CN213124431U - Mounting device for power semiconductor radiator - Google Patents
Mounting device for power semiconductor radiator Download PDFInfo
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- CN213124431U CN213124431U CN202120653264.2U CN202120653264U CN213124431U CN 213124431 U CN213124431 U CN 213124431U CN 202120653264 U CN202120653264 U CN 202120653264U CN 213124431 U CN213124431 U CN 213124431U
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- radiator
- inboard
- outside
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- fastener
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Abstract
The utility model relates to an installation device for power semiconductor radiator, the device include box shop front, inboard radiator and outside radiator, the box shop front is equipped with the radiator mounting hole, and inboard radiator is located the inboard of box shop front, and the outside radiator is installed in the outside surface of box shop front, and semiconductor element is located the inside of box shop front, just inboard radiator and outside radiator are hugged closely respectively to semiconductor element's positive and negative, and the radiator fastener passes the radiator mounting hole and is connected a whole with inboard radiator, outside heat dissipation and semiconductor element. The utility model discloses installation device is simple, and the installation of being convenient for can effectively improve the radiating effect of radiator, helps power semiconductor's heat dissipation.
Description
Technical Field
The utility model relates to a mounting structure of radiator specifically indicates a mounting device for power semiconductor radiator.
Background
In modern life, the power supply is related to public interests of society and quality of life and production of people, and the demand and quality of power supply are higher in both the power supply of the industrial and commercial service industry and the daily life power supply of residents, so that the quality of related power supply equipment and matched components thereof also needs to be improved accordingly. For example, with the rapid development of power semiconductors, the applications of power semiconductors are becoming more and more extensive, and power semiconductors have the characteristics of small size, relatively simple structure, strong functions, and the like, and for example, products such as thyristors, diodes, and the like are widely applied to various electronic devices and electronic products, and are used as controllable rectification, inversion, voltage regulation, contactless switches, and the like.
However, when the power semiconductor device is operated, heat energy loss is generated due to large current, the temperature of the semiconductor device is increased by the heat energy generated by the heat energy loss, and if the temperature is not controlled to be increased in time through an external medium, the semiconductor device fails due to overhigh temperature, so that the conventional power semiconductor device needs to be assembled with a radiator to meet the heat dissipation requirement of a product.
The selection of the radiator and the effective and reasonable mounting structure greatly affect the heat dissipation efficiency of the power semiconductor element, the existing mounting structure is complex, and the reliability is unstable, so that a novel mounting structure of the power semiconductor element needs to be researched to solve the structural mounting problem and improve the heat dissipation performance of the power semiconductor element.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome above-mentioned prior art not enough and provide a mounting device for power semiconductor radiator, this mounting device is simple, and the installation of being convenient for can effectively improve the radiating effect of radiator, helps power semiconductor's heat dissipation.
The utility model discloses realize the technical scheme that the purpose was adopted is a mounting device for power semiconductor radiator, and this mounting device includes box shop front, inboard radiator, outside radiator and radiator fastener, the box shop front is equipped with the radiator mounting hole, and inboard radiator is located the inboard of box shop front, and the outside radiator is installed in the outside surface of box shop front, and semiconductor element is located the inside of box shop front, just inboard radiator and outside radiator are hugged closely respectively to semiconductor element's positive and negative, and the radiator fastener passes the radiator mounting hole and connects into a whole with inboard radiator, outside radiator and semiconductor element.
In the above technical scheme, the radiator fastener includes a flat iron support and a flat iron fastener, the flat iron support passes through the sheet scattering gap of the outer side radiator and is placed on the sheet scattering of the outer side radiator, and the flat iron fastener passes through the flat iron support and the radiator mounting hole in sequence and then fixedly connects the outer side radiator, the inner side radiator and the semiconductor element with the door surface of the box body.
Furthermore, the upper end and the lower end of the radiator at the outer side are respectively provided with a radiator supporting piece, and the radiator supporting pieces are fixed with the door surface of the box body through flat iron fasteners.
Furthermore, the flat iron fastener penetrates through the flat iron support piece, the radiator support piece and the radiator mounting hole in sequence and then fixedly connects the outer side radiator, the inner side radiator and the semiconductor element with the door surface of the box body.
The utility model discloses following beneficial effect has: the power semiconductor element is cooled through the inner side radiator and the outer side radiator, the cooling effect is improved, the inner side radiator, the outer side radiator and the semiconductor element can be stably fixed on the door surface of the box body through the radiator fastening piece, and the mounting stability is improved.
Drawings
Fig. 1 is a schematic structural view of a mounting device for a power semiconductor heat sink.
Fig. 2 is a schematic cross-sectional view of fig. 1.
In the figure, 1-box body door surface, 2-flat iron supporting piece, 3-flat iron fastening piece, 4-radiator, 5-radiator fastening piece, 6-radiator mounting hole, 7-radiator supporting piece, 8-inner radiator, 9-outer radiator and 10-semiconductor element.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and specific embodiments.
As shown in fig. 1 and 2, the mounting device for the power semiconductor radiator comprises a case door surface 1, a radiator 4 and a radiator fastener 5, wherein the case door surface 1 is manufactured, and a radiator mounting hole 6 is determined according to the mounting size of the radiator 4 so as to facilitate the mounting and fastening of the radiator 4.
The heat sink 4 includes an inner heat sink 8 and an outer heat sink 9, the inner heat sink 8 is positioned inside the case door 1 but not in contact with the inner surface of the case door 1, the outer heat sink 9 is attached to the outer surface of the case door 1, the front and back surfaces of the semiconductor element 10 are closely attached to the inner heat sink 8 and the outer heat sink 9, and the inner heat sink 8 is relatively separated from the outer heat sink 9 by the semiconductor element 10. The semiconductor element 10 is not in contact with the case door surface 1, but only in contact with the inner radiator 8 and the outer radiator 9, the radiator fastener 5 fixes the inner radiator 8, the outer radiator 9 and the semiconductor element 10 as a whole, and the whole and the case door surface 1 are positioned and connected in the following way:
the radiator fastening piece 5 comprises a flat iron support piece 2 and a flat iron fastening piece 3, the flat iron support piece 2 penetrates through a sheet scattering gap of the outer side radiator 9 and is placed on a sheet scattering of the outer side radiator 9, and the flat iron fastening piece 3 penetrates through the flat iron support piece 2, the radiator support piece 7 and the radiator mounting hole 6 in sequence and then fixedly connects the outer side radiator 9, the inner side radiator 8 and the semiconductor element 10 with the box body door surface 1.
In order to stably fix the outer side radiator 9, the upper end and the lower end of the outer side radiator 9 are respectively provided with a radiator support piece 7, the radiator support piece 7 clamps and fixes the outer side radiator 9, the radiator support piece 7 is fixed with the box body door surface 1 through a flat iron fastener 3, and specifically, the flat iron fastener 3 passes through a flat iron support piece 2, the radiator support piece 7 and a radiator mounting hole in sequence and then fixedly connects the outer side radiator 9, the inner side radiator 8 and a semiconductor element 10 with the box body door surface.
Claims (4)
1. A mounting device for a power semiconductor heat sink, characterized by: including box shop front (1), inboard radiator (8), outside radiator (9) and radiator fastener (5), box shop front (1) is equipped with the radiator mounting hole, and inboard radiator (8) are located the inboard of box shop front (1), and outside radiator (9) are installed in the outside surface of box shop front (1), and semiconductor element (10) are located the inside of box shop front (1), just inboard radiator (8) and outside radiator (9) are hugged closely respectively to the positive and negative of semiconductor element (10), and radiator fastener (5) pass the radiator mounting hole and connect inboard radiator (8), outside radiator (9) and semiconductor element (10) into a whole.
2. A mounting device for a power semiconductor heat sink according to claim 1, characterized in that: radiator fastener (5) include band iron props up piece (2) and band iron fastener (3), band iron props up piece (2) and passes the scattered clearance of piece of outside radiator (9) and place and scatter in the piece of outside radiator (9), and band iron fastener (3) pass in proper order after band iron props up piece (2) and the radiator mounting hole with outside radiator (9), inboard radiator (8) and semiconductor component (10) and box door face fixed connection.
3. A mounting device for a power semiconductor heat sink according to claim 1, characterized in that: and the upper end and the lower end of the outer side radiator (9) are respectively provided with a radiator supporting piece (7), and the radiator supporting piece (7) is fixed with the door surface (1) of the box body through a flat iron fastener (3).
4. A mounting device for a power semiconductor heat sink according to claim 3, characterized in that: and the flat iron fastener (3) penetrates through the flat iron support piece (2), the radiator support piece (7) and the radiator mounting hole in sequence and then fixedly connects the outer side radiator (9), the inner side radiator (8) and the semiconductor element (10) with the door surface of the box body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120653264.2U CN213124431U (en) | 2021-03-31 | 2021-03-31 | Mounting device for power semiconductor radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120653264.2U CN213124431U (en) | 2021-03-31 | 2021-03-31 | Mounting device for power semiconductor radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213124431U true CN213124431U (en) | 2021-05-04 |
Family
ID=75668596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120653264.2U Active CN213124431U (en) | 2021-03-31 | 2021-03-31 | Mounting device for power semiconductor radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213124431U (en) |
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2021
- 2021-03-31 CN CN202120653264.2U patent/CN213124431U/en active Active
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