CN213275842U - Laser chip testing integrated equipment - Google Patents
Laser chip testing integrated equipment Download PDFInfo
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- CN213275842U CN213275842U CN202021130245.3U CN202021130245U CN213275842U CN 213275842 U CN213275842 U CN 213275842U CN 202021130245 U CN202021130245 U CN 202021130245U CN 213275842 U CN213275842 U CN 213275842U
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- laser chip
- shaft assembly
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Abstract
The utility model discloses an integrative equipment of laser chip test, including the frame, install test seat, actuating mechanism and test probe on the base plate of frame, actuating mechanism further includes Z axle subassembly, with Y axle subassembly, X axle motor and two parallel arrangement's of Z axle subassembly swing joint X axle guide rail, install the test probe on the Z axle subassembly for the drive test probe reciprocates, and this Z axle subassembly is installed on Y axle subassembly, the both ends of Y axle subassembly are provided with a slider respectively, two the slider respectively with two X axle guide rail sliding connection, the test seat further includes test base plate, heating plate and bottom plate, the bottom plate is located under the test base plate, the heating plate sets up between test base plate and bottom plate, a through-hole has been seted up to the central authorities of heating plate. The utility model provides the high precision of probe to the device test guarantees the uniformity and the stability of test data, improves efficiency of software testing.
Description
Technical Field
The utility model relates to an integrative equipment of laser chip test belongs to optical communication test technical field.
Background
The design of a clamp for testing aging of a laser chip is always difficult, particularly the test of a temperature-sensitive chip is difficult, at present, only a normal-temperature TO test system is used in the industry, but with the development of the optical communication industry, 25G and 50GTO products are more and more required TO be tested at high temperature, and the industry is lack of the high-temperature test system.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a integrative equipment of laser chip test, this integrative equipment of laser chip test have improved the precision of probe to the device test, guarantee test data's uniformity and stability, improve efficiency of software testing.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a laser chip testing integrated device comprises a rack, a testing seat, a driving mechanism and a testing probe, wherein the testing seat is arranged on a base plate of the rack;
the driving mechanism further comprises a Z shaft assembly, a Y shaft assembly movably connected with the Z shaft assembly, an X shaft motor and two X shaft guide rails arranged in parallel, a test probe is mounted on the Z shaft assembly and used for driving the test probe to move up and down, the Z shaft assembly is mounted on the Y shaft assembly and can reciprocate along the Y shaft direction, two ends of the Y shaft assembly are respectively provided with a sliding block, and the two sliding blocks are respectively connected with the two X shaft guide rails in a sliding manner, so that the Y shaft assembly can reciprocate along the X shaft direction; the test seat further comprises a test substrate, a heating sheet and a bottom plate, wherein the bottom plate is positioned under the test substrate, the heating sheet is arranged between the test substrate and the bottom plate, and a through hole is formed in the center of the heating sheet.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, one of the two X-axis guide rails is a screw rod, one end of the screw rod is connected with the X-axis motor, and one of the two sliding blocks is sleeved on the screw rod and is in threaded connection with the screw rod.
2. In the above scheme, the through hole is an i-shaped through hole.
3. In the scheme, two sides above the test substrate are respectively provided with a pressing strip.
4. In the above scheme, the test substrate is fixedly connected with the substrate through the supporting seats arranged at the two ends of the lower surface of the test substrate.
5. In the above scheme, the upper surface of the test substrate is provided with at least two positioning pins.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model discloses integrative equipment of laser chip test, it is through setting up Z axle subassembly, the Y axle subassembly with Z axle subassembly swing joint, X axle motor and two parallel arrangement's X axle guide rail at actuating mechanism, and parallel arrangement's guide rail plays better supporting role to the Y axle subassembly, and it is higher to make the removal of Y axle subassembly more stable and remove the precision to improve the precision and the uniformity of probe to the device test, effectual improvement efficiency of software testing.
2. The utility model discloses integrative equipment of laser chip test, it has seted up a through-hole through the central authorities at the heating plate for the test seat keeps balanced stable to the heating of placing a plurality of devices that await measuring above that, avoids leading to the great deviation to appear to the test data of central authorities 'device and device test data all around because of the high temperature all around of central authorities' temperature, guarantees the uniformity and the stability of test data.
Drawings
FIG. 1 is a schematic structural diagram of the laser chip testing integrated device of the present invention;
FIG. 2 is a partial structure diagram of the structure of the laser chip testing integrated device of the present invention;
figure 3 is the utility model discloses test seat structure sketch map.
In the above drawings: 1. a frame; 101. a substrate; 2. a test seat; 21. testing the substrate; 22. a heating plate; 23. a base plate; 24. a through hole; 25. layering; 26. a supporting seat; 27. positioning pins; 3. a drive mechanism; 301. a Z-axis assembly; 302. a Y-axis assembly; 303. an X-axis motor; 304. an X-axis guide rail; 305. a slider; 306. a screw rod; 4. the probe is tested.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a laser chip testing integrated device comprises a rack 1, a testing seat 2, a driving mechanism 3 and a testing probe 4, wherein the testing seat 2 is installed on a base plate 101 of the rack 1, the driving mechanism 3 is installed on the base plate 101, and the testing probe 4 is movably installed on the driving mechanism 3 and is positioned above the testing seat 2;
the driving mechanism 3 further comprises a Z-axis assembly 301, a Y-axis assembly 302 movably connected with the Z-axis assembly 301, an X-axis motor 303 and two X-axis guide rails 304 arranged in parallel, the Z-axis assembly 301 is provided with a test probe 4 for driving the test probe 4 to move up and down, the Z-axis assembly 301 is arranged on the Y-axis assembly 302 and can reciprocate along the Y-axis direction, two ends of the Y-axis assembly 302 are respectively provided with a sliding block 305, and the two sliding blocks 305 are respectively connected with the two X-axis guide rails 304 in a sliding manner, so that the Y-axis assembly 302 can reciprocate along the X-axis direction; the test socket 2 further comprises a test substrate 21, a heating plate 22 and a bottom plate 23, the bottom plate 23 is located under the test substrate 21, the heating plate 22 is arranged between the test substrate 21 and the bottom plate 23, and a through hole 24 is formed in the center of the heating plate 22.
One of the two X-axis guide rails 304 is a screw rod 306, one end of the screw rod 306 is connected with the X-axis motor 303, and one of the two slide blocks 305 is sleeved on the screw rod 306 and is in threaded connection with the screw rod 306; the through-hole 24 is an i-shaped through-hole.
Example 2: a laser chip testing integrated device comprises a rack 1, a testing seat 2, a driving mechanism 3 and a testing probe 4, wherein the testing seat 2 is installed on a base plate 101 of the rack 1, the driving mechanism 3 is installed on the base plate 101, and the testing probe 4 is movably installed on the driving mechanism 3 and is positioned above the testing seat 2;
the driving mechanism 3 further comprises a Z-axis assembly 301, a Y-axis assembly 302 movably connected with the Z-axis assembly 301, an X-axis motor 303 and two X-axis guide rails 304 arranged in parallel, the Z-axis assembly 301 is provided with a test probe 4 for driving the test probe 4 to move up and down, the Z-axis assembly 301 is arranged on the Y-axis assembly 302 and can reciprocate along the Y-axis direction, two ends of the Y-axis assembly 302 are respectively provided with a sliding block 305, and the two sliding blocks 305 are respectively connected with the two X-axis guide rails 304 in a sliding manner, so that the Y-axis assembly 302 can reciprocate along the X-axis direction; the test socket 2 further comprises a test substrate 21, a heating plate 22 and a bottom plate 23, the bottom plate 23 is located under the test substrate 21, the heating plate 22 is arranged between the test substrate 21 and the bottom plate 23, and a through hole 24 is formed in the center of the heating plate 22.
And two pressing strips 25 are respectively arranged on two sides above the test substrate 21 and used for fixing the clamp.
The test substrate 21 is fixedly connected with the substrate 101 through the supporting seats 26 arranged at the two ends of the lower surface of the test substrate; the upper surface of the test substrate 21 is provided with at least two positioning pins 27.
When the laser chip testing integrated equipment is adopted, the driving mechanism is provided with the Z shaft assembly, the Y shaft assembly movably connected with the Z shaft assembly, the X shaft motor and the two X shaft guide rails arranged in parallel, and the guide rails arranged in parallel have a better supporting effect on the Y shaft assembly, so that the Y shaft assembly is more stable in movement and higher in movement precision, the precision and consistency of a probe for testing a device are improved, and the testing efficiency is effectively improved; in addition, a through hole is formed in the center of the heating plate, so that the test seat can uniformly and stably heat a plurality of devices to be tested placed on the test seat, the situation that the test data of the central device and the test data of devices around the test seat have large deviation due to high central temperature and low ambient temperature is avoided, and the consistency and the stability of the test data are ensured.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (6)
1. The utility model provides an integrative equipment of laser chip test which characterized in that: the device comprises a rack (1), a test seat (2) arranged on a substrate (101) of the rack (1), a driving mechanism (3) and a test probe (4), wherein the driving mechanism (3) is arranged on the substrate (101), and the test probe (4) is movably arranged on the driving mechanism (3) and is positioned above the test seat (2);
the driving mechanism (3) further comprises a Z shaft assembly (301), a Y shaft assembly (302) movably connected with the Z shaft assembly (301), an X shaft motor (303) and two X shaft guide rails (304) arranged in parallel, a test probe (4) is mounted on the Z shaft assembly (301) and used for driving the test probe (4) to move up and down, the Z shaft assembly (301) is mounted on the Y shaft assembly (302) and can reciprocate along the Y shaft direction, two ends of the Y shaft assembly (302) are respectively provided with a sliding block (305), and the two sliding blocks (305) are respectively connected with the two X shaft guide rails (304) in a sliding manner, so that the Y shaft assembly (302) can reciprocate along the X shaft direction; the test seat (2) further comprises a test substrate (21), a heating sheet (22) and a bottom plate (23), the bottom plate (23) is located under the test substrate (21), the heating sheet (22) is arranged between the test substrate (21) and the bottom plate (23), and a through hole (24) is formed in the center of the heating sheet (22).
2. The laser chip test integrated apparatus according to claim 1, wherein: one of the two X-axis guide rails (304) is a screw rod (306), one end of the screw rod (306) is connected with the X-axis motor (303), and one of the two sliding blocks (305) is sleeved on the screw rod (306) and is in threaded connection with the screw rod (306).
3. The laser chip test integrated apparatus according to claim 1, wherein: the through hole (24) is an I-shaped through hole.
4. The laser chip test integrated apparatus according to claim 1, wherein: and two sides above the test substrate (21) are respectively provided with a pressing bar (25).
5. The laser chip test integrated apparatus according to claim 1, wherein: the test substrate (21) is fixedly connected with the substrate (101) through supporting seats (26) arranged at two ends of the lower surface of the test substrate.
6. The laser chip test integrated apparatus according to claim 1, wherein: the upper surface of the test substrate (21) is provided with at least two positioning pins (27).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021130245.3U CN213275842U (en) | 2020-06-17 | 2020-06-17 | Laser chip testing integrated equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021130245.3U CN213275842U (en) | 2020-06-17 | 2020-06-17 | Laser chip testing integrated equipment |
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CN213275842U true CN213275842U (en) | 2021-05-25 |
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CN202021130245.3U Active CN213275842U (en) | 2020-06-17 | 2020-06-17 | Laser chip testing integrated equipment |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114325300A (en) * | 2021-11-09 | 2022-04-12 | 苏州联讯仪器有限公司 | Chip test equipment for optical communication |
CN114355132A (en) * | 2021-11-09 | 2022-04-15 | 苏州联讯仪器有限公司 | Laser chip test system for optical communication |
-
2020
- 2020-06-17 CN CN202021130245.3U patent/CN213275842U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114325300A (en) * | 2021-11-09 | 2022-04-12 | 苏州联讯仪器有限公司 | Chip test equipment for optical communication |
CN114355132A (en) * | 2021-11-09 | 2022-04-15 | 苏州联讯仪器有限公司 | Laser chip test system for optical communication |
CN114325300B (en) * | 2021-11-09 | 2023-08-08 | 苏州联讯仪器股份有限公司 | Chip test equipment for optical communication |
CN114355132B (en) * | 2021-11-09 | 2024-03-01 | 苏州联讯仪器股份有限公司 | Laser chip test system for optical communication |
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CP03 | Change of name, title or address |
Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215011 Building 5, no.1508 Xiangjiang Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: STELIGHT INSTRUMENT Inc. |
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CP03 | Change of name, title or address |