically, as shown in fig. 10 and 11, after the fingerprint module connecting board 1 is mounted on the carrier board 2, the fastening cover 6 is closed, the sensing area 114 of each fingerprint module 11 is exposed through the corresponding through hole 63, and after the plurality of pressing heads 7 are pressed above the sensing areas 114 of the plurality of fingerprint modules 11 at the same time, each fingerprint chip 111 respectively acquires an image signal and transmits the image signal to the fingerprint circuit board 112. The fingerprint circuit board 112 sequentially passes through the connector 113, the thimble 42 and the bonding pad 31 to transmit the image signal to the switching circuit board 3, the switching circuit board 3 transmits the image signal to the test mainboard through the flat cable interface 33, and the test mainboard simultaneously tests the image signal acquired by the plurality of fingerprint chips 111, so that the function test of the fingerprint module connecting board 1 is realized.

Further, as shown in fig. 4, two opposite sides of the adapting circuit board 3 are provided with positioning holes 32, two opposite sides of the carrier 2 are provided with positioning holes 24, the positioning hole 32 on the left side of the adapting circuit board 3 (as shown in fig. 4, the direction indicated by the arrow L is the left direction) corresponds to the positioning hole 24 on the left side of the carrier 2, and the positioning hole 32 on the right side of the adapting circuit board 3 corresponds to the positioning hole 24 on the right side of the carrier 2.

In the embodiment, the positioning holes 24 are disposed at four top corners of the carrier board 2, when the carrier board 2 is mounted on the adapting circuit board 3, the limiting holes 32 of the adapting circuit board 3 are matched with the corresponding positioning holes 24 on the carrier board 2, so that the positions of the pads 31 on the adapting circuit board 3 correspond to the positions of the through holes 21, that is, the centers of the pads 31 and the pins 42 are aligned, and a good electrical signal conduction connection between the pads 31 and the pins 42 is realized.

The following elucidation fingerprint module test structure, the equipment order of fingerprint module even board:

as shown in fig. 7 to 11, the adapting circuit board 3 is first mounted on the bottom support plate 5, and then the carrier plate 2 is mounted on the adapting circuit board 3, the position of the limiting hole 32 corresponds to the position of the positioning hole 24, so that the pad 31 is aligned with the thimble 42. Then, the fastening gland 6 is mounted on the bottom supporting plate 5, the fingerprint module connecting plate 1 is mounted on the carrier plate 2, and the fastening gland 6 is closed to press the fingerprint module connecting plate 1, so that the connector 113 is in close contact with the thimble 42. Finally, a plurality of pressure heads 7 are pressed above the sensing areas 114 of a plurality of fingerprint modules 11 simultaneously, and then testing is carried out.

The embodiment of the utility model provides a beneficial effect lies in:

1. after the surface mounting of the fingerprint module connecting plate 1 is completed, the fingerprint module connecting plate 1 is not subjected to segmentation treatment, the whole fingerprint module connecting plate 1 is directly tested, namely a plurality of fingerprint modules 11 are tested simultaneously, the testing efficiency of the fingerprint modules 11 can be effectively improved, and the production cost is reduced;

2. the electrical signal conduction connection between the fingerprint module 11 and the transfer circuit board 3 is realized through the matching of the thimble module 4 and the buckling gland 6, so that the fingerprint module is convenient and quick, and is convenient to check and maintain;

3. the arrangement of the second accommodating grooves 23 and the through holes 21 is used for judging the placing direction of the carrier plate 2, so that the installation of the fingerprint module connecting plate 1 is facilitated;

4. the limiting hole 32 corresponds to the positioning hole 24, so that the center of the pad 31 is aligned with the center of the thimble 42, good electric signal conduction connection between the pad 31 and the thimble 42 is realized, and the mounting of the carrier plate 2 and the transfer circuit board 3 is facilitated;

5. through set up switching shaft 61 and actuation subassembly 62 between lock gland 6 and bottom plate 5 for connector 113 and thimble 42 in close contact with realize good signal of telecommunication turn-on connection between connector 113 and the thimble 42, the change test of the fingerprint module even board 1 of being convenient for simultaneously.

The utility model discloses still provide another embodiment, as shown in fig. 12, the utility model discloses fingerprint module test structure that second embodiment provided is the same basically with first embodiment, and the difference lies in the structure difference of lock gland 6.

Specifically, in this embodiment, two through holes 63 are formed in the fastening gland 6 at intervals, the two through holes 63 are in a strip structure, the plurality of fingerprint modules 11 are arranged in two rows, each through hole 63 is located above the sensing area 114 of one corresponding fingerprint module 11, that is, the sensing area 114 of each fingerprint module 11 in each row is exposed through the corresponding through hole 63, and the sensing area 114 is not covered by the fastening gland 6, so as to facilitate the test. Of course, the through hole 63 of the snap cover 6 may have other shapes as long as the sensing area 114 of the fingerprint module 11 is exposed, and the shape of the through hole 63 is not limited herein.

Other configurations of this embodiment are the same as those of the first embodiment, and are not described herein.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A fingerprint module test structure for testing a fingerprint module connecting plate (1), which comprises a transfer circuit board (3) and a carrier plate (2), wherein the upper surface of the transfer circuit board (3) is attached to the lower surface of the carrier plate (2), the fingerprint module test structure is characterized in that the lower surface of the fingerprint module connecting plate (1) is attached to the upper surface of the carrier plate (2), the fingerprint module connecting plate (1) is provided with a plurality of fingerprint modules (11), each lower surface of the fingerprint module (11) is provided with a connector (113), the upper surface of the transfer circuit board (3) is provided with a plurality of groups of pads (31), the carrier plate (2) is internally provided with a plurality of thimble modules (4), and the thimble modules (4) are corresponding to the connectors (113) of the fingerprint modules (11) and the pads (31), the top end of each thimble module (4) is in electric signal conduction connection with one corresponding connector (113), and the bottom end of each thimble module (4) is in electric signal conduction connection with a group of corresponding bonding pads (31).

2. The fingerprint module testing structure of claim 1, wherein a plurality of through holes (21) are formed in the carrier board (2) in a vertical penetrating manner, the plurality of through holes (21) simultaneously correspond to the connectors (113) of the plurality of fingerprint modules (11) and the plurality of groups of pads (31), the number of the plurality of through holes (21) is the same as that of the plurality of thimble modules (4), and each thimble module (4) is disposed in a corresponding through hole (21).

3. The fingerprint module testing structure of claim 1, wherein each fingerprint module (11) comprises a fingerprint chip (111) and a fingerprint circuit board (112), the fingerprint chip (111) is attached to the upper surface of the fingerprint circuit board (112), and the connector (113) is disposed on the lower surface of each fingerprint circuit board (112).

4. The fingerprint module testing structure of claim 1, wherein the carrier (2) has a first receiving cavity (22) formed on an upper surface thereof, the first receiving cavity (22) has a size same as that of the fingerprint module connecting plate (1), and the fingerprint module connecting plate (1) is mounted in the first receiving cavity (22).

5. The fingerprint module testing structure of claim 1, wherein a sensing area (114) is disposed on an upper surface of each fingerprint module (11), a conductive base (115) is disposed on a lower surface of each fingerprint module (11), the conductive base (115) corresponds to the sensing area (114), a second receiving groove (23) is disposed on a position of the upper surface of the carrier (2) corresponding to each conductive base (115), and the conductive base (115) is disposed in the second receiving groove (23).

6. The fingerprint module testing structure of claim 1, wherein the thimble module (4) comprises a thimble die holder (41) and a thimble (42), the thimble (42) is vertically disposed in the thimble die holder (41), the top end of the thimble (42) is electrically connected to the connector (113), and the bottom end of the thimble (42) is electrically connected to the pad (31).

7. The fingerprint module test structure of claim 1, further comprising a snap-in gland (6) for pressing the fingerprint module connecting plate (1), the snap-in gland (6) pressing against the fingerprint module connecting plate (1).

8. The fingerprint module testing structure of claim 7, further comprising a bottom plate (5), wherein an upper surface of the bottom plate (5) is attached to and connected with a lower surface of the adapting circuit board (3), an opening and closing shaft (61) is arranged between a lower surface of one side of the fastening gland (6) and the upper surface of the bottom plate (5), and an attraction component (62) is arranged between a lower surface of the other side of the fastening gland (6) and the upper surface of the bottom plate (5).

9. The fingerprint module testing structure of claim 7, wherein a plurality of through holes (63) are spaced on the snap-fit gland (6), the number of the through holes (63) is the same as the number of the fingerprint modules (11), and each through hole (63) is located above a sensing area (114) of a corresponding fingerprint module (11); or, the interval is equipped with two perforation (63) on lock gland (6), two perforation (63) are long bar-type texture, and are a plurality of fingerprint module (11) are arranged into two lines, every perforation (63) are located the one line and correspond the response region (114) top of fingerprint module (11).

10. The fingerprint module testing structure of claim 1, further comprising a plurality of pressing heads (7), wherein the number of the plurality of pressing heads (7) is the same as the number of the plurality of fingerprint modules (11), each pressing head (7) presses on a sensing area (114) of the corresponding fingerprint module (11), and the plurality of pressing heads (7) are integrated into a linkage structure.

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