CN211240296U - Super-smooth high-hardness PCB substrate - Google Patents
Super-smooth high-hardness PCB substrate Download PDFInfo
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- CN211240296U CN211240296U CN201921833782.1U CN201921833782U CN211240296U CN 211240296 U CN211240296 U CN 211240296U CN 201921833782 U CN201921833782 U CN 201921833782U CN 211240296 U CN211240296 U CN 211240296U
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Abstract
The utility model relates to the technical field of PCB, in particular to an ultra-smooth high-hardness PCB substrate, which comprises a core material layer, wherein both sides of the core material layer are provided with matched surface fabric filling plates, both sides of the core material layer are provided with connecting grooves, both surface fabric filling plates are provided with connecting parts, one side of one connecting part is provided with a plurality of stretching-resistant tooth grooves, the other connecting part is provided with fastening teeth, an adhesive is filled between the stretching-resistant tooth grooves and one side of the fastening teeth, both ends of the surface fabric filling plates are provided with lateral grooves, one side of the groove wall of the lateral groove is provided with a lateral side band, one side of the surface fabric filling plate is provided with a copper foil layer, one side of the copper foil layer is provided with a bonding layer, through the improvement of the utility model, the stretching-resistant performance of the high-hardness PCB substrate is effectively improved, the occurrence of the side warping phenomenon is, is suitable for popularization.
Description
Technical Field
The utility model relates to a PCB base plate technical field especially relates to a super smooth high rigidity PCB base plate.
Background
The substrate is a basic material for manufacturing the PCB, and generally, the substrate is a copper clad laminate, and the single-sided or double-sided board is a panel on which a desired circuit pattern is printed by directly using a single layer or double layers of the substrate, and the desired circuit pattern is obtained by selectively performing processes such as hole processing, electroless copper plating, electrolytic copper plating, etching, and the like. Common substrates generally fall into two broad categories: rigid plates, commonly known as hardboards; flexible boards or flexible composite boards. The kind of rigid board is well developed, and can be divided into phenolic PCB paper substrate, composite PCB substrate, glass fiber PCB substrate, etc. according to the difference of materials, wherein the composite PCB substrate is most widely used due to its high hardness and good machining performance. However, the composite PCB substrate has many disadvantages, such as edge warping or bending easily occurring when a single-sided board or a double-sided board is used, or an internal layer deviation easily occurring when a TG temperature is reached when PP glue is used for lamination. Therefore, the utility model provides an ultra-smooth high rigidity PCB base plate solves above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the existing easy shortcoming of raising the limit or the layer partially that takes place among the prior art, and the super smooth high rigidity PCB base plate that provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
designing an ultra-smooth high-hardness PCB substrate, which comprises a core material layer, wherein both sides of the core material layer are provided with matched fabric filling plates, both sides of the core material layer are provided with a through connecting groove, both the two fabric filling plates are provided with strip-shaped combining parts matched with the connecting grooves, one side of one of the combination parts is provided with a plurality of anti-stretching tooth sockets, the other combination part is provided with fastening teeth matched with the anti-stretching tooth sockets, an adhesive is filled between the stretch-resistant tooth grooves and one side of the fastening teeth, lateral grooves are formed in the two adjacent ends of the fabric filling plate and the fastening teeth, and a side edge belt matched with the side groove is arranged on one side of the groove wall of the side groove, a copper foil layer is arranged on one side of the fabric filling plate far away from the core material layer, and an adhesive layer is arranged between the copper foil layer and one side of the fabric filling plate.
Preferably, the outer side of the copper foil layer is provided with a region to be subjected to screen printing, and two sides of the copper foil layer adjacent to the region to be subjected to screen printing are provided with insulating positioning holes.
Preferably, the core material layer is formed by gluing and fixing a plurality of layers of wood pulp paper boards, the glue joint agent is epoxy resin glue joint agent, and the fabric filling board is formed by gluing and compounding a plurality of layers of glass fiber cloth and fabric resin.
Preferably, the side band and the fabric filling plate are fixed with the copper foil layer through hot pressing, and the side band is formed by gluing, superposing and fixing a plurality of layers of fiber paper.
Preferably, the surface of the copper foil layer is subjected to polishing and grinding surface treatment, heat-resistant layer treatment and oxidation-resistant treatment.
The utility model provides a pair of super smooth high rigidity PCB base plate, beneficial effect lies in: through setting and cooperation of core material layer and surface fabric infill panel in the base plate, and it has the epoxy adhesive to fill in inside, the surface fabric adopts the fine cloth combined material of glass of high rigidity simultaneously, can make the base plate obtain higher hardness, be favorable to later stage drilling or silk screen printing to cover copper, set up the spread groove through the both ends at the core material layer, set up the bar joint portion in one side that the surface fabric infill panel corresponds simultaneously, prevent that the surface fabric infill panel from taking place serious layer inclined to one side phenomenon after receiving tensile stress, destroy inside circuit, the lateral part sideband has been set up in surface fabric panel both sides simultaneously, and it is fixed to carry out the pressfitting through the mode of hot pressing, effectually prevent the lateral part stick up limit, the copper foil layer is through multichannel surface treatment, it is smooth and level, holistic simple.
Drawings
Fig. 1 is a schematic structural view of an ultra-smooth high-hardness PCB substrate provided by the present invention;
fig. 2 is a schematic view of a cross-sectional structure of an ultra-smooth high-hardness PCB substrate according to the present invention.
In the figure: the structure comprises a core material layer 1, a fabric filling plate 2, a connecting groove 3, a bonding part 31, an anti-stretching tooth groove 4, fastening teeth 5, a side groove 6, a side edge 61, a copper foil layer 7, a to-be-silk-screen printing area 71, an adhesive layer 8 and an insulation positioning hole 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, an ultra-smooth high-hardness PCB substrate comprises a core material layer 1, wherein two sides of the core material layer 1 are respectively provided with a matched fabric filling plate 2, an epoxy resin adhesive is filled between the core material layer 1 and the fabric filling plates 2, two sides of the core material layer 1 are respectively provided with a through connecting groove 3, two fabric filling plates 2 are respectively provided with a strip-shaped combining part 31 matched with the connecting grooves 3, the combination part 31 is arranged to enable the two fabric filling plates 2 to generate layer deviation when being subjected to tensile force, one side of one combining part 31 is provided with a plurality of anti-stretching tooth grooves 4, the other combining part 31 is provided with fastening teeth 5 matched with the anti-stretching tooth grooves 4, an adhesive is filled between one side of the anti-stretching tooth grooves 4 and one side of the fastening teeth 5, the fastening teeth 5 and the anti-stretching tooth grooves 4 are arranged equidistantly and equally, two adjacent ends of the fabric filling plates 2 and the fastening teeth 5 are respectively provided with a, cell wall one side of lateral part recess 6 is equipped with rather than assorted lateral part side area 61, and lateral part side area 61 can effectually prevent that the side from raising hair thorn or warping the limit, and one side that core bed of material 1 was kept away from to surface fabric infill panel 2 is equipped with copper foil layer 7, is equipped with bond line 8 between one side of copper foil layer 7 and surface fabric infill panel 2, strengthens holistic fastening degree, improves the hardness of whole base plate.
The utility model discloses in, the outside of copper foil layer 7 is equipped with and remains silk screen printing district 71, and copper foil layer 7 all is equipped with insulating locating hole 9 with the both sides of treating that silk screen printing district 71 is adjacent, and the location processing when insulating locating hole 9 is provided with and does benefit to multilayer substrate coincide.
Core bed of material 1 adopts a plurality of layers of wood pulp cardboard to form through gluing fixedly, and the adhesive adopts the epoxy resin adhesive, and surface fabric infill panel 2 adopts a plurality of layers of glass fine cloth and surface fabric resin to glue the bonding complex and form, and lateral part sideband 61, surface fabric infill panel 2 all are fixed through the hot pressing with copper foil layer 7, and lateral part sideband 61 adopts a plurality of layers of fiber paper to form through sticky coincide is fixed for the stretch resistance performance of side further improves, prevents the side burr simultaneously.
The surface of the copper foil layer is subjected to polishing and grinding surface treatment, heat-resistant layer treatment and anti-oxidation treatment, the surface is smooth and flat, subsequent processing is facilitated, the overall structure is strong in practicability, and the copper foil layer is suitable for popularization.
Above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.
Claims (5)
1. A super-smooth high-hardness PCB substrate comprises a core material layer (1) and is characterized in that two sides of the core material layer (1) are respectively provided with a matched fabric filling plate (2), two sides of the core material layer (1) are respectively provided with a through connecting groove (3), two fabric filling plates (2) are respectively provided with a strip-shaped combining part (31) matched with the connecting grooves (3), one side of one combining part (31) is provided with a plurality of anti-stretching tooth grooves (4), the other combining part (31) is provided with fastening teeth (5) matched with the anti-stretching tooth grooves (4), an adhesive is filled between one side of each anti-stretching tooth groove (4) and one side of each fastening tooth (5), two ends of the fabric filling plates (2) adjacent to the fastening teeth (5) are respectively provided with a side groove (6), one side of each side groove (6) is provided with a side belt (61) matched with the side groove, and a copper foil layer (7) is arranged on one side, away from the core material layer (1), of the fabric filling plate (2), and an adhesive layer (8) is arranged between the copper foil layer (7) and one side of the fabric filling plate (2).
2. The ultra-smooth high-hardness PCB substrate as claimed in claim 1, wherein the area (71) to be screen printed is arranged on the outer side of the copper foil layer (7), and insulation positioning holes (9) are arranged on two sides of the copper foil layer (7) adjacent to the area (71) to be screen printed.
3. The ultra-smooth high-hardness PCB substrate as claimed in claim 1, wherein the core material layer (1) is formed by gluing and fixing a plurality of layers of wood pulp paper boards, and the fabric filling board (2) is formed by gluing and compounding a plurality of layers of glass fiber cloth and fabric resin.
4. The PCB substrate with ultra-smooth surface and high hardness as claimed in claim 1, wherein the side edge strips (61) and the fabric filler board (2) are fixed with the copper foil layer (7) through hot pressing, and the side edge strips (61) are formed by gluing, laminating and fixing a plurality of layers of fiber paper.
5. The ultra-smooth high-hardness PCB substrate of claim 1, wherein the surface of the copper foil layer is subjected to a polishing and grinding surface treatment, a heat-resistant layer treatment and an oxidation-preventing treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921833782.1U CN211240296U (en) | 2019-10-29 | 2019-10-29 | Super-smooth high-hardness PCB substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921833782.1U CN211240296U (en) | 2019-10-29 | 2019-10-29 | Super-smooth high-hardness PCB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211240296U true CN211240296U (en) | 2020-08-11 |
Family
ID=71915923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921833782.1U Active CN211240296U (en) | 2019-10-29 | 2019-10-29 | Super-smooth high-hardness PCB substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211240296U (en) |
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2019
- 2019-10-29 CN CN201921833782.1U patent/CN211240296U/en active Active
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