JP2009295751A - Substrate holding mechanism, and substrate holding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holding mechanism capable of holding a substrate with a simpler configuration. <P>SOLUTION: The substrate holding mechanism includes: a base 1; a plurality of substrate-support members 2 supported by the base 1 and configured to be movable in a vertical direction relative to the base 1; substrate-clamp portions 28 provided on upper ends of the substrate-support members 2 respectively; a drive mechanism 20 configured to move the substrate-support members 2 in the vertical direction; a first magnet 31 attached to one of at least one of substrate-support members 2 and the base 1; and a second magnet 32 attached to the other of at least one of substrate-support members 2 and the base 1. The first magnet 31 is arranged so as to be in close proximity to the second magnet 32 accompanying the vertical movement of the substrate-support members 2, and when the first magnet 31 is made close to the second magnet 32, magnetic force generated between the first magnet 31 and the second magnet 32 causes the substrate-support member 2 to move in a direction such that the substrate-holding portion 28 presses the end part of a substrate W. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate gripping mechanism and a substrate gripping method, and more particularly to a substrate gripping mechanism that is suitably incorporated in a cleaning device or a drying device for a substrate such as a semiconductor wafer.

  In the semiconductor device manufacturing process, the substrate is subjected to a cleaning process and a drying process after the polishing process and the plating process. For example, in the substrate cleaning process, the substrate is rotated while the substrate is held by the substrate holding mechanism, and the cleaning liquid is supplied to the substrate in this state. As a conventional substrate gripping mechanism, a mechanism for gripping a substrate by driving a chuck by an actuator or the like is known.

Japanese Patent Laid-Open No. 11-058226 Japanese Patent Laid-Open No. 11-090355

  The present invention relates to an improvement of a conventional substrate gripping mechanism, and an object thereof is to provide a substrate gripping mechanism that can grip a substrate with a simpler configuration.

  In order to achieve the above-described object, one embodiment of the present invention includes a base, a plurality of substrate support members that are supported by the base and are relatively movable in the vertical direction with respect to the base, and the substrate support. A substrate gripping portion provided at each upper end of the member, a drive mechanism for moving the substrate support member up and down, and interlocking with the lowering of the substrate support member, the substrate gripping portion on at least one of the substrate support members A substrate gripping mechanism comprising a pressing mechanism that presses against a substrate and moves the substrate gripping portion away from the substrate in conjunction with the ascent of the substrate support member.

In a preferred aspect of the present invention, the pressing mechanism is a rotation mechanism that rotates the at least one substrate support member around its axis in conjunction with the vertical movement of the substrate support member.
In a preferred aspect of the present invention, the substrate gripping portion is a cylindrical clamp disposed eccentrically from the axis of the substrate support member.

In a preferred aspect of the present invention, the pressing mechanism includes: a first magnet attached to any one of the at least one substrate support member and the base; the at least one substrate support member; A second magnet attached to the other of the bases, and the first magnet is disposed so as to be close to the second magnet as the substrate support member moves up and down. When the first magnet and the second magnet come close to each other, the substrate gripping portion presses the peripheral edge of the substrate by the magnetic force generated between the first magnet and the second magnet. The substrate support member is moved in a direction to be moved.
In a preferred aspect of the present invention, a third magnet is further attached to the at least one substrate support member or the base on which the second magnet is attached, and the first magnet includes: Along with the vertical movement of the substrate support member, the substrate support member is disposed so as to be close to one of the second magnet and the third magnet.

In a preferred aspect of the present invention, when the first magnet and the second magnet are close to each other, the substrate gripping portion is formed on the substrate by a magnetic force generated between the first magnet and the second magnet. The substrate support member is rotated about its axis in the direction of pressing the peripheral end, and when the first magnet and the third magnet approach each other, the first magnet and the third magnet The substrate supporting member is rotated about its axis in a direction in which the substrate gripping portion is separated from the substrate by a magnetic force generated during the period.
In a preferred aspect of the present invention, the second magnet and the third magnet are spaced apart from each other in the vertical direction.

In a preferred aspect of the present invention, the at least one substrate support member is formed with a groove extending along an axis thereof, and the base is provided with a protrusion that gently engages with the groove. It is characterized by.
In a preferred aspect of the present invention, the pressing mechanism includes a spiral groove formed in the at least one substrate support member, and a pin provided on the base that engages with the spiral groove. .
In a preferred aspect of the present invention, the plurality of substrate support members are at least four substrate support members, and two substrate support members facing each other among the substrate support members move up and down without rotating. And
In a preferred aspect of the present invention, a mechanism for rotating the base and the plurality of substrate support members is further provided.

  Another aspect of the present invention includes a base, a plurality of substrate support members supported by the base, a substrate gripping portion and a positioning portion provided at an upper end of the substrate support member, and the substrate support member. A rotation mechanism that rotates at least one of the substrate support member about an axis thereof, the substrate gripping part is arranged eccentrically from an axis of the substrate support member, and the positioning part is formed in a circle concentric with the substrate support member. A substrate gripping mechanism having a side surface curved along the substrate.

Another aspect of the present invention relates to a method for gripping a substrate, a gripping step of gripping the substrate by pressing the substrate by a substrate gripping portion provided at the upper end of the plurality of substrate support members, and the support of the plurality of substrates. A separation step of raising the member to separate the substrate gripping part from the substrate, wherein the gripping step and the separation step are performed by moving the plurality of substrate support members up and down. .
According to another aspect of the present invention, there is provided a method for gripping a substrate, the step of placing a substrate on a plurality of substrate support members, and lowering the plurality of substrate support members so as to be placed on upper ends of the plurality of substrate support members. A gripping step of gripping the substrate by pressing the substrate with the substrate gripping portion provided, and a separating step of lifting the plurality of substrate support members to separate the substrate gripping portion from the substrate, The gripping step and the separation step are performed by an operation of moving the plurality of substrate support members up and down.

In a preferred aspect of the present invention, the holding step presses the substrate holding portion against the substrate by rotating at least one of the plurality of substrate support members.
In a preferred aspect of the present invention, two substrate support members facing each other among the plurality of substrate support members move up and down without rotating.

According to another aspect of the present invention, in a method of cleaning while gripping a substrate, the substrate is gripped by pressing the substrate with a substrate gripping portion provided at the upper ends of a plurality of substrate support members covered with a rotating cover. A gripping step; a cleaning step of cleaning the substrate by supplying a cleaning liquid onto the substrate while rotating the substrate gripped by the substrate gripping portion; and raising the plurality of substrate support members to raise the substrate gripping portion A separation step of separating the substrate from the substrate, wherein the gripping step and the separation step are performed by moving the plurality of substrate support members up and down.
According to another aspect of the present invention, in a method of drying while gripping a substrate, the substrate is gripped by pressing the substrate with a substrate gripping portion provided at the upper ends of a plurality of substrate support members covered with a rotating cover. A gripping step, a drying step of drying the substrate by supplying vapor containing isopropyl alcohol onto the substrate while rotating the substrate gripped by the substrate gripping unit, and raising the plurality of substrate support members A separation step of separating the substrate gripping part from the substrate, wherein the gripping step and the separation step are performed by an operation of moving the plurality of substrate support members up and down.

  According to the present invention, since the gripping force of the substrate is generated as the substrate support member moves up and down, an electric actuator or the like can be eliminated, and a substrate gripping mechanism with a simple configuration is realized. The substrate gripping mechanism according to the present invention can be applied to a cleaning device that supplies a cleaning liquid to a substrate while rotating the substrate, a drying device that rotates the substrate, and dries the substrate. Since the substrate gripping mechanism has a simple structure and is lightweight, the rotational load on the rotating body is reduced, and the life of the substrate gripping mechanism is extended. Further, there is an advantage that the cleaning liquid is less scattered.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a longitudinal sectional view showing a substrate gripping mechanism according to the first embodiment of the present invention. FIG. 2 is a plan view showing the substrate gripping mechanism according to the first embodiment.

  As shown in FIGS. 1 and 2, the substrate gripping mechanism includes a base 1 having four arms 1a and four cylindrical substrate support members 2 supported at the tips of the arms 1a. Yes. The base 1 is fixed to the upper end of the rotating shaft 5, and the rotating shaft 5 is rotatably supported by a bearing 6. The bearing 6 is fixed to the inner peripheral surface of a cylindrical body 7 extending in parallel with the rotary shaft 5. The lower end of the cylindrical body 7 is attached to the gantry 9 and its position is fixed. The gantry 9 is fixed to the frame 10. The rotating shaft 5 is connected to a motor 15 via pulleys 11 and 12 and a belt 14, and by driving the motor 15, the base 1 rotates about its axis. A symbol W is a substrate such as a semiconductor wafer.

  Around the cylindrical body 7, a lift mechanism 20 for lifting the substrate support member 2 is disposed. The lift mechanism 20 is configured to be slidable in the vertical direction with respect to the cylindrical body 7. The lift mechanism 20 has a contact plate 20 a that contacts the lower end of the substrate support member 2. A first gas chamber 21 and a second gas chamber 22 are formed between the outer peripheral surface of the cylindrical body 7 and the inner peripheral surface of the lift mechanism 20. The first gas chamber 21 and the second gas chamber 22 communicate with the first gas channel 24 and the second gas channel 25, respectively. The end of the gas channel 25 is connected to a pressurized gas supply source (not shown). When the pressure in the first gas chamber 21 is made higher than the pressure in the second gas chamber 22, the lift mechanism 20 rises as shown in FIG. On the other hand, when the pressure in the second gas chamber 22 is made higher than the pressure in the first gas chamber 21, the lift mechanism 20 is lowered as shown in FIG.

  4A is a plan view showing a part of the substrate support member 2 and the arm 1a shown in FIG. 2, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. c) is a sectional view taken along line BB in FIG. The arm 1a of the base 1 has a holding portion 1b that holds the substrate support member 2 in a slidable manner. In addition, you may comprise this holding | maintenance part 1b integrally with the arm 1a. A through hole extending in the vertical direction is formed in the holding portion 1b, and the substrate support member 2 is inserted into the through hole. The diameter of the through hole is slightly larger than the diameter of the substrate support member 2, so that the substrate support member 2 can move relative to the base 1 in the vertical direction, and the substrate support member 2 has its axis. It can be rotated around.

  A spring receiver 2 a is attached to the lower part of the substrate support member 2. A spring 27 is disposed around the substrate support member 2, and the spring 27 is supported by the spring receiver 2a. The upper end of the spring 27 presses the holding portion 1b (a part of the base 1). Accordingly, a downward force is applied to the substrate support member 2 by the spring 27. A stopper 2 b having a diameter larger than the diameter of the through hole is formed on the outer peripheral surface of the substrate support member 2. Therefore, as shown in FIG. 4B, the substrate support member 2 is restricted from moving downward by the stopper 2b.

  At the upper end of the substrate support member 2, a support pin 29 on which the substrate W is placed and a cylindrical clamp 28 as a substrate gripping portion that comes into contact with the peripheral end of the substrate W are provided. The support pins 29 are disposed on the axis of the substrate support member 2, and the clamps 28 are disposed at positions separated from the axis of the substrate support member 2. Accordingly, the clamp 28 can rotate around the axis of the substrate support member 2 as the substrate support member 2 rotates.

  A first magnet 31 is attached to the holding portion 1 b of the base 1, and the first magnet 31 is disposed to face the side surface of the substrate support member 2. On the other hand, the substrate support member 2 is provided with a second magnet 32 and a third magnet 33. The second magnet 32 and the third magnet 33 are arranged apart from each other in the vertical direction. As these 1st-3rd magnets 31, 32, 33, a neodymium magnet is used suitably.

  FIG. 5 is a schematic diagram for explaining the arrangement of the second magnet 32 and the third magnet 33, and is a view seen from the axial direction of the substrate support member 2. As shown in FIG. 5, the second magnet 32 and the third magnet 33 are arranged so as to be shifted in the circumferential direction of the substrate support member 2. That is, the line connecting the second magnet 32 and the center of the substrate support member 2 and the line connecting the second magnet 32 and the center of the substrate support member 2 are viewed from the axial direction of the substrate support member 2. Sometimes they intersect at a predetermined angle α.

  When the substrate support member 2 is in the lowered position shown in FIG. 4B, the first magnet 31 and the second magnet 32 face each other. At this time, an attractive force acts between the first magnet 31 and the second magnet 32. This suction force gives the substrate support member 2 a force that rotates around its axis, and the rotation direction is a direction in which the clamp 28 presses the peripheral end of the substrate W. Therefore, the lowered position shown in FIG. 4B can be said to be a clamp position for gripping the substrate W.

  Note that the first magnet 31 and the second magnet 32 do not necessarily have to face each other when the substrate W is gripped as long as they are close enough to generate a sufficient gripping force. For example, even when the first magnet 31 and the second magnet 32 are close to each other in an inclined state, a magnetic force is generated between them. Therefore, the first magnet 31 and the second magnet 32 do not necessarily have to face each other as long as the magnetic force is large enough to rotate the substrate support member 2 and grip the substrate W.

FIG. 6A is a plan view showing a part of the substrate support member 2 and the arm 1a when the substrate support member 2 is lifted by the lift mechanism 20, and FIG. FIG. 6 is a cross-sectional view taken along line AA in FIG. 2 when the support member 2 is raised, and FIG. 6C is a cross-sectional view taken along line CC in FIG.
When the substrate holding portion 1b is raised to the raised position shown in FIG. 6B by the lift mechanism 20, the first magnet 31 and the third magnet 33 face each other, and the second magnet 32 is the first magnet. Separated from 31. At this time, an attractive force acts between the first magnet 31 and the third magnet 33. This suction force gives the substrate support member 2 a force to rotate around its axis, and the rotation direction is a direction in which the clamp 28 is separated from the substrate W. Therefore, it can be said that the raised position shown in FIG. 6A is an unclamping position for releasing the substrate. Also in this case, the first magnet 31 and the third magnet 33 do not necessarily have to face each other when the holding of the substrate W is released, and the substrate support member 2 in the direction in which the clamp 28 is separated from the substrate W. As long as they are close enough to generate a rotational force (magnetic force) of rotating the.

  Since the second magnet 32 and the third magnet 33 are arranged at positions shifted in the circumferential direction of the substrate support member 2, a rotational force is exerted on the substrate support member 2 as the substrate support member 2 moves up and down. Works. This rotational force gives the clamp 28 a force for gripping the substrate W and a force for opening the substrate W. Therefore, the substrate W can be gripped and released simply by moving the substrate support member 2 up and down. Thus, the first magnet 31, the second magnet 32, and the third magnet 33 rotate the substrate support member 2 around its axis and grip the substrate W by the clamp 28 (rotation mechanism). ). This gripping mechanism (rotating mechanism) is operated by the vertical movement of the substrate support member 2.

  The contact plate 20 a of the lift mechanism 20 is located below the substrate support member 2. When the contact plate 20a rises, the upper surface of the contact plate 20a comes into contact with the lower end of the substrate support member 2, and the substrate support member 2 is lifted by the contact plate 20a against the pressing force of the spring 27. The upper surface of the contact plate 20a is a flat surface, while the lower end of the substrate support member 2 is formed in a hemispherical shape. In the present embodiment, the lift mechanism 20 and the spring 27 constitute a drive mechanism that moves the substrate support member 2 up and down. Note that the drive mechanism is not limited to the above-described embodiment, and for example, a configuration using a servo motor may be employed.

Fig.7 (a) is the side view which looked at the board | substrate support member 2 in a clamp position from another angle, FIG.7 (b) is the DD sectional view taken on the line of Fig.7 (a). FIG. 8A is a side view of the substrate support member 2 in the unclamping position as seen from another angle, and FIG. 8B is a cross-sectional view taken along the line EE of FIG.
A groove 40 extending along the axis is formed on the side surface of the substrate support member 2. The groove 40 has an arcuate horizontal cross section. A protrusion 41 that protrudes toward the groove 40 is formed on the arm 1 a (the holding portion 1 b in this embodiment) of the base 1. The tip of the protrusion 41 is located inside the groove 40, and the protrusion 41 is gently engaged with the groove 40.

  The groove 40 and the protrusion 41 are provided to limit the rotation angle of the substrate support member 2. More specifically, as shown in FIGS. 7B and 8B, when the substrate support member 2 rotates between the clamp position and the unclamp position, the protrusion 41 does not contact the groove 40. . Therefore, the board | substrate support member 2 can rotate freely with the magnetic force which acts between the magnets mentioned above. On the other hand, when the substrate support member 2 tries to rotate beyond the clamping position and the unclamping position, the protrusion 41 contacts the groove 40, thereby preventing the substrate support member 2 from rotating excessively. Thus, since the protrusion 41 and the groove 40 function as a stopper, when the substrate support member 2 moves up and down, one of the second magnet 32 and the third magnet 33 is always the first magnet. It is located in the vicinity of 31.

Here, the operation of the substrate gripping mechanism configured as described above will be described.
While the substrate gripping mechanism stands by at the unclamping position shown in FIG. 6B, the substrate W is placed on the support pins 29 by a transport mechanism (not shown) such as a transport robot. Thereafter, the lift mechanism 20 is lowered, and the substrate support member 2 is lowered to the clamp position shown in FIG. While the substrate support member 2 is lowered, the second magnet 32 faces the first magnet 31, thereby rotating the substrate support member 2. By the rotation of the substrate support member 2, the side surface of the clamp 28 comes into contact with the peripheral end portion of the substrate W, and the substrate W is held by the clamp 28. The contact area between the tip of the support pin 29 and the substrate W is extremely small. Similarly, the contact area between the side surface of the clamp 28 and the substrate W is extremely small, so that contamination of the substrate W due to contact with members other than the substrate W is prevented. be able to. Here, as the member in contact with the substrate W, it is preferable to use a conductive member (preferably iron, aluminum, SUS) or a carbon resin such as PEEK or PVC in order to prevent electrification.

  When the motor 15 is driven, the substrate W rotates integrally with the substrate support member 2. When the rotation stops, the four substrate support members 2 and the four contact plates 20a of the lift mechanism 20 are aligned. That is, the rotation of the base 1 is stopped so that each substrate support member 2 is positioned above the contact plate 20a. When the substrate support member 2 is raised by the lift mechanism 20, the substrate support member 2 rotates around its axis and the clamp 28 is separated from the substrate W. As a result, the substrate W is simply placed on the support pins 29 and is taken out of the substrate gripping mechanism by the transport mechanism.

  FIG. 9A is an enlarged plan view showing a modification of the substrate support member 2 and the clamp (substrate gripping portion) 28, and FIG. 9B is the substrate support member 2 and the clamp 28 shown in FIG. 9A. FIG. 9A and 9B show only a part of the substrate support member 2. FIG.

  At the upper end of the substrate support member 2, there are a cylindrical clamp 28 as a substrate gripping portion that contacts the peripheral end of the substrate W, and a positioning portion 46 that extends from the clamp 28 toward the axis of the substrate support member 2. Is provided. One end of the positioning portion 46 is integrally connected to the side surface of the clamp 28, and the other end is located on the axis of the substrate support member 2. The end portion on the center side of the positioning portion 46 has a side surface 46 a that is curved along a circle concentric with the substrate support member 2. That is, the horizontal cross section of the center side end portion of the positioning portion 46 is constituted by a part of a circle concentric with the substrate support member 2. The upper end of the substrate support member 2 is a tapered surface that is inclined downward.

  FIG. 10A is a plan view showing a state where the substrate is gripped, and FIG. 10B is a plan view showing a state where the grip of the substrate is released. The substrate W is placed on the upper end (tapered surface) of the substrate support member 2, and the clamp 28 is brought into contact with the peripheral end portion of the substrate W by rotating the substrate support member 2. As a result, the substrate W is held by the clamp 28 as shown in FIG. When the substrate support member 2 is rotated in the opposite direction, as shown in FIG. 10B, the clamp 28 is separated from the substrate W, thereby releasing the substrate W. At this time, as the substrate support member 2 rotates, the peripheral end portion of the substrate W comes into sliding contact with the side surface 46 a of the center side end portion of the positioning portion 46. Therefore, the side surface 46a of the positioning portion 46 prevents the position of the substrate W from being displaced with the rotation of the substrate support member 2, and the stability of subsequent substrate conveyance can be improved.

  FIG. 11A is a cross-sectional view showing a part of the substrate gripping mechanism according to the second embodiment of the present invention, and FIG. 11B is a side view showing the substrate support member shown in FIG. It is. Note that the configuration and operation of the present embodiment that are not specifically described are the same as those of the first embodiment, and thus redundant description thereof is omitted.

  A spiral groove 47 is formed on the side surface of the substrate support member 2. The spiral groove 47 has a portion that is slightly inclined with respect to the axis of the substrate support member 2. The upper and lower portions of the spiral groove 47 extend in parallel with the axis of the substrate support member 2. A pin 48 that gently engages the spiral groove 47 is provided in the holding portion 1b. According to such a configuration, when the substrate support member 2 moves up and down, the substrate support member 2 rotates by a predetermined angle around its axis by the engagement between the spiral groove 47 and the pin 48. When the substrate support member 2 rotates, the clamp 28 moves in a direction in which the clamp 28 contacts and separates from the peripheral end of the substrate W. Therefore, in the present embodiment, the spiral groove 47 and the pin 48 function as a gripping mechanism (rotating mechanism) that rotates the substrate support member 2 around its axis and grips the substrate W by the clamp 28. This gripping mechanism (rotating mechanism) is operated by the vertical movement of the substrate support member 2.

  FIG. 12 is a longitudinal sectional view showing an example in which the rotation cover 50 is attached to the substrate gripping mechanism according to the first embodiment. The left half of FIG. 12 shows a state where the substrate is gripped, and the right half shows a state where the grip of the substrate is opened. In FIG. 12, the rotary shaft 5, the cylindrical body 7, the lift mechanism 20, and the like are schematically shown, but their detailed configurations are as shown in FIG. FIG. 12 shows a longitudinal section of the rotary cover 50.

  As shown in FIG. 12, the rotary cover 50 is fixed to the upper surface of the base 1 and is disposed so as to surround the substrate W. The vertical cross-sectional shape of the rotary cover 50 is inclined radially inward. The upper end of the rotation cover 50 is close to the substrate W, and the inner diameter of the upper end of the rotation cover 50 is set to be slightly larger than the diameter of the substrate W. Further, at the upper end of the rotary cover 50, a notch 50 a along the outer peripheral surface shape of the substrate support member 2 is formed corresponding to each substrate support member 2. A liquid discharge hole 51 extending obliquely is formed on the bottom surface of the rotary cover 50.

  Such a substrate gripping mechanism to which the rotary cover 50 is attached can be suitably applied to a substrate processing apparatus that uses a liquid. For example, the substrate gripping mechanism can be applied to a substrate cleaning apparatus that supplies a cleaning liquid to the upper surface of the substrate while rotating the substrate. The cleaning liquid (for example, pure water) supplied to the upper surface of the substrate jumps out from the peripheral end portion of the substrate by centrifugal force and is captured by the inner peripheral surface of the rotating cover 50 that rotates at the same rotational speed as the substrate. Since the inner peripheral surface of the rotary cover 50 is inclined, the cleaning liquid is forced to flow downward by centrifugal force and is discharged downward from the liquid discharge hole 51 of the rotary cover 50. As described above, since the rotary cover 50 rotates integrally with the substrate, the liquid does not rebound so that the watermark can be prevented from being formed on the substrate. In order to clean the substrate, by using the substrate gripping mechanism shown in FIG. 12, the substrate W is gripped by pressing the substrate W by the substrate gripping portions 28 provided at the upper ends of the plurality of substrate support members 2. While rotating the substrate W gripped by the grip portion 28, a cleaning liquid is supplied onto the substrate W to clean the substrate W, and then the plurality of substrate support members 2 are raised to separate the substrate grip portion 28 from the substrate W. A series of operations up to this time can be performed by an operation of moving the plurality of substrate support members 2 up and down, and the substrate can be cleaned without applying an external force that adversely affects mechanically.

The substrate gripping mechanism described above can be applied to various types of processing apparatuses other than the substrate cleaning apparatus. For example, the substrate gripping mechanism shown in FIG. 12 can be applied to a Rotagoni type drying apparatus. In this Rotagoni drying, IPA vapor (mixture of isopropyl alcohol and N ₂ gas) and pure water are respectively supplied from two nozzles arranged in parallel to the surface of the rotating substrate, and the two nozzles are aligned along the radial direction of the substrate. The surface of the substrate is dried by moving the substrate. This rotagoni drying is attracting attention as a drying method for suppressing the formation of watermarks. In order to dry the substrate W, by using the substrate gripping mechanism shown in FIG. 12, the substrate W is gripped by pressing the substrate W by the substrate gripping portions 28 provided at the upper ends of the plurality of substrate support members 2, While rotating the substrate W gripped by the substrate gripping portion 28, IPA vapor containing isopropyl alcohol is supplied onto the substrate W to dry the substrate W, and then the plurality of substrate support members 2 are raised to raise the substrate gripping portion. A series of operations until the 28 is separated from the substrate can be performed by moving the plurality of substrate supporting members 2 up and down, and the substrate is handled without applying a mechanical external force that adversely affects the substrate 28. be able to. Furthermore, it becomes possible to reduce the influence of water droplets scattered by centrifugal force during drying.

  The substrate gripping mechanism according to the above-described embodiment is configured such that all four substrate support members generate a substrate gripping force by rotation. For example, two of the four facing members are only in the vertical direction. It can also be configured so that it can move and does not rotate about its axis. In this case, two non-rotating substrate support members can function as substrate positioning. Further, the number of substrate support members may be three, or five or more substrate support members may be included. When three substrate support members are provided, the rotation mechanism (magnet or spiral groove) described above can be provided in only one of them.

  Furthermore, in the first embodiment described above, the first magnet 31 is attached to the base 1 and the second magnet 32 and the third magnet 33 are attached to the substrate support member 2. It is not limited to this arrangement. For example, the first magnet 31 may be attached to the substrate support member 2, and the second magnet 32 and the third magnet 33 may be attached to the base 1.

  The embodiment described above is described for the purpose of enabling the person having ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention should not be limited to the described embodiments, but should be the widest scope according to the technical idea defined by the claims.

It is a longitudinal cross-sectional view which shows the board | substrate holding | grip mechanism which concerns on the 1st Embodiment of this invention. It is a top view which shows the board | substrate holding | grip mechanism which concerns on the 1st Embodiment of this invention. It is a longitudinal cross-sectional view which shows the state which the lift mechanism raised. 4A is a plan view showing a part of the substrate support member and the arm shown in FIG. 2, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. 2, and FIG. FIG. 5 is a cross-sectional view taken along line BB in FIG. It is a schematic diagram for demonstrating arrangement | positioning of a 2nd magnet and a 3rd magnet. FIG. 6A is a plan view showing a part of the substrate support member and the arm when the substrate support member is lifted by the lift mechanism, and FIG. 6B is a view of raising the substrate support member by the lift mechanism. FIG. 6 is a cross-sectional view taken along line AA in FIG. 2, and FIG. 6C is a cross-sectional view taken along line CC in FIG. 6B. Fig.7 (a) is the side view which looked at the board | substrate support member in a clamp position from another angle, FIG.7 (b) is the DD sectional view taken on the line of Fig.7 (a). FIG. 8A is a side view of the substrate support member in the unclamping position as seen from another angle, and FIG. 8B is a cross-sectional view taken along the line E-E in FIG. FIG. 9A is an enlarged plan view showing a modified example of the substrate support member and the clamp, and FIG. 9B is a side view of the substrate support member and the clamp shown in FIG. 9A. FIG. 10A is a plan view showing a state where the substrate is gripped, and FIG. 10B is a plan view showing a state where the grip of the substrate is released. FIG. 11A is a cross-sectional view showing a part of the substrate gripping mechanism according to the second embodiment of the present invention, and FIG. 11B is a side view showing the substrate support member shown in FIG. It is. It is a longitudinal cross-sectional view which shows the example which attached the rotation cover to the board | substrate holding | grip mechanism which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2 Substrate support member 5 Rotating shaft 6 Bearing 7 Cylindrical body 9 Base 10 Frame 11, 12 Pulley 14 Belt 15 Motor 20 Lift mechanism 21 First gas chamber 22 Second gas chamber 24 First gas flow path 25 Second gas flow path 27 Spring 28 Clamp (substrate gripping part)
29 support pin 31 1st magnet 32 2nd magnet 33 3rd magnet 40 groove 41 projection part 46 positioning part 47 spiral groove 48 pin 50 rotation cover 51 liquid discharge hole

Claims (18)

The base,
A plurality of substrate support members supported by the base and movable relative to the base in the vertical direction;
A substrate gripping portion provided at each of the upper ends of the substrate support members;
A drive mechanism for moving the substrate support member up and down;
In conjunction with the lowering of the substrate support member, the substrate gripping portion on at least one of the substrate support members is pressed against the substrate, and in conjunction with the ascent of the substrate support member, the substrate gripping portion is separated from the substrate. A substrate gripping mechanism comprising a pressing mechanism.   The substrate pressing mechanism according to claim 1, wherein the pressing mechanism is a rotating mechanism that rotates the at least one substrate supporting member around its axis in conjunction with the vertical movement of the substrate supporting member. .   The substrate gripping mechanism according to claim 2, wherein the substrate gripping portion is a cylindrical clamp disposed eccentrically from an axis of the substrate support member. The pressing mechanism is
A first magnet attached to any one of the at least one substrate support member and the base;
A second magnet attached to the other of the at least one substrate support member and the base;
The first magnet is arranged to be in a position close to the second magnet as the substrate support member moves up and down.
A direction in which the substrate gripping portion presses the peripheral end portion of the substrate by the magnetic force generated between the first magnet and the second magnet when the first magnet and the second magnet approach each other. The substrate gripping mechanism according to claim 1, wherein the substrate support member is moved in a step. A third magnet is further attached to the at least one substrate support member or the base to which the second magnet is attached,
The first magnet is arranged to be in a position close to one of the second magnet and the third magnet as the substrate support member moves up and down. The board | substrate holding | grip mechanism of Claim 4. A direction in which the substrate gripping portion presses the peripheral end portion of the substrate by the magnetic force generated between the first magnet and the second magnet when the first magnet and the second magnet approach each other. The substrate support member is rotated around its axis,
When the first magnet and the third magnet come close to each other, the substrate holding portion is supported in a direction in which the substrate gripping portion is separated from the substrate by a magnetic force generated between the first magnet and the third magnet. 6. The substrate gripping mechanism according to claim 5, wherein the member is rotated about its axis.   The substrate holding mechanism according to claim 5, wherein the second magnet and the third magnet are spaced apart from each other in the vertical direction. The at least one substrate support member is formed with a groove extending along its axis.
The substrate gripping mechanism according to claim 1, wherein the base is provided with a protrusion that gently engages with the groove. The pressing mechanism is
A spiral groove formed in the at least one substrate support member;
The substrate gripping mechanism according to claim 1, further comprising a pin that is provided on the base and engages with the spiral groove. The plurality of substrate support members are at least four substrate support members;
The substrate holding mechanism according to claim 2, wherein two of the substrate support members facing each other move up and down without rotating.   The substrate gripping mechanism according to claim 1, further comprising a mechanism for rotating the base and the plurality of substrate support members. The base,
A plurality of substrate support members supported by the base;
A substrate gripping portion and a positioning portion respectively provided at the upper end of the substrate support member;
A rotation mechanism for rotating at least one of the substrate support members around an axis thereof;
The substrate gripping part is arranged eccentric from the axis of the substrate support member,
The substrate gripping mechanism, wherein the positioning portion has a side surface that curves along a circle concentric with the substrate support member. In a method of gripping a substrate,
A gripping step of gripping the substrate by pressing the substrate with a substrate gripping portion provided at the upper ends of the plurality of substrate support members;
A separation step of raising the plurality of substrate support members to separate the substrate gripping portion from the substrate,
The substrate holding method, wherein the holding step and the separating step are performed by moving the plurality of substrate support members up and down. In a method of gripping a substrate,
Placing a substrate on a plurality of substrate support members;
A gripping step of gripping the substrate by lowering the plurality of substrate support members and pressing the substrate by a substrate gripping portion provided at an upper end of the plurality of substrate support members;
A separation step of raising the plurality of substrate support members and separating the substrate gripping portion from the substrate,
The substrate holding method, wherein the holding step and the separating step are performed by moving the plurality of substrate support members up and down.   15. The substrate holding method according to claim 13, wherein the holding step presses the substrate holding portion against the substrate by rotating at least one of the plurality of substrate support members.   The substrate holding method according to claim 15, wherein two substrate support members facing each other among the plurality of substrate support members move up and down without rotating. In the method of cleaning while gripping the substrate,
A gripping step of gripping the substrate by pressing the substrate by a substrate gripping portion provided at the upper ends of the plurality of substrate support members covered by the rotation cover;
A cleaning step of cleaning the substrate by supplying a cleaning liquid onto the substrate while rotating the substrate held by the substrate holding unit;
A separation step of raising the plurality of substrate support members to separate the substrate gripping portion from the substrate,
The method, wherein the gripping step and the separating step are performed by moving the plurality of substrate support members up and down. In the method of drying while gripping the substrate,
A gripping step of gripping the substrate by pressing the substrate by a substrate gripping portion provided at the upper ends of the plurality of substrate support members covered by the rotation cover;
A drying step of drying the substrate by supplying a vapor containing isopropyl alcohol onto the substrate while rotating the substrate held by the substrate holding unit;
A separation step of raising the plurality of substrate support members to separate the substrate gripping portion from the substrate,
The method, wherein the gripping step and the separating step are performed by moving the plurality of substrate support members up and down.

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