CN218878674U

CN218878674U - Conveying device for semiconductor wafer

Info

Publication number: CN218878674U
Application number: CN202223228508.6U
Authority: CN
Inventors: 周君; 周小鎏
Original assignee: Jiangsu Techwell Automation Equipment Co ltd
Current assignee: Jiangsu Techwell Automation Equipment Co ltd
Priority date: 2022-12-03
Filing date: 2022-12-03
Publication date: 2023-04-18
Anticipated expiration: 2032-12-03

Abstract

The utility model discloses a conveyor that semiconductor wafer used relates to semiconductor processing technology field. The utility model discloses a return flexible subassembly of shape conveyer belt, lower fixed subassembly and go up fixed subassembly, return and be provided with a plurality of manipulator subassemblies on the shape conveyer belt, return and be provided with a plurality of flexible subassemblies on the shape conveyer belt, be provided with down fixed subassembly on the flexible subassembly, fixed subassembly top is provided with fixed subassembly down. The size of the groove of the fixed base is gradually reduced from the top end to the bottom end, so that the fixed base is suitable for wafers with different sizes and can convey wafers with different sizes; the bottom of the groove of the fixed base is a conical groove which can be used for placing the bottom of the wafer rod, when the telescopic component drives the lower fixed component to move, the fixed block in the upper fixed component moves along with the lower fixed component, one side of the fixed block contacts with the outer wall of the wafer rod and fixes the wafer rod, and the wafer rod can be transported.

Description

Conveying device for semiconductor wafer

Technical Field

The utility model belongs to the technical field of semiconductor processing, particularly, conveyor that in particular to semiconductor wafer used.

Background

The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined in electric arc furnace, chloridized by hydrochloric acid, and distilled to obtain high-purity polycrystalline silicon, then the polycrystalline silicon is melted by wafer manufacturer, and then the seed crystal is seeded in the solution, then slowly pulled out to form cylindrical monocrystalline silicon ingot, and then the silicon ingot is undergone the processes of cutting, rolling grinding, slicing, chamfering, polishing, laser-etching and packaging so as to obtain the invented silicon wafer as basic raw material for integrated circuit factory.

In the semiconductor industry, when wafers are conveyed, the process is generally performed by a single mechanical arm for multiple processes, the capacity is low, the conveying sequence is disordered, the efficiency is low, and meanwhile, the mechanical arm can only convey a certain specific wafer and can only convey the wafer but not the wafer rod.

SUMMERY OF THE UTILITY MODEL

To solve the problems in the related art, the present invention provides a conveying device for semiconductor wafers to overcome the above technical problems in the related art.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a conveyor that semiconductor wafer was used, including returning shape conveyer belt, flexible pole subassembly, lower fixed subassembly and going up fixed subassembly, it is provided with manipulator assembly to return shape conveyer belt one side, it is provided with a plurality of flexible subassemblies on the conveyer belt to return to shape, be provided with down fixed subassembly on the flexible subassembly, fixed subassembly top is provided with fixed subassembly down.

Furthermore, the lower fixing assembly comprises a plurality of fixing bases and a plurality of fixing rods, sliding grooves are formed in two sides below the fixing bases, grooves are formed in one sides of the fixing bases, and the fixing rods are arranged on the top ends of the fixing bases close to two sides.

Furthermore, the upper fixing component comprises a plurality of supporting blocks, a plurality of springs, a fixing plate, a plurality of guide rods and a spring cavity, the spring cavity is formed in one side of each supporting block and close to the top end of the supporting block, the springs are arranged in the spring cavity and fixedly connected with the fixing plate, the guide rods are arranged on one side of the fixing plate and close to the supporting blocks, a plurality of slotted holes are formed in one side of each supporting block and close to the supporting blocks, the slotted holes are in sliding fit with the guide rods, and the top ends of the supporting blocks are provided with a plurality of slotted holes and fixed on the fixing rods.

Furthermore, flexible subassembly includes a plurality of slide rails and a plurality of electric telescopic handle, slide rail one side is fixed on returning the shape conveyer belt, slide rail opposite side top is provided with electric telescopic handle, the slide rail with fixed baseplate spout sliding fit, electric telescopic handle output shaft and fixed baseplate fixed connection.

Further, the manipulator assembly comprises a workbench and a manipulator, and the manipulator is arranged at the top end of the workbench.

The utility model discloses following beneficial effect has:

when the device is used for conveying wafers, the paper-clip-shaped conveyor belt starts to rotate, when the lower fixing component is conveyed to the front of the mechanical arm, the paper-clip-shaped conveyor belt stops rotating, the mechanical arm clamps the wafers positioned above the groove of the fixing base, the electric telescopic rod extends out to drive the fixing base to move, the fixing base drives the fixed rod to move, the fixed rod drives the upper fixing component to move, when the wafers are wafer rods, the fixed plate is far away from the middle upper end of the wafers and is extruded to the spring in the spring cavity to restore the original state, when the wafers are wafer rods, the fixing base groove is far away from the wafer, the manipulator clamps and clamps the wafer and moves to the process treatment chamber and loosens, the manipulator moves to the adjacent side lower fixing component and the adjacent side upper fixing component and clamps the wafer, the electric telescopic push rod drives the fixing base to move, the lower fixing base drives the fixing rod to move, the fixing rod drives the supporting block to move, the supporting block drives the fixing plate to move, the fixing base groove contacts with the lower end of the wafer and fixes the wafer, the manipulator loosens and moves out the wafer, the wafer is placed in the fixing base groove, and the square-shaped conveyor belt rotates. The device can be used, and the operation can be repeated. The size of the groove of the fixed base is gradually reduced from the top end to the bottom end, so that the fixed base is suitable for wafers with different sizes and can convey wafers with different sizes; the bottommost end of the groove of the fixed base is a conical groove which can be used for placing the bottom end of the wafer rod, when the telescopic component drives the lower fixed component to move, the fixed block in the upper fixed component moves along with the lower fixed component, one side of the fixed block contacts with the outer wall of the wafer rod and fixes the wafer rod, and the wafer rod can be transported.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages simultaneously.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is one of the overall three-dimensional structural diagrams of the present invention;

fig. 2 is a second schematic view of the overall three-dimensional structure of the present invention;

fig. 3 is a schematic view of a partial enlarged structure at a in fig. 2 according to the present invention;

fig. 4 is a schematic view of the structure with a partial three-dimensional cross section of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a clip-shaped conveyor belt; 2. a manipulator assembly; 201. a work table; 202. a manipulator; 3. a telescoping assembly; 301. a slide rail; 302. an electric telescopic rod; 4. a lower fixing component; 401. a fixed base; 402. fixing the rod; 5. an upper fixing assembly; 501. a support block; 502. a spring; 503. a fixing plate; 504. a guide bar; 505. a spring cavity.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "open hole", "upper", "lower", "top", "middle", "inner", and the like indicate positional or orientational relationships and are merely for convenience of description and simplicity of description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Referring to fig. 1-4, the present invention relates to a conveying device for semiconductor wafers, which includes a clip conveyor 1, a telescopic assembly 3, a lower fixing assembly 4 and an upper fixing assembly 5, wherein one side of the clip conveyor 1 is provided with a plurality of manipulator assemblies 2, the clip conveyor 1 is provided with a plurality of telescopic assemblies 3, the telescopic assemblies 3 are provided with the lower fixing assembly 4, and the upper fixing assembly 5 is arranged above the lower fixing assembly 4; when the wafer clamping device is used, the rectangular conveyor belt 1 rotates to drive the telescopic component 3, the lower fixing component 4 and the upper fixing component 5 to move to the front of the mechanical arm component 2, the rectangular conveyor belt 1 stops rotating, the mechanical arm component 2 grabs a processed wafer and moves the wafer to the middle of the lower fixing component 4 and the upper fixing component 5, the telescopic component 3 drives the lower fixing component 4 to move, the lower fixing component 4 drives the upper fixing component 5 to move and fix the wafer, the mechanical arm component 2 loosens the wafer, the mechanical arm component 2 moves to the adjacent side lower fixing component 4 and the upper fixing component 5 and grabs the wafer, the telescopic component 3 drives the lower fixing component 4 to move, the lower fixing component 4 drives the upper fixing component 5 to move and loosen the wafer, the mechanical arm component 2 moves the wafer to a process chamber, the rectangular conveyor belt 1 rotates to move the adjacent side lower fixing component 4 to the front of the mechanical arm component 2.

In an embodiment, for the lower fixing assembly 4, the lower fixing assembly 4 includes a plurality of fixing bases 401 and a plurality of fixing rods 402, sliding grooves are formed on two sides below the fixing bases 401, a groove is formed on one side of the fixing bases 401, and the fixing rods 402 are arranged on two sides of the top end of the fixing bases 401; during the use, 2 clamp of manipulator subassembly get in the technology process chamber wafer move to down fixed subassembly 4 and last fixed subassembly 5 in the middle of, flexible subassembly 3 drives fixed base 401 and stretches out, fixed base 401 contacts the wafer lower extreme, fixed base 401 drives dead lever 402 motion, dead lever 402 drives fixed subassembly 5 motion, fix the wafer, manipulator subassembly 2 loosens the wafer, and move to adjacent side down fixed subassembly 4 and last fixed subassembly 5 in, press from both sides tight wafer, flexible subassembly 3 drives fixed base 401 and stretches out, fixed base 401 drives dead lever 402 motion, dead lever 402 drives fixed subassembly 5 motion and loosens the wafer.

In one embodiment, for the upper fixing assembly 5, the upper fixing assembly 5 includes a plurality of supporting blocks 501, a plurality of springs 502, a fixing plate 503, a plurality of guiding rods 504 and a spring cavity 505, the spring cavity 505 is disposed on one side of the supporting block 501 near the top end, the plurality of springs 502 are disposed in the spring cavity 505, the springs 502 are fixedly connected with the fixing plate 503, the plurality of guiding rods 504 are disposed on one side of the fixing plate 503 near the supporting block 501, a plurality of slots are disposed on one side of the supporting block 501, the slots are in sliding fit with the guiding rods 504, and the plurality of slots are disposed on the top end of the supporting block 501 and fixed on the fixing rod 402; when the wafer clamping device is used, the wafer is moved to the middle of the lower fixing component 4 and the upper fixing component 5 by the manipulator component 2, the fixing rod 402 is driven to move by the telescopic component 3, the supporting block 501 is driven by the fixing rod 402 to move, the supporting block 501 drives the fixing plate 503 to move, when the wafer is a wafer rod, the fixing plate 503 contacts the middle upper end of the wafer rod and extrudes the spring 502, the spring 502 is compressed into the spring cavity 505, the wafer rod is fixed by the fixing plate 503, when the wafer is a wafer, the spring 502 cannot be extruded, the wafer is loosened by the manipulator component 2 and moved to the lower fixing component 4 and the upper fixing component 5 to clamp the wafer, the lower fixing component 4 drives the lower fixing component 4 to move, the supporting block 501 drives the fixing plate 503 to move, the wafer is loosened, and the spring 502 returns to the original state.

In an embodiment, for the telescopic assembly 3, the telescopic assembly 3 includes a plurality of slide rails 301 and a plurality of electric telescopic rods 302, one side of each slide rail 301 is fixed on the belt conveyor 1, the top end of the other side of each slide rail 301 is provided with an electric telescopic rod 302, the slide rails 301 are in sliding fit with the sliding grooves of the fixed base 401, and the output shafts of the electric telescopic rods 302 are fixedly connected with the fixed base 401; during the use, electric telescopic handle 302 drives fixed baseplate 401 and moves on the slide rail, and fixed baseplate 401 drives dead lever 402 motion, and fixed lever 402 drives fixed subassembly 5 and moves.

In one embodiment, for the above robot assembly 2, the robot assembly 2 includes a workbench 201 and a robot 202, and the robot 202 is disposed on the top end of the workbench 201; when the wafer clamping device is used, the mechanical arm 202 grabs a wafer from a process chamber and moves the wafer to the lower fixing component 4 and the upper fixing component 5 to enable the wafer to be fixed, the mechanical arm 202 loosens the wafer and moves the wafer to the adjacent side of the lower fixing component 4 and the upper fixing component 5 to clamp the wafer, the telescopic component 3 drives the lower fixing component 4 and the upper fixing component 5 to loosen the wafer, and the mechanical arm 202 moves the wafer to the process chamber.

In conclusion, with the aid of the above technical scheme of the utility model, when carrying the wafer through using this device, return shape conveyer belt 1 and begin to rotate, when fixing subassembly 4 conveys before manipulator 202, return shape conveyer belt 1 stall, manipulator 202 presss from both sides the wafer that is located fixed base 401 recess top, electric telescopic handle 302 stretches out and drives fixed base 401 motion, fixed base 401 drives dead lever 402 motion, fixed lever 402 drives fixed subassembly 5 motion, when the wafer is the wafer stick, fixed plate 503 keeps away from the upper end in the wafer, and the spring 502 that is extruded to spring cavity 505 resumes original state, when the wafer is the wafer, fixed base 401 recess keeps away from the wafer, manipulator 202 presss from both sides the clamp and gets the wafer and moves to the technology process chamber and unclamp, manipulator 202 moves to under the adjacent side fixed subassembly 4 and last fixed subassembly 5 and clamp the wafer, electric telescopic push rod 302 drives fixed base 401 motion, fixed base 401 drives dead lever 402 motion, dead lever 402 drives the supporting shoe motion, supporting shoe 501 drives fixed plate 503 motion, fixed base 401 recess contact wafer low end and fixed wafer, wafer is loosened the wafer and is moved out the wafer in the manipulator 202, the wafer is arranged in fixed base 401 and rotates, return shape conveyer belt 401 returns. The device can be used, and the operation can be repeated.

Through above-mentioned technical scheme, 1, the recess of fixed baseplate reduces from the top to the end size gradually, adapts to the wafer of equidimension not, can carry the wafer of equidimension not.

2. The bottommost end of the groove of the fixed base is a conical groove which can be used for placing the bottom end of the wafer rod, when the telescopic component drives the lower fixed component to move, the fixed block in the upper fixed component moves along with the lower fixed component, one side of the fixed block contacts with the outer wall of the wafer rod and fixes the wafer rod, and the wafer rod can be transported.

In the description of the present specification, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended only to help illustrate the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A transport apparatus for a semiconductor wafer, characterized in that: including returning shape conveyer belt (1), flexible subassembly (3), fixed subassembly (4) and going up fixed subassembly (5) down, it is provided with a plurality of manipulator components (2) to return shape conveyer belt (1) one side, it is provided with a plurality of flexible subassemblies (3) on shape conveyer belt (1) to return, be provided with down fixed subassembly (4) on flexible subassembly (3), fixed subassembly (4) top is provided with fixed subassembly (5) down.

2. The conveying apparatus for semiconductor wafers as claimed in claim 1, wherein the lower fixing assembly (4) comprises a plurality of fixing bases (401) and a plurality of fixing rods (402), wherein sliding grooves are formed on two sides of the lower portion of the fixing bases (401), a groove is formed on one side of the fixing bases (401), and a plurality of fixing rods (402) are arranged on two sides of the top end of the fixing bases (401).

3. The conveying apparatus for semiconductor wafers as claimed in claim 2, wherein the upper fixing assembly (5) comprises a plurality of supporting blocks (501), a plurality of springs (502), a fixing plate (503), a plurality of guiding rods (504) and a spring cavity (505), the spring cavity (505) is disposed at one side of the supporting blocks (501) near the top end, the springs (502) are disposed in the spring cavity (505), the springs (502) are fixedly connected with the fixing plate (503), the guiding rods (504) are disposed at one side of the fixing plate (503) near the supporting blocks (501), a plurality of slots are disposed at one side of the supporting blocks (501), the slots are slidably engaged with the guiding rods (504), and the fixing rod (402) is fixed at the top end of the supporting blocks (501).

4. The conveying device for the semiconductor wafers as claimed in claim 2, wherein the telescopic assembly (3) comprises a plurality of slide rails (301) and a plurality of electric telescopic rods (302), one side of each slide rail (301) is fixed on the loop-shaped conveyor belt (1), the top end of the other side of each slide rail (301) is provided with the electric telescopic rod (302), each slide rail (301) is in sliding fit with the corresponding chute of the fixed base (401), and the output shaft of each electric telescopic rod (302) is fixedly connected with the fixed base (401).

5. The conveying apparatus for semiconductor wafers as claimed in claim 1, wherein the robot assembly (2) comprises a table (201) and a robot (202), and the robot (202) is disposed on top of the table (201).