CN221283446U - Thick copper circuit board lamination typesetting structure - Google Patents
Thick copper circuit board lamination typesetting structure Download PDFInfo
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- CN221283446U CN221283446U CN202323057297.9U CN202323057297U CN221283446U CN 221283446 U CN221283446 U CN 221283446U CN 202323057297 U CN202323057297 U CN 202323057297U CN 221283446 U CN221283446 U CN 221283446U
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- Prior art keywords
- thick copper
- circuit board
- copper circuit
- layer
- pattern
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 138
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 125
- 239000010949 copper Substances 0.000 title claims abstract description 125
- 238000003475 lamination Methods 0.000 title claims abstract description 45
- 239000010410 layer Substances 0.000 claims abstract description 131
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 53
- 239000013039 cover film Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 238000003825 pressing Methods 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 6
- 238000010030 laminating Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a thick copper circuit board lamination typesetting structure, which comprises a second covered release structure, a thick copper circuit board lamination structure and a first covered release structure which are sequentially overlapped; the thick copper circuit board stacking structure comprises a second copper foil, a second prepreg, a second covering film layer, a thick copper circuit board to be pressed, a first prepreg and a first copper foil which are stacked in sequence; the thick copper circuit board to be pressed comprises a first covering film dielectric layer, wherein a first adhesive layer is attached to the first covering film dielectric layer, and thick copper circuit patterns are distributed on the first adhesive layer; utilize the toughness of covering the rete, provide the effective coverage of pressfitting process and fill the glue guarantee, set up first prepreg and second prepreg and play the effect of further filling the glue film, whole pressfitting typesetting structure not only guarantees to fill glue and cover abundant to the thickness between the regulation and control layer of being convenient for ensures that whole thickness is stable controllable, prevents the problem of overflow glue between the layer, surface unevenness.
Description
Technical Field
The utility model relates to the technical field of circuit board processing, in particular to a thick copper circuit board lamination typesetting structure.
Background
The thickness of the circuit pattern of the thick copper circuit board is generally more than or equal to 70 mu m, and some ultra-thick copper circuit boards can even reach 210 mu m; when the thick copper circuit board is manufactured, the thick copper circuit pattern needs to be effectively filled with glue, namely, an insulating medium layer such as a prepreg and the thick copper circuit pattern need to be pressed in a pressing mode, so that the whole circuit board is formed.
Because the thickness of the circuit pattern of the thick copper circuit board is thicker, the fall of the formed circuit gap is larger, when the requirement on the whole thickness of the thick copper circuit board is more strict and the exceeding allowable range is smaller, the thickness of the prepreg selected during lamination generally needs to be controlled, if the traditional lamination structure of the prepreg, the thick copper core plate layer and the prepreg is adopted, on one hand, the prepreg generates the gap that the gummosis needs to be filled in the thick copper circuit pattern in the lamination process, so that the prepreg covers the edge of the thick copper circuit pattern thinner, even the problem that the prepreg is cracked during the too thin lamination is generated, on the other hand, the gel content of the prepreg is limited, the problem that the bonding force between lamination layers is weaker or layering is generated due to the insufficient filling of the circuit gap of the thick copper circuit pattern, or the problems that the filling is excessively generated, the surface of the overflow gel is uneven and the like are generated, and the manufacturing of the subsequent surface circuit is influenced.
Based on the above background and problems, there is a need to provide a thick copper circuit board lamination typesetting structure capable of ensuring the lamination interlayer bonding effect and effectively controlling the overall thickness of the thick copper circuit board.
Disclosure of utility model
The utility model aims to solve the problems that when a thick copper circuit board with strict total thickness is subjected to press fit processing, the prepreg is easy to cover the thick copper circuit pattern, or the interlayer binding force is weak due to insufficient glue filling, or the glue overflow and uneven surface are caused by excessive glue filling.
Providing a thick copper circuit board lamination typesetting structure, wherein the lamination typesetting structure comprises a second covered release structure, a thick copper circuit board lamination structure and a first covered release structure which are sequentially overlapped;
The thick copper circuit board stacking structure comprises a second copper foil, a second prepreg, a second covering film layer, a thick copper circuit board to be pressed, a first prepreg and a first copper foil which are stacked in sequence;
the thick copper circuit board to be pressed comprises a first covering film dielectric layer, a first adhesive layer is attached to the first covering film dielectric layer, and thick copper circuit patterns are distributed on the first adhesive layer;
the second covering film layer comprises a second covering film medium layer, a second adhesive layer is attached to the second covering film medium layer, and the second adhesive layer faces the thick copper circuit pattern;
The second cover type release structure comprises a second auxiliary cover type structure layer and a second release film which are placed in a laminated mode, and the second release film faces the thick copper circuit board stacking structure;
The first cover type release structure comprises a first auxiliary cover type structure layer and a first release film which are placed in a laminated mode, and the first release film faces to the thick copper circuit board stacking structure.
Optionally, the second auxiliary covering structure layer includes a second covering dielectric layer, a second covering pattern is distributed on the second covering dielectric layer, the second covering pattern corresponds to the line gap distribution of the thick copper line pattern, and the width and the height are smaller than the line gap of the thick copper line pattern; the second overlay pattern is oriented to the second release film.
Optionally, the width of the second overlay pattern is unilaterally smaller than 10 μm to 100 μm of the line gap of the thick copper line pattern; the height is less than 10 μm to 100 μm of the line gap of the thick copper line pattern.
Optionally, the first auxiliary covering structure layer includes a first covering dielectric layer, a first covering pattern is distributed on the first covering dielectric layer, the first covering pattern corresponds to the line gap distribution of the thick copper line pattern, and the width and the height are smaller than the line gap of the thick copper line pattern; the first overlay pattern is oriented to the first release film.
Optionally, the width of the first overlay pattern is unilaterally smaller than 10 μm to 100 μm of the line gap of the thick copper line pattern; the height is less than 10 μm to 100 μm of the line gap of the thick copper line pattern.
Optionally, the first cover film dielectric layer and the second cover film dielectric layer are made of the same material, and are both polyimide layers or polytetrafluoroethylene layers.
Optionally, the second prepreg and the first prepreg are made of the same material, and are both epoxy resin composite glass fiber layers.
Optionally, the roughness Rz of the surface of the second cover film dielectric layer facing to one surface of the second prepreg layer and the roughness Rz of the surface of the first cover film dielectric layer facing to one surface of the first prepreg layer are all 0.8 to 4.2.
Optionally, the thick copper line pattern has a thickness of 105 μm or more.
Optionally, the line gaps of the thick copper line pattern are filled with a resin, which is one of epoxy or via ink or solder resist ink.
According to the utility model, the thick copper circuit pattern is firstly manufactured on the first covering film layer, the supporting effect of the thick copper circuit pattern is given, the second covering film layer is further arranged, the covering film layers arranged on the two sides of the thick copper circuit pattern are formed, the toughness, high temperature resistance and high pressure resistance of the covering film layers are utilized, effective covering and glue filling guarantee of a direct base layer in the laminating process are provided for the thick copper circuit pattern, the first prepreg and the second prepreg are arranged to play a role of further filling a glue layer, the first covering release structure and the second covering release structure are arranged to play a role of covering and releasing on the auxiliary laminating structure, the thickness of each layer is arranged according to the requirement standard of the finished thick copper circuit board, the edge and the surface of the thick copper circuit pattern in the laminating process can be effectively covered with an insulating medium layer, the thickness between layers can be conveniently regulated and controlled, and the problem of glue overflow and uneven surface between layers can be prevented.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a thick copper circuit board lamination layout structure according to the present utility model.
Fig. 2 is a schematic cross-sectional structure of a thick copper circuit board fabricated using the thick copper circuit board press-fit layout structure of the present utility model.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | Stacked structure of thick copper circuit board | 170 | Second copper foil |
| 110 | Thick copper plate to be pressed | 180 | First-coating release structure |
| 1110 | Thick copper circuit pattern | 1810 | First release film |
| 1120 | A first covering film layer | 1820 | First auxiliary covering structure layer |
| 1120A | A first cover film dielectric layer | 1821 | First overlay pattern |
| 1120B | First adhesive layer | 1822 | First cover type dielectric layer |
| 130 | A second covering film layer | 190 | Second cover type release structure |
| 1310 | A second cover film dielectric layer | 1910 | Second release film |
| 1320 | Second adhesive layer | 1920 | Second auxiliary covering structure layer |
| 140 | First prepreg | 1921 | Second overlay pattern |
| 150 | First copper foil | 1922 | Second cladding dielectric layer |
| 160 | Second prepreg | 120 | Resin composition |
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the embodiments of the present disclosure.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a thick copper circuit board layout structure according to the present utility model.
The thick copper circuit board lamination typesetting structure of this embodiment includes a second cover type release structure 190, a thick copper circuit board lamination structure 100, a first cover type release structure 180 that are laminated in order.
The thick copper circuit board stack structure 100 includes a second copper foil 170, a second prepreg 160, a second cover film 130, a thick copper circuit board 110 to be laminated, a first prepreg 140, and a first copper foil 150.
The thick copper circuit board 110 to be laminated includes a first film dielectric layer 1120A, a first glue layer 1120B is attached to the first film dielectric layer 1120A, and thick copper circuit patterns 1110 are distributed on the first glue layer 1120B.
It should be noted that, the first adhesive layer 1120B attached to the first cover film dielectric layer 1120A may be structurally regarded as the first cover film layer 1120; the structure of the thick copper circuit board 110 to be laminated can be understood as taking a single-sided thick copper-clad plate, wherein the single-sided thick copper-clad plate comprises a first covering film layer 1120 and a thick copper layer, and the thick copper layer is patterned to form a thick copper circuit pattern 1110, so that the thick copper circuit board 110 to be laminated is integrally formed.
Therefore, the thick copper circuit board stack structure 100 of the present embodiment is a stack structure that needs to be pressed to form an integrated circuit board, wherein the first copper foil 150 and the second copper foil 170 are surface copper layers after the pressing is completed, the first prepreg 140 and the second prepreg 160 are insulating medium layers after the pressing is completed, and the first cover film 1120 and the second cover film 130 are layers for improving the thickness, the covering capacity and the filling capacity of the insulating medium layer covered on the thick copper circuit pattern 1110.
The second cover film 130 includes a second cover film dielectric layer 1310, and a second glue layer 1320 is attached to the second cover film dielectric layer 1310, and the second glue layer 1320 faces the thick copper circuit pattern 1110.
It should be noted that, the first adhesive layer 1120B and the second adhesive layer 1320 are solid adhesives in a normal temperature state, and under the high temperature and high pressure lamination condition, the glass state (solid) is changed into the rubber state (fluid state), so that the adhesive performance is provided, and the adhesion bonding between layers during lamination is realized; for example, an acrylic glue or an epoxy glue may be used.
The second cover release structure 190 includes a second auxiliary cover structure layer 1920 and a second release film 1910, which are stacked, and the second release film 1910 faces the thick copper circuit board stack structure 100.
The first cover release structure 180 includes a first auxiliary cover structure layer 1820 and a first release film 1810 stacked together, and the first release film 1810 faces the thick copper circuit board stack structure 100.
The first auxiliary covering structure layer 1820 and the second auxiliary covering structure layer 1920 play a role in providing covering capacity for the pressing structure, so that the rugged structures in the pressing process can be tightly combined with each other to form a firm interlayer binding force effect; the first release film 1810 and the second release film 1910 perform release function after lamination, so as to prevent the surface of the circuit board after lamination from adhering to the auxiliary lamination structure (the first auxiliary lamination structure layer 1820 and the second auxiliary lamination structure layer 1920).
In this embodiment, the second auxiliary capping structure layer 1920 includes a second capping dielectric layer 1922, and a second capping pattern 1921 is distributed on the second capping dielectric layer 1922, where the second capping pattern 1921 corresponds to the line gap distribution of the thick copper line pattern 1110, and has a width and a height that are smaller than the line gap of the thick copper line pattern 1110; the second cover pattern 1921 faces the second release film 1910.
The width of the second overlay pattern 1921 is unilaterally smaller than 10 μm to 100 μm of the line gap of the thick copper line pattern 1110; the height is less than 10 μm to 100 μm of the line gap of the thick copper line pattern 1110.
It should be noted that, because the thickness of the thick copper line pattern 1110 is thicker, in order to ensure the effect of filling and adhering the line gaps of the thick copper line pattern 1110 with each other during the lamination process of the second prepreg 160, the second cover film 130, the first cover film 1120 and the first prepreg 140, the second cover pattern 1921 is provided, which can play a role in more punching and complementary lamination, improve the interlayer bonding force, and make the width and the height smaller than the line gaps of the thick copper line pattern 1110, so that the second prepreg 160, especially the second cover film 130, can be provided with a certain lamination space, and prevent the problems of glue overflow, interlayer rupture and the like during lamination.
The first auxiliary capping structure layer 180 includes a first capping dielectric layer 1822, a first capping pattern 1821 is distributed on the first capping dielectric layer 1822, the first capping pattern 1821 corresponds to the line gap distribution of the thick copper line pattern 1110, and the width and the height are smaller than the line gap of the thick copper line pattern 1110; the first overlay pattern 1821 is directed toward the first release film 1810.
The width of the first overlay pattern 1821 is unilaterally smaller than the line gap of the thick copper line pattern 1110
10 Μm to 100 μm; the height is less than 10 μm to 100 μm of the line gap of the thick copper line pattern 1110.
The function of setting the first pattern 1821 is the same as the function of setting the second pattern 1921, and on the basis of setting the second pattern 1921, the symmetry of the double-sided pressing force can be further ensured, and the symmetry of the pressing structure is improved.
In this embodiment, the first capping film dielectric layer 1120A and the second capping film dielectric layer 1310 are made of the same material, and are both polyimide layers or polytetrafluoroethylene layers.
The epoxy resin glass fiber material (FR-4) of the polyimide layer or polytetrafluoroethylene layer material has higher toughness, high temperature resistance and high pressure resistance, can better cover and protect the thick copper circuit pattern 1110, and is not easy to crack in the pressing process.
In this embodiment, the second prepreg 160 is the same as the first prepreg 140 in material, and both are epoxy resin composite glass fiber layers.
The epoxy resin composite glass fiber layer has good covering and adhering properties and can play an effective role in filling and adhering.
In this embodiment, the roughness Rz of the surface of the second cover film dielectric layer 1310 facing the second prepreg layer 160 and the roughness Rz of the surface of the first cover film dielectric layer 1120A facing the first prepreg layer 140 are 0.8 to 4.2.
Because the second cover film dielectric layer 1310 and the first cover film dielectric layer 1120A have a certain inertia, in order to ensure that the second cover film dielectric layer 1310 can form a better adhesion effect with the second prepreg layer 160 and the first cover film dielectric layer 1120A can form a better adhesion effect with the first prepreg layer 140, the surfaces of the second cover film dielectric layer 1310 and the first cover film dielectric layer 1120A can be roughened, i.e. treated to form a certain roughness so as to improve the interlayer bonding effect, the roughening treatment can adopt a method of mechanically polishing and plasma treatment, the mechanically polishing forms a relatively rough surface, and the plasma treatment forms a relatively fine and uniform rough surface.
In this embodiment, the thickness of the thick copper wiring pattern 1110 is 105 μm or more; the embodiment is generally suitable for pressing thick copper circuit boards with thicker copper.
In this embodiment, the line gap of the thick copper line pattern 1110 is filled with a resin 120, and the resin 120 is one of epoxy or via ink or solder resist ink.
When the copper thickness is thicker (for example, the copper thickness exceeds 210 μm), the filling effect of the second prepreg 160 and the second cover film 130 and the first cover film 1120 and the first prepreg 140 on the thick copper line pattern 1110 may still be limited, and thus, the resin 120 may be filled into the line gap of the thick copper line pattern 1110 to form pre-filling before lamination, thereby reducing the height difference of the line gap, improving the lamination filling fullness, and simultaneously preventing the problem of lamination cracking of the second cover film 130 and the first cover film 1120; the resin 120 may be selected from materials with which other layers may adhere, and may be made by silk-screening.
It should be noted that, in one embodiment, the first release film 1810 and the second release film 1910 are made of the same material, and both are one of a polytetrafluoroethylene layer or a polyimide layer or an ETFE layer or a TPX layer.
The release layer material has good release effect, ensures that the thick copper circuit board after lamination can be effectively peeled off from the auxiliary lamination structure, and does not damage the board surface.
Fig. 2 is a schematic cross-sectional structure of a thick copper circuit board fabricated using the thick copper circuit board press-fit layout structure of the present utility model.
By adopting the thick copper circuit board lamination typesetting structure of the embodiment, the thick copper circuit board structure shown in fig. 2 can be formed after lamination is completed.
The foregoing description is only the preferred embodiments of the present utility model, and is not intended to limit the scope of the embodiments of the present utility model, and all the equivalent structural changes made by the descriptions of the embodiments of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the embodiments of the present utility model.
Claims (10)
1. The thick copper circuit board lamination typesetting structure is characterized by comprising a second lamination type release structure, a thick copper circuit board lamination type release structure and a first lamination type release structure which are overlapped in sequence;
The thick copper circuit board stacking structure comprises a second copper foil, a second prepreg, a second covering film layer, a thick copper circuit board to be pressed, a first prepreg and a first copper foil which are stacked in sequence;
the thick copper circuit board to be pressed comprises a first covering film dielectric layer, a first adhesive layer is attached to the first covering film dielectric layer, and thick copper circuit patterns are distributed on the first adhesive layer;
the second covering film layer comprises a second covering film medium layer, a second adhesive layer is attached to the second covering film medium layer, and the second adhesive layer faces the thick copper circuit pattern;
The second cover type release structure comprises a second auxiliary cover type structure layer and a second release film which are placed in a laminated mode, and the second release film faces the thick copper circuit board stacking structure;
The first cover type release structure comprises a first auxiliary cover type structure layer and a first release film which are placed in a laminated mode, and the first release film faces to the thick copper circuit board stacking structure.
2. The thick copper circuit board lamination typesetting structure according to claim 1, wherein the second auxiliary coverage type structural layer comprises a second coverage type dielectric layer, second coverage type patterns are distributed on the second coverage type dielectric layer, the second coverage type patterns correspond to line gap distribution of the thick copper line patterns, and the width and the height of the second coverage type patterns are smaller than the line gaps of the thick copper line patterns; the second overlay pattern is oriented to the second release film.
3. The thick copper circuit board lamination typesetting structure according to claim 2, wherein the width single side of the second coverage pattern is smaller than 10 μm to 100 μm of the line gap of the thick copper circuit pattern; the height is less than 10 μm to 100 μm of the line gap of the thick copper line pattern.
4. The thick copper circuit board lamination typesetting structure according to claim 1, wherein the first auxiliary coverage type structural layer comprises a first coverage type dielectric layer, first coverage type patterns are distributed on the first coverage type dielectric layer, the first coverage type patterns correspond to line gap distribution of the thick copper line patterns, and the width and the height of the first coverage type patterns are smaller than the line gaps of the thick copper line patterns; the first overlay pattern is oriented to the first release film.
5. The thick copper circuit board laminated typesetting structure according to claim 4, wherein the width single side of the first coverage pattern is smaller than 10 μm to 100 μm of the line gap of the thick copper circuit pattern; the height is less than 10 μm to 100 μm of the line gap of the thick copper line pattern.
6. The thick copper circuit board lamination typesetting structure of claim 1, wherein the first and second cover film dielectric layers are made of the same material, and are both polyimide layers or polytetrafluoroethylene layers.
7. The thick copper circuit board lamination layout structure of claim 1, wherein the second prepreg and the first prepreg are made of the same material, and are both epoxy resin composite glass fiber layers.
8. The thick copper circuit board lamination typesetting structure according to claim 1, wherein the roughness Rz of the surface of the second covering film dielectric layer facing to the surface of the second prepreg layer and the roughness Rz of the surface of the first covering film dielectric layer facing to the surface of the first prepreg layer are all 0.8 to 4.2;
The first release film and the second release film are made of the same material, and the first release film and the second release film are made of one of a polytetrafluoroethylene layer, a polyimide layer, an ETFE layer and a TPX layer.
9. The thick copper circuit board layout structure of claim 1, wherein the thick copper circuit pattern has a thickness of 105 μm or more.
10. The thick copper circuit board layout structure of claim 1, wherein the line gaps of the thick copper line pattern are filled with a resin, the resin being one of epoxy or via ink or solder resist ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323057297.9U CN221283446U (en) | 2023-11-13 | 2023-11-13 | Thick copper circuit board lamination typesetting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323057297.9U CN221283446U (en) | 2023-11-13 | 2023-11-13 | Thick copper circuit board lamination typesetting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221283446U true CN221283446U (en) | 2024-07-05 |
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ID=91700886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323057297.9U Active CN221283446U (en) | 2023-11-13 | 2023-11-13 | Thick copper circuit board lamination typesetting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221283446U (en) |
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2023
- 2023-11-13 CN CN202323057297.9U patent/CN221283446U/en active Active
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