KR102242544B1 - Preparation method of continuous sheet for circuit board production and continuous sheet for circuit board production produced therefrom - Google Patents

Abstract

The present invention relates to a method of manufacturing a continuous sheet for manufacturing a circuit board having improved mechanical properties and satisfying excellent chemical resistance, and a continuous sheet for manufacturing a circuit board manufactured therefrom. More specifically, according to the present invention, by connecting at least two or more sheet-like metal laminates using a reinforcing film and an adhesive film to which conductivity is applied, a reel-type laminate can be provided in a continuous roll-to-roll process. A method of manufacturing a continuous sheet for manufacturing a circuit board having excellent chemical properties and reinforced mechanical properties, and a continuous sheet for manufacturing a circuit board manufactured therefrom are provided.

Description

TECHNICAL FIELD The manufacturing method of a continuous sheet for manufacturing a circuit board and a continuous sheet for manufacturing a circuit board manufactured therefrom TECHNICAL FIELD

The present invention relates to a method for manufacturing a continuous sheet for manufacturing a circuit board and a continuous sheet for manufacturing a circuit board manufactured therefrom, and more specifically, a roll to roll (RTR) process for a roll copper clad laminate, hereinafter CCL) and providing the bonding film necessary for the production of the Roll CCL, the running performance is improved compared to the copper-clad laminate process applied only to the existing sheet type, and the manufacturing method of a continuous sheet for circuit board manufacturing excellent in both chemical resistance and mechanical properties, and thereby It relates to a continuous sheet for manufacturing a circuit board manufactured from.

Conventional metal laminates for manufacturing circuit boards, such as copper clad laminates (hereinafter referred to as CCL), are largely manufactured by the following two methods.

The first is a method of manufacturing a sheet-like CCL using impregnation and pressing. In addition, secondly, there is a method of manufacturing CCL in a reel type using a belt press.

The problem of the first method is that productivity is deteriorated because it is not a continuous process when manufacturing a printed circuit board (PCB).

In addition, in order to manufacture the second winding type CCL, a belt press is required, but there is a disadvantage in that the initial investment cost is high in order to install the belt press.

Accordingly, there is a need to develop a new method capable of securing productivity and basic mechanical properties, and manufacturing a metal laminate for manufacturing a circuit board in an inexpensive manner.

It is an object of the present invention to connect at least two or more sheet-like metal laminates using a conductive adhesive film and then move them, so that the final product can be provided in a reel type through a continuous roll-to-roll process even if a belt press is not provided. It is to provide a method of manufacturing a sheet.

Another object of the present invention is to provide a CCL for manufacturing a roll-type circuit board obtained according to the above method, which has improved mechanical properties and excellent chemical resistance and productivity.

In the present specification, in a state in which at least two or more sheet-like metal laminates are in parallel contact with each other in a metal foil direction, one or more film-shaped adhesive films are provided on both sides of the portion where the sheet-like metal laminates are in contact so that the sheet-like metal laminates are connected to each other. It provides a method of manufacturing a continuous sheet for manufacturing a circuit board comprising; positioning and bonding by pressing.

The adhesive film includes a reinforcing film and an adhesive layer, or a conductor layer and an adhesive layer, and is formed on both sides of a portion where the sheet-shaped metal laminates are in contact with each other based on a horizontal direction in which at least two or more sheet-like metal laminates are arranged in parallel in a metal foil direction. It may include an adhesive film and a second adhesive film applied on the first adhesive film.

In addition, in the present specification, at least two or more sheet-like metal laminates are arranged in parallel in the metal foil direction and are in contact, and on both sides of the portion where the adjacent sheet-like metal laminates are in contact, the sheet-like metal laminates are laminated based on the contact portion. A first adhesive layer, a reinforcing film, a second adhesive layer, and a conductor layer; Alternatively, it provides a continuous sheet for manufacturing a circuit board, including a film-shaped adhesive film including a third adhesive layer, a conductor layer, a fourth adhesive layer, and a reinforcing film.

Hereinafter, a method of manufacturing a continuous sheet for manufacturing a circuit board according to a specific embodiment of the present invention and a continuous sheet for manufacturing a circuit board formed therefrom will be described in more detail.

Manufacturing method of continuous sheet for circuit board manufacturing

According to one embodiment of the invention, in a state in which at least two or more sheet-like metal laminates are in parallel contact with each other in a metal foil direction, a first adhesive film is provided on both sides of a portion where the sheet-like metal laminates are in contact so that the sheet-like metal laminates are connected to each other. And the step of sequentially positioning and pressing the adhesive film in the form of a second adhesive film, which is a film, and bonding them; including, a method of manufacturing a continuous sheet for manufacturing a circuit board is provided.

The present invention relates to manufacturing a Roll to Roll (RTR) process for Roll CCL and a bonding film required for manufacturing the Roll CCL. Specifically, according to the present invention, by using the existing sheet type CCL in the RTR process, which is more productive than the circuit creation process of the sheet type CCL, it has better running performance than the existing general sheet type CCL process, and breakage during the circuit creation process It relates to a manufacturing method of Roll CCL for circuit board manufacturing excellent in chemical resistance and mechanical properties so that it does not occur.

In addition, the present invention provides a method of manufacturing a continuous sheet for manufacturing a roll-up type circuit board using a continuous roll-to-roll process without the use of a belt press as in the past. To this end, the present invention includes a process of connecting existing sheet-like metal laminates using an adhesive film including a reinforcing film and imparting conductivity. In other words, the present invention uses a sheet-type CCL, but is applied to a roll-to-roll process by connecting them with a bonding film.

Accordingly, the present invention can improve the mechanical properties of the final product by solving the problem of breakage during running of the roll-to-roll process.

In addition, the present invention provides a bonding film required for the production of roll CCL, and the bonding film may use a film shape having a specific structure.

For example, the adhesive film may include one or more film-shaped adhesive films having the same width and to which a reinforcing film and a conductor layer are respectively applied. Such an adhesive film may mean a sheet type. More specifically, the adhesive film may be a reinforcing film or a first adhesive film including a conductor layer and an adhesive layer, and a second adhesive film including a conductor layer or a reinforcing film and an adhesive layer. By applying it to both sides in turn, it is possible to connect the portions in contact with the sheet-like metal laminates. Preferably, the adhesive film includes a first adhesive film including a reinforcing film and a first adhesive layer, and a second adhesive film including a conductor layer and a second adhesive layer formed on the first adhesive film; Alternatively, it may include a first adhesive film including a conductor layer and a third adhesive layer, and a second adhesive film including a reinforcing film and a fourth adhesive layer formed on the first adhesive film.

In the present invention, the film to which the reinforcing film and the conductor layer are respectively applied may be used sequentially with the first and second adhesive films, and when applied to the bonding portion of the CCL, the order of these may be changed and applied. That is, when applying the adhesive film, a first adhesive film including a reinforcing film and a first adhesive layer, and a second adhesive film including a conductor layer and a second adhesive layer may be used. In addition, when applying the adhesive film, a first adhesive film including a third adhesive layer including a conductor layer and a conductive powder, and a second adhesive film including a fourth adhesive layer including a reinforcing film and conductive powder may be used.

Accordingly, according to an embodiment of the present invention, providing a first adhesive film including a first adhesive layer including a reinforcing film and a conductive powder, and a second adhesive film including a second adhesive layer including a conductor layer and a conductive powder; Providing at least two or more sheet-like metal laminates cut to a predetermined size; Placing at least two or more sheet-like metal laminates in parallel so as to be in contact with each other, placing a first adhesive film on both surfaces of a portion where the sheet-like metal laminates are in contact, and bonding them by pressing; And placing a second adhesive film on both surfaces of the first adhesive film to which the sheet-like metal laminates are in contact with each other and bonding through pressing. It provides a method of manufacturing a continuous sheet for manufacturing a circuit board.

And, according to another embodiment of the present invention, providing a first adhesive film including a third adhesive layer including a conductor layer and a conductive powder, and a second adhesive film including a fourth adhesive layer including a reinforcing film and conductive powder; Providing at least two or more sheet-like metal laminates cut to a predetermined size; Placing at least two or more sheet-like metal laminates in parallel so as to be in contact with each other, placing a first adhesive film on both surfaces of a portion where the sheet-like metal laminates are in contact, and bonding them by pressing; And placing a second adhesive film on both surfaces of the first adhesive film to which the sheet-like metal laminates are in contact with each other and bonding through pressing. It provides a method of manufacturing a continuous sheet for manufacturing a circuit board.

Hereinafter, a method of manufacturing an adhesive film for bonding a sheet type CCL, a method of manufacturing a continuous sheet for manufacturing a circuit board using the same, and a continuous sheet for manufacturing a circuit board manufactured therefrom will be described.

Preparation of adhesive film

In the method according to an embodiment of the present invention, each step of using the film-shaped adhesive film will be described in more detail.

First, according to a preferred embodiment of the present invention, a step of providing an adhesive film including the conductor layer and an adhesive layer, and an adhesive film including a reinforcing film and an adhesive layer is performed.

According to the first embodiment, the first adhesive film may include a reinforcing film and a first adhesive layer. In addition, the second adhesive film may include a conductor layer and a second adhesive layer.

In addition, the first adhesive film of the present invention may be composed of only the conductor layer excluding the reinforcing film, and the second adhesive film may be composed of only the reinforcing film.

Therefore, according to the second embodiment, optionally, the first adhesive film may include a conductor layer and a third adhesive layer. In this case, the second adhesive film may include a reinforcing film and a fourth adhesive layer.

In this case, the first to fourth adhesive layers in the present invention are used for convenience of description, and may be formed using the same varnish composition. In addition, in the first adhesive film and the second adhesive film of the first and second embodiments, the configurations of the reinforcing film and the conductor layer may each be prepared by the same method.

In addition, in the first adhesive film, the reinforcing film or the conductor layer may include one or more layers. The second adhesive film may also include one or more reinforcing films or conductor layers. In addition, a conductor layer may be further included on the reinforcing film included in the first adhesive film or the second adhesive film. In addition, a reinforcing film may be further included on the conductor layer included in the first adhesive film or the second adhesive film.

Preferably, the adhesive film is a step of preparing a reinforcing film and a conductor layer, preparing a first adhesive film or a second bonding film including a reinforcing film and an adhesive layer by coating a varnish including an adhesive resin and conductive powder on the reinforcing film. , And coating a varnish including an adhesive resin and a conductive powder on the conductor layer to prepare a first adhesive film or a second bonding film including the conductor layer and the adhesive layer.

Therefore, as described above, the adhesive film of the present invention may include a first adhesive film including a reinforcing film and a first adhesive layer, and a second adhesive film including a conductor layer and a second adhesive layer. In addition, the adhesive film of the present invention may include a first adhesive film including a third adhesive layer including a conductor layer and a conductive powder, and a second adhesive film including a fourth adhesive layer including a reinforcing film and conductive powder.

On the other hand, the manufacturing method of the present invention comprises the steps of preparing a varnish for forming an adhesive layer; Preparing an adhesive film having a four-layer structure using a conductor layer, a reinforcing film and a varnish; And bonding the sheet-shaped metal laminates to the adhesive film.

In addition, for the plating stability of the rolled CCL during the plating process, since the adhesive film needs electrical conductivity, the conductor powder (conductive powder) is dispersed in the adhesive layer. Preferably, the present invention can proceed by dispersing the conductive powder in the varnish for forming the adhesive layer.

In addition, in the present invention, a method of selectively depositing a conductive powder on a reinforcing film may be used. For example, it may include preparing a reinforcing film on which conductive powder is deposited, and forming an adhesive layer by coating a varnish including an adhesive resin on the opposite side of the reinforcing film on which the conductive powder is deposited. The method of depositing the conductive powder on the reinforcing film is not very limited, and may be deposited according to a generally well-known method.

The varnish may include an adhesive resin and a conductive powder in a weight ratio of 1: 0.005 to 0.015. If the weight ratio of the adhesive resin and the conductive powder is less than 1: 005, there is a problem that the electrical conductivity is not secured, and if it exceeds 1: 0.015, there is a problem of agglomeration of the conductive powder and a decrease in adhesion.

The adhesive resin may include at least one selected from the group consisting of a polyimide resin, an epoxy resin, an acrylic resin, a phenoxy resin, and a polyisocyanate resin having a weight average molecular weight of 33,000 to 38,000.

It is preferable that the conductive powder has a particle size of 2.0 to 8.5um based on D50. The conductive powder may be at least one selected from the group consisting of copper, aluminum, nickel, and silver (Ag).

By the above method, conductivity is imparted to the adhesive layer, so that fracture of the adhesive film can be prevented when the winder is running. It is preferable that the adhesive layer has a resistance value of 0.1 to 0.5 ohm or less.

In addition, since the manufacturing method of CCL is a continuous roll-to-roll process, mechanical properties must be excellent so that fracture does not occur when a certain tension is applied. Therefore, in the present invention, in order to reinforce mechanical properties, a reinforcing film is applied to the adhesive film.

The conductor layer may include Cu, SUS, or aluminum foil having a thickness of 7 to 35 μm. The reinforcing film has a thickness of 5 to 25 μm, and may include one or more polymer resins selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate glycol, polycarbonate, and polyphenylene sulfide. The adhesive layer may be formed using a varnish including an adhesive resin and a conductive powder in a weight ratio of 1: 0.005 to 0.015.

According to a preferred embodiment, the first adhesive film in the present invention has i) a reinforcing film and a first adhesive layer structure, ii) a conductor layer and a third adhesive layer structure, or iii) a reinforcing film, a conductor layer, and a first adhesive layer structure. I can. More specifically, the first adhesive film may have i) a Pi film and a first adhesive layer structure, ii) a Cu foil and a third adhesive layer structure, or iii) PI Fim, Cu Foil, and a first adhesive layer structure.

In addition, the second adhesive film may have i) a conductor layer and a second adhesive layer structure, ii) a reinforcing film and a fourth adhesive layer structure, or ii) a conductor layer, a reinforcing film, and a second adhesive layer structure. More specifically, the second adhesive film may have ii) a structure of a Cu foil and a second adhesive layer, ii) a structure of a Pi film and a fourth adhesive layer, or iii) a structure of a Cu foil, a PI film, and a second adhesive layer.

Such a film-shaped adhesive film is applied to a portion where at least two or more sheet-like metal laminates are in contact, so that electricity can be communicated with the reinforcing film 30 through the first and second adhesive layers 20 and 22 as shown in FIG. 1. It may be provided in the form of an adhesive film having a four-layer structure including the conductive layer 10 that can be used. In addition, in the final structure applied to both surfaces of the sheet-like metal laminates, the adhesive film may have a structure formed by contacting the second adhesive layer 22 to the part where the sheet-like metal laminates are in contact, as shown in FIG. 2. .

In addition, in the present invention, a metal layer may be additionally included in the outermost portion of the adhesive film.

The metal layer may include at least one selected from the group consisting of copper, aluminum, nickel, silver (Ag), and iron. In addition, the thickness of the metal layer may be 0.1 to 50㎛.

Manufacturing method of continuous sheet for circuit board manufacturing

On the other hand, after the adhesive film in the form of a film is provided by the above method, if the adhesive film is applied to both sides of a portion where at least two or more sheet-like metal laminates are in contact, they can be easily bonded, and the thus bonded material uses a guide means Since it can be wound by using, it is possible to easily provide a continuous sheet for manufacturing a circuit board having excellent mechanical properties and chemical resistance.

As an example, Figs. 2 and 3 show an example in which a film-shaped adhesive film is applied. As shown in Figs. 2 and 3, by arranging at least two or more sheet-like metal laminates 200 cut to a predetermined size in parallel in the metal foil direction and bonding them to each other using the adhesive film 100, A continuous sheet 300 for manufacturing a circuit board to which two sheet-like metal laminates are connected may be provided.

In addition, i) a reinforcing film, a first adhesive film including a first adhesive layer, and a second adhesive film including a conductor layer and a second adhesive layer, or ii) four layers of a conductor layer, a first adhesive layer, a reinforcing film and a second adhesive layer When an adhesive film including a structure is applied, the first adhesive layer of i) and ii) the second adhesive layer are positioned so as to be in contact with the joint portion of the sheet-like metal laminates on both sides, and the conductor layer is exposed to the outside so that electricity can be communicated. Position it if possible. In the sheet-shaped metal laminates 200, metal foils 40 are formed on both sides of the reinforcing material 40. The adhesive film 100 may be formed on both sides of a portion in which the sheet-like metal laminates are in contact with each other in a vertical direction based on a horizontal direction in which at least two or more sheet-like metal laminates are arranged in parallel in a metal foil direction.

At this time, since at least two or more sheet-like metal laminates 200 must be connected, they are placed in parallel on the planarizer so as to contact each other. Then, a step of bonding both surfaces of the portion in contact with the sheet-like metal laminates with an adhesive film through pressing is performed.

In addition, as shown in FIGS. 4 and 5, at least two or more sheet-like metal laminates 200 are connected by the adhesive film 100 when the above-described process is performed. Accordingly, at least two or more sheet-like metal laminates 300 connected by the adhesive film may be wound through a guide means and a winding means 500.

And, it is preferable that the adhesive film used to connect at least two or more sheet-like metal laminates has a width of 3 to 20 mm, or 4 to 15 mm, or 5 to 10 mm. Most preferably, the adhesive film may have a width of 5 to 10 mm.

In addition, the thickness of the adhesive film may be 7 to 25um.

In addition, the bonding portion of the at least two or more sheet-like metal laminates may be bonded to the sheet-like metal laminates and the adhesive film through heating by applying a pressing means to the adhesive film.

In addition, the method of manufacturing a continuous sheet for manufacturing a circuit board may further include winding at least two or more sheet-like metal laminates connected by the adhesive film through a guide means.

For example, the sheet metal laminates are cut on a planarizer and placed in parallel, the adhesive film is applied to both sides of the sheet metal laminates, and the sheet metal laminates and the adhesive film are pressed using a press. A continuous sheet for manufacturing a final circuit board may be provided through a step of winding it up after making it into a long film form.

In the present invention, when the adhesive film is applied to at least two or more sheet-like metal laminates, a temporary adhesion step and a main adhesion step for first and second bonding may be included.

Specifically, the temporary bonding step is as follows.

First, at least two or more sheet-like metal laminates are temporarily welded, and then arranged horizontally and in parallel so as to contact each other. Then, the above-described first adhesive film is first positioned on one side of the portion where the sheet-like metal laminates are in contact, and then pressurized. Thereafter, it includes the step of placing the above-described second adhesive film again on the first adhesive film, and pressing the first adhesive film in the same manner as the method of pressing.

Through this process, the first and second adhesive films of the present invention may be sequentially applied to both surfaces of a portion where at least two or more sheet-like metal laminates are in contact, so that the first and second adhesive films may be preliminarily bonded. Accordingly, the adhesive film may have a total of four-layer structure, including the two-layer structure of each of the first and second adhesive films.

As a specific example, after placing the first adhesive film vertically on the temporary bonding heating wire, CCLs having an insulating layer thickness of 40 μm to 215 μm cut to a predetermined size were respectively 3.5 to 7.5 on the first adhesive film placed on the temporary bonding heating wire. Place it in parallel in mm width and fix it.

Then, on the fixed CCLs, the first adhesive film is covered in parallel to the top of the CCL in parallel with the bottom and in parallel with a width of 3.5 to 7.5 mm, respectively, and then fixed to the temporary joint clip. Then, after temporary bonding for 2.5 to 5 seconds at 110°C and a pressure of 2kgf/cm2, the first adhesive film at the edge is cut parallel to the CCL surface.

Thereafter, the second adhesive film is applied on the first adhesive film in the same manner as the temporary bonded first adhesive film to be temporarily bonded.

In addition, the present bonding step is a step in which at least two or more sheet-like metal laminates are secondarily pressed to the bonding portion and the bonding portion to which the first and second adhesive films are applied to achieve complete bonding. The main bonding step may include a step of secondary final bonding of the entire surfaces of the portions where the first and second adhesive films are in contact with each other by pressing at a pressure and temperature range higher than that of the temporary bonding step.

When performing the temporary bonding and main bonding, the pressing means may use a press machine equipped with a heating means, and the configuration is not greatly limited. For example, the pressing means may be a vacuum hot press or a general hot press. In addition, in the present invention, the pressing may include a pressure condition in a process of manufacturing a continuous sheet for a final circuit board in the step of bonding the entire surface of the portion in contact with the sheet-like metal laminates with an adhesive film.

The temporary bonding step may be carried out for 1.5 to 5 seconds at a pressure of 100 to 120 ℃, 2kgf / cm2.

This bonding step may be performed under conditions of 180 to 220° C., a pressure of 6.5 to 12.5 kgf/cm 2, and a pressing time of 1 minute to 5 minutes. When the pressurization temperature is less than 160° C. during the main bonding, there is a problem of lowering of adhesion due to uncuring, and when it exceeds 200° C., there is a problem of contamination around the bonding portion due to the flow of the adhesive. In addition, when the pressing pressure is less than 6.5 kgf/cm 2, there is a problem of non-adhesion, and when it exceeds 13 kgf/cm 2, there is a problem in that the adhesive layer thickness decreases due to excessive flow of the adhesive and the thickness of the adhesive layer decreases, causing breakage during winding. In addition, if the pressing time is less than 1 minute, there is a problem of peeling due to non-adhesion, and if it exceeds 10 minutes, there is a problem of overcuring of the adhesive and damage to the CCL copper foil around the joint.

Meanwhile, the at least two or more sheet-like metal laminates may be provided by a conventional impregnation and press method. Preferably, the sheet-shaped metal laminates are prepared by impregnating a fibrous substrate with a varnish of thermosetting resin and then semi-curing to prepare a prepreg, laminating one or more sheets of the prepreg, and one or both sides of the prepreg. After laminating the metal foil on the heating and pressing step; can be prepared by a method comprising.

As the varnish of the thermosetting resin, a thermosetting resin composition including a binder resin such as an epoxy resin and a filler may be used.

In addition, the thermosetting resin composition may further include at least one additive selected from the group consisting of a solvent, a curing accelerator, a flame retardant, a lubricant, a dispersant, a plasticizer, and a silane coupling agent. Since the type and content of the binder resin, filler, and additive may be used according to a method well known in the art, a detailed description will be omitted.

The type of the fiber substrate is not particularly limited, but polyamide resin fibers such as glass fiber substrates, polyamide resin fibers, and aromatic polyamide resin fibers, polyester resin fibers, aromatic polyester resin fibers, and wholly aromatic polyester Synthetic fiber substrates composed of woven or nonwoven fabrics mainly composed of polyester resin fibers such as resin fibers, polyimide resin fibers, polybenzoxazole fibers, fluororesin fibers, etc., kraft paper, cotton linter paper, linter and kraft pulp. A paper substrate or the like containing mixed paper or the like as a main component may be used, and a glass fiber substrate is preferably used. The glass fiber substrate can improve the strength of the prepreg, reduce the water absorption rate, and can reduce the coefficient of thermal expansion.

The glass substrate may be selected from glass substrates used for various printed circuit board materials. Examples of these include, but are not limited to, glass fibers such as E glass, D glass, S glass, T glass, NE glass, and L glass. The glass-based material can be selected according to the intended use or performance as needed. The glass substrate type is typically woven, nonwoven, roving, chopped strand mat or surfacing mat. The thickness of the glass substrate is not particularly limited, but may be about 0.01 to 0.3mm or the like. Among the above materials, glass fiber materials are more preferred in terms of strength and moisture absorption properties.

In addition, the method of manufacturing the prepreg in the present invention is not particularly limited, and may be manufactured by a method well known in the art. For example, the preparation method of the prepreg may use an impregnation method, a coating method using various coaters, a spray spray method, or the like.

In the case of the impregnation method, after preparing a varnish, a prepreg may be manufactured by impregnating the fibrous substrate into the varnish.

The metal thin film may be at least one selected from the group consisting of copper, iron, nickel, titanium, aluminum, silver, gold, and two or more alloys thereof. The metal thin film may have a thickness of 0.1 μm to 50 μm.

According to a preferred embodiment, copper foil or aluminum foil is used as the metal foil used in the present invention, and one having a thickness of about 2 to 200 μm may be used, but the thickness is preferably about 2 to 35 μm. Preferably, copper foil is used as the metal foil. In addition, according to the present invention, as a metal foil, nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead, or lead-tin alloy is used as an intermediate layer, and a copper layer of 0.5 to 15 µm and 10 to 10 µm are formed on both surfaces of the metal foil. A three-layered composite foil provided with a 300 µm copper layer or a two-layered composite foil obtained by combining aluminum and copper foil may also be used.

The metal laminated plate including the thus produced prepreg is laminated in one or more sheets to provide a sheet-like metal laminate.

Continuous sheet for circuit board manufacturing

According to another embodiment of the invention, at least two or more sheet-like metal laminates are arranged in parallel in the metal foil direction and are in contact, and on both sides of a portion where adjacent sheet-like metal laminates are in contact, based on the portion where the sheet-like metal laminates are in contact. A laminated first adhesive layer, a reinforcing film, a second adhesive layer, and a conductor layer; Alternatively, a continuous sheet for manufacturing a circuit board may be provided, including a film-shaped adhesive film including a third adhesive layer, a conductor layer, a fourth adhesive layer, and a reinforcing film.

As described above, since the present invention selectively uses an adhesive film having a specific configuration for at least two or more sheet-like metal laminates, it is possible to manufacture a continuous sheet for manufacturing a winding-type CCL-type circuit board.

To this end, in the present invention, one or more adhesive films in a film shape including a reinforcing film or a conductor layer and an adhesive layer are used, but in the adhesive film, a certain amount of conductive metal powder is distributed in the reinforcing film or adhesive layer. Since the adhesive film obtained by this method has uniform plating properties, when applied to the roll-to-roll process of a winder, fracture does not occur, so that excellent mechanical properties can be secured, as well as excellent chemical resistance.

In particular, in the present invention, it is possible to improve the problems of a sheet metal laminate and a general wound metal laminate.

That is, the present invention is to apply the adhesive film to at least two or more sheet-like metal laminates provided by using impregnation and pressing, so that a continuous process of roll-to-roll is possible, and also the disadvantages of the existing sheet-like metal laminates are solved. I can.

In addition, since the present invention does not need to have a belt press that must be used when manufacturing a roll-up metal laminate as in the prior art, production cost can be reduced.

In the adhesive film applied to the continuous sheet for manufacturing a circuit board of the present invention, the first and second adhesive layers may have a resistance value of 0.1 to 0.5 ohm.

The adhesive film may have a width of 3 to 20 mm, or 4 to 15 mm or 5 to 10 mm, and a total thickness of 7 to 25 μm with respect to a direction in which two or more sheet-like metal laminates are arranged.

In addition, the thicknesses of the first to fourth adhesive layers may be 1 to 10 μm or 8 to 10 μm, respectively.

In each of the adhesive layers, the adhesive resin and the conductive powder are preferably included in a weight ratio of 1: 0.005 to 0.015.

The adhesive resin may include at least one selected from the group consisting of a polyimide resin, an epoxy resin, an acrylic resin, a phenoxy resin, and a polyisocyanate resin having a weight average molecular weight of 33,000 to 38,000.

On the other hand, as for the conductive powder used to impart conductivity to the reinforcing film or adhesive layer, it is preferable to use a particle size of 2.0 to 8.5 um based on D50 and 9.5 um based on D90.

The conductive powder may be at least one selected from the group consisting of copper, aluminum, nickel, and silver (Ag). The specific conductive powder of the present invention provides an effect of conducting electricity between junctions.

And, the reinforcing film may be made with a thickness of 5 to 25 um, and the material may be one or more selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate glycol, polycarbonate, and polyphenylene sulfide. .

The conductor layer is a thin film through which electricity can pass, and may be formed to a thickness of 7 to 35 um or 10 to 15 um. The material of the conductor layer may include Cu, SUS, or aluminum foil.

In addition, the adhesive film applied in the present invention may have a film shape, and as described above, a shape positioned on both sides of a portion in contact with each other adjacent sheet-like metal laminates may include a sheet shape.

At least two or more sheet-like metal laminates used in the above embodiment may include a polymer resin layer and a metal thin film as described above.

Accordingly, both surfaces of the adjacent portions of the sheet-like metal laminates adjacent to each other include the metal layer of the sheet-like metal laminate.

Specifically, a thermosetting polymer resin layer may be included on one or both sides of the metal thin film.

The thermosetting polymer resin layer may include a general-purpose thermosetting resin used in the manufacture of a copper clad laminate, and the kind is not limited thereto. Examples of the thermosetting resin may include at least one selected from the group consisting of a polyimide resin, an epoxy resin, an acrylic resin, a phenoxy resin, and a polyisocyanate resin having a weight average molecular weight of 33,000 to 38,000. .

The polymer resin layer may have a thickness in the range of 0.1 μm to 100 μm, or 1 μm to 50 μm.

The metal thin film may be at least one selected from the group consisting of copper, iron, nickel, titanium, aluminum, silver, gold, and two or more alloys thereof. The metal thin film may have a thickness of 0.1 μm to 50 μm.

In addition, at least two or more sheet-like metal laminates of the present invention may include one metal thin film, and may include two metal thin films facing each other if necessary. When two metal thin films are included in the sheet-like metal laminate, the polymer resin layer may be positioned between two metal thin films facing each other.

In addition, the at least two or more sheet-like metal laminates described above may further include a polymer resin layer formed on at least one surface of the polymer resin layer. In this case, the polymer resin layer may have a thickness identical to or different from that of the polymer resin layer included, and may have a thickness in the range of 0.1 μm to 100 μm, or 1 μm to 50 μm.

As described above, the continuous sheet for manufacturing a circuit board according to an embodiment of the present invention can secure both mechanical and chemical properties, and can provide excellent effects of a thermal expansion coefficient.

The final product thus produced can be used in the manufacture of a double-sided or multilayer printed circuit board. That is, in the present invention, the continuous sheet for circuit board manufacturing may be circuit-processed to produce a double-sided or multilayer printed circuit board, and the circuit processing may be performed by a method performed in a general double-sided or multi-layer printed circuit board manufacturing process.

According to the present invention, by connecting the existing sheet-type metal laminate with an adhesive film with improved plating properties, a circuit board that is a reel type metal laminate in an economical way is excellent in chemical resistance to chemicals during the PCB process while reinforcing mechanical properties. It is possible to provide an effect capable of providing a continuous sheet for production.

1 is a schematic view showing the structure of an adhesive film in the form of a film according to an embodiment of the present invention.
Fig. 2 is a continuous sheet for manufacturing a circuit board in which two sheet-like metal laminates are connected to each other using an adhesive film including a first adhesive film and a second adhesive film on both sides of a bonded portion of two sheet-like metal laminates. It shows a simplified side view of.
3 is a schematic plan view of the continuous sheet for manufacturing a circuit board of FIG. 2.
FIG. 4 is a schematic diagram illustrating a form of collecting the continuous sheet for manufacturing a circuit board of FIG. 2 in a rolled-up type.
5 is a side view schematically showing a form of collecting the continuous sheet for manufacturing a circuit board of FIG. 2 in a wound type.

The invention will be described in more detail in the following examples. However, the following examples are merely illustrative of the present invention, and the contents of the present invention are not limited by the following examples.

[Example 1]

1) Manufacture of conductive adhesive varnish

A conductive varnish was prepared by mixing 100% by weight of a general-purpose polyimide resin and 1% by weight of Cu powder (4 to 4.5 μm based on particle size D50) with a conductive metal powder while stirring.

2) Manufacture of film-shaped first adhesive film and second adhesive film

The conductive varnish prepared in 1) was applied to a 12.5 um reinforcing film (polyimide, SK Kolon PI, 12.5 µm (1/2 mil)) and an 18 µm copper foil using a comma coater. , Each was coated with 10 μm, and then slitting to a certain width (10 mm) to form a tape. The thus prepared form was used as the first adhesive film and the second adhesive film.

First adhesive film: Structure of PI film and first adhesive layer

Second adhesive film: Structure of Cu foil and second adhesive layer

The terms of the first adhesive layer and the second adhesive layer are all formed using the varnish of 1), and are separated for convenience of description.

3) Temporary joining step

After placing the first adhesive film of 2) vertically on the heating wire, CCLs with an insulating layer thickness of 215 μm cut into 340 mm *1030 mm (or 1250 mm) were each 5 mm wide on the first adhesive film placed on the heating wire. It was placed in parallel with and then fixed.

On the fixed CCLs, the first adhesive film was covered with a width of 5 mm on the top of the CCL in parallel to the bottom, and then fixed. Then, after temporary bonding for 2.5 to 5 seconds at 110° C. and a pressure of 2 kgf/cm 2, the first adhesive film at the edge was cut parallel to the CCL surface.

Thereafter, the second adhesive film (Copper foil) was temporarily bonded by applying the same method as the first adhesive film temporarily bonded. That is, temporary bonding was performed so that the second bonding films were respectively positioned on the first bonding film by applying the second bonding film to both surfaces of the first bonding film in which CCLs arranged in parallel were temporarily bonded. In this process, as shown in FIG. 2, the adhesive film obtained by temporarily bonding the CCLs includes a first adhesive film including a PI film 30 and a first adhesive layer 20, which are reinforcing films, and a first adhesive film thereon. It includes a second adhesive film composed of Cu foil (10), which is an applicator layer formed through the second adhesive layer (10).

4) Manufacture of continuous sheet for circuit board manufacturing

CCLs having an insulating layer thickness of 40 µm to 215 µm cut into 340 mm × 1030 mm (or 1250 mm) were temporarily bonded and placed in parallel.

The temporary-bonded CCL product was transferred to a vacuum hot press and pressurized for 1 to 5 minutes at a temperature of 180 to 220°C and a pressure of 6.5 to 12.5 kgf/cm2.

The end of the bonded CCL was fixed using a nip bar, and then the unit length was transferred using a linear servo and wound on a take-up roll. (Tension 150 ~ 500 N)

Through the continuous operation of the above process, a continuous sheet for manufacturing a circuit board having the structure of FIG. 5 was manufactured.

[Example 2]

In Example 1, a continuous sheet for manufacturing a circuit board was easily manufactured in the same manner as in Example 1, except that the configuration of the adhesive film was changed as follows.

1st adhesive film: structure of Cu foil and 3rd adhesive layer

Second adhesive film: Structure of Pi film and fourth adhesive layer

The terms of the third adhesive layer and the fourth adhesive layer are all formed using the varnish of 1) of the first embodiment, and are separated for convenience of description.

[Experimental Example]

In Example 1, the alkali resistance and acid resistance tests of the bonded substrate portion were conducted, and the results are shown in the table.

division Drug name Test condition result Alkali resistance NaOH 10wt%, 80℃, 10 minutes immersion clear 25wt%, 80℃, 5 minutes immersion clear NaClO ₃ 10wt%, 80℃, 10 minutes immersion clear 20wt%, 80℃, 5 minutes immersion clear Acid resistance HCl 35wt%, 25℃, 10 minutes immersion clear 35wt%, 50℃, 5 minutes immersion clear H ₂ SO ₄ 60wt%, 25℃, 5 minutes immersion clear

10: conductor layer
20: second adhesive layer
22: first adhesive layer
30: reinforcing film
100: adhesive film
40: reinforcement
50: metal layer (metal foil)
200: sheet-shaped metal laminate
300, 310: continuous sheet for circuit board manufacturing
400: pressurizing means
500: winding means

Claims (22)

In a state in which at least two or more sheet-like metal laminates are in parallel contact with each other in the direction of the metal foil,
Including; in a step of bonding at least one film-shaped adhesive film on both sides of the portion in contact with the sheet-like metal laminates to each other and pressurized so that the sheet-like metal laminates are connected to each other,
The adhesive film includes a reinforcing film and a conductive adhesive layer, or a conductor layer and a conductive adhesive layer,
The pressing and bonding step includes a temporary adhesion step and a main adhesion step,
The temporary bonding step is carried out for 1.5 to 5 seconds at a pressure of 100 to 120 ℃, 2kgf / cm2,
The present bonding step is performed under conditions of 180 to 220° C., pressure 6.5 to 12.5 kgf/cm 2 and pressing time for 1 minute to 5 minutes,
The conductive adhesive layer has a resistance value of 0.1 to 0.5 ohm,
The conductive adhesive layer includes an adhesive resin and a conductive powder in a weight ratio of 1: 0.005 to 0.015,
The sheet-like metal laminates,
Prepreg is prepared by impregnating the fiber substrate with a varnish of thermosetting resin and then semi-curing, laminating one or more sheets of the prepreg, and heating and pressing after laminating metal foil on one or both sides of the prepreg. Prepared by a method comprising a step;
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 1, wherein the adhesive film
A first adhesive film and a second adhesive film applied on the first adhesive film are provided on both sides of a portion where the sheet-like metal laminates are in contact with each other based on a horizontal direction in which at least two or more sheet metal laminates are arranged in parallel in the metal foil direction. Included,
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 1, wherein the adhesive film
Coating a varnish including an adhesive resin and conductive powder on the reinforcing film to prepare a first adhesive film or a second bonding film including a reinforcing film and an adhesive layer, and
It is provided, including the step of preparing a first adhesive film or a second bonding film including a conductor layer and an adhesive layer by coating a varnish including an adhesive resin and a conductive powder on the conductor layer,
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 1, wherein the method is
Providing a first adhesive film including a reinforcing film and a first adhesive layer, and a second adhesive film including a conductor layer and a second adhesive layer;
Providing at least two or more sheet-like metal laminates cut to a predetermined size;
Placing at least two or more sheet-like metal laminates in parallel so as to be in contact with each other, placing a first adhesive film on both surfaces of the portions where the sheet-like metal laminates are in contact, and bonding them by pressing; And
Placing a second adhesive film on both surfaces of the first adhesive film to which the sheet-like metal laminates are in contact with each other and bonding them by pressing;
Containing, the manufacturing method of the continuous sheet for circuit board manufacturing.
The method of claim 1,
Providing a first adhesive film including a third adhesive layer including a conductor layer and a conductive powder, and a second adhesive film including a fourth adhesive layer including a reinforcing film and a conductive powder;
Providing at least two or more sheet-like metal laminates cut to a predetermined size;
Placing at least two or more sheet-like metal laminates in parallel so as to be in contact with each other, placing a first adhesive film on both surfaces of the portions where the sheet-like metal laminates are in contact, and bonding them by pressing; And
Placing a second adhesive film on both surfaces of the first adhesive film to which the sheet-like metal laminates are in contact with each other and bonding them by pressing;
A method for manufacturing a continuous sheet for manufacturing a circuit board, including a.
delete delete The method of claim 1,
The conductive powder is a method of manufacturing a continuous sheet for manufacturing a circuit board having a particle size of 2.0 to 8.5um based on D50.
The method of claim 1,
The conductive powder is at least one selected from the group consisting of copper, aluminum, nickel, and silver (Ag),
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 2,
The conductor layer comprises Cu, SUS, or aluminum foil having a thickness of 7 to 35um,
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 1,
The adhesive resin comprises at least one selected from the group consisting of a polyimide resin, an epoxy resin, an acrylic resin, a phenoxy resin, and a polyisocyanate resin having a weight average molecular weight of 33,000 to 38,000,
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 2,
The reinforcing film has a thickness of 5 to 25 um, and includes at least one polymer resin selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate glycol, polycarbonate and polyphenylene sulfide,
A method of manufacturing a continuous sheet for manufacturing a circuit board.
The method of claim 1,
Further comprising a metal layer on the outermost portion of the adhesive film
A method of manufacturing a continuous sheet for manufacturing a circuit board.
delete The method of claim 1,
The adhesive film is a method of manufacturing a continuous sheet for manufacturing a circuit board having a width of 3 to 20mm.
delete The method of claim 1,
Winding at least two or more sheet-like metal laminates connected by the adhesive film in a horizontal direction through a guide means; further comprising, a method of manufacturing a continuous sheet for manufacturing a circuit board.
At least two or more sheet-like metal laminates are arranged in parallel in the direction of the metal foil and are in contact with each other,
On both sides of the portion where adjacent sheet-like metal laminates are in contact with each other,
A first adhesive layer, a reinforcing film, a second adhesive layer, and a conductor layer laminated on the basis of a portion where the sheet-like metal laminates contact; or
A third adhesive layer, a conductor layer, a fourth adhesive layer, and a reinforcing film; including a film-shaped adhesive film,
The first adhesive layer and the second adhesive layer have a resistance value of 0.1 to 0.5 ohm,
The sheet-like metal laminates,
Prepreg is prepared by impregnating the fiber substrate with a varnish of thermosetting resin and then semi-curing, laminating one or more sheets of the prepreg, and heating and pressing after laminating metal foil on one or both sides of the prepreg. Step; to be provided in a method comprising,
Continuous sheet for circuit board manufacturing.
The method of claim 18,
Further comprising a metal layer on the outermost portion of the adhesive film,
Continuous sheet for circuit board manufacturing.
The method of claim 18,
The continuous sheet for manufacturing a circuit board, wherein both surfaces of the adjacent portions of the sheet-like metal laminates adjacent to each other are metal layers of the sheet-like metal laminate.
The method of claim 18,
The adhesive film is a continuous sheet for manufacturing a circuit board having a width of 3 to 20 mm with respect to a direction in which two or more sheet-like metal laminates are arranged.
delete

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