CN213275842U - Laser chip testing integrated equipment - Google Patents

Laser chip testing integrated equipment Download PDF

Info

Publication number
CN213275842U
CN213275842U CN202021130245.3U CN202021130245U CN213275842U CN 213275842 U CN213275842 U CN 213275842U CN 202021130245 U CN202021130245 U CN 202021130245U CN 213275842 U CN213275842 U CN 213275842U
Authority
CN
China
Prior art keywords
test
substrate
laser chip
shaft assembly
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021130245.3U
Other languages
Chinese (zh)
Inventor
徐鹏嵩
郭孝明
朱晶
王凯旋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lianxun Instrument Co ltd
Original Assignee
Stelight Instrument Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stelight Instrument Inc filed Critical Stelight Instrument Inc
Priority to CN202021130245.3U priority Critical patent/CN213275842U/en
Application granted granted Critical
Publication of CN213275842U publication Critical patent/CN213275842U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The utility model discloses an integrative equipment of laser chip test, including the frame, install test seat, actuating mechanism and test probe on the base plate of frame, actuating mechanism further includes Z axle subassembly, with Y axle subassembly, X axle motor and two parallel arrangement's of Z axle subassembly swing joint X axle guide rail, install the test probe on the Z axle subassembly for the drive test probe reciprocates, and this Z axle subassembly is installed on Y axle subassembly, the both ends of Y axle subassembly are provided with a slider respectively, two the slider respectively with two X axle guide rail sliding connection, the test seat further includes test base plate, heating plate and bottom plate, the bottom plate is located under the test base plate, the heating plate sets up between test base plate and bottom plate, a through-hole has been seted up to the central authorities of heating plate. The utility model provides the high precision of probe to the device test guarantees the uniformity and the stability of test data, improves efficiency of software testing.

Description

Laser chip testing integrated equipment
Technical Field
The utility model relates to an integrative equipment of laser chip test belongs to optical communication test technical field.
Background
The design of a clamp for testing aging of a laser chip is always difficult, particularly the test of a temperature-sensitive chip is difficult, at present, only a normal-temperature TO test system is used in the industry, but with the development of the optical communication industry, 25G and 50GTO products are more and more required TO be tested at high temperature, and the industry is lack of the high-temperature test system.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a integrative equipment of laser chip test, this integrative equipment of laser chip test have improved the precision of probe to the device test, guarantee test data's uniformity and stability, improve efficiency of software testing.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a laser chip testing integrated device comprises a rack, a testing seat, a driving mechanism and a testing probe, wherein the testing seat is arranged on a base plate of the rack;
the driving mechanism further comprises a Z shaft assembly, a Y shaft assembly movably connected with the Z shaft assembly, an X shaft motor and two X shaft guide rails arranged in parallel, a test probe is mounted on the Z shaft assembly and used for driving the test probe to move up and down, the Z shaft assembly is mounted on the Y shaft assembly and can reciprocate along the Y shaft direction, two ends of the Y shaft assembly are respectively provided with a sliding block, and the two sliding blocks are respectively connected with the two X shaft guide rails in a sliding manner, so that the Y shaft assembly can reciprocate along the X shaft direction; the test seat further comprises a test substrate, a heating sheet and a bottom plate, wherein the bottom plate is positioned under the test substrate, the heating sheet is arranged between the test substrate and the bottom plate, and a through hole is formed in the center of the heating sheet.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, one of the two X-axis guide rails is a screw rod, one end of the screw rod is connected with the X-axis motor, and one of the two sliding blocks is sleeved on the screw rod and is in threaded connection with the screw rod.
2. In the above scheme, the through hole is an i-shaped through hole.
3. In the scheme, two sides above the test substrate are respectively provided with a pressing strip.
4. In the above scheme, the test substrate is fixedly connected with the substrate through the supporting seats arranged at the two ends of the lower surface of the test substrate.
5. In the above scheme, the upper surface of the test substrate is provided with at least two positioning pins.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model discloses integrative equipment of laser chip test, it is through setting up Z axle subassembly, the Y axle subassembly with Z axle subassembly swing joint, X axle motor and two parallel arrangement's X axle guide rail at actuating mechanism, and parallel arrangement's guide rail plays better supporting role to the Y axle subassembly, and it is higher to make the removal of Y axle subassembly more stable and remove the precision to improve the precision and the uniformity of probe to the device test, effectual improvement efficiency of software testing.
2. The utility model discloses integrative equipment of laser chip test, it has seted up a through-hole through the central authorities at the heating plate for the test seat keeps balanced stable to the heating of placing a plurality of devices that await measuring above that, avoids leading to the great deviation to appear to the test data of central authorities 'device and device test data all around because of the high temperature all around of central authorities' temperature, guarantees the uniformity and the stability of test data.
Drawings
FIG. 1 is a schematic structural diagram of the laser chip testing integrated device of the present invention;
FIG. 2 is a partial structure diagram of the structure of the laser chip testing integrated device of the present invention;
figure 3 is the utility model discloses test seat structure sketch map.
In the above drawings: 1. a frame; 101. a substrate; 2. a test seat; 21. testing the substrate; 22. a heating plate; 23. a base plate; 24. a through hole; 25. layering; 26. a supporting seat; 27. positioning pins; 3. a drive mechanism; 301. a Z-axis assembly; 302. a Y-axis assembly; 303. an X-axis motor; 304. an X-axis guide rail; 305. a slider; 306. a screw rod; 4. the probe is tested.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a laser chip testing integrated device comprises a rack 1, a testing seat 2, a driving mechanism 3 and a testing probe 4, wherein the testing seat 2 is installed on a base plate 101 of the rack 1, the driving mechanism 3 is installed on the base plate 101, and the testing probe 4 is movably installed on the driving mechanism 3 and is positioned above the testing seat 2;
the driving mechanism 3 further comprises a Z-axis assembly 301, a Y-axis assembly 302 movably connected with the Z-axis assembly 301, an X-axis motor 303 and two X-axis guide rails 304 arranged in parallel, the Z-axis assembly 301 is provided with a test probe 4 for driving the test probe 4 to move up and down, the Z-axis assembly 301 is arranged on the Y-axis assembly 302 and can reciprocate along the Y-axis direction, two ends of the Y-axis assembly 302 are respectively provided with a sliding block 305, and the two sliding blocks 305 are respectively connected with the two X-axis guide rails 304 in a sliding manner, so that the Y-axis assembly 302 can reciprocate along the X-axis direction; the test socket 2 further comprises a test substrate 21, a heating plate 22 and a bottom plate 23, the bottom plate 23 is located under the test substrate 21, the heating plate 22 is arranged between the test substrate 21 and the bottom plate 23, and a through hole 24 is formed in the center of the heating plate 22.
One of the two X-axis guide rails 304 is a screw rod 306, one end of the screw rod 306 is connected with the X-axis motor 303, and one of the two slide blocks 305 is sleeved on the screw rod 306 and is in threaded connection with the screw rod 306; the through-hole 24 is an i-shaped through-hole.
Example 2: a laser chip testing integrated device comprises a rack 1, a testing seat 2, a driving mechanism 3 and a testing probe 4, wherein the testing seat 2 is installed on a base plate 101 of the rack 1, the driving mechanism 3 is installed on the base plate 101, and the testing probe 4 is movably installed on the driving mechanism 3 and is positioned above the testing seat 2;
the driving mechanism 3 further comprises a Z-axis assembly 301, a Y-axis assembly 302 movably connected with the Z-axis assembly 301, an X-axis motor 303 and two X-axis guide rails 304 arranged in parallel, the Z-axis assembly 301 is provided with a test probe 4 for driving the test probe 4 to move up and down, the Z-axis assembly 301 is arranged on the Y-axis assembly 302 and can reciprocate along the Y-axis direction, two ends of the Y-axis assembly 302 are respectively provided with a sliding block 305, and the two sliding blocks 305 are respectively connected with the two X-axis guide rails 304 in a sliding manner, so that the Y-axis assembly 302 can reciprocate along the X-axis direction; the test socket 2 further comprises a test substrate 21, a heating plate 22 and a bottom plate 23, the bottom plate 23 is located under the test substrate 21, the heating plate 22 is arranged between the test substrate 21 and the bottom plate 23, and a through hole 24 is formed in the center of the heating plate 22.
And two pressing strips 25 are respectively arranged on two sides above the test substrate 21 and used for fixing the clamp.
The test substrate 21 is fixedly connected with the substrate 101 through the supporting seats 26 arranged at the two ends of the lower surface of the test substrate; the upper surface of the test substrate 21 is provided with at least two positioning pins 27.
When the laser chip testing integrated equipment is adopted, the driving mechanism is provided with the Z shaft assembly, the Y shaft assembly movably connected with the Z shaft assembly, the X shaft motor and the two X shaft guide rails arranged in parallel, and the guide rails arranged in parallel have a better supporting effect on the Y shaft assembly, so that the Y shaft assembly is more stable in movement and higher in movement precision, the precision and consistency of a probe for testing a device are improved, and the testing efficiency is effectively improved; in addition, a through hole is formed in the center of the heating plate, so that the test seat can uniformly and stably heat a plurality of devices to be tested placed on the test seat, the situation that the test data of the central device and the test data of devices around the test seat have large deviation due to high central temperature and low ambient temperature is avoided, and the consistency and the stability of the test data are ensured.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (6)

1. The utility model provides an integrative equipment of laser chip test which characterized in that: the device comprises a rack (1), a test seat (2) arranged on a substrate (101) of the rack (1), a driving mechanism (3) and a test probe (4), wherein the driving mechanism (3) is arranged on the substrate (101), and the test probe (4) is movably arranged on the driving mechanism (3) and is positioned above the test seat (2);
the driving mechanism (3) further comprises a Z shaft assembly (301), a Y shaft assembly (302) movably connected with the Z shaft assembly (301), an X shaft motor (303) and two X shaft guide rails (304) arranged in parallel, a test probe (4) is mounted on the Z shaft assembly (301) and used for driving the test probe (4) to move up and down, the Z shaft assembly (301) is mounted on the Y shaft assembly (302) and can reciprocate along the Y shaft direction, two ends of the Y shaft assembly (302) are respectively provided with a sliding block (305), and the two sliding blocks (305) are respectively connected with the two X shaft guide rails (304) in a sliding manner, so that the Y shaft assembly (302) can reciprocate along the X shaft direction; the test seat (2) further comprises a test substrate (21), a heating sheet (22) and a bottom plate (23), the bottom plate (23) is located under the test substrate (21), the heating sheet (22) is arranged between the test substrate (21) and the bottom plate (23), and a through hole (24) is formed in the center of the heating sheet (22).
2. The laser chip test integrated apparatus according to claim 1, wherein: one of the two X-axis guide rails (304) is a screw rod (306), one end of the screw rod (306) is connected with the X-axis motor (303), and one of the two sliding blocks (305) is sleeved on the screw rod (306) and is in threaded connection with the screw rod (306).
3. The laser chip test integrated apparatus according to claim 1, wherein: the through hole (24) is an I-shaped through hole.
4. The laser chip test integrated apparatus according to claim 1, wherein: and two sides above the test substrate (21) are respectively provided with a pressing bar (25).
5. The laser chip test integrated apparatus according to claim 1, wherein: the test substrate (21) is fixedly connected with the substrate (101) through supporting seats (26) arranged at two ends of the lower surface of the test substrate.
6. The laser chip test integrated apparatus according to claim 1, wherein: the upper surface of the test substrate (21) is provided with at least two positioning pins (27).
CN202021130245.3U 2020-06-17 2020-06-17 Laser chip testing integrated equipment Active CN213275842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021130245.3U CN213275842U (en) 2020-06-17 2020-06-17 Laser chip testing integrated equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021130245.3U CN213275842U (en) 2020-06-17 2020-06-17 Laser chip testing integrated equipment

Publications (1)

Publication Number Publication Date
CN213275842U true CN213275842U (en) 2021-05-25

Family

ID=75957194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021130245.3U Active CN213275842U (en) 2020-06-17 2020-06-17 Laser chip testing integrated equipment

Country Status (1)

Country Link
CN (1) CN213275842U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114325300A (en) * 2021-11-09 2022-04-12 苏州联讯仪器有限公司 Chip test equipment for optical communication
CN114355132A (en) * 2021-11-09 2022-04-15 苏州联讯仪器有限公司 Laser chip test system for optical communication

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114325300A (en) * 2021-11-09 2022-04-12 苏州联讯仪器有限公司 Chip test equipment for optical communication
CN114355132A (en) * 2021-11-09 2022-04-15 苏州联讯仪器有限公司 Laser chip test system for optical communication
CN114325300B (en) * 2021-11-09 2023-08-08 苏州联讯仪器股份有限公司 Chip test equipment for optical communication
CN114355132B (en) * 2021-11-09 2024-03-01 苏州联讯仪器股份有限公司 Laser chip test system for optical communication

Similar Documents

Publication Publication Date Title
CN213275842U (en) Laser chip testing integrated equipment
CN208654292U (en) OCV test equipment
CN217820513U (en) Semiconductor power device testing device
CN208704919U (en) Temperature measurement card test fixture
CN214409144U (en) High-low temperature test bench for laser chip
CN207301259U (en) A kind of movable detection head, flying probe device and flying probe tester
CN212301629U (en) A structure test machine for mineral casting
CN214794916U (en) Flat bridge testing device
CN212513557U (en) Multifunctional testing device for light-emitting device
CN114337807B (en) Multi-temperature test system of optical communication module
CN212432482U (en) Test device for TO optical communication device
CN211043513U (en) Silver glue resistance measurement system
CN213600818U (en) Multipurpose power-on voltage-withstand test device for automobile connector
CN212723206U (en) Test system for optical communication device
CN210835004U (en) PCB impedance value positive and negative automatic measuring mechanism
CN207528878U (en) A kind of automation chip strip test machine
CN218068097U (en) High-flexibility test probe tool
CN219284149U (en) Lithium battery protection board production calibration frock
CN212513556U (en) High-precision test system for optical communication device
CN219675003U (en) Inverted module bottom flatness testing jig
CN218331889U (en) Battery OCV testing arrangement
CN219533234U (en) Multifunctional test fixture
CN214622723U (en) Optical chip wafer level aging equipment platform
CN219935911U (en) Single-double-direction compatible transverse-placing testing mechanism for square lithium ion battery
CN218630089U (en) Integrated circuit testing device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129

Patentee after: Suzhou Lianxun Instrument Co.,Ltd.

Address before: 215011 Building 5, no.1508 Xiangjiang Road, high tech Zone, Suzhou City, Jiangsu Province

Patentee before: STELIGHT INSTRUMENT Inc.

CP03 Change of name, title or address