CN110278661B - Preparation method of multilayer copper-clad plate - Google Patents
Preparation method of multilayer copper-clad plate Download PDFInfo
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- CN110278661B CN110278661B CN201910664318.2A CN201910664318A CN110278661B CN 110278661 B CN110278661 B CN 110278661B CN 201910664318 A CN201910664318 A CN 201910664318A CN 110278661 B CN110278661 B CN 110278661B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000005406 washing Methods 0.000 claims abstract description 26
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 238000005553 drilling Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 11
- 239000010959 steel Substances 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 5
- 239000003513 alkali Substances 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 6
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 claims description 3
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- 238000004876 x-ray fluorescence Methods 0.000 claims description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 150000003851 azoles Chemical class 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- -1 halogen ions Chemical class 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 239000012286 potassium permanganate Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a preparation method of a multilayer copper-clad plate, which comprises the following steps: s1, brownification of the core plate (1); s2, pre-stacking the multilayer plates (2); s3, pre-stacking and fixing (3); s3, hot-press bonding (4); s4, cold pressing and solidifying (5); s5, removing the steel plate (6); s6, board splitting and cutting (7); s7, fishing the edge (8); s8, X-RAY drilling (9); s9, electroplating (10); wherein, the brown ization process of the brown ization of the core plate sequentially comprises: acid washing (11), overflow water washing (12), alkali washing (13), presoaking (14), browning (15), secondary overflow water washing (16) and drying (17). According to the invention, the core plate after the browning treatment is laminated with the PP film and the copper foil and fixed by using the rivets, then the core plate is conveyed to a pressing device through a conveying belt for pressing, and laser drilling and electroplating treatment are carried out through X-rays, so that the preparation process of the multilayer plate is simplified, and the core plate is finished by matching with an automatic device, so that the quality of the multilayer copper-clad plate is ensured, and the cost can be controlled.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a multilayer copper-clad plate.
Background
Copper Clad Laminate (CCL) is a product which is prepared by using wood pulp paper or glass fiber cloth as a reinforcing material, soaking the reinforcing material with resin, coating Copper foil on one side or two sides, and carrying out hot pressing. When it is used for the production of multilayer boards, it is also called CORE board (CORE);
at present, the copper-clad plates supplied in the market can be mainly divided into the following types from the consideration of base materials: the composite board comprises a paper substrate, a glass fiber cloth substrate, a synthetic fiber cloth substrate, a non-woven fabric substrate and a composite substrate, wherein the substrate is an insulating laminate composed of high-molecular synthetic resin and a reinforcing material; covering a layer of pure copper foil with high conductivity and good weldability on the surface of the substrate, wherein the common thickness is 35-50 μm; the copper clad laminate with the copper foil covering one side of the substrate is called a single-sided copper clad laminate, and the copper clad laminate with the copper foil covering both sides of the substrate is called a double-sided copper clad laminate; if the copper foil can be firmly covered on the substrate, the process is completed by the adhesive;
generally, the more core plates that are stacked, the more the manufacturing cost is doubled, and therefore, a method for manufacturing a multi-layer copper-plated plate that can balance the cost and the performance quality is needed.
Disclosure of Invention
The invention mainly solves the technical problem of providing a preparation method of a multilayer copper-clad plate, wherein a core plate after browning treatment is laminated with a PP film and a copper foil and fixed by rivets, then the core plate is conveyed to a pressing device through a conveying belt for pressing, laser drilling and electroplating treatment are carried out through X rays, the preparation process of a multilayer plate is simplified, and the preparation method is completed by matching with an automatic device, so that the quality of the multilayer copper-clad plate is ensured, and the cost can be controlled.
In order to solve the technical problems, the invention adopts a technical scheme that: a preparation method of a multilayer copper-clad plate comprises the following steps:
s1, browning of the core plate: carrying out brown oxidation treatment on the etched core plate;
s2, pre-stacking of multilayer plates: aligning and overlapping PP films, copper foils and the browned core plates, wherein one PP film is arranged on each side of each core plate, one PP film is shared between two adjacent core plates, two copper foils are arranged, and the two copper foils are respectively positioned on the upper side and the lower side of the overlapped core plates and the PP films;
s3, pre-stacking and fixing: fixing the pre-stacked multilayer copper-clad plates through rivets, placing steel plates on the upper side and the lower side of the multilayer copper-clad plates, and then placing the steel plates and the multilayer copper-clad plates into a carrying disc together;
s3, hot-press bonding: transferring the carrying disc to a hot press through a conveying belt, vacuumizing the multiple layers to remove air between the core plate and the PP film, heating the PP film by the hot press to semi-melt and bond the PP film with the core plate, and applying pressure for pressing;
s4, cold pressing and solidifying: maintaining the pressing force and cooling to solidify the PP film;
s5, dismantling the steel plate: outputting the carrying disc through a conveying belt, and taking out the multilayer copper-clad plate through manpower or equipment;
s6, board splitting and cutting: carrying out plate separation and cutting on the taken out multilayer copper-clad plate;
s7, fishing: conveying the cut multilayer copper-clad plate to an edge milling machine through a conveying belt to carry out edge fishing;
s8, X-RAY drilling: carrying out laser drilling on the fished multilayer copper-clad plate by an XRAY (X-ray fluorescence) target drilling machine;
s9, electroplating: carrying out full-board copper plating on the multilayer copper-clad plate or carrying out local copper plating in a through hole formed after X-RAY drilling;
wherein, the brown ization process of the brown ization of the core plate sequentially comprises: acid washing, overflow water washing, alkali washing, presoaking, browning, secondary overflow water washing and drying.
Further, the heating temperature in the hot-press bonding is 80-140 ℃ or 200-210 ℃.
Further, the heating temperature in the thermocompression bonding is 140 ℃ or 205 ℃.
Further, the glue content of the PP film is 62% -65%, and the thickness of the PP film is 0.08-0.1 mm.
Further, the acid-washing solution comprises sulfuric acid and water, and the concentration of the sulfuric acid is 3-5%.
Further, the alkaline washing solution comprises phosphate, isomeric alcohol polyoxyethylene ether sodium sulfate, dodecyl benzene sulfonate, hydrofluoric acid and moisture, wherein the concentration of the hydrofluoric acid is 40%.
Further, the multilayer copper-clad plate is a 6-layer copper-clad plate, and the overlapping sequence of the 6-layer copper-clad plate is from top to bottom: copper foil, PP film, core plate, PP film and copper foil.
Further, the core board is a PCB having circuit copper layers on both sides.
Further, the multi-layer board pre-stacking is a manual pre-stacking operation.
The invention has the beneficial effects that:
according to the preparation method of the multilayer copper-clad plate, the core plate after the browning treatment is overlapped with the PP film and the copper foil and fixed by using the rivets, the core plate is conveyed to the pressing equipment through the conveying belt to be pressed, laser drilling and electroplating treatment are carried out through X rays, the preparation process of the multilayer plate is simplified, the preparation is completed by matching with automatic equipment, the quality of the multilayer copper-clad plate is guaranteed, and the cost can be controlled.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of the preparation steps of the multilayer copper-clad plate of the present invention;
FIG. 2 is a schematic structural diagram of a multilayer copper-clad plate of the present invention;
FIG. 3 is a schematic flow diagram of the brownification of the core plate of the present invention;
the parts in the drawings are marked as follows:
brownification of a core plate 1, acid washing 11, overflow water washing 12, alkali washing 13, presoaking 14, brownification 15, secondary overflow water washing 16 and drying 17;
2, copper foil 21, PP film 22 and core board 23 are pre-stacked on the multilayer board;
pre-stacking and fixing 3, hot-press bonding 4, cold-press curing 5, steel plate dismantling 6, plate dividing and cutting 7, edge fishing 8, X-RAY drilling 9 and electroplating 10.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example (b): a preparation method of a multilayer copper-clad plate is shown in figures 1 and 2: the preparation method of the multilayer copper-clad plate comprises the following steps:
s1, brown oxidation of the core plate 1: carrying out brown oxidation treatment on the etched core plate;
s2, multilayer board pre-stacking 2: aligning and overlapping a copper foil 21, a PP film 22 and a core plate 23 subjected to browning treatment, wherein one PP film is arranged on each side of each core plate, one PP film is shared between two adjacent core plates, two copper foils are arranged, and the two copper foils are respectively positioned on the upper side and the lower side of the overlapped core plate and the overlapped PP film;
in this embodiment, the multilayer copper-clad plate is a 6-layer copper-clad plate, and the overlapping sequence of the 6-layer copper-clad plate is from top to bottom: copper foil 21, PP film 22, core plate 23, PP film 22 and copper foil 21.
S3, pre-stacking and fixing 3: fixing the pre-stacked multilayer copper-clad plates through rivets, placing steel plates on the upper side and the lower side of the multilayer copper-clad plates, and then placing the steel plates and the multilayer copper-clad plates into a carrying disc together;
s3, thermocompression bonding 4: transferring the carrying disc to a hot press through a conveying belt, vacuumizing the multiple layers to remove air between the core plate and the PP film, heating the PP film by the hot press to semi-melt and bond the PP film with the core plate, and applying pressure for pressing;
s4, cold-pressing and solidifying 5: maintaining the pressing force and cooling to solidify the PP film;
s5, steel plate dismantling 6: outputting the carrying disc through a conveying belt, and taking out the multilayer copper-clad plate through manpower or equipment;
s6, board cutting 7: carrying out plate separation and cutting on the taken out multilayer copper-clad plate;
s7, fishing edge 8: conveying the cut multilayer copper-clad plate to an edge milling machine through a conveying belt to carry out edge fishing;
s8, X-RAY drilling 9: carrying out laser drilling on the fished multilayer copper-clad plate by an XRAY (X-ray fluorescence) target drilling machine;
specifically, the X-RAY drilling comprises drilling a through hole and a blind hole;
s9, electroplating 10: carrying out full-board copper plating on the multilayer copper-clad plate or carrying out local copper plating in a through hole formed after X-RAY drilling;
wherein, as shown in fig. 3: the browning process of the core plate browning sequentially comprises the following steps: acid washing 11, overflow water washing 12, alkali washing 13, presoaking 14, browning 15, secondary overflow water washing 16 and drying 17.
In this embodiment, the heating temperature during the thermocompression bonding is 80 ℃ to 140 ℃ or 200 ℃ to 210 ℃.
The heating temperature in the thermocompression bonding is 140 ℃ or 205 ℃.
The glue content of the PP film is 62-65%, and the thickness of the PP film is 0.08-0.1 mm.
In this embodiment, the acid-washing solution includes sulfuric acid and water, and the concentration of the sulfuric acid is 3-5%.
The alkaline washing solution comprises phosphate, isomeric alcohol polyoxyethylene ether sodium sulfate, dodecyl benzene sulfonate, hydrofluoric acid and moisture, wherein the concentration of the hydrofluoric acid is 40%.
The browning agent used in the browning procedure comprises the following raw materials (by mass concentration): 30-50mg/L of nitric acid, 5-8mg/L of potassium permanganate, 10-30mg/L of polyethylene glycol monomethyl ether, 10-30mg/L of halogen ions and 10-20mg/L of azoles, and adding water to 1L, wherein the mass concentration of the browning agent is 15-20%.
The overflow water washing means that the water is flowing running water.
The drying comprises the following specific steps: firstly, drying with cold air for 30-50min by using an air cooler, and then drying with hot air for 1-2 h.
The core board is a PCB with circuit copper layers on two sides, and the copper layers on the two sides of the core board are the PCB with circuit arrangement and embedded holes and positioning holes.
The multilayer board pre-stacking is a manual pre-stacking operation.
The working principle of the invention is as follows:
according to the preparation method of the multilayer copper-clad plate, the core plate after the browning treatment is overlapped with the PP film and the copper foil and fixed by using the rivets, the core plate is conveyed to the pressing equipment through the conveying belt to be pressed, laser drilling and electroplating treatment are carried out through X rays, the preparation process of the multilayer plate is simplified, the preparation is completed by matching with automatic equipment, the quality of the multilayer copper-clad plate is guaranteed, and the cost can be controlled.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A preparation method of a multilayer copper-clad plate is characterized by comprising the following steps: the preparation method of the multilayer copper-clad plate comprises the following steps:
s1, brownification of the core plate (1): carrying out brown oxidation treatment on the etched core plate;
s2, pre-stacking the multilayer plates (2): aligning and overlapping PP films, copper foils and the browned core plates, wherein one PP film is arranged on each side of each core plate, one PP film is shared between two adjacent core plates, two copper foils are arranged, and the two copper foils are respectively positioned on the upper side and the lower side of the overlapped core plates and the PP films;
s3, pre-stacking and fixing (3): fixing the pre-stacked multilayer copper-clad plates through rivets, placing steel plates on the upper side and the lower side of the multilayer copper-clad plates, and then placing the steel plates and the multilayer copper-clad plates into a carrying disc together;
s3, thermocompression bonding (4): transferring the carrying disc to a hot press through a conveying belt, vacuumizing the multiple layers to remove air between the core plate and the PP film, heating the PP film by the hot press to semi-melt and bond the PP film with the core plate, and applying pressure for pressing;
s4, cold-pressing and solidifying (5): maintaining the pressing force and cooling to solidify the PP film;
s5, steel plate dismantling (6): outputting the carrying disc through a conveying belt, and taking out the multilayer copper-clad plate through manpower or equipment;
s6, board splitting and cutting (7): carrying out plate separation and cutting on the taken out multilayer copper-clad plate;
s7, edge fishing (8): conveying the cut multilayer copper-clad plate to an edge milling machine through a conveying belt to carry out edge fishing;
s8, X-RAY drilling (9): carrying out laser drilling on the fished multilayer copper-clad plate by an XRAY (X-ray fluorescence) target drilling machine;
s9, electroplating (10): carrying out full-board copper plating on the multilayer copper-clad plate or carrying out local copper plating in a through hole formed after X-RAY drilling;
wherein, the brown ization process of the brown ization of the core plate sequentially comprises: acid washing (11), overflow water washing (12), alkali washing (13), presoaking (14), browning (15), secondary overflow water washing (16) and drying (17);
the alkaline washing solution comprises phosphate, isomeric alcohol polyoxyethylene ether sodium sulfate, dodecyl benzene sulfonate, hydrofluoric acid and moisture;
the browning agent used in the browning procedure comprises the following raw materials: 30-50mg/L of nitric acid, 5-8mg/L of potassium permanganate, 10-30mg/L of polyethylene glycol monomethyl ether, 10-30mg/L of halogen ions and 10-20mg/L of azoles, and adding water to 1L, wherein the mass concentration of the browning agent is 15-20%.
2. The preparation method of the multilayer copper-clad plate according to claim 1, which is characterized in that: the heating temperature in the hot-press bonding is 80-140 ℃ or 200-210 ℃.
3. The preparation method of the multilayer copper-clad plate according to claim 2, characterized in that: the heating temperature in the thermocompression bonding is 140 ℃ or 205 ℃.
4. The preparation method of the multilayer copper-clad plate according to claim 1, which is characterized in that: the glue content of the PP film is 62-65%, and the thickness of the PP film is 0.08-0.1 mm.
5. The preparation method of the multilayer copper-clad plate according to claim 1, which is characterized in that: the pickling solution comprises sulfuric acid and water, and the concentration of the sulfuric acid is 3-5%.
6. The preparation method of the multilayer copper-clad plate according to claim 1, which is characterized in that: the multilayer copper-clad plate is a 6-layer copper-clad plate, and the superposition sequence of the 6-layer copper-clad plate is sequentially from top to bottom: copper foil, PP film, core plate, PP film and copper foil.
7. The preparation method of the multilayer copper-clad plate according to claim 1, which is characterized in that: the core board is a PCB with circuit copper layers on two sides.
8. The preparation method of the multilayer copper-clad plate according to claim 1, which is characterized in that: the multilayer board pre-stacking is a manual pre-stacking operation.
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| CN201910664318.2A CN110278661B (en) | 2019-07-23 | 2019-07-23 | Preparation method of multilayer copper-clad plate |
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| CN201910664318.2A CN110278661B (en) | 2019-07-23 | 2019-07-23 | Preparation method of multilayer copper-clad plate |
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| CN112752444A (en) * | 2020-12-14 | 2021-05-04 | 深圳市瀚鼎电路电子有限公司 | Lamination method of multilayer thick copper metal-based circuit board |
| CN113334899A (en) * | 2021-04-16 | 2021-09-03 | 江西新永海电子科技有限公司 | Manufacturing method of rigid copper-clad plate |
| CN113382565A (en) * | 2021-06-09 | 2021-09-10 | 金禄电子科技股份有限公司 | Multi-layer circuit board, core board structure and laminating method thereof |
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