CN218630089U - Integrated circuit testing device - Google Patents

Abstract

The application provides an integrated circuit testing device. The integrated circuit testing device comprises a mounting seat and a supporting rod. The mount is configured to carry an integrated circuit board. The support rod is arranged on the mounting seat. The relative position of the supporting rod and the mounting seat can be adjusted.

Description

Integrated circuit testing device

Technical Field

The present application relates generally to an apparatus, and more particularly, to an integrated circuit testing apparatus.

Background

In the prior art, when a reliability test is performed on an integrated circuit board, a pin on the integrated circuit board and an external power supply must be manually welded, so that the reliability test can be performed under the condition that the external power supply provides power. In addition, the integrated circuit boards with different specifications are required to be welded once, and the applicability is low. Welding in a manual manner takes a large amount of operating time, and has low operating efficiency and high cost.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides an integrated circuit testing apparatus to solve the above problems.

According to an embodiment of the present application, an integrated circuit testing apparatus is provided. The integrated circuit testing device comprises a mounting seat and a supporting rod. The mount is configured to carry an integrated circuit board. The support rod is arranged on the mounting seat. The relative position of the supporting rod and the mounting seat can be adjusted.

According to an embodiment of the application, the mount rail. The support rod is movably connected to the guide rail.

According to an embodiment of the application, the mount includes a side wall. The guide rail is mounted on the side wall.

According to an embodiment of the present application, the integrated circuit testing apparatus further includes the connector detachably connected to the supporting rod. The connector is configured to be electrically connected to an integrated circuit board to transmit a signal of an external power source to the integrated circuit board.

According to an embodiment of the application, the mount further comprises a base. The side wall is arranged on the base. The base includes a guide channel. The guide slot is configured to carry the integrated circuit board.

According to an embodiment of the application, the support bar comprises a slider structure. The slider structure is embedded in the guide rail.

According to an embodiment of the present application, the support bar further comprises a fixing device. The fixing device is configured to fix a height of the support bar on the guide rail.

According to an embodiment of the present application, the connector is detachably connected to the support rod.

According to an embodiment of the present application, the integrated circuit testing apparatus further includes a functional panel. The function panel is detachably connected to the connector. The function panel is configured to be electrically connected to the external power supply.

According to an embodiment of the present application, the connector includes an interface end and a pin end, the pin of the integrated circuit board is connected to the interface end, the pin end is connected to the interface of the function panel, and the pin of the function panel is connected to the external power supply.

The integrated circuit testing device provided by the application can greatly increase the applicability of products, is simple and easy to install, greatly reduces the operation time and reduces the testing cost.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application and not to limit the application. In the drawings:

FIG. 1 is a block diagram illustrating an integrated circuit testing apparatus according to an embodiment of the present application.

FIG. 2 illustrates a schematic diagram of an integrated circuit testing apparatus according to an embodiment of the present application.

Fig. 3A and 3B respectively illustrate a partially enlarged view of a support rod according to an embodiment of the present application.

Fig. 4A illustrates a schematic diagram of a connector connecting a support rod according to an embodiment of the present application.

Fig. 4B illustrates a schematic diagram of a connector connecting support rods according to another embodiment of the present application.

Detailed Description

The following disclosure provides various embodiments or illustrations that can be used to implement various features of the disclosure. The embodiments of components and arrangements described below serve to simplify the present disclosure. It is to be understood that such descriptions are merely illustrative and are not intended to limit the present disclosure. For example, in the description that follows, forming a first feature on or over a second feature may include certain embodiments in which the first and second features are in direct contact with each other; and may also include embodiments in which additional elements are formed between the first and second features described above, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or characters in various embodiments. Such reuse is for brevity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Moreover, spatially relative terms, such as "under," "below," "over," "above," and the like, may be used herein to facilitate describing a relationship between one element or feature relative to another element or feature as illustrated in the figures. These spatially relative terms are intended to encompass a variety of different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors should be interpreted accordingly.

Although numerical ranges and parameters setting forth the broad scope of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain standard deviations found in their respective testing measurements. As used herein, "about" generally refers to actual values within plus or minus 10%, 5%, 1%, or 0.5% of a particular value or range. Alternatively, the term "about" indicates that the actual value falls within the acceptable standard error of the mean, subject to consideration by those of ordinary skill in the art to which this application pertains. It is understood that all ranges, amounts, values and percentages herein used (e.g., to describe amounts of materials, length of time, temperature, operating conditions, ratio of amounts, and the like) are modified by "about" in addition to the examples, or unless otherwise expressly stated. Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained. At the very least, these numerical parameters are to be understood as meaning the number of significant digits recited and the number resulting from applying ordinary carry notation. Herein, numerical ranges are expressed from one end to the other or between the two ends; unless otherwise indicated, all numerical ranges set forth herein are inclusive of the endpoints.

FIG. 1 is a block diagram illustrating an integrated circuit tester 1 according to an embodiment of the present application. In certain embodiments, the integrated circuit testing device 1 is configured to perform reliability tests on an integrated circuit board. In some embodiments, the integrated circuit testing device 1 includes a mounting base 11 and a support bar 12. In certain embodiments, the mount 11 is configured to carry an integrated circuit board. The support rod 12 is mounted on the mounting base 11. In some embodiments, the relative positions of the support rod 12 and the mounting seat 11 are adjustable.

FIG. 2 illustrates a schematic diagram of an integrated circuit testing apparatus 2 according to an embodiment of the present application. In certain embodiments, the integrated circuit testing device 2 is configured to perform reliability tests on an integrated circuit board. In some embodiments, the integrated circuit test apparatus 2 may be used to implement the integrated circuit test apparatus 1 of the embodiment of FIG. 1. In some embodiments, the integrated circuit testing device 2 includes a mounting base 21, a support bar 22, a connector 23, a base 213, and a function panel 25.

In certain embodiments, the mount 21 is configured to carry an integrated circuit board. In certain embodiments, mount 21 includes a rail 211, a sidewall 212, and a base 213. In some embodiments, the sidewalls 212 are disposed on both sides of the integrated circuit test apparatus 2. In certain embodiments, the rails 211 are mounted to the sidewalls 212. In some embodiments, the length of the guide track 211 extends in a first direction (e.g., the y-axis direction in fig. 2). In some embodiments, the guide rails 211 may be bolted to the inside of the side walls 212. However, the present application is not limited to the guide rail 211 being fixed to the sidewall 212, and in other embodiments, the guide rail 211 may be fixed to the base 213 by bolts and extend along a first direction (e.g., a y-axis direction in fig. 2). In some embodiments, the sidewall 212 includes a hollowed-out structure H21 to reduce the weight of the sidewall 212 and allow air to flow for the purpose of stabilizing temperature and humidity.

In some embodiments, the sidewall 212 is disposed above the base 213. In certain embodiments, the base 213 includes a channel 241. In some embodiments, the guide channel 241 is configured to carry an integrated circuit board. In some embodiments, the length of the guide groove 241 extends in a second direction (e.g., the x-axis direction in fig. 2). In some embodiments, the base 213 may include a plurality of guide grooves 241 to simultaneously test the reliability of a plurality of integrated circuit boards. In some embodiments, the base 213 may further include a hollow structure to reduce the weight of the base 213, and allow the air flow to achieve the purpose of stabilizing the temperature and humidity.

In some embodiments, the support rod 22 is mounted to the mounting base 21. In some embodiments, the relative positions of the support rod 22 and the mounting seat 21 are adjustable. In some embodiments, the support bar 22 is movably coupled within the track 211. In some embodiments, the support bar 22 may be movable in a first direction (e.g., the y-axis direction in fig. 2) within the guide track 211. Reference is made to fig. 3A and 3B, wherein fig. 3A and 3B respectively illustrate a close-up view of the support pole 22 according to an embodiment of the present application. In some embodiments, the support rod 22 includes a slider structure 221. In some embodiments, the slider structures 221 are disposed at both ends of the support rod 22. In some embodiments, the slider structure 221 is embedded in the guide track 211 such that the support rod 22 can move in the guide track 211 in a first direction (e.g., the y-axis direction in fig. 2). In some embodiments, the slider structure 221 includes a boss-shaped slider. However, this is not a limitation of the present application. In other embodiments, the slider structure 221 may include other shaped sliders.

In some embodiments, the support pole 22 further includes a fixture 222. In certain embodiments, the fixture 222 is configured to fix the height of the support bar 22 on the guide rail 211. In certain embodiments, the securing device 222 comprises a securing bolt. In some embodiments, the height of the support bar 22 on the guide rail 211 is fixed by tightening the fixing bolts. In some embodiments, the fixing bolt is disposed on the outside of the support rod 22. In some embodiments, a plurality of support bars 22 may be provided in parallel with each other and coupled in the guide rail 211 according to the specification of the integrated circuit board.

In some embodiments, the connector 23 is configured to electrically connect to the integrated circuit board to transfer power from an external power source to the integrated circuit board. Fig. 4A illustrates a schematic diagram of the connector 23 connecting the support rods 22 according to an embodiment of the present application. In some embodiments, the connector 23 is removably connected to the support rod 22. In some embodiments, the connector 23 is removably coupled to the support rod 22 via a threaded hole 223 in the support rod 22. In some embodiments, the support bar 22 may be provided with a plurality of spaced screw holes 223, whereby the position of the connector 23 on the support bar 22 may be elastically set in conformity with the specification of the integrated circuit board. However, this is not a limitation of the present application. Referring to fig. 4B, fig. 4B illustrates a schematic view of the connector 23 connecting the support rods 22 according to another embodiment of the present application. In some embodiments, the supporting rod 22 may include a guide rail 224, and the connector 23 is detachably connected to the supporting rod 22 in a slider structure through the guide rail 224 on the supporting rod 22, thereby arbitrarily adjusting the position of the connector 23 on the supporting rod 22 according to the specification of the ic board. In some embodiments, the support rod 22 may include positioning holes, and the connector 23 is provided with positioning pins, which are inserted into the positioning holes of the support rod 22 for connection on the connector 23.

In certain embodiments, the connector 23 includes an interface end 231 and a pin end 232. In certain embodiments, interface end 231 includes a plurality of interfaces. In some embodiments, the plurality of interfaces of interface end 231 are configured to receive pins of an integrated circuit board. In some embodiments, the pin end 232 includes a plurality of pins. In some embodiments, the pins of the pin terminal 232 are used to access the interface of the function panel 25. In some embodiments, a plurality of connectors 23 may be provided in parallel with each other and connected to the support bars 22 according to the specification of the integrated circuit board.

In some embodiments, the functional panel 25 is configured to be electrically connected to an external power source. In some embodiments, the functional panel 25 includes a plurality of pins 251. In some embodiments, the functional panel 25 is electrically connected to an external power source through a plurality of pins 251. In some embodiments, the functional panel 25 may further include a plurality of wires (not shown) connected to the plurality of pins 251. In some embodiments, the distance between the functional panel 25 and the external power source can be extended by a plurality of wires, so that, after the integrated circuit testing apparatus 2 is placed in the reliability testing device, the external power source can still provide power to the functional panel 25 by the plurality of wires, and the functional panel 25 transmits the power to the integrated circuit board through the connector 23 for performing the reliability test.

When the integrated circuit testing apparatus 2 is used to perform a reliability test on an integrated circuit board, the supporting rod 22 is connected to the guiding rail 211 according to the specification of the integrated circuit board, the connector 23 corresponding to the pin count of the integrated circuit board is connected to the supporting rod 22 in the manner of the embodiment shown in fig. 4A or 4B, and the functional panel 25 corresponding to the pin count of the integrated circuit board is connected to the functional panel 25 through the pin end 232 of the connector 23. The integrated circuit board is then placed vertically in the channel 241 of the base 213 and pushed along the channel 241 toward the functional panel 25 until the pins on the integrated circuit board are received into the interface end 231 of the connector 23. Then, the fixing device 222 on the support bar 22 is tightened to fix the height of the support bar 22 on the guide rail 211. Next, the integrated circuit testing device 2 is placed in a reliability testing apparatus. Finally, the pins 251 of the functional panel 25 are wired to an external power source to supply power to the integrated circuit board to start a reliability test.

The integrated circuit testing device 2 provided by the application can be suitable for integrated circuit boards of various specifications only by replacing the supporting rod 22 according to the specification of the integrated circuit board and correspondingly arranging the connector 23 and the functional panel 25 so as to perform reliability tests on the integrated circuit boards of different specifications. The applicability of the product can be greatly improved through the integrated circuit testing device 2, the installation is simpler, the operation time is greatly shortened, and the testing cost is reduced.

As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and account for minor variations. When used in conjunction with an event or circumstance, the terms can refer to the exact occurrence of the event or circumstance as well as the very approximate occurrence of the event or circumstance. As used herein with respect to a given value or range, the term "about" generally means within ± 10%, ± 5%, ± 1%, or ± 0.5% of the given value or range. Ranges may be expressed herein as from one endpoint to the other endpoint, or between two endpoints. Unless otherwise specified, all ranges disclosed herein are inclusive of the endpoints. The term "substantially coplanar" can refer to two surfaces located within a few micrometers (μm) along the same plane, e.g., within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm located along the same plane. When referring to "substantially" the same numerical value or property, the term can refer to values within ± 10%, 5%, 1%, or 0.5% of the mean of the stated values.

As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, the terms can refer to an instance in which the event or circumstance occurs precisely as well as an instance in which the event or circumstance occurs in close proximity. For example, when used in conjunction with numerical values, the terms can refer to a range of variation that is less than or equal to ± 10% of the stated numerical value, e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, two numerical values are considered to be "substantially" or "about" the same if the difference between the two numerical values is less than or equal to ± 10% (e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%) of the mean of the values. For example, "substantially" parallel may refer to a range of angular variation of less than or equal to ± 10 ° from 0 °, e.g., less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °. For example, "substantially" perpendicular may refer to a range of angular variation of less than or equal to ± 10 ° from 90 °, e.g., less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °.

For example, two surfaces may be considered coplanar or substantially coplanar if the displacement between the two surfaces is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm. A surface may be considered planar or substantially planar if the displacement of the surface relative to the plane between any two points on the surface is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm.

As used herein, the singular terms "a" and "the" can include the plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided "on" or "over" another component may encompass the case where the preceding component is directly on (e.g., in physical contact with) the succeeding component, as well as the case where one or more intervening components are located between the preceding and succeeding components.

As used herein, spatially relative terms, such as "below," "lower," "above," "upper," "lower," "left," "right," and the like, may be used herein for ease of description to describe one component or feature's relationship to another component or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

The foregoing has outlined features of several embodiments and detailed aspects of the present disclosure. The embodiments described in this disclosure may be readily used as a basis for designing or modifying other processes and structures for carrying out the same or similar purposes and/or obtaining the same or similar advantages of the embodiments introduced herein. Such equivalent constructions do not depart from the spirit and scope of the present disclosure and various changes, substitutions, and alterations can be made therein without departing from the spirit and scope of the present disclosure.

Claims (10)

1. An integrated circuit testing apparatus, comprising:

a mount configured to carry an integrated circuit board; and

the supporting rod is arranged on the mounting seat, and the relative position of the supporting rod and the mounting seat is adjustable.

2. The integrated circuit test apparatus of claim 1, wherein the mounting block comprises:

a guide rail, wherein the support bar is movably connected to the guide rail.

3. The integrated circuit testing apparatus of claim 2, wherein said mounting base comprises:

a side wall, the guide rail being mounted on the side wall.

4. The IC tester apparatus of claim 3, further comprising a connector mounted on the support bar, the connector configured to electrically connect to an IC board to transmit signals of an external power source to the IC board.

5. The integrated circuit testing apparatus of claim 3, wherein said mounting base further comprises:

a base, the sidewall disposed over the base, the base including a guide slot configured to carry the integrated circuit board.

6. The integrated circuit testing apparatus of claim 2, wherein said support bar comprises a slider structure embedded in said guide rail.

7. The integrated circuit testing apparatus of claim 2, wherein the support bar further comprises a fixing device configured to fix a height of the support bar on the guide rail.

8. The IC tester of claim 4, wherein the connector is detachably connected to the support bar.

9. The integrated circuit test apparatus of claim 4, further comprising:

a functional panel detachably connected to the connector, the functional panel configured to be electrically connected to the external power source.

10. The device of claim 9, wherein the connector comprises an interface end and a pin end, the pins of the ic board are connected to the interface end, the pin end is connected to the interface of the functional panel, and the pins of the functional panel are connected to the external power source.

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