CN213366526U

CN213366526U - Conveying mechanism of etching machine

Info

Publication number: CN213366526U
Application number: CN202022514136.8U
Authority: CN
Inventors: 钱强; 袁鸣
Original assignee: Wuxi Xinhan Electronic Technology Co ltd
Current assignee: Wuxi Xinhan Electronic Technology Co ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2021-06-04
Anticipated expiration: 2030-11-03

Abstract

The utility model discloses a conveying mechanism of etching machine, the fruit pick-up device comprises a frame body, the fixed positive reverse motor that is provided with in framework inner chamber one side, just framework top both sides all run through and are provided with the bull stick, two the bull stick outside all overlaps and is equipped with two sliders, four be connected with the activity frame between the slider, activity frame top both sides all run through and are provided with the connecting piece, two connecting piece top and bottom all are connected with the limiting plate, two at top the limiting plate top all is connected with splint, two the one end that splint are relative all is connected with the layer board. The utility model discloses a stimulate two splint to both sides respectively to drive the fly leaf rebound, the spring is compressed simultaneously, slowly loosens two splint, and two splint move the realization to the middle part simultaneously and press from both sides semiconductor silicon chip or substrate tightly, press from both sides tightly effectually, take place the skew when avoiding semiconductor silicon chip or substrate to etch, and semiconductor silicon chip or substrate location dismantlement are convenient.

Description

Conveying mechanism of etching machine

Technical Field

The utility model relates to a semiconductor silicon chip or substrate processing technology field, concretely relates to conveying mechanism of sculpture machine.

Background

A plasma etching machine, also called a plasma etching machine, a plasma plane etching machine, a plasma surface treatment instrument, a plasma cleaning system and the like, wherein the plasma etching is the most common form in dry etching, the principle is that gas exposed in an electron region forms plasma, gas consisting of ionized gas and released high-energy electrons is generated, thereby plasma or ions are formed, ionized gas atoms can release enough force to tightly adhere materials or etching surfaces with surface expulsion force when being accelerated by an electric field, and the plasma cleaning is a light condition of plasma etching to a certain extent, the equipment for carrying out the etching process substantially comprises a reaction chamber, a dry power supply and a vacuum part, a workpiece is sent into the reaction chamber pumped out by a vacuum pump, gas is introduced and is exchanged with the plasma, and the plasma reacts on the surface of the workpiece, the volatile by-products of the reaction are pumped away by the vacuum pump, the plasma etching process is actually a reactive plasma process, and the recent development is that the plasma etching process is installed in a shelf type inside the reaction chamber, the design is flexible, and the user can remove the shelf to configure a proper plasma etching method: reactive plasma (RIE), downstream plasma, direct plasma, and the processing of semiconductor silicon wafers or substrates requires the transportation of the semiconductor silicon wafers or substrates during the processing of the semiconductor silicon wafers or substrates.

The prior art has the following defects: the existing conveying mechanism of the etching machine is poor in positioning effect, when a semiconductor silicon wafer or a substrate is conveyed, the semiconductor silicon wafer or the substrate is prone to shifting, etching is not accurate, and the existing conveying mechanism of the etching machine is fixed and complex to disassemble, so that the overall practicability is poor.

The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a conveying mechanism of etching machine is through pulling two splint to both sides respectively to drive the fly leaf rebound, the spring is compressed simultaneously, slowly loosens two splint, and two splint are moved to the middle part simultaneously and are realized pressing from both sides semiconductor silicon chip or substrate tightly, and it is effectual to press from both sides tightly, takes place the skew when avoiding semiconductor silicon chip or substrate to etch, and semiconductor silicon chip or substrate location dismantlement are convenient, with the problem among the above-mentioned background art of solution.

In order to achieve the above object, the present invention provides the following technical solutions: a conveying mechanism of an etching machine comprises a frame body, wherein a positive and negative rotating motor is fixedly arranged on one side of an inner cavity of the frame body, rotating rods are arranged on two sides of the top of the frame body in a penetrating manner, two sliding blocks are sleeved outside the two rotating rods, a movable frame is connected between the four sliding blocks, connecting pieces are arranged on two sides of the top of the movable frame in a penetrating manner, limiting plates are connected to the tops and the bottoms of the two connecting pieces, clamping plates are connected to the tops of the two limiting plates at the tops, a supporting plate is connected to the opposite end of each clamping plate, a limiting rod is connected to the top of the inner side of the movable frame, a spring is sleeved outside the limiting rod, a movable plate is arranged at the bottom of the inner side of the movable frame, the limiting rod penetrates through the movable plate, the top and the bottom, the etching machine comprises a frame body, wherein the frame body is provided with a limiting plate and a movable plate, the limiting plate and the movable plate are arranged at the inner side of the frame body, the connecting plate is connected with the limiting plate and the movable plate through rotating shafts, the connecting plate is connected with the limiting plate and the movable plate at corresponding positions through rotating shafts, and the etching machine body is fixedly arranged at the top of the inner side of the fixing frame.

Preferably, the tops of the opposite ends of the two clamping plates are fixedly provided with anti-slip pads.

Preferably, two the bull stick outer peripheral face all fixedly is provided with the external screw thread, four the slider top all runs through and is provided with the screw hole, four slider threaded connection is outside at the bull stick that corresponds the position respectively.

Preferably, both sides of the top of the movable frame are fixedly provided with through grooves, and the connecting pieces are respectively arranged in the through grooves in corresponding positions.

Preferably, the bottoms of the two rotating rods are fixedly provided with belt pulleys, and a transmission belt is connected between the two belt pulleys.

Preferably, one ends of the two clamping plates which are opposite to each other are both connected with pull rings.

Preferably, a bearing is arranged at the joint of the rotating rod far away from the forward and reverse rotating motor and the frame, and the rotating rod is rotatably connected with the frame through the bearing.

In the technical scheme, the utility model provides a technological effect and advantage:

the two clamping plates are respectively pulled to two sides, the two clamping plates drive the connecting plates at the corresponding positions to be inclined from vertical, thereby driving the movable plate to move upwards, simultaneously compressing the spring, placing the semiconductor silicon chip or the substrate between the two clamping plates, slowly loosening the two clamping plates, under the action of the restoring force of the spring, the spring drives the movable plate to move downwards so as to drive the two clamping plates to simultaneously move towards the middle part to clamp the semiconductor silicon wafer or the substrate, under the action of the two anti-slip pads, the clamping effect is better, the clamping of the semiconductor silicon chip or the substrate is realized by the two clamping plates and the spring, the clamping effect is good, the semiconductor silicon chip or the substrate is prevented from deviating during etching, and the semiconductor silicon chip or the substrate is convenient to position and detach, the forward and reverse rotating motor rotates forward to drive the semiconductor silicon chip or the substrate to move upwards, and the semiconductor silicon chip or the substrate is etched through the etching machine body.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is an enlarged view of a portion a of fig. 1 according to the present invention.

Fig. 3 is an enlarged view of a portion B of fig. 1 according to the present invention.

Fig. 4 is a view of the usage scenario of fig. 1 according to the present invention.

Description of reference numerals:

1. a frame body; 2. a positive and negative rotation motor; 3. a rotating rod; 4. a slider; 5. a movable frame; 6. a connecting member; 7. a limiting plate; 8. a splint; 9. a support plate; 10. a limiting rod; 11. a spring; 12. a movable plate; 13. a connecting plate; 14. a rotating shaft; 15. a fixed mount; 16. an etching machine body; 17. a non-slip mat; 18. a belt pulley; 19. a drive belt.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.

The utility model provides a conveying mechanism of an etching machine as shown in figures 1-4, which comprises a frame body 1, wherein a positive and negative rotating motor 2 is fixedly arranged at one side of an inner cavity of the frame body 1, rotating rods 3 are arranged at both sides of the top of the frame body 1 in a penetrating way, two rotating rods 3 are sleeved outside two sliding blocks 4, four sliding blocks 4 are connected with a movable frame 5, connecting pieces 6 are arranged at both sides of the top of the movable frame 5 in a penetrating way, the tops and bottoms of the two connecting pieces 6 are connected with limiting plates 7, the tops of the two limiting plates 7 at the top are connected with clamping plates 8, one ends of the two clamping plates 8 opposite to each other are connected with a supporting plate 9, a limiting rod 10 is connected at the top of the inner side of the movable frame 5, a spring 11 is sleeved outside the limiting rod 10, a movable plate 12 is arranged at, spring 11 top and bottom are connected with movable frame 5 and fly leaf 12 respectively, equal swing joint has connecting plate 13, two between two limiting plates 7 of fly leaf 12 and bottom connecting plate 13 is provided with pivot 14 with limiting plate 7 and the fly leaf 12 junction that corresponds the position, two connecting plate 13 all rotates through pivot 14 and limiting plate 7 and the fly leaf 12 that correspond the position to be connected, 1 top of framework is connected with mount 15, the fixed etching machine body 16 that is provided with in the inboard top of mount 15.

Further, in the above technical solution, the top of the opposite end of the two clamping plates 8 is fixedly provided with a non-slip mat 17.

Furthermore, in the above technical scheme, two outer peripheral surfaces of the rotating rods 3 are all fixedly provided with external threads, the tops of the four sliding blocks 4 are all provided with threaded holes in a penetrating manner, and the four sliding blocks 4 are respectively in threaded connection with the outer portions of the rotating rods 3 at corresponding positions.

Further, in the above technical solution, through grooves are fixedly formed on both sides of the top of the movable frame 5, and the two connecting pieces 6 are respectively arranged in the through grooves at the corresponding positions.

Further, in the above technical solution, belt pulleys 18 are fixedly arranged at the bottoms of the two rotating rods 3, and a transmission belt 19 is connected between the two belt pulleys 18.

Further, in the above technical solution, the ends of the two clamping plates 8 opposite to each other are both connected with a pull ring.

Further, in the above technical solution, a bearing is disposed at a connection position of the rotating rod 3 far away from the forward and reverse rotation motor 2 and the frame 1, and the rotating rod 3 is rotatably connected with the frame 1 through the bearing.

The implementation mode is specifically as follows: when the silicon wafer or substrate clamping device is in actual use, the forward and reverse rotating motor 2 and the etching machine body 16 are connected with an external power supply through wires, two pull rings are pulled to drive the two clamping plates 8 to move towards two sides respectively, under the action of the two limiting plates 7 and the connecting piece 6 at corresponding positions, the two clamping plates 8 drive the connecting plate 13 at corresponding positions to incline from vertical, so as to drive the movable plate 12 to move upwards, meanwhile, the spring 11 is compressed, a semiconductor silicon wafer or substrate is placed between the two clamping plates 8, the two clamping plates 8 are slowly loosened, under the action of the restoring force of the spring 11, the spring 11 drives the movable plate 12 to move downwards, further, the two clamping plates 8 are driven to move towards the middle part simultaneously to clamp the semiconductor silicon wafer or substrate, under the action of the two anti-skid pads 17, the clamping effect is better, the clamping effect on the semiconductor silicon wafer, the semiconductor silicon chip or the substrate is prevented from being deviated during etching, the semiconductor silicon chip or the substrate is convenient to position and disassemble, the forward and reverse rotating motor 2 is switched on to rotate forwards, the forward and reverse rotating motor 2 drives the two rotating rods 3 to rotate simultaneously under the action of the two belt pulleys 18 and the transmission belt 19, the four sliding blocks 4 are respectively connected with the outer parts of the rotating rods 3 at corresponding positions in a threaded manner, the two rotating rods 3 drive the four sliding blocks 4 and the movable frame 5 to move upwards simultaneously when rotating, the movable frame 5 further drives the two clamping plates 8 and the semiconductor silicon chip or the substrate to move upwards simultaneously, when the semiconductor silicon chip or the substrate moves to be attached to the bottom of the etching machine body 16, the forward and reverse rotating motor 2 is closed, the semiconductor silicon chip or the substrate is etched through the etching machine body 16, and the implementation mode particularly solves the problem that the positioning effect of the existing conveying mechanism of, when the semiconductor silicon wafer or the substrate is conveyed, the semiconductor silicon wafer or the substrate is easy to shift, so that the etching is not accurate, and the conventional conveying mechanism of the etching machine is fixed and is complex to disassemble, so that the whole practicability is poor.

This practical theory of operation: through pulling two splint 8 respectively to both sides to drive fly leaf 12 rebound, spring 11 is compressed simultaneously, loosens two splint 8 slowly, and two splint 8 move the realization to the middle part simultaneously and press from both sides semiconductor silicon chip or substrate tightly, presss from both sides tightly effectually, avoids semiconductor silicon chip or substrate skew to take place when etching, and semiconductor silicon chip or substrate location dismantlement are convenient.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

Claims

1. The utility model provides a conveying mechanism of etching machine, includes framework (1), its characterized in that: a positive and negative rotation motor (2) is fixedly arranged on one side of an inner cavity of the frame body (1), rotating rods (3) are arranged on two sides of the top of the frame body (1) in a penetrating mode, two sliding blocks (4) are sleeved on the outer portions of the two rotating rods (3), a movable frame (5) is connected between the four sliding blocks (4), connecting pieces (6) are arranged on two sides of the top of the movable frame (5) in a penetrating mode, limiting plates (7) are connected to the tops and the bottoms of the two connecting pieces (6), clamping plates (8) are connected to the tops of the two limiting plates (7) on the top, supporting plates (9) are connected to the opposite ends of the two clamping plates (8), limiting rods (10) are connected to the top of the inner side of the movable frame (5), springs (11) are sleeved on the outer portions of the limiting rods, gag lever post (10) runs through fly leaf (12), spring (11) top and bottom are connected with movable frame (5) and fly leaf (12) respectively, equal swing joint has connecting plate (13), two between two limiting plate (7) of fly leaf (12) and bottom connecting plate (13) are provided with pivot (14), two with limiting plate (7) and fly leaf (12) junction that correspond the position connecting plate (13) all rotate through pivot (14) and limiting plate (7) and fly leaf (12) that correspond the position and are connected, framework (1) top is connected with mount (15), the fixed etching machine body (16) that is provided with in inboard top of mount (15).

2. The conveying mechanism of the etching machine according to claim 1, wherein: and anti-skid pads (17) are fixedly arranged at the tops of the opposite ends of the two clamping plates (8).

3. The conveying mechanism of the etching machine according to claim 1, wherein: two the outer peripheral face of bull stick (3) all fixedly is provided with the external screw thread, four slider (4) top all runs through and is provided with the screw hole, four slider (4) threaded connection respectively is in the bull stick (3) outside of corresponding position.

4. The conveying mechanism of the etching machine according to claim 1, wherein: both sides of the top of the movable frame (5) are fixedly provided with through grooves, and the connecting pieces (6) are respectively arranged in the through grooves corresponding to the positions.

5. The conveying mechanism of the etching machine according to claim 1, wherein: the bottom of each rotating rod (3) is fixedly provided with a belt pulley (18), and a transmission belt (19) is connected between the two belt pulleys (18).

6. The conveying mechanism of the etching machine according to claim 1, wherein: one ends of the two clamping plates (8) which are back to back are both connected with pull rings.

7. The conveying mechanism of the etching machine according to claim 1, wherein: the bearing is arranged at the joint of the rotating rod (3) far away from the forward and reverse rotating motor (2) and the frame body (1), and the rotating rod (3) is rotatably connected with the frame body (1) through the bearing.