CN214622723U

CN214622723U - Optical chip wafer level aging equipment platform

Info

Publication number: CN214622723U
Application number: CN202022611304.5U
Authority: CN
Inventors: 熊联军; 李晓琳; 冯硕; 黄晓华; 赵一滟
Original assignee: Jiangsu Yanling Intelligent Technology Co ltd
Current assignee: Jiangsu Yanling Intelligent Technology Co ltd
Priority date: 2020-11-12
Filing date: 2020-11-12
Publication date: 2021-11-05
Anticipated expiration: 2030-11-12

Abstract

The utility model relates to an optical chip wafer level aging equipment platform, which relates to the technical field of lasers, and comprises a workbench, an installation mechanism, a positioning mechanism, a connecting mechanism and a working mechanism, wherein the workbench comprises a bedplate, a first slide seat and a second slide seat, the installation mechanism comprises a second slide seat, one end of the two second slide seats is connected with the upper surface of the first slide seat, the other ends of the two second slide seats are in sliding fit with the second slide seat, the positioning mechanism comprises installation columns, one surface of each installation column is connected with one surface of the bedplate, the connecting mechanism comprises a vertical rod, a third slide seat and a third slide seat, one surface of the vertical rod is connected with the peripheral surface of the bedplate, the working mechanism rotates a round platform, one end of the third slide seat is in sliding fit with the third slide seat, and the other end of the third slide seat is in rotating fit with the round platform, the utility model relates to an optical chip wafer level aging equipment platform, wherein the first slide seat slides with the first slide seat, the second sliding rail and the second sliding seat slide and can move towards all directions in a plane.

Description

Optical chip wafer level aging equipment platform

Technical Field

The utility model relates to a laser instrument technical field, in particular to optical chip wafer level ageing equipment platform.

Background

The existing scheme temporarily does not need to age the wafer-level optical chip, mainly aims at aging the cut product, and can find a defective product earlier by adopting a wafer-level aging technology, so that the cost loss caused by the subsequent process is reduced.

The optical chip wafer level aging equipment table in the prior art has the problems that the movement of a mounting mechanism is limited, a working mechanism cannot move and the like, and therefore the optical chip wafer level aging equipment table is provided.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides an optical chip wafer level ageing equipment platform can effectively solve among the background art installation mechanism and remove limited, operating mechanism not movable scheduling problem.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme: the utility model provides an optical chip wafer level ageing equipment platform, includes workstation, installation mechanism, positioning mechanism, coupling mechanism and operating mechanism, the workstation includes platen, first slide and second slide, installation mechanism includes the second slide, two second slide one end all with first slide upper surface connection, two the second slide other end all with second slide sliding fit, positioning mechanism includes the erection column, four a surface of erection column all is connected with a platen surface, coupling mechanism includes montant, third slide and third slide, montant a surface and platen week side-to-side connection, the rotatory round platform of operating mechanism, third slide one end and third slide sliding fit, the third slide other end and the rotatory round platform normal running fit.

Preferably, the workbench further comprises first slide rails, one ends of the first slide rails are connected with the upper surface of the bedplate, the other ends of the first slide rails are in sliding fit with the first slide base, and the bedplate is a working platform of the whole device.

Preferably, the mounting mechanism further comprises a mounting table, a first partition and a second partition, the mounting table is mounted on the upper surface of the second slide, the first partition and the second partition are connected with the first surface of the mounting table, and the first partition and the second partition are divided according to the size of the product.

Preferably, positioning mechanism still includes the locater, four the locater is installed respectively in four erection column week side faces, and the locater can carry out the accurate positioning to the chip of placing.

Preferably, the connecting mechanism further comprises a cross rod, the peripheral side face of the cross rod is connected with one surface of the vertical rod, the third slide rail is installed on the lower surface of the cross rod, and the vertical rod is a bearing platform for bearing the whole connecting mechanism and the working mechanism.

Preferably, operating mechanism still includes connecting rod, mounting panel, first needle card and second needle card, connecting rod one end and rotatory round platform lower surface are connected, the connecting rod other end and two mounting panel upper surface connections, first needle card and second needle card are installed respectively in two mounting panel lower surfaces, and rotatory round platform can change the position of first needle card and second needle card.

The utility model discloses following beneficial effect has:

1. the utility model is provided with the first slide rail and the second slide rail, the first slide rail slides with the first slide seat, and the second slide rail slides with the second slide seat, thus realizing the movement in all directions in the plane;

2. the utility model discloses a set up the third slide rail on the horizontal pole, the third slide slides on the third slide rail, can change operating device's position, has broken the fixed drawback of operating device in the past.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic diagram of an overall structure of an optical chip wafer level burn-in apparatus table according to the present invention;

fig. 2 is a schematic front view of the optical chip wafer level burn-in apparatus of the present invention;

fig. 3 is a schematic side view of the optical chip wafer level burn-in apparatus of the present invention;

fig. 4 is a schematic view of a part of an enlarged structure at a in fig. 1 according to the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

100. a work table; 110. a platen; 120. a first slide rail; 130. a first slider; 140. a second slide rail; 200. an installation mechanism; 210. a second slide carriage; 220. an installation table; 230. a first partition; 240. a second partition; 300. a positioning mechanism; 310. mounting a column; 320. a positioning instrument; 400. a connecting mechanism; 410. A vertical rod; 420. a cross bar; 430. a third slide rail; 440. a third slide carriage; 500. a working mechanism; 510. rotating the circular table; 520. a connecting rod; 530. mounting a plate; 540. a first pin card; 550. and a second pin card.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention is an optical chip wafer level burn-in apparatus table, which comprises a worktable 100, a mounting mechanism 200, and a positioning mechanism 300, the connecting mechanism 400 and the working mechanism 500, the workbench 100 includes a platen 110, a first slide carriage 130 and a second slide carriage 140, the mounting mechanism 200 includes a second slide carriage 210, one end of each of the two second slide carriages 140 is connected with the upper surface of the first slide carriage 130, the other end of each of the two second slide carriages 140 is in sliding fit with the second slide carriage 210, the positioning mechanism 300 includes a mounting column 310, one surface of each of the four mounting columns 310 is connected with one surface of the platen 110, the connecting mechanism 400 includes a vertical rod 410, a third slide carriage 430 and a third slide carriage 440, one surface of the vertical rod 410 is connected with the peripheral side of the platen 110, the working mechanism 500 rotates a circular table 510, one end of the third slide carriage 440 is in sliding fit with the third slide carriage 430, and the other end of the third slide carriage 440 is in rotating fit with the rotating circular table 510.

Referring to fig. 1, the workbench 100 further includes first slide rails 120, one ends of the two first slide rails 120 are connected to the upper surface of the bedplate 110, the other ends of the two first slide rails 120 are slidably engaged with the first slide carriage 130, and the bedplate 110 is a working platform of the whole device.

Referring to FIG. 1, the mounting mechanism 200 further includes a mounting platform 220, a first section 230 and a second section 240, the mounting platform 220 is mounted on the upper surface of the second slide 210, a surface of each of the first section 230 and the second section 240 is connected to a surface of the mounting platform 220, and the first section 230 and the second section 240 are divided according to the size of the product.

Referring to fig. 1, the positioning mechanism 300 further includes a positioning tool 320, the four positioning tools 320 are respectively installed on the peripheral sides of the four mounting posts 310, and the positioning tools 320 can accurately position the chips.

Referring to fig. 1 and 3, the connecting mechanism 400 further includes a cross bar 420, a peripheral side of the cross bar 420 is connected to a surface of a vertical bar 410, a third slide rail 430 is mounted on a lower surface of the cross bar 420, and the vertical bar 410 is a bearing platform for receiving the whole connecting mechanism 400 and the working mechanism 500.

Referring to fig. 1 and 2, the working mechanism 500 further includes a connecting rod 520, a mounting plate 530, a first pin clamp 540 and a second pin clamp 550, one end of the connecting rod 520 is connected to the lower surface of the rotary circular table 510, the other end of the connecting rod 520 is connected to the upper surfaces of the two mounting plates 530, the first pin clamp 540 and the second pin clamp 550 are respectively mounted on the lower surfaces of the two mounting plates 530, and the rotary circular table 510 can change the positions of the first pin clamp 540 and the second pin clamp 550.

The utility model discloses a theory of operation does: the platen 110 is a working platform of the whole apparatus, the first slide rail 120 and the first slide 130 slide, the second slide rail 140 and the second slide 210 slide, so that the mounting mechanism 200 can move in all directions in a plane, the third slide 440 slides on the third slide rail 430, so that the position of the working mechanism 500 can be changed, and the first pin clamp 540 and the second pin clamp 550 correspond to the first partition 230 and the second partition 240, respectively.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a light chip wafer level ageing equipment platform, includes workstation (100), installation mechanism (200), positioning mechanism (300), coupling mechanism (400) and operating device (500), its characterized in that: the workbench (100) comprises a bedplate (110), a first sliding seat (130) and a second sliding rail (140), the mounting mechanism (200) comprises second sliding seats (210), one ends of the two second sliding rails (140) are connected with the upper surface of the first sliding seat (130), the other ends of the two second sliding rails (140) are in sliding fit with the second sliding seats (210), the positioning mechanism (300) comprises mounting columns (310), one surface of each of the four mounting columns (310) is connected with one surface of the bedplate (110), the connecting mechanism (400) comprises a vertical rod (410), a third sliding rail (430) and a third sliding seat (440), one surface of the vertical rod (410) is connected with the peripheral side surface of the bedplate (110), the working mechanism (500) rotates the round table (510), one end of the third sliding seat (440) is in sliding fit with the third sliding rail (430), and the other end of the third sliding seat (440) is in rotating fit with the rotating circular truncated cone (510).

2. The optical chip wafer level burn-in apparatus of claim 1, wherein: the workbench (100) further comprises first sliding rails (120), one ends of the first sliding rails (120) are connected with the upper surface of the bedplate (110), and the other ends of the first sliding rails (120) are in sliding fit with the first sliding base (130).

3. The optical chip wafer level burn-in apparatus of claim 1, wherein: the mounting mechanism (200) further comprises a mounting table (220), a first partition (230) and a second partition (240), the mounting table (220) is mounted on the upper surface of the second sliding base (210), and one surface of each of the first partition (230) and the second partition (240) is connected with one surface of the mounting table (220).

4. The optical chip wafer level burn-in apparatus of claim 1, wherein: the positioning mechanism (300) further comprises four positioning instruments (320), and the four positioning instruments (320) are respectively arranged on the peripheral side surfaces of the four mounting columns (310).

5. The optical chip wafer level burn-in apparatus of claim 1, wherein: the connecting mechanism (400) further comprises a cross rod (420), the peripheral side face of the cross rod (420) is connected with one surface of the vertical rod (410), and the third sliding rail (430) is installed on the lower surface of the cross rod (420).

6. The optical chip wafer level burn-in apparatus of claim 1, wherein: the working mechanism (500) further comprises a connecting rod (520), a mounting plate (530), a first needle clamp (540) and a second needle clamp (550), one end of the connecting rod (520) is connected with the lower surface of the rotary circular table (510), the other end of the connecting rod (520) is connected with the upper surfaces of the two mounting plates (530), and the first needle clamp (540) and the second needle clamp (550) are respectively mounted on the lower surfaces of the two mounting plates (530).