CN213094624U - Laminate capable of preventing asymmetric processing warping - Google Patents

Abstract

The utility model discloses a prevent warping plywood of asymmetric processing, including middle sandwich layer and the surface course of laying in middle sandwich layer upper and lower surface, the cavity that link up is seted up to the position department that treats processing region corresponding to the surface course of upper surface on the middle sandwich layer, and it has high strength material to fill on the cavity. The utility model discloses improve the fine machining in-process and remove the unbalanced phenomenon of internal stress that leads to after the back because of partial surface layer material is milled, improve the intensity of laminated board, avoid warping emergence.

Description

Laminate capable of preventing asymmetric processing warping

Technical Field

The utility model belongs to the technical field of composite board technique and specifically relates to a prevent warping plywood of asymmetric processing is related to.

Background

The laminated board is also called a sandwich board, and is generally formed by laminating two or more high-strength thin boards serving as surface layers and a light sandwich layer filled between the upper surface layer and the lower surface layer. In recent years, with the high requirements of electronic products on portability and durability, sandwich plates with surface layers made of carbon fiber composite materials and core layers made of light glass fiber reinforced epoxy resin composite materials are more and more widely applied to 3C electronic products. Due to their multilayer composite structure, they are more prone to warping than homogeneous materials, for which reason sandwich panels are generally designed as symmetrical structures to minimize warping. However, when a sandwich panel is used, it is usually necessary to process a single surface of the sandwich panel, for example, to design some grooves, holes, etc. for placing some functional electronic components. As the finish machining performed on a single face of the sandwich panel breaks the symmetry of the sandwich panel structure, asymmetric internal stresses are generated, resulting in significant warpage of the sandwich panel. However, the current field of electronic products, such as 3c electronic products, has higher requirements on the warpage of the sandwich panel, and the excessive warpage will affect the installation of functional electronic components on the sandwich panel and the overall assembly of the sandwich panel.

Therefore, the above-mentioned existing problems have become a technical problem to be solved.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a prevent warping plywood of asymmetric processing treats the processing region and sets up the cavity corresponding to the surface course on middle sandwich layer, fills high strength material in the cavity, improves the intensity of finish machining in-process because of the unbalanced phenomenon of internal stress that leads to after partial surface course material is detached by milling, avoids warping emergence.

In order to solve the technical problem, the utility model provides a technical scheme is: the utility model provides an anti-asymmetric processing warping's plywood, includes middle sandwich layer and lays in the upper surface layer and the lower floor of middle sandwich layer upper and lower surface, the first region of treating that corresponds to the upper surface layer of upper surface on the middle sandwich layer and second treat the position department in region and offer the first cavity and the second cavity that link up first high strength material and second high strength material are filled to first cavity and second cavity on.

In the laminated board for preventing asymmetric processing warpage, the first cavity and the second cavity penetrate through the middle core layer.

In the laminated board for preventing the asymmetric processing warpage, the thicknesses of the first high-strength material and the second high-strength material filled in the first cavity and the second cavity of the middle core layer are the same as the depths of the first cavity and the second cavity.

In the laminated board for preventing asymmetric processing warpage, the planar areas of the first cavity and the second cavity on the middle core layer are larger than the areas of the first region to be processed and the second region to be processed on the upper layer.

In the laminated board for preventing the asymmetric processing warpage, the middle core layer is made of a light glass fiber reinforced epoxy resin composite material.

The above technical scheme is adopted in the utility model, through improving the buckled plywood of an anti-symmetry processing, this improves the buckled method of the asymmetric processing of plywood and includes: a cavity is arranged on the middle core layer of the laminated board corresponding to the area to be processed of the surface layer; filling a high-strength material in the cavity of the middle core layer; symmetrically paving surface layer materials on the upper surface and the lower surface of the middle core layer, and performing hot-pressing curing under the conditions of high temperature, high pressure and vacuum; and performing finish machining operation on the area to be processed of the surface layer of the laminated board formed by hot pressing and curing.

The cavity is formed in the part, corresponding to the surface layer to-be-processed area, of the middle core layer and is replaced by the high-strength material, the high-strength material below the finish processing area plays a role in strengthening and supporting when the to-be-processed area on the surface layer is subjected to finish processing, the phenomenon of unbalanced internal stress is improved, the warping phenomenon is prevented, and the strength and the quality of the laminated board are improved.

According to the processing method for improving the asymmetric processing warpage of the laminated board, the plane area of the cavity on the middle core layer is larger than the area of the area to be processed on the surface layer. During finish machining, the machining area on the surface layer can be supported by the high-strength material filled in the cavity, and buckling deformation is avoided.

The above technical scheme is adopted in the utility model, through seting up the cavity on the inside middle sandwich layer of plywood to fill high strength material, promote the intensity of plywood, improve the unbalanced phenomenon of internal stress after getting rid of because of partial surface layer material is milled at the finish machining in-process, prevent warping phenomenon's emergence.

The utility model discloses the beneficial effect who gains is: the utility model discloses processing method is simple, and maneuverability is strong, effectively promotes the intensity of plywood, improves asymmetric processing and leads to the internal stress unbalanced, has avoided the emergence of warpage phenomenon for the plywood keeps surfacing after the finish machining, can not influence the assembly of the regional electronic components of finish machining.

Drawings

FIG. 1 is a schematic view of an exploded structure of a laminate according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure view of the laminate of fig. 1 according to an embodiment of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description.

As shown in fig. 1 and 2, the laminate for preventing asymmetric processing warpage comprises a middle core layer 1, and an upper surface layer 2A and a lower surface layer 2B laid on the upper and lower surfaces of the middle core layer 1, wherein a first cavity 3a and a second cavity 3B penetrating through the middle core layer 1 are formed at positions corresponding to a first region to be processed 4a and a second region to be processed 4B of the upper surface layer 2A, and a first high-strength material 3a1 and a second high-strength material 3B1 are filled in the first cavity 3a and the second cavity 3B.

A process for improving the asymmetric processing warpage of a laminate, the process comprising:

a first cavity 3a and a second cavity 3b are arranged on the middle core layer 1 of the laminated board corresponding to the first region to be processed 4a and the second region to be processed 4b of the surface layer 2A;

filling the first and second cavities 3a and 3b of the intermediate core layer 1 with the first and second high-strength materials 3a and 3b1 and 3b 1;

symmetrically paving surface layer materials on the upper surface and the lower surface of the middle core layer 1, and performing hot-pressing curing under the conditions of high temperature, high pressure and vacuum;

and performing finishing operation on the first to-be-processed area 4a and the second to-be-processed area 4b of the surface layer of the laminated board formed by hot pressing and curing.

In the present processing method, the first cavity 3a and the second cavity 3b penetrate the intermediate core layer 1.

The first and second high-strength materials 3a1 and 3b1 filled in the first and second cavities 3a and 3b of the intermediate core layer 1 have the same thickness as the depth of the first and second cavities 3a and 3 b.

The planar areas of the first cavity 3a and the second cavity 3b on the intermediate core layer 1 are larger than the areas of the first region to be processed 4a and the second region to be processed 4b on the upper layer 2A.

The first and second high-strength materials 3a1 and 3b1 filled on the intermediate core layer 1 include at least one of a high-strength glass fiber material, a high-strength carbon fiber material, and a high-strength aramid fiber material.

The middle core layer 1 is made of a light glass fiber reinforced epoxy resin composite material.

When the utility model is implemented, corresponding to the positions of the first to-be-processed area 4a and the second to-be-processed area 4B on the surface layer 2A, the first cavity 3a and the second cavity 3B are arranged on the middle core layer 1, then the first high-strength material 3a1 and the second high-strength material 3B1 are filled in the positions of the first cavity 3a and the second cavity 3B, wherein the thickness of the first high-strength material 3a1 and the second high-strength material 3B1 is the same as the depth of the cavity, so that the whole thickness of the middle core layer 1 is flat, the upper surface layer 2A and the lower surface layer 2B are symmetrically laid on the middle core layer 1, when the fine processing is carried out on the first to-be-processed area 4a and the second to-be-processed area 4B of the upper surface layer 2A, the filled first high-strength material 3a1 and the second high-strength material 3B1 play a role of supporting the upper surface layer 2A, thereby avoiding the internal stress caused by unbalanced warping caused by an asymmetrical processing mode, the structural strength of the laminate is improved.

The high-strength material described in this embodiment may be a prepreg of high-strength fibers, or may be a cured high-strength fiber composite material. In the present invention, the cavity includes but is not limited to the first cavity 3a and the second cavity 3b, and in other embodiments, the number of the cavities and the filled high-strength material should be designed according to the actual processing requirement.

In summary, the present invention has been made to practical samples according to the description and the drawings, and after a plurality of use tests, the utility model can be proved to achieve the expected purpose, and the practical value is undoubted. The above-mentioned embodiments are only used to conveniently illustrate the present invention, and are not to the limit of the present invention in any form, and any person who knows commonly in the technical field has, if not in the scope of the technical features of the present invention, utilize the present invention to make the equivalent embodiment of local change or modification, and not to break away from the technical features of the present invention, and all still belong to the technical features of the present invention.

Claims (5)

1. A laminate resistant to asymmetric processing warpage, characterized by: including middle sandwich layer (1) and lay upper surface layer (2A) and lower surface layer (2B) on middle sandwich layer (1) upper and lower surface, first cavity (3a) and second cavity (3B) that link up are seted up to the position department that first treat processing region (4a) and second treat processing region (4B) corresponding to upper surface layer (2A) on middle sandwich layer (1) first cavity (3a) and second cavity (3B) are gone up to pack and are had first high strength material (3a1) and second high strength material (3B 1).

2. A laminate protected from asymmetric processing warpage as claimed in claim 1 in which: the first cavity (3a) and the second cavity (3b) penetrate through the middle core layer (1).

3. A laminate protected against asymmetric processing warpage according to claim 1 or 2, wherein: the first and second high-strength materials (3a1, 3b1) filled in the first and second cavities (3a, 3b) of the intermediate core layer (1) have the same thickness as the depth of the first and second cavities (3a, 3 b).

4. A laminate protected against asymmetric processing warpage according to claim 1 or 2, wherein: the plane areas of the first cavity (3a) and the second cavity (3b) on the middle core layer (1) are larger than the areas of the first region to be processed (4a) and the second region to be processed (4b) on the upper layer (2A).

5. A laminate protected against asymmetric processing warpage according to claim 1 or 2, wherein: the middle core layer (1) is made of a light glass fiber reinforced epoxy resin composite material.

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