CN213186705U

CN213186705U - Multilayer printed board for high pressure resistance

Info

Publication number: CN213186705U
Application number: CN202022609758.9U
Authority: CN
Inventors: 李清华; 张仁军; 牟玉贵; 胡志强
Original assignee: Sichuan Yingchuangli Electronic Technology Co Ltd
Current assignee: Sichuan Yingchuangli Electronic Technology Co Ltd
Priority date: 2020-11-12
Filing date: 2020-11-12
Publication date: 2021-05-11
Anticipated expiration: 2030-11-12

Abstract

The utility model discloses a multilayer printed board for high pressure resistance, it includes apron (1), kraft paper A (2), metal sheet A (3), silica gel blotter A (4), copper foil A (5), printed board (6), copper foil B (7), silica gel blotter B (8), metal sheet B (9), kraft paper B (10) and tray (11) that set firmly in order from top to bottom, the thickness of silica gel blotter A (4) and silica gel blotter B (8) equals; the top surface of the cover plate (1) is provided with a corrosion-resistant layer (12); a plurality of heat sinks (13) are arranged on the bottom surface of the tray (11). The utility model has the advantages that: compact structure, long service life and high pressure resistance.

Description

Multilayer printed board for high pressure resistance

Technical Field

The utility model relates to a technical field of printing board structure, especially a be used for high pressure resistant multilayer printing board.

Background

At present, along with the increase of functions of electronic products, the service environment and the service life of the electronic products are higher and higher, and the common printed board is easy to corrode, soften, deform, mildew, puncture and the like under the environments of chemistry, vibration, high dust, salt mist, humidity, high temperature and the like, so that the service life of the circuit on the surface of the printed board is influenced by environmental factors. The printed board has a broken circuit in a long-time operation under high voltage, thereby reducing the service life of the printed board. In addition, the printed board is subjected to large thermal pressure in the production process, and the thermal pressure causes deformation of the printed board, so that lines on the upper surface and the lower surface of the printed board are laminated and damaged, the service life of the printed board is further shortened, and therefore a multilayer printed board which is long in service life and used for high pressure resistance is urgently needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, long service life, high pressure resistant be used for high pressure resistant multilayer printing board.

The purpose of the utility model is realized through the following technical scheme: the utility model provides a be used for high pressure resistant multilayer printed board, it includes from last apron, kraft paper A, metal sheet A, silica gel blotter A, copper foil A, printing board, copper foil B, silica gel blotter B, metal sheet B, kraft paper B and the tray that down sets firmly in order, silica gel blotter A equals with silica gel blotter B's thickness.

The top surface of the cover plate is provided with a corrosion-resistant layer.

A plurality of heat sinks are arranged on the bottom surface of the tray.

The radiator is a tooth-plate radiator.

The metal plate A and the metal plate B are both steel plates.

The printed board is provided with a plurality of device holes, and the device holes penetrate through the silica gel cushion A, the silica gel cushion B and the printed board.

The utility model has the advantages of it is following:

1. the upper surface and the lower surface of the printed board are respectively bonded with the silica gel cushion pads, the silica gel cushion pads are used for protecting the printed board, the using function of the printed board is met under the severe environment and high voltage condition, the printed board is prevented from being damaged or broken down under high voltage when in use, the service life of the printed board is prolonged, and the use safety and reliability are ensured.

2. Compared with the common printed board, the printed board has the advantages that the service life is prolonged by 10-20 years, the use environment is not limited, and the application range is wide.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is an exploded view of the present invention;

in the figure, 1-cover plate, 2-kraft paper A, 3-metal plate A, 4-silica gel cushion A, 5-copper foil A, 6-printed plate, 7-copper foil B, 8-silica gel cushion B, 9-metal plate B, 10-kraft paper B, 11-tray, 12-corrosion-resistant layer, 13-radiator.

Detailed Description

The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:

as shown in fig. 1-2, the multilayer printed board for high voltage resistance comprises a cover plate 1, kraft paper a2, a metal plate A3, a silica gel buffer pad a 4, a copper foil a 5, a printed board 6, a copper foil B7, a silica gel buffer pad B8, a metal plate B9, kraft paper B10 and a tray 11 which are fixedly arranged from top to bottom in sequence, wherein the thicknesses of the silica gel buffer pad a 4 and the silica gel buffer pad B8 are equal. When the layers are laminated and typeset, the maximum laminating pressure can be set to 20kg/cm and the laminating temperature is 190 ℃ at the maximum because the silicone cushion A4 and the silicone cushion B8 are respectively paved on the copper foils at the upper and lower outermost layers of the printed board 6. Because silica gel blotter and FR-4 worn-out fur windowing department recess lead to the face unevenness, the purpose of using the silica gel blotter is that recess department can not lose pressure when the face unevenness, consequently has high resistance to pressure. A silica gel buffer pad is bonded on the upper surface and the lower surface of the printed board 6 and used for protecting the printed board 6, so that the using function of the printed board is met under severe environment and high pressure, and the printed board is prevented from being damaged or broken down under high pressure when in use, so that the service life of the printed board is prolonged, and the use safety and reliability are ensured. In addition, the silica gel cushion A4 and the silica gel cushion B8 form circuit layers on the upper surface and the lower surface of the printed board 6, damage to the circuit layers in the hot pressing process is avoided, and the service life of the printed board is further prolonged.

The corrosion-resistant layer 12 is arranged on the top surface of the cover plate 1, and the corrosion-resistant layer 12 prevents the printed board 6 from being corroded, so that the protection effect is achieved, and the service life of the printed board is further prolonged. A plurality of heat sinks 13 are arranged on the bottom surface of the tray 11, and the heat sinks 13 can rapidly discharge heat generated by the printed board 6 to the outside, thereby playing a role in heat dissipation. The heat sink 13 is a fin type heat sink. The metal plate A3 and the metal plate B9 are both steel plates. The printed board 6 is provided with a plurality of device holes, and the device holes penetrate through the silica gel cushion A4, the silica gel cushion B8 and the printed board 6.

The manufacturing process of the multilayer printed board comprises the following steps:

A. process flow

a. The printed board process: cutting → drilling → circuit → etching → brown oxidation → laminating → edge milling frame → drilling → copper deposition → electroplating → circuit → etching → solder resist → character → surface treatment → molding → test → light plate to be pressed

FR-4 light panel procedure: cutting → drilling → windowing of light panel → pressing of light panel

c. The non-flowing adhesive bonding sheet flow comprises the following steps: cutting → drilling → bonding sheet windowing → optical panel to be pressed

d. Outer layer flow: pressing light plate → pressing → drilling → forming → quality inspection

B. According to the process, the multilayer printed board is normally produced to be tested, and an FR-4 light plate is bonded on the printed board. Wherein, the FR-4 optical plate is an insulating layer of the copper-clad plate after copper layers on two sides are removed.

C. And after cutting the FR-4 light panel, drilling a positioning hole fixed with the edge of the panel and an alignment hole when the FR-4 light panel is bonded with the multilayer printed board, and then hollowing the position of a device hole of the corresponding printed board where a device and a plug-in are to be mounted by using a programming program of the light panel and a forming machine, wherein the window opening of the FR-4 light panel is 6-8mil larger than the unilateral side of a bonding pad of the corresponding printed board, and the corresponding non-metallized hole is as large as the non-metallized hole on the printed board.

D. The adhesive sheet without flowing adhesive drills out a positioning hole fixed with the edge of the board and an alignment hole when the adhesive sheet is adhered with the multilayer printed board, then the adhesive sheet uses a programmed program to use a forming machine to hollowing the position of a device hole of the corresponding printed board where a device and a plug-in unit are to be pasted, the window of the adhesive sheet is 4-6mil larger than the single side of an FR-4 light plate, and the corresponding non-metallized hole is as large as the non-metallized hole on the printed board.

E. Before the FR-4 light board and the printed board are pressed, a non-flowing adhesive bonding sheet and the light board are sequentially placed on two sides of the printed board respectively, and then the light board is fixed on a positioning hole of the printed board by using a 3.175mm split nail. The alignment precision of the FR-4 optical plate and the printed board is controlled within 0.05mm when the optical plate and the printed board are laminated.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A multilayer printed board for high voltage resistance, characterized in that: it includes from last apron (1), kraft paper A (2), metal sheet A (3), silica gel blotter A (4), copper foil A (5), printing board (6), copper foil B (7), silica gel blotter B (8), metal sheet B (9), kraft paper B (10) and tray (11) that down set firmly in order, silica gel blotter A (4) equals with the thickness of silica gel blotter B (8).

2. The multilayer printed board for high voltage resistance according to claim 1, wherein: the corrosion-resistant layer (12) is arranged on the top surface of the cover plate (1), and the corrosion-resistant layer (12) prevents the printed board (6) from being corroded and plays a role in protection.

3. The multilayer printed board for high voltage resistance according to claim 1, wherein: the bottom surface of the tray (11) is provided with a plurality of radiators (13), and the radiators (13) can quickly discharge heat generated by the printed board (6) to the outside, so that the heat dissipation effect is achieved.

4. The multilayer printed board for high voltage resistance according to claim 3, wherein: the radiator (13) is a toothed plate radiator.

5. The multilayer printed board for high voltage resistance according to claim 1, wherein: the metal plate A (3) and the metal plate B (9) are both steel plates.

6. The multilayer printed board for high voltage resistance according to claim 1, wherein: the printed board (6) is provided with a plurality of device holes, and the device holes penetrate through the silica gel cushion A (4), the silica gel cushion B (8) and the printed board (6).