JPH09181421A - Manufacture of metal foil clad laminated board and manufacture of printed board - Google Patents
Manufacture of metal foil clad laminated board and manufacture of printed boardInfo
- Publication number
- JPH09181421A JPH09181421A JP27789396A JP27789396A JPH09181421A JP H09181421 A JPH09181421 A JP H09181421A JP 27789396 A JP27789396 A JP 27789396A JP 27789396 A JP27789396 A JP 27789396A JP H09181421 A JPH09181421 A JP H09181421A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- metal foil
- layer
- plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
ための金属箔張り積層板の製造法に関する。また、この
金属箔張り積層板を回路加工するプリント配線板の製造
法に関する。この方法で製造したプリント配線板は、Ｉ
Ｃカード等の薄型の電子機器に組み込んで使用するのに
適したものである。TECHNICAL FIELD The present invention relates to a method for producing a metal foil-clad laminate for a printed wiring board. The present invention also relates to a method for manufacturing a printed wiring board, which is a circuit processing of the metal foil-clad laminate. The printed wiring board manufactured by this method is
It is suitable for being used by incorporating it into a thin electronic device such as a C card.
【０００２】[0002]
【従来の技術】ＩＣカード等の非常に薄型の電子機器に
用いる片面プリント配線板は、図２に示すように、絶縁
層１の片面に回路２を形成し、絶縁層１のみを貫通する
穴を設けたものである。この穴は、ＩＣを収容して固定
するＩＣ収容穴３と、ＩＣと回路２をワイヤボンディン
グにより接続する接続穴４とがある。いずれの穴もその
底面は、回路２の裏面側が露出して形成されたものであ
る。従来、このようなプリント配線板は、ポリイミドフ
ィルムを絶縁層とし、長尺の当該ポリイミドフィルム上
に所定の回路を一列に配列したＴＡＢテープとして巻物
の状態で供給されている。ＴＡＢテープの両側部には供
給装置による送り出し用のスプロケット穴が配列されて
おり、順次送り出されるＴＡＢテープを所定長さごとに
裁断して個々のプリント配線板とする。2. Description of the Related Art A single-sided printed wiring board used for a very thin electronic device such as an IC card has a circuit 2 formed on one side of an insulating layer 1 and a hole penetrating only the insulating layer 1 as shown in FIG. Is provided. The holes include an IC housing hole 3 for housing and fixing the IC, and a connection hole 4 for connecting the IC and the circuit 2 by wire bonding. The bottom surface of each hole is formed by exposing the back side of the circuit 2. Conventionally, such a printed wiring board is supplied in the form of a roll as a TAB tape having a polyimide film as an insulating layer and predetermined circuits arranged in a row on the long polyimide film. Sprocket holes for feeding by the supply device are arranged on both sides of the TAB tape, and the sequentially fed TAB tape is cut into predetermined lengths to form individual printed wiring boards.
【０００３】上記ＴＡＢテープの製造法として、例えば
次の（１）や（２）の技術が実用化されている。 （１）長尺の所定幅のポリイミドフィルム上に、キャス
ト法、スパッタ法、めっき法、ＴＰＩ法等により銅の薄
層を形成した銅張り積層板を準備する。次に、銅の薄層
をエッチングして、ポリイミドフィルム上に所定の回路
を一列に配列して形成する。そして、ポリイミドフィル
ムの所定箇所を薬液により溶解除去して、ＩＣ収容穴
３、接続穴４、スプロケット穴を形成する。 （２）長尺の所定幅のポリイミドフィルムの所定箇所
に、金型による打抜き加工で、ＩＣ収容穴３、接続穴
４、スプロケット穴を形成する。次に、前記穴あけ加工
をしたポリイミドフィルムの片面に熱硬化型接着剤を塗
布してその面に銅箔を重ね、連続的な加熱加圧成形によ
り両者を一体化した銅張り積層板を準備する。そして、
銅箔をエッチングして、ポリイミドフィルム上に所定の
回路を一列に配列して形成する。ここで、穴あけ加工を
した後にポリイミドフィルムに熱硬化型接着剤を塗布す
るのは、塗布した熱硬化型接着剤に粘着性が残っている
からである。穴あけ加工より前に熱硬化型接着剤を塗布
して粘着性が残っているポリイミドフィルムは、実質上
穴あけに供することができない。As a method for producing the above TAB tape, for example, the following techniques (1) and (2) have been put to practical use. (1) A copper-clad laminate having a thin copper layer formed on a long polyimide film having a predetermined width by a casting method, a sputtering method, a plating method, a TPI method or the like is prepared. Next, a thin layer of copper is etched to form predetermined circuits in a line on the polyimide film. Then, a predetermined portion of the polyimide film is dissolved and removed with a chemical solution to form an IC housing hole 3, a connection hole 4, and a sprocket hole. (2) The IC housing hole 3, the connection hole 4, and the sprocket hole are formed at predetermined positions of a long polyimide film having a predetermined width by punching using a die. Next, a thermosetting adhesive is applied to one surface of the perforated polyimide film, a copper foil is laminated on the surface, and a copper-clad laminate is prepared by integrating the two by continuous heat and pressure molding. . And
The copper foil is etched to form predetermined circuits arranged in a line on the polyimide film. Here, the reason why the thermosetting adhesive is applied to the polyimide film after the perforation processing is performed is that the applied thermosetting adhesive has tackiness remaining. A polyimide film which remains to be tacky by applying a thermosetting adhesive before the drilling process cannot be substantially subjected to drilling.
【０００４】また、ノートブックパソコンや携帯電話等
の電子機器には、絶縁層にＩＣ収容穴を設けた両面プリ
ント配線板や多層プリント配線板が使用される。両面プ
リント配線板は、絶縁層の両面に回路を形成したもので
あり、多層プリント配線板は、表面及び内層に回路を形
成したものである。これらの電子機器では、一般に大型
のＩＣがプリント配線板に実装されるため、プリント配
線板には機械的な強度が必要とされ、その絶縁層には、
ポリイミド等のフィルム基材ではなく、ガラス繊維の織
布や不織布基材にエポキシ樹脂やポリイミド等を含浸し
たＦＲＰ材が一般に使用される。これらプリント配線板
の絶縁層にＩＣ収容穴を設けるために、例えば次の
（３）や（４）の技術が実用化されている。 （３）プリント配線板の絶縁層をルーターにより所定の
深さだけ削ってＩＣ収容穴を形成する方法。 （４）事前に打抜き加工やルーター加工によりＩＣ収容
穴を形成した絶縁層とプリント配線板を、前記ＩＣ収容
穴と同形状に穴あけ加工した樹脂流動性の非常に低いプ
リプレグ（一般にノーフロープリプレグと呼ばれる）を
介して加熱加圧により一体化する方法。[0004] Further, a double-sided printed wiring board or a multilayer printed wiring board having an IC accommodation hole in an insulating layer is used for an electronic device such as a notebook personal computer or a mobile phone. The double-sided printed wiring board has circuits formed on both sides of an insulating layer, and the multilayer printed wiring board has circuits formed on the surface and inner layers. In these electronic devices, a large-sized IC is generally mounted on a printed wiring board, so that the printed wiring board needs to have mechanical strength.
An FRP material obtained by impregnating a glass fiber woven or nonwoven fabric substrate with an epoxy resin, polyimide, or the like is generally used instead of a film substrate such as polyimide. For example, the following techniques (3) and (4) have been put to practical use in order to provide IC accommodation holes in the insulating layer of these printed wiring boards. (3) A method in which an insulating layer of a printed wiring board is cut to a predetermined depth by a router to form an IC receiving hole. (4) A prepreg having a very low resin flowability (generally, a no-flow prepreg) in which an insulating layer and a printed wiring board in which an IC housing hole is formed by punching or router processing in advance is formed in the same shape as the IC housing hole. (Referred to as “integration”).
【０００５】[0005]
【発明が解決しようとする課題】上記（１）（２）のよ
うに、絶縁層の片面に回路を有し、絶縁層に、ＩＣを収
容して固定するＩＣ収容穴と、ＩＣと回路をワイヤボン
ディングにより接続する接続穴を設けたプリント配線板
は、回路を一列に配列した長尺のＴＡＢテープで供給さ
れる。このようなＴＡＢテープは、回路を一列に配列し
ていることに起因して、回路形成工程や穴あけ工程の作
業効率が低い。１枚のワーク（絶縁層）上に縦方向・横
方向とも回路を複数個配列して形成するプリント配線板
の製造法は、作業効率のよい方法であるが、このような
製造法に用いる汎用の製造設備は、前記ＴＡＢテープの
製造には用いることができない。また、上記（２）の技
術では、銅箔の一体化時に絶縁層の穴底面（銅箔の裏
面）に熱硬化型接着剤がしみ出ることがあり、好ましく
ない。As described in (1) and (2) above, there is a circuit on one side of the insulating layer, and the insulating layer has an IC receiving hole for receiving and fixing the IC, and an IC and a circuit. A printed wiring board provided with connection holes connected by wire bonding is supplied by a long TAB tape in which circuits are arranged in a line. Such a TAB tape has a low work efficiency in a circuit forming step and a drilling step due to the arrangement of circuits in a line. A method of manufacturing a printed wiring board in which a plurality of circuits are arranged on one work (insulating layer) both vertically and horizontally is a method with high work efficiency. Cannot be used for the production of the TAB tape. Further, the technique (2) is not preferable because the thermosetting adhesive may exude to the bottom surface of the hole of the insulating layer (the back surface of the copper foil) when the copper foil is integrated.
【０００６】また、上記（３）の技術では、絶縁層を反
対側の回路面まで厚さ方向に非常に精度良く切削する必
要がある。切削しすぎて必要な回路がなくならないよ
う、回路を構成する金属箔として厚さの厚いもの（例え
ば７０μｍ厚みの銅箔）を使用しなければならない等の
制限もある。そして、切削後、露出した回路面（絶縁層
と接着していた面）に残留している絶縁層形成樹脂を薬
品で溶かし除去した上でないとメッキを行なえない。上
記（４）の技術では、ＩＣ収容穴と同形状に穴あけ加工
したノーフロープリプレグを準備しなければない。さら
に、ノーフロープリプレグを使用して一体化を行なって
もＩＣ収容穴への樹脂のしみ出しを十分に抑えることは
できない。そして、本来の絶縁層とは別にノーフロープ
リプレグを使用して一体化を行なうため、薄型化が困難
になる。In the technique (3), it is necessary to cut the insulating layer very accurately in the thickness direction up to the circuit surface on the opposite side. There is also a restriction that a thick metal foil (for example, a copper foil having a thickness of 70 μm) must be used as a metal foil constituting the circuit so that the necessary circuit is not lost due to excessive cutting. Then, after cutting, plating cannot be performed unless the insulating layer forming resin remaining on the exposed circuit surface (the surface adhered to the insulating layer) is dissolved and removed with a chemical. In the above technique (4), it is necessary to prepare a no-flow prepreg drilled in the same shape as the IC housing hole. Furthermore, even if integration is performed using a no-flow prepreg, it is not possible to sufficiently suppress the exudation of resin into the IC housing hole. Since the integration is performed using a no-flow prepreg separately from the original insulating layer, it is difficult to reduce the thickness.
【０００７】本発明が解決しようとする第１の課題は、
絶縁層の片面に回路を有しＩＣ収容等のために絶縁層に
当該絶縁層だけを貫通する穴を設けた片面プリント配線
板を、汎用のプリント配線板製造設備を使用して製造で
きるようにすることである。また、そのようなプリント
配線板のための金属箔張り積層板を製造することであ
る。さらには、絶縁層の穴底面への樹脂のしみ出しを防
止することである。The first problem to be solved by the present invention is
A single-sided printed wiring board having a circuit on one side of the insulating layer and having a hole penetrating only the insulating layer for accommodating an IC or the like can be manufactured using a general-purpose printed wiring board manufacturing facility. It is to be. Another object is to manufacture a metal foil-clad laminate for such a printed wiring board. Further, it is to prevent the resin from seeping out to the bottom surface of the hole of the insulating layer.
【０００８】本発明が解決しようとする第２の課題は、
絶縁層の両面に回路を有しＩＣ収容等のために絶縁層に
当該絶縁層だけを貫通する穴を設けた両面プリント配線
板を、汎用のプリント配線板製造設備を使用して製造で
きるようにすることである。また、そのようなプリント
配線板のための金属箔張り積層板を製造することであ
る。さらには、穴あけに加工精度を必要とする切削を使
用せず、また、絶縁層の穴底面への樹脂のしみ出しを防
止することである。[0008] A second problem to be solved by the present invention is as follows.
A double-sided printed wiring board having circuits on both sides of the insulating layer and having holes penetrating only the insulating layer for accommodating ICs can be manufactured using general-purpose printed wiring board manufacturing equipment. It is to be. Another object is to manufacture a metal foil-clad laminate for such a printed wiring board. Furthermore, it is to prevent the resin from seeping out to the bottom surface of the hole of the insulating layer without using cutting that requires processing accuracy for drilling.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するため
に本発明に係るプリント配線板の製造法は、加熱硬化後
においても再加熱により金属箔との接着が可能である加
熱硬化した熱硬化性樹脂Ａの層を、絶縁層となる板状体
に形成する。この板状体にＩＣ収容穴となる貫通穴をあ
けた後、熱硬化性樹脂Ａの層に回路形成のための金属箔
を重ねて加熱成形により一体化し、金属箔張り積層板と
する。熱硬化性樹脂Ａの層は、硬化しているので、金属
箔を一体化する加熱加圧成形時に流動することはなく、
前記貫通穴の内側への樹脂のしみ出しは殆どない。しか
も、熱硬化性樹脂Ａの層は、加熱硬化後においても再加
熱により接着性が出てくるので、板状体と金属箔の一体
化は十分な強度をもって実現される。このような金属箔
張り積層板の金属箔をエッチングして回路加工し、プリ
ント配線板を製造する。In order to solve the above-mentioned problems, a method for manufacturing a printed wiring board according to the present invention is capable of adhering to a metal foil by reheating even after heat curing. The layer of the functional resin A is formed into a plate-shaped body that will be an insulating layer. After forming a through hole serving as an IC accommodation hole in this plate-shaped body, a metal foil for forming a circuit is overlaid on the thermosetting resin A layer and integrated by heat molding to obtain a metal foil-clad laminate. Since the layer of the thermosetting resin A is cured, it does not flow at the time of heat and pressure molding for integrating the metal foil,
Almost no resin exudes to the inside of the through hole. Moreover, since the thermosetting resin A layer exhibits adhesiveness by reheating even after heating and curing, the integration of the plate-shaped body and the metal foil is realized with sufficient strength. The metal foil of such a metal foil-clad laminate is etched to form a circuit, and a printed wiring board is manufactured.
【００１０】[0010]
【発明の実施の形態】上記第１の課題を解決するために
本発明に係る第１のプリント配線板の製造法は、次の
（ａ）〜（ｄ）の工程を経る金属箔張り積層板の製造法
の後に、（ｅ）の工程を経ることを特徴とする。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して、片面に熱硬化性樹脂Ａの層を有する離型フィル
ムを準備する工程 （ｂ）上記離型フィルムの熱硬化性樹脂Ａの層側に、シ
ート状基材に熱硬化性樹脂を含浸乾燥して得たプリプレ
グを重ね、加熱加圧成形により一体化して板状体とする
工程 （ｃ）離型フィルムを剥がして又は剥がさずに、上記板
状体の所定位置に貫通穴をあける行程 （ｄ）上記工程を経た板状体の熱硬化性樹脂Ａの層側
に、金属箔を重ねて加熱加圧成形により一体化する工程
（ｅ）上記金属箔張り積層板の製造の工程の後に、貫通
穴を埋めて又は覆って金 属箔をエッチングし所定の回路に加工する工程 上記第１の製造法において、加熱硬化後においても再加
熱により金属箔との接着が可能である熱硬化性樹脂Ａの
層は、シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの片面に塗布乾燥して形成することもでき
る。この場合、前記プリプレグを加熱加圧成形して、片
面に熱硬化性樹脂Ａの層を有するする板状体を得、当該
板状体の所定位置に貫通穴をあける。そして、貫通穴を
あけた板状体の熱硬化性樹脂Ａの層側に金属箔を重ねて
加熱加圧成形により一体化し、金属箔張り積層板を製造
する。以下は、第１の製造法と同様である（第２の製造
法）。上記シート状基材を使用しない場合は、加熱硬化
後においても再加熱により金属箔との接着が可能である
熱硬化性樹脂Ａを離型フィルムの片面に塗布乾燥して粘
着性がなくなる程度まで加熱硬化させる。そして、離型
フィルムの所定位置に貫通穴をあける。その後、離型フ
ィルムの熱硬化性樹脂Ａの層側に金属箔を重ねて加熱加
圧成形により一体化し、金属箔張り積層板を製造する。
以下は、第１の製造法と同様である（第３の製造法）。BEST MODE FOR CARRYING OUT THE INVENTION In order to solve the above first problem, a first printed wiring board manufacturing method according to the present invention comprises a metal foil-clad laminate having the following steps (a) to (d): The method is characterized by performing the step (e) after the manufacturing method of (A) A release film having a layer of the thermosetting resin A on one side is dried by applying a thermosetting resin A to the release film, which can be adhered to a metal foil by reheating even after heat curing. Preparing step (b) A prepreg obtained by impregnating and drying a thermosetting resin on a sheet-shaped substrate is placed on the layer side of the thermosetting resin A of the release film, and integrated by heat and pressure molding to obtain a plate. Step of forming a plate-like body (c) A step of forming a through hole at a predetermined position of the plate-like body with or without peeling off the release film (d) A layer of the thermosetting resin A of the plate-like body that has undergone the above-mentioned steps (E) After the step of manufacturing the metal foil-clad laminate described above, the metal foil is etched by filling or covering the through holes to etch a predetermined circuit. In the first manufacturing method described above, even after heating and curing A layer of a thermosetting resin A bonding is possible between the metal foil by heating can also be formed by coating and drying a thermosetting resin on one surface of the prepreg obtained by impregnating dried base material sheet. In this case, the prepreg is heat-pressed to obtain a plate-shaped body having a layer of the thermosetting resin A on one side, and a through hole is formed at a predetermined position of the plate-shaped body. Then, a metal foil is laminated on the layer side of the thermosetting resin A of the plate-shaped body having the through holes and integrated by heat and pressure molding to produce a metal foil-clad laminate. The following is the same as the first manufacturing method (second manufacturing method). When the above-mentioned sheet-shaped substrate is not used, the thermosetting resin A capable of adhering to the metal foil by reheating even after heating and curing is applied to one side of the release film and dried to the extent that the tackiness is lost. Heat cure. Then, a through hole is formed at a predetermined position of the release film. Then, a metal foil is laminated on the layer side of the thermosetting resin A of the release film and integrated by heat and pressure molding to produce a metal foil-clad laminate.
The following is the same as the first manufacturing method (third manufacturing method).
【００１１】上記の第１、第２のいずれの製造法におい
ても、片面に熱硬化性樹脂Ａの層を有する板状体は通常
の積層板成形プレスを使用して成形し、１ｍ×１ｍや１
ｍ×１．２ｍの寸法のものを準備することができる。上
記の第３の製造法において、片面に熱硬化性樹脂Ａの層
を有する離型フィルムも、前記板状体と同様の寸法のも
のを準備することができる。この板状体や離型フィルム
の熱硬化性樹脂Ａの層は硬化しているので粘着性がな
く、これらに貫通穴をあける作業を支障なく実施するこ
とができる。しかし、熱硬化性樹脂Ａの層は、再加熱に
より金属箔との接着性を有するので、板状体や離型フィ
ルムの熱硬化性樹脂Ａの層側に、金属箔を加熱加圧成形
により十分な接着力で一体化することができる。このと
き、熱硬化性樹脂Ａの層側は流動しないので、板状体や
離型フィルムの穴の底面（すなわち、金属箔の裏面）に
熱硬化性樹脂Ａがしみ出して付着することはない。本発
明に係る方法によれば、長尺のテープではなく、通常の
プリント配線板のワークサイズで金属箔張り積層板を用
意することができ、回路を１枚のワーク（絶縁層）上に
縦方向・横方向とも複数個配列して形成するプリント配
線板の製造が、汎用の設備を使用して可能となる。In both the first and second manufacturing methods described above, the plate-like body having a layer of the thermosetting resin A on one surface is molded by using an ordinary laminated plate molding press to obtain 1 m × 1 m or 1
It is possible to prepare one having a size of m × 1.2 m. In the third manufacturing method described above, a release film having a layer of the thermosetting resin A on one surface can be prepared in the same size as the plate-shaped body. Since the layer of the thermosetting resin A of the plate-like body or the release film is hardened, it has no tackiness, and the work of forming a through hole in them can be carried out without any trouble. However, since the thermosetting resin A layer has adhesiveness to the metal foil by reheating, the metal foil is heat-pressed and molded on the layer side of the thermosetting resin A of the plate-shaped body or the release film. It can be integrated with sufficient adhesive force. At this time, since the layer side of the thermosetting resin A does not flow, the thermosetting resin A does not exude and adhere to the bottom surface of the hole of the plate-like body or the release film (that is, the back surface of the metal foil). . According to the method of the present invention, it is possible to prepare a metal foil-clad laminate with a work size of an ordinary printed wiring board, instead of a long tape, and a circuit is vertically arranged on one work (insulating layer). A general-purpose facility can be used to manufacture a printed wiring board formed by arranging a plurality of elements in both the lateral and lateral directions.
【００１２】上記第２の課題を解決するために本発明に
係る第４のプリント配線板の製造法は、両面プリント配
線板を製造する場合であり、次の（ａ）〜（ｄ）の工程
を経る両面金属箔張り積層板の製造法の後に、（ｅ）の
工程を経ることを特徴とする。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して、片面に熱硬化性樹脂Ａの層を有する離型フィル
ムを準備する工程 （ｂ）シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの両面に、上記離型フィルムの熱硬化性樹脂
Ａの層側をそれぞれ重ねて、加熱加圧成形により一体化
して板状体とする工程 （ｃ）離型フィルムを剥がして又は剥がさずに、上記板
状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の両面に、金属箔を重ねて
加熱加圧成形により一体化する工程 （ｅ）上記金属箔張り積層板の製造の工程の後に、金属
箔をエッチングし所定の回路に加工する工程 上記第４の製造法において、加熱硬化後においても再加
熱により金属箔との接着が可能である熱硬化性樹脂Ａの
層は、シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの両面に塗布乾燥して形成することもでき
る。この場合、前記プリプレグを加熱加圧成形して、両
面に熱硬化性樹脂Ａの層を有するする板状体を得、当該
板状体の所定位置に貫通穴をあける。そして、貫通穴を
あけた板状体の両面に金属箔を重ねて加熱加圧成形によ
り一体化し、金属箔張り積層板を製造する。以下は、第
４の製造法と同様である（第５の製造法）。また、加熱
硬化後においても再加熱により金属箔との接着が可能で
ある熱硬化性樹脂Ａの層は、シート状基材に熱硬化性樹
脂を含浸乾燥し加熱加圧して得た板状体の両面に塗布乾
燥して形成することもできる。この場合、両面に熱硬化
性樹脂Ａの層を形成した板状体の所定位置に貫通穴をあ
ける。そして、貫通穴をあけた板状体の両面に金属箔を
重ねて加熱加圧成形により一体化し、金属箔張り積層板
を製造する。以下は、第４の製造法と同様である（第６
の製造法）。さらに、上記シート状基材を使用しない場
合は、加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムの片面に
塗布乾燥して粘着性がなくなる程度まで加熱硬化させ
る。そして、離型フィルムを剥がして又は剥がさずに、
熱硬化性樹脂Ａの層の所定位置に貫通穴をあける。その
後、熱硬化性樹脂Ａの層の両面に金属箔を重ねて加熱加
圧成形により一体化し、金属箔張り積層板を製造する。
以下は、第４の製造法と同様である（第７の製造法）。
このような第４〜第７の製造法の場合にも、第１〜第３
の製造法の場合と同様の理由で、両面プリント配線板に
ついての第２の課題を達成することができる。第４〜第
７の製造法においては、片面の金属箔は貫通穴に対応す
る部分をエッチングで除去し、他面の金属箔はそのまま
残して貫通穴の底面を構成するようにしなければなら
い。貫通穴に対応する部分の金属箔をエッチングで除去
すると、貫通穴にはエッチング液が入り込むので、当該
エッチング液が他面の金属箔を著しくエッチングしない
ようにエッチング終了時点を制御する配慮をする必要が
出てくる。前記他面の金属箔の厚さを前記エッチングで
除去する側の金属箔の厚さより厚くしておくことによ
り、多少エッチングされても差し支えなくなるので、こ
のような発明の実施の形態は好ましいものである（第８
の製造法）。In order to solve the above-mentioned second problem, a fourth method for manufacturing a printed wiring board according to the present invention is a case of manufacturing a double-sided printed wiring board, and the following steps (a) to (d) are performed. After the method for producing a double-sided metal foil-clad laminate sheet, the step (e) is performed. (A) A release film having a layer of the thermosetting resin A on one side is dried by applying a thermosetting resin A to the release film, which can be adhered to a metal foil by reheating even after heat curing. Step (b) of preparing: A thermosetting resin is impregnated and dried in a sheet-shaped substrate, and the thermosetting resin A layer side of the release film is overlaid on both sides of the prepreg, and heat-pressing is performed. Step of integrally forming a plate-like body (c) Step of forming a through hole at a predetermined position of the plate-like body with or without peeling the release film (d) On both sides of the plate-like body that has undergone the above-mentioned steps, A step of stacking metal foils and integrating them by heat and pressure molding (e) a step of etching the metal foils and processing them into a predetermined circuit after the step of manufacturing the metal foil-clad laminate, in the fourth manufacturing method, Contact with metal foil by reheating even after heat curing A layer of thermosetting resin A is possible can be formed by coating and drying on both sides of the prepreg obtained by the thermosetting resin impregnated dry sheet-like base material. In this case, the prepreg is heat-pressed to obtain a plate-shaped body having layers of the thermosetting resin A on both sides, and a through hole is formed at a predetermined position of the plate-shaped body. Then, a metal foil is laminated on both surfaces of the plate-shaped body having the through holes and integrated by heat and pressure molding to manufacture a metal foil-clad laminate. The following is the same as the fourth manufacturing method (fifth manufacturing method). Further, the layer of the thermosetting resin A which can be adhered to the metal foil by reheating even after the heating and curing is a plate-like body obtained by impregnating and drying the sheet-like base material with the thermosetting resin and heating and pressing. It can also be formed by coating and drying on both surfaces of. In this case, a through hole is formed at a predetermined position of the plate-shaped body having the thermosetting resin A layer formed on both sides. Then, a metal foil is laminated on both surfaces of the plate-shaped body having the through holes and integrated by heat and pressure molding to manufacture a metal foil-clad laminate. The following is similar to the fourth manufacturing method (sixth method).
Manufacturing method). Further, when the above-mentioned sheet-shaped substrate is not used, the thermosetting resin A capable of adhering to the metal foil by reheating even after heating and curing is applied to one side of the release film and dried to eliminate tackiness. Heat cure to a certain degree. Then, with or without removing the release film,
A through hole is formed in a predetermined position of the thermosetting resin A layer. Then, a metal foil is laminated on both surfaces of the thermosetting resin A layer and integrated by heat and pressure molding to produce a metal foil-clad laminate.
The following is the same as the fourth manufacturing method (seventh manufacturing method).
Even in the case of such fourth to seventh manufacturing methods, the first to third
The second problem regarding the double-sided printed wiring board can be achieved for the same reason as in the case of the manufacturing method. In the fourth to seventh manufacturing methods, the metal foil on one side must be removed by etching at a portion corresponding to the through hole, and the metal foil on the other side must be left as it is to form the bottom surface of the through hole. When the metal foil in the part corresponding to the through hole is removed by etching, the etching liquid enters the through hole.Therefore, it is necessary to consider the control of the etching end time so that the etching liquid does not significantly etch the metal foil on the other surface. Comes out. By setting the thickness of the metal foil on the other surface to be thicker than the thickness of the metal foil on the side to be removed by the etching, even if it is etched to some extent, there is no problem, and such an embodiment of the invention is preferable. Yes (Eighth
Manufacturing method).
【００１３】さらに、上記第２の課題を解決するために
本発明に係る第９のプリント配線板の製造法は、両面プ
リント配線板を製造する場合であり、次の（ａ）〜
（ｄ）の工程を経る両面金属箔張り積層板の製造法の後
に、（ｅ）の工程を経ることを特徴とする。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して、片面に熱硬化性樹脂Ａの層を有する離型フィル
ムを準備する工程 （ｂ）シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの一方の面に、上記離型フィルムの熱硬化性
樹脂Ａの層側を重ね、前記プリプレグの他方の面には金
属箔を重ねて、加熱加圧成形により一体化して板状体と
する工程 （ｃ）離型フィルムを剥がして又は剥がさずに、上記板
状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の熱硬化性樹脂Ａの層側
に、金属箔を重ねて加熱加圧成形により一体化する工程 （ｅ）上記金属箔張り積層板の製造の工程の後に、貫通
穴を埋めて又は覆って金属箔をエッチングし所定の回路
に加工する工程 上記第９の製造法において、加熱硬化後においても再加
熱により金属箔との接着が可能である熱硬化性樹脂Ａの
層は、シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの片面に塗布乾燥して形成することもでき
る。この場合、前記プリプレグの熱硬化性樹脂Ａの層を
有しない側に金属箔を重ね、加熱加圧成形により一体化
して板状体を得る。そして、当該板状体の所定位置に貫
通穴をあける。そして、貫通穴をあけた板状体の熱硬化
性樹脂Ａの層側に金属箔を重ねて加熱加圧成形により一
体化し、金属箔張り積層板を製造する。以下は、第９の
製造法と同様である（第１０の製造法）。Furthermore, in order to solve the above-mentioned second problem, a ninth method for manufacturing a printed wiring board according to the present invention is a case of manufacturing a double-sided printed wiring board, and the following (a) to
The method is characterized in that after the method for producing a double-sided metal foil-clad laminate that undergoes the step (d), the step (e) is performed. (A) A release film having a layer of the thermosetting resin A on one side is dried by applying a thermosetting resin A to the release film, which can be adhered to a metal foil by reheating even after heat curing. Step of preparing (b) The thermosetting resin layer A of the release film is overlaid on one surface of the prepreg obtained by impregnating and drying the sheet-shaped base material with the thermosetting resin, and the other side of the prepreg is prepared. A step of stacking a metal foil on the surface and integrally forming it into a plate by heat and pressure molding. (C) A step of forming a through hole at a predetermined position of the plate without peeling or releasing the release film. (D) A step of superimposing a metal foil on the layer side of the thermosetting resin A of the plate-shaped body that has undergone the above steps and integrating them by heat and pressure molding (e) After the step of manufacturing the metal foil-clad laminate , Fill in or cover the through holes to etch the metal foil and process it into a predetermined circuit Step in the ninth production method described above, the layer of the thermosetting resin A which can be adhered to the metal foil by reheating even after heating and curing is formed by impregnating and drying the sheet-shaped base material with the thermosetting resin. It can also be formed by coating and drying on one surface of the obtained prepreg. In this case, a metal foil is placed on the side of the prepreg that does not have the thermosetting resin A layer and is integrated by heat and pressure molding to obtain a plate-shaped body. Then, a through hole is formed at a predetermined position of the plate-shaped body. Then, a metal foil is laminated on the layer side of the thermosetting resin A of the plate-shaped body having the through holes and integrated by heat and pressure molding to produce a metal foil-clad laminate. The following is the same as the ninth manufacturing method (tenth manufacturing method).
【００１４】熱硬化性樹脂Ａは、例えば、ゴム変性熱硬
化性樹脂組成物であり、具体的には、エポキシ樹脂、エ
ポキシ樹脂と反応性を有するゴム成分、硬化剤を必須成
分とするものを使用することができる。ゴム成分は、エ
ポキシ変性アクリルゴムが、加熱による変色防止の観点
から好ましい。本発明に係る製造法の実施において、板
状体や離型フィルムの穴あけ加工には、プリント配線板
の外形加工に用いるルーター加工機やＮＣパンチ加工機
を利用することができる。高価な専用の打抜き金型を準
備しなくても済むので、金型製作の日数を考慮しなくて
もよく、また、製造コスト面でも有利になる。プリプレ
グのためのシート状基材には、ガラス繊維やアラミド繊
維で構成した織布、不織布を使用することができる。こ
のシート状基材の厚さが板状体のＩＣ収容穴の深さに関
係してくる。シート状基材の厚さを適宜選択することに
より、ＩＣ収容穴の深さ設定を簡単に行なうことができ
る。プリント配線板の絶縁層を熱硬化性樹脂を含浸した
シート状基材で構成する第１及び第２の製造法では、ポ
リイミドフィルムを絶縁層とするプリント配線板では不
十分であった強度を確保することができる。シート状基
材に含浸する熱硬化性樹脂は、ポリイミド、フェノール
樹脂、シアネート樹脂、シアン酸エステル樹脂、エポキ
シ樹脂、不飽和ポリエステルなどを使用することができ
る。貫通穴をあけた板状体や離型フィルムの熱硬化性樹
脂Ａの層側に一体化する金属箔は、銅箔、アルミニウム
箔、ニッケル箔等、導電性の良好な金属箔を用いること
ができ、適宜の厚さを選択する。The thermosetting resin A is, for example, a rubber-modified thermosetting resin composition, and specifically, one having an epoxy resin, a rubber component reactive with the epoxy resin, and a curing agent as essential components. Can be used. The rubber component is preferably an epoxy-modified acrylic rubber from the viewpoint of preventing discoloration due to heating. In carrying out the manufacturing method according to the present invention, a router processing machine or an NC punching machine used for external processing of a printed wiring board can be used for drilling a plate-shaped body or a release film. Since it is not necessary to prepare an expensive dedicated punching die, it is not necessary to consider the number of days for manufacturing the die, which is advantageous in terms of manufacturing cost. As the sheet-like base material for the prepreg, a woven fabric or a non-woven fabric made of glass fiber or aramid fiber can be used. The thickness of the sheet-like substrate is related to the depth of the IC receiving hole of the plate-like body. By appropriately selecting the thickness of the sheet-shaped substrate, the depth of the IC accommodation hole can be easily set. In the first and second manufacturing methods, in which the insulating layer of the printed wiring board is made of a sheet-shaped base material impregnated with a thermosetting resin, the printed wiring board having a polyimide film as an insulating layer has sufficient strength. can do. The thermosetting resin with which the sheet-shaped base material is impregnated may be polyimide, phenol resin, cyanate resin, cyanate ester resin, epoxy resin, unsaturated polyester, or the like. A metal foil having good conductivity such as a copper foil, an aluminum foil, or a nickel foil may be used as the metal foil to be integrated on the layer side of the thermosetting resin A of the plate or the release film having the through holes. Yes, and select an appropriate thickness.
【００１５】プリント配線板に高い放熱性が要求される
場合には、プリプレグの替わりに絶縁処理をした金属板
を準備し、この片面に熱硬化性樹脂Ａの層を形成して用
いることができる。熱硬化性樹脂Ａの層を形成した金属
板に所定の穴あけ加工をして穴壁面の絶縁処理をしてか
ら、熱硬化性樹脂Ａの層に金属箔を加熱加圧成形により
一体化する。金属板は、銅、アルミニウム、鉄などから
なるものである。When high heat dissipation is required for the printed wiring board, a metal plate having an insulation treatment may be prepared in place of the prepreg, and a thermosetting resin A layer may be formed on one side of the metal plate for use. . The metal plate on which the layer of the thermosetting resin A is formed is subjected to a predetermined drilling process to insulate the wall surface of the hole, and then a metal foil is integrated with the layer of the thermosetting resin A by heat and pressure molding. The metal plate is made of copper, aluminum, iron or the like.
【００１６】[0016]
実施例１（第１の製造法） 熱硬化性樹脂Ａとして、エポキシ樹脂（ビスフェノール
Ａ型エポキシ樹脂）１０重量部、ゴム成分（エポキシ変
性アクリルゴム）８０重量部、硬化剤（ノボラック型フ
ェノール樹脂）１０重量部、硬化促進剤（イミダゾー
ル）１重量部を配合したワニスを調製した。このワニス
をポリプロピレンからなる離型フィルム１１に塗布し、
１００℃で２０分間乾燥して、片面に熱硬化性樹脂Ａの
層１２を有する離型フィルム１１を準備した。ガラス織
布にエポキシ樹脂を含浸乾燥したプリプレグ１３（１ｍ
×１ｍ，０．１mm厚）１枚に、前記離型フィルム１１を
熱硬化性樹脂Ａの層１２を内側にして重ね、圧力２０kg
f／cm2、最高温度１４０℃で１０分間加熱加圧成形し
た。この成形は、プリプレグ１３に離型フィルム１１の
熱硬化性樹脂Ａの層１２を内側にして重ねた積層構成物
のプリプレグ１３側にも別の離型フィルム２０を重ね
（図１（ａ））、これを鏡面板に挟んでプレス熱盤間に
投入して実施した。プレス熱盤１段の間には、前記鏡面
板で挟んだ構成物１０組を投入した。上記成形後、３４
０mm×５１０mmの寸法のワークサイズに裁断し、離型フ
ィルムを剥がして、片面に熱硬化性樹脂Ａの層１２を有
する板状体１４を得た（図１（ｂ））。熱硬化性樹脂Ａ
の層１２の厚さは３０μｍである。熱硬化性樹脂Ａの層
１２の表面は硬化しており粘着性はなかった。上記ワー
クサイズに裁断した板状体を１０枚重ね、ＮＣルーター
加工機で、ＩＣ収容穴３、接続穴４、スプロケット穴と
なる貫通穴をあけた。穴あけに際しては、上面と下面に
フェノール樹脂積層板からなる１．５mm厚の当て板２１
を当てた（図１（ｃ））。貫通穴をあけた板状体１４の
熱硬化性樹脂Ａの層１２側に金属箔１５（３５μｍ銅
箔）を重ね、これを鏡面板に挟んで圧力３０Kgf／cm2、
最高温度１５０℃で４０分間加熱加圧成形した（図１
（ｄ））。この成形は、プレス熱盤１段の間に２０枚の
材料を投入して減圧雰囲気中で実施した。以上が、金属
箔張り積層板の製造工程である。Example 1 (First Production Method) As thermosetting resin A, 10 parts by weight of epoxy resin (bisphenol A type epoxy resin), 80 parts by weight of rubber component (epoxy modified acrylic rubber), curing agent (novolak type phenol resin) A varnish containing 10 parts by weight and 1 part by weight of a curing accelerator (imidazole) was prepared. This varnish is applied to the release film 11 made of polypropylene,
After drying at 100 ° C. for 20 minutes, a release film 11 having a layer 12 of thermosetting resin A on one surface was prepared. Glass woven cloth impregnated with epoxy resin and dried prepreg 13 (1m
X 1 m, 0.1 mm thick), the release film 11 is overlaid with the layer 12 of the thermosetting resin A inside, and the pressure is 20 kg.
It was heated and pressed at f / cm 2 and a maximum temperature of 140 ° C. for 10 minutes. In this molding, another release film 20 is overlaid on the prepreg 13 side of the laminated structure in which the layer 12 of the thermosetting resin A of the release film 11 is overlaid on the prepreg 13 (FIG. 1 (a)). Then, this was sandwiched between mirror surface plates and put into a press hot platen for implementation. Ten sets of components sandwiched by the mirror surface plates were placed between the first stage of the press heating platen. 34 after molding
The work piece having a size of 0 mm × 510 mm was cut, and the release film was peeled off to obtain a plate-like body 14 having the layer 12 of the thermosetting resin A on one surface (FIG. 1 (b)). Thermosetting resin A
The layer 12 has a thickness of 30 μm. The surface of the layer 12 of the thermosetting resin A was cured and had no tackiness. Ten plate-like bodies cut into the above-mentioned work size were stacked, and an NC router processing machine was used to form IC accommodation holes 3, connection holes 4, and through holes to be sprocket holes. When drilling holes, a 1.5 mm thick pad 21 made of a phenolic resin laminated plate on the upper and lower surfaces.
Was applied (FIG. 1 (c)). A metal foil 15 (35 μm copper foil) is laid on the side of the thermosetting resin A layer 12 of the plate-shaped body 14 having a through hole, and the metal foil 15 (35 μm copper foil) is sandwiched between mirror-like plates and the pressure is 30 Kgf / cm 2 ,
Heat and pressure molding was performed at a maximum temperature of 150 ° C for 40 minutes (Fig. 1
(D)). This molding was carried out in a reduced pressure atmosphere by putting 20 sheets of material into one stage of the press heating platen. The above is the manufacturing process of the metal foil-clad laminate.
【００１７】上記金属箔張り積層板の両面に回路形成用
ドライフィルム２２をラミネートし（図１（ｅ））、金
属箔１５側は所定の回路形状に露光し、その反対側は全
面露光して、エッチングにより金属箔１５を回路２に加
工した（図１（f））。１枚のワーク上には縦２８列、
横１８列で、合計５０４個の回路が配列されている。回
路２の表面ならびにＩＣ収容穴３と接続穴４に露出して
いる回路２の裏面に、ニッケルメッキ、さらには金めっ
きを施し、個々のプリント配線板へ裁断により分割し
て、ＴＡＢテープで供給されるプリント配線板と同様の
プリント配線板を製造した。製造したプリント配線板の
特性を表１に示した。表１から明らかなように、板状体
の熱硬化性樹脂Ａの層側に銅箔を一体化した後に穴底面
への樹脂のしみ出しはほとんど発生せず、良好な結果が
得られた。半田耐熱性、銅箔ピール強度等もＪＩＳ規格
値以上である。A circuit forming dry film 22 is laminated on both sides of the metal foil-clad laminate (FIG. 1 (e)), and the metal foil 15 side is exposed to a predetermined circuit shape and the opposite side is entirely exposed. The metal foil 15 was processed into the circuit 2 by etching (FIG. 1 (f)). 28 columns on one work,
A total of 504 circuits are arranged in 18 rows. The front surface of the circuit 2 and the back surface of the circuit 2 exposed in the IC housing hole 3 and the connection hole 4 are nickel-plated and then gold-plated, cut into individual printed wiring boards, and supplied by TAB tape. A printed wiring board similar to the printed wiring board to be manufactured was manufactured. The characteristics of the manufactured printed wiring board are shown in Table 1. As is clear from Table 1, after the copper foil was integrated on the layer side of the thermosetting resin A of the plate-like body, the resin did not substantially exude to the bottom surface of the hole, and good results were obtained. Solder heat resistance and copper foil peel strength are also JIS standard values or higher.
【００１８】[0018]
【表１】 [Table 1]
【００１９】実施例２（第２の製造法） 実施例１で用いたプリプレグの片面に実施例１で用いた
熱硬化性樹脂Ａのワニスを塗布し乾燥した。このプリプ
レグを離型フィルムで覆い、鏡面板に挟んで実施例１と
同様に加熱加圧成形して、片面に熱硬化性樹脂Ａの層１
２を有する板状体１４を得た。以下実施例１と同様にし
て、プリント配線板を製造した。その特性は、表１に示
した実施例１の特性と同等であった。Example 2 (Second Production Method) The varnish of the thermosetting resin A used in Example 1 was applied to one surface of the prepreg used in Example 1 and dried. This prepreg was covered with a release film, sandwiched between mirror-finished plates, and heat-pressed in the same manner as in Example 1 to form a layer 1 of thermosetting resin A on one surface.
A plate-shaped body 14 having 2 was obtained. A printed wiring board was manufactured in the same manner as in Example 1 below. The characteristics were similar to those of Example 1 shown in Table 1.
【００２０】実施例３（第３の製造法） 片面に熱硬化性樹脂Ａの層を有する実施例１で用いた離
型フィルムの所定位置に穴あけをした後、その熱硬化性
樹脂Ａの層側に銅箔を重ね、銅箔を重ねない側は離型フ
ィルムで覆って、これを鏡面板に挟んで実施例１と同様
に加熱加圧成形し金属箔張り積層板を製造した。以下実
施例１と同様にして、プリント配線板を製造した。その
特性は、表１に示した実施例１の特性と同等であった。Example 3 (Third Production Method) The release film used in Example 1 having a layer of thermosetting resin A on one side was perforated at a predetermined position, and then the layer of thermosetting resin A was formed. A copper foil was overlaid on the side, the side not overlaid with the copper foil was covered with a release film, which was sandwiched between mirror surface plates and heat-pressed in the same manner as in Example 1 to produce a metal foil-clad laminate. A printed wiring board was manufactured in the same manner as in Example 1 below. The characteristics were similar to those of Example 1 shown in Table 1.
【００２１】実施例３（第４，第８の製造法） 熱硬化性樹脂Ａとして、エポキシ樹脂（ビスフェノール
Ａ型エポキシ樹脂）１０重量部、ゴム成分（エポキシ変
性アクリルゴム）８０重量部、硬化剤（ノボラック型フ
ェノール樹脂）１０重量部、硬化促進剤（イミダゾー
ル）１重量部を配合したワニスを調整した。このワニス
をポリプロピレンからなる離型フィルム１１に塗布し、
１５０℃で２分間乾燥して、片面に熱硬化性樹脂Ａの層
１２を有する離型フィルム１１を準備した。この際、乾
燥後の熱硬化性樹脂Ａの厚みが５０μｍとなるよう塗布
量を調整した。ガラス織布にエポキシ樹脂を含浸乾燥し
たＦＲ−４グレードのプリプレグ１３（１ｍ×１ｍ，
０．１mm厚）１枚の両面に前記離型フィルム１１の熱硬
化性樹脂Ａの層１２側を重ね（図３（ａ））、これをス
テンレス製の鏡面板に挟み、圧力２０kgf／cm2、熱盤最
高温度１４０℃で１０分間加熱加圧成形した。成形した
板状体１４は、両面に熱硬化性樹脂Ａの層１２を有して
おり、その表面は硬化しており粘着性はなかった（図３
（ｂ））。離型フィルム１１を剥がした板状体１４にル
ーター加工機でＩＣ収容穴３、部品実装穴５となる貫通
穴をあけた（図３（ｃ））後、その片面に厚い金属箔１
５（３５μｍ厚の電解銅箔）を、他面には薄い金属箔１
５’（１８μｍ厚の電解銅箔）を重ね、これをステンレ
ス製の鏡面板に挟んで圧力８０kg／cm2、熱盤最高温度
１８０℃で、材料温度１５０℃が３０分間継続するよう
加熱加圧成形した（図３（ｄ））。以上が、金属箔張り
積層板の製造工程である。上記金属箔１５，１５’の厚
みを変えることは、以下に説明するプリント配線板製造
において、回路加工時のエッチングを容易にする。Example 3 (4th and 8th manufacturing methods) As thermosetting resin A, 10 parts by weight of epoxy resin (bisphenol A type epoxy resin), 80 parts by weight of rubber component (epoxy modified acrylic rubber), curing agent A varnish containing 10 parts by weight of (novolac type phenol resin) and 1 part by weight of a curing accelerator (imidazole) was prepared. This varnish is applied to the release film 11 made of polypropylene,
After drying at 150 ° C. for 2 minutes, a release film 11 having a thermosetting resin A layer 12 on one surface was prepared. At this time, the coating amount was adjusted so that the thickness of the thermosetting resin A after drying was 50 μm. FR-4 grade prepreg 13 (1m x 1m, made by impregnating glass woven cloth with epoxy resin and drying,
(0.1 mm thick) The thermosetting resin A layer 12 side of the release film 11 is superposed on both sides of one sheet (FIG. 3 (a)), which is sandwiched between stainless mirror plates and pressure of 20 kgf / cm 2 Then, hot press molding was performed at a hot platen maximum temperature of 140 ° C for 10 minutes. The molded plate-shaped body 14 had a layer 12 of thermosetting resin A on both sides, and its surface was cured and was not tacky (FIG. 3).
(B)). After the through hole which becomes the IC accommodation hole 3 and the component mounting hole 5 is made in the plate-shaped body 14 from which the release film 11 has been peeled off by the router processing machine (FIG. 3C), the thick metal foil 1 is formed on one side thereof.
5 (35 μm thick electrolytic copper foil) and thin metal foil on the other side 1
5 '(18 μm thick electrolytic copper foil) is stacked, sandwiched between stainless steel mirror plates, pressure 80 kg / cm 2 , heating plate maximum temperature 180 ° C, heating and pressurizing so that material temperature 150 ° C continues for 30 minutes. It was molded (FIG. 3 (d)). The above is the manufacturing process of the metal foil-clad laminate. Changing the thickness of the metal foils 15 and 15 'facilitates etching during circuit processing in the production of a printed wiring board described below.
【００２２】上記金属箔張り積層板にスルーホール用穴
をあけた後、スルーホールメッキを行ないスルーホール
６を形成した（図３（ｅ））。そして、両面に回路形成
用ドライフィルム２２をラミネートし（図３（ｆ））、
所定の回路形状に露光、エッチングし、両面プリント配
線板を得た（図３（ｇ））。この際、ＩＣ収容穴３、部
品実装穴５の底面を構成する金属箔１５が著しくエッチ
ングされないよう、エッチング時間は必要最小限とす
る。また、エッチング液が、ＩＣ収容穴３、部品実装穴
５に溜まらないよう、金属箔１５’側を下面にする。金
属箔１５の厚さが金属箔１５’の厚さより厚ければ、金
属箔１５’の所定部分がエッチングされて、金属箔１５
がエッチング液にさらされ多少エッチングされても支障
がないので、エッチング工程の管理が容易になる。製造
したプリント配線板の特性を表２に示した。表２から明
らかなように、穴底面への樹脂のしみ出しはほとんど発
生せず、良好な結果が得られた。半田耐熱性、銅箔ピー
ル強度もＪＩＳ規格値以上である。After forming through-holes in the metal foil-clad laminate, through-hole plating was performed to form through-holes 6 (FIG. 3 (e)). Then, a dry film 22 for circuit formation is laminated on both sides (FIG. 3 (f)),
Exposure to a predetermined circuit shape and etching were performed to obtain a double-sided printed wiring board (Fig. 3 (g)). At this time, the etching time is set to a necessary minimum so that the metal foil 15 forming the bottoms of the IC housing hole 3 and the component mounting hole 5 is not significantly etched. Further, the metal foil 15 ′ side is the lower surface so that the etching liquid does not collect in the IC housing hole 3 and the component mounting hole 5. If the thickness of the metal foil 15 is thicker than the thickness of the metal foil 15 ', a predetermined portion of the metal foil 15' is etched and the metal foil 15 'is etched.
Can be exposed to an etching solution and be etched to some extent, so that the etching process can be easily controlled. The characteristics of the manufactured printed wiring board are shown in Table 2. As is clear from Table 2, the resin does not substantially exude to the bottom surface of the hole, and a good result was obtained. The solder heat resistance and the copper foil peel strength are also JIS standard values or higher.
【００２３】[0023]
【表２】 [Table 2]
【００２４】実施例４（第５，第８の製造法） 実施例３で使用したプリプレグ１３の両面に、実施例３
と同様の熱硬化性樹脂Ａのワニスを塗布し、１５０℃で
１分間乾燥して、両面に熱硬化性樹脂Ａの層を有するプ
リプレグを準備した。この際、乾燥後の熱硬化性樹脂Ａ
の厚みが５０μｍとなるよう塗布量を調整した。この１
枚のプリプレグの両面を離型フィルムで覆い、これをス
テンレス製の鏡面板に挟み、圧力２０kgf／cm2、熱盤最
高温度１４０℃で１０分間加熱加圧成形した。成形した
板状体は、両面に熱硬化性樹脂Ａの層を有しており（図
３（ｂ）と同様の構成）、その表面は硬化しており粘着
性はなかった。以下、実施例３と同様の方法で両面プリ
ント配線板を製造した。その特性は、表２に示した実施
例３の特性と同等であった。Example 4 (Fifth and Eighth Manufacturing Methods) Example 3 was formed on both surfaces of the prepreg 13 used in Example 3.
The same varnish of thermosetting resin A was applied and dried at 150 ° C. for 1 minute to prepare a prepreg having a layer of thermosetting resin A on both surfaces. At this time, the thermosetting resin A after drying
The coating amount was adjusted so that the thickness was 50 μm. This one
Both sides of each prepreg were covered with a release film, sandwiched between stainless mirror plates, and heated and pressed at a pressure of 20 kgf / cm 2 and a hot platen maximum temperature of 140 ° C. for 10 minutes. The molded plate-shaped body had a layer of thermosetting resin A on both sides (the same structure as in FIG. 3B), and the surface was cured and had no tackiness. Hereinafter, a double-sided printed wiring board was manufactured in the same manner as in Example 3. The characteristics were similar to those of Example 3 shown in Table 2.
【００２５】実施例５（第７の製造法） 実施例３で使用した片面に熱硬化性樹脂Ａの層１２を有
する離型フィルム１１の所定位置に貫通穴をあけた後、
熱硬化性樹脂Ａの層側に金属箔（１８μｍ厚の電解銅
箔）を重ね、離型フィルムを剥がしたもう一方の側に
も、金属箔（１８μｍ厚の電解銅箔）を重ね、これをス
テンレス製の鏡面板に挟み、圧力２０kgf／cm2、熱盤最
高温度１４０℃で１０分間加熱加圧成形し、金属箔張り
積層板を得た。以下実施例３と同様の方法で両面プリン
ト配線板を製造した。その特性は、表２に示した実施例
３の特性と同等であった。Example 5 (Seventh Production Method) After making a through hole at a predetermined position of the release film 11 having the layer 12 of the thermosetting resin A on one side used in Example 3,
A metal foil (18 μm thick electrolytic copper foil) is overlaid on the layer side of the thermosetting resin A, and a metal foil (18 μm thick electrolytic copper foil) is overlaid on the other side where the release film is peeled off. It was sandwiched between stainless mirror plates and heated and pressed at a pressure of 20 kgf / cm 2 and a hot platen maximum temperature of 140 ° C. for 10 minutes to obtain a metal foil-clad laminate. A double-sided printed wiring board was manufactured in the same manner as in Example 3 below. The characteristics were similar to those of Example 3 shown in Table 2.
【００２６】実施例６（第９の製造法） 実施例３で使用した１枚のプリプレグ１３の片面に、実
施例３で使用した熱硬化性樹脂Ａの層１２を有する離型
フィルム１１の熱硬化性樹脂Ａの層側を重ね、同プリプ
レグの他面には金属箔１５’（１８μｍ厚の電解銅箔）
を重ね（図４（ａ））、これをステンレス製の鏡面板に
挟んで圧力２０kg／cm2、熱盤最高温度１４０℃で１０
分間加熱加圧成形し、片面には金属箔１５’、他面に熱
硬化性樹脂Ａの層１２を有する板状体を得た（図４
（ｂ））。離型フィルム１１を剥がした板状体１４にル
ーター加工機でＩＣ収容穴３、部品実装穴５となる貫通
穴をあけた後（図４（ｃ））、熱硬化性樹脂Ａの層１２
側に金属箔１５（３５μｍ厚の電解銅箔）を重ね、これ
をステンレス製の鏡面板に挟んで圧力８０kg／cm2、熱
盤最高温度１８０℃で、材料温度１５０℃が３０分間継
続するよう加熱加圧成形した（図４（ｄ））。以上が、
両面金属箔張り積層板の製造工程である。本実施例では
金属箔１５，１５’の厚さを異なるのにしているが、必
ずしもその必要はない。上記金属箔張り積層板にスルー
ホール用穴をあけた後、ＩＣ収容穴及び部品実装穴を耐
酸性インク２３（ロジン変性フェノール樹脂系レジスト
インク）で埋め、スルーホールメッキを行ないスルーホ
ール６を形成した（図４（ｅ））。そして、両面に回路
形成用ドライフィルム２２をラミネートし（図４
（ｆ））、所定の回路形状に露光、エッチングし、両面
プリント配線板を得た（図４（ｇ））。その特性は、表
２に示した実施例３の特性と同等であった。尚、前記耐
酸性インクは、回路形成後溶剤で溶解除去した。Example 6 (Ninth Production Method) The heat of the release film 11 having the layer 12 of the thermosetting resin A used in Example 3 on one surface of one prepreg 13 used in Example 3 A layer of curable resin A is overlaid, and a metal foil 15 '(18 μm thick electrolytic copper foil) is provided on the other surface of the prepreg.
Lap (FIG. 4 (a)), a pressure 20 kg / cm 2 This composition was sandwiched between stainless mirror plates, 10 in the heat plate maximum temperature 140 ° C.
After heat and pressure molding for a minute, a plate-like body having a metal foil 15 ′ on one surface and a layer 12 of thermosetting resin A on the other surface was obtained (FIG. 4).
(B)). After the through holes which will become the IC housing holes 3 and the component mounting holes 5 are formed in the plate-shaped body 14 from which the release film 11 has been peeled off by the router processing machine (FIG. 4C), the layer 12 of the thermosetting resin A
A metal foil 15 (35 μm thick electrolytic copper foil) is stacked on the side, sandwiched between stainless steel mirror plates, pressure 80 kg / cm 2 , hot platen maximum temperature 180 ° C., material temperature 150 ° C. for 30 minutes. It was heat-press molded (FIG. 4 (d)). More than,
This is a manufacturing process of a double-sided metal foil-clad laminate. In this embodiment, the metal foils 15 and 15 'have different thicknesses, but this is not always necessary. After making holes for through holes in the metal foil-clad laminate, the IC housing holes and component mounting holes are filled with acid resistant ink 23 (rosin-modified phenolic resin-based resist ink), and through holes are plated to form through holes 6. (Fig. 4 (e)). Then, the dry film 22 for circuit formation is laminated on both sides (see FIG.
(F)) Exposure to a predetermined circuit shape and etching were performed to obtain a double-sided printed wiring board (Fig. 4 (g)). The characteristics were similar to those of Example 3 shown in Table 2. The acid-resistant ink was dissolved and removed with a solvent after forming the circuit.
【００２７】実施例７（第１０の製造法） 実施例３で使用したプリプレグ１３の片面に、実施例３
と同様の熱硬化性樹脂Ａのワニスを塗布し、１５０℃で
１分間乾燥して、片面に熱硬化性樹脂Ａの層を有するプ
リプレグを準備した。この際、乾燥後の熱硬化性樹脂Ａ
の厚みが５０μｍとなるよう塗布量を調整した。このプ
リプレグの熱硬化性樹脂Ａの層を有する側を離型フィル
ムで覆い、反対面には金属箔（１８μｍ厚の電解銅箔）
を重ね、これをステンレス製の鏡面板に挟んで圧力２０
kg／cm2、熱盤最高温度１４０℃で１０分間加熱加圧成
形し、片面には金属箔、他面に熱硬化性樹脂Ａの層を有
する板状体を得た（図４（ｂ）と同様の構成）。以下実
施例６と同様の方法で両面プリント配線板を製造した。
その特性は、表２に示した実施例３の特性と同等であっ
た。Example 7 (Tenth Manufacturing Method) Example 3 was formed on one surface of the prepreg 13 used in Example 3.
The same varnish of thermosetting resin A was applied and dried at 150 ° C. for 1 minute to prepare a prepreg having a layer of thermosetting resin A on one surface. At this time, the thermosetting resin A after drying
The coating amount was adjusted so that the thickness was 50 μm. The side having the layer of thermosetting resin A of this prepreg is covered with a release film, and the opposite surface is a metal foil (electrolytic copper foil with a thickness of 18 μm).
Layered on top of each other and sandwiched between them with a stainless steel mirror plate, and pressure 20
It was heat and pressure molded at a temperature of 140 kg / cm 2 and a maximum temperature of 140 ° C. for 10 minutes to obtain a plate-like body having a metal foil on one side and a layer of thermosetting resin A on the other side (FIG. 4 (b)). Similar configuration with). A double-sided printed wiring board was manufactured in the same manner as in Example 6 below.
The characteristics were similar to those of Example 3 shown in Table 2.
【００２８】実施例８（第９の製造法の変形） 実施例３で使用した片面に熱硬化性樹脂Ａの層１２を有
する離型フィルム１１の所定位置に穴あけをした後、熱
硬化性樹脂Ａの層側に金属箔（１８μｍ厚の電解銅箔）
を重ね、これをステンレス製の鏡面板に挟み、圧力２０
kgf／cm2、熱盤最高温度１４０℃で１０分間加熱加圧成
形し、片面には金属箔、他面に熱硬化性樹脂Ａの層を有
する板状体を得た。そして、熱硬化性樹脂Ａの層側に金
属箔（３５μｍ厚の電解銅箔）を重ね、実施例６と同様
に両面金属箔張り積層板を得た。以下、実施例６と同様
の方法で両面プリント配線板を製造した。その特性は、
表２に示した実施例３の特性と同等であった。Example 8 (Variation of Ninth Manufacturing Method) After releasing holes in predetermined positions of the release film 11 having the layer 12 of the thermosetting resin A on one side used in Example 3, the thermosetting resin is used. Metal foil (18 μm thick electrolytic copper foil) on layer A side
Are stacked and sandwiched between stainless steel mirror plates, pressure 20
It was heat-pressed at a hot platen temperature of 140 ° C. for 10 minutes under kgf / cm 2 to obtain a plate-shaped body having a metal foil on one side and a thermosetting resin A layer on the other side. Then, a metal foil (35 μm-thick electrolytic copper foil) was laminated on the layer side of the thermosetting resin A, and a double-sided metal foil-clad laminate was obtained in the same manner as in Example 6. Hereinafter, a double-sided printed wiring board was manufactured in the same manner as in Example 6. Its characteristics are
The characteristics were the same as those of Example 3 shown in Table 2.
【００２９】[0029]
【発明の効果】上述のように、本発明に係る方法によれ
ば、絶縁層の片面に回路を有し絶縁層に当該絶縁層だけ
を貫通する穴を設けたプリント配線板を製造しようとす
る場合に、汎用の積層板成形プレスとプリント配線板製
造設備を使用して、回路を１枚のワーク（絶縁層）上に
縦方向・横方向とも複数個配列して形成することができ
る。この方法は、回路を一列に配列してしか製造できな
いＴＡＢテープによる方法に比べて極めて効率的であ
る。また、穴底面への樹脂のしみ出しがない点でも優れ
ている。また、絶縁層だけを貫通する穴を設けた両面プ
リント配線板を製造しようとする場合にも、前記と同様
の効果が得られる。As described above, according to the method of the present invention, it is intended to manufacture a printed wiring board which has a circuit on one side of an insulating layer and which has a hole which penetrates only the insulating layer. In this case, a general-purpose laminated board molding press and a printed wiring board manufacturing facility can be used to form a plurality of circuits on one work (insulating layer) by arranging a plurality of circuits in both the vertical and horizontal directions. This method is much more efficient than a method using a TAB tape which can be manufactured only by arranging circuits in a line. It is also excellent in that the resin does not exude to the bottom of the hole. Further, also in the case of manufacturing a double-sided printed wiring board having a hole penetrating only the insulating layer, the same effect as described above can be obtained.
【図１】本発明に係る実施例の製造工程を示す断面図で
ある。FIG. 1 is a cross-sectional view showing a manufacturing process of an example according to the present invention.
【図２】本発明が製造の対象としているプリント配線板
の断面図である。FIG. 2 is a cross-sectional view of a printed wiring board that is the object of manufacture of the present invention.
【図３】本発明に係る他の実施例の製造工程を示す断面
図である。FIG. 3 is a cross-sectional view showing a manufacturing process of another embodiment according to the present invention.
【図４】本発明に係るさらに他の実施例の製造工程を示
す断面図である。FIG. 4 is a cross-sectional view showing the manufacturing process of still another embodiment of the present invention.
２は回路 ３はＩＣ収容穴 ４は接続穴 ５は部品実装穴 ６はスルーホール １１は離型フィルム １２は熱硬化性樹脂の層 １３はプリプレグ １４は板状体 １５，１５’は金属箔 ２２はドライフィルム ２３は耐熱性インク 2 is a circuit 3 is an IC accommodation hole 4 is a connection hole 5 is a component mounting hole 6 is a through hole 11 is a release film 12 is a thermosetting resin layer 13 is a prepreg 14 is a plate-like body 15 and 15 'is a metal foil 22 Is a dry film 23 is a heat-resistant ink
───────────────────────────────────────────────────── フロントページの続き (72)発明者 谷口 恵弘 東京都中央区日本橋本町２丁目８番７号 新神戸電機株式会社内 (72)発明者 金井 淳 東京都中央区日本橋本町２丁目８番７号 新神戸電機株式会社内 (72)発明者 大塚 稔 東京都中央区日本橋本町２丁目８番７号 新神戸電機株式会社内 (72)発明者 平岡 宏一 東京都中央区日本橋本町２丁目８番７号 新神戸電機株式会社内 (72)発明者 小川 広義 愛知県豊橋市下地町字瀬上26番地の２ 株 式会社ジーエフ内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshihiro Taniguchi 2-8-7 Nihonbashihonmachi, Chuo-ku, Tokyo Inside Shin-Kobe Electric Machinery Co., Ltd. (72) Inventor Jun Kanai 2-8-7 Nihonbashihoncho, Chuo-ku, Tokyo Inside Shin-Kobe Electric Machinery Co., Ltd. (72) Minor Otsuka 2-8-7 Nihonbashi-honcho, Chuo-ku, Tokyo Inside Shin-Kobe Electric Machinery Co., Ltd. (72) Koichi Hiraoka 2-8-7 Nihonbashi-honmachi, Chuo-ku, Tokyo Shin-Kobe Electric Machinery Co., Ltd. (72) Inventor Hiroyoshi Ogawa 2 GE Company, Ltd., a stock company at 26 Segami, Shimoji-cho, Toyohashi City, Aichi Prefecture
Claims (15)
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して、片面に熱硬化性樹脂Ａの層を有する離型フィル
ムを準備する工程 （ｂ）上記離型フィルムの熱硬化性樹脂Ａの層側に、シ
ート状基材に熱硬化性樹脂を含浸乾燥して得たプリプレ
グを重ね、加熱加圧成形により一体化して板状体とする
工程 （ｃ）離型フィルムを剥がして又は剥がさずに、上記板
状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の熱硬化性樹脂Ａの層側
に、金属箔を重ねて加熱加圧成形により一体化する工程1. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (d): (A) A release film having a layer of the thermosetting resin A on one side is dried by applying a thermosetting resin A to the release film, which can be adhered to a metal foil by reheating even after heat curing. Preparing step (b) A prepreg obtained by impregnating and drying a thermosetting resin on a sheet-shaped substrate is placed on the layer side of the thermosetting resin A of the release film, and integrated by heat and pressure molding to obtain a plate. Step (c) of forming a through hole at a predetermined position of the plate-like body with or without peeling the release film (d) Layer of thermosetting resin A of the plate-like body that has undergone the above-mentioned steps Step of stacking metal foil on the side and integrating by heat and pressure molding
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを、シート状基材に熱硬
化性樹脂を含浸乾燥して得たプリプレグに塗布乾燥し
て、片面に熱硬化性樹脂Ａの層を有するプリプレグを準
備する工程 （ｂ）上記プリプレグを加熱加圧成形して、片面に熱硬
化性樹脂Ａの層を有するする板状体を得る工程 （ｃ）上記板状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の熱硬化性樹脂Ａの層側
に、金属箔を重ねて加熱加圧成形により一体化する工程2. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (d): (A) A thermosetting resin A, which can be adhered to a metal foil by reheating even after heat curing, is applied to a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-shaped base material, followed by drying. Step (b) of preparing a prepreg having a layer of thermosetting resin A on one side (b) Step of heat-press molding the above prepreg to obtain a plate-shaped body having a layer of thermosetting resin A on one side (c) A step of forming a through hole at a predetermined position of the plate-like body (d) A step of laminating a metal foil on the layer side of the thermosetting resin A of the plate-like body that has undergone the above-mentioned steps and integrating them by heat and pressure molding
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して粘着性がなくなる程度まで加熱硬化させ、片面に
熱硬化性樹脂Ａの層を有する離型フィルムを準備する工
程 （ｂ）上記離型フィルムの所定位置に貫通穴をあける工
程 （ｃ）上記工程を経た離型フィルムの熱硬化性樹脂Ａの
層側に、金属箔を重ねて加熱加圧成形により一体化する
工程3. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (c). (A) A thermosetting resin A, which can be adhered to a metal foil by reheating even after being heat-cured, is applied to a release film and dried to heat-cure to such an extent that the tackiness disappears. A step of preparing a release film having a layer of A. (b) A step of forming a through hole at a predetermined position of the release film. (C) A metal on the layer side of the thermosetting resin A of the release film having undergone the above steps. Process of integrating foils by heat and pressure molding
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して、片面に熱硬化性樹脂Ａの層を有する離型フィル
ムを準備する工程 （ｂ）シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの両面に、上記離型フィルムの熱硬化性樹脂
Ａの層側をそれぞれ重ねて、加熱加圧成形により一体化
して板状体とする工程 （ｃ）離型フィルムを剥がして又は剥がさずに、上記板
状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の両面に、金属箔を重ねて
加熱加圧成形により一体化する工程4. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (d): (A) A release film having a layer of the thermosetting resin A on one side is dried by applying a thermosetting resin A to the release film, which can be adhered to a metal foil by reheating even after heat curing. Step (b) of preparing: A thermosetting resin is impregnated and dried in a sheet-shaped substrate, and the thermosetting resin A layer side of the release film is overlaid on both sides of the prepreg, and heat-pressing is performed. Step of integrally forming a plate-like body (c) Step of forming a through hole at a predetermined position of the plate-like body with or without peeling the release film (d) On both sides of the plate-like body that has undergone the above-mentioned steps, A process in which metal foils are stacked and integrated by heat and pressure molding
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを、シート状基材に熱硬
化性樹脂を含浸乾燥して得たプリプレグの両面に塗布乾
燥して、両面に熱硬化性樹脂Ａの層を有するプリプレグ
を準備する工程 （ｂ）上記プリプレグを加熱加圧成形して両面に熱硬化
性樹脂Ａの層を有する板状体とする工程 （ｃ）上記板状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の両面に、金属箔を重ねて
加熱加圧成形により一体化する工程5. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (d): (A) A thermosetting resin A, which can be adhered to a metal foil by reheating even after heat curing, is applied to both surfaces of a prepreg obtained by impregnating and drying a thermosetting resin in a sheet-shaped base material, followed by drying. And (b) a step of preparing a prepreg having a layer of thermosetting resin A on both surfaces thereof (b) a step of forming the prepreg into a plate having a layer of thermosetting resin A on both surfaces by heat-press molding (c) A step of forming a through hole at a predetermined position of the plate-like body (d) A step of laminating metal foils on both surfaces of the plate-like body which has undergone the above-mentioned steps and integrating them by heat and pressure molding
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを、シート状基材に熱硬
化性樹脂を含浸乾燥し加熱加圧して得た板状体に塗布乾
燥して、両面に熱硬化性樹脂Ａの層を有する板状体を準
備する工程 （ｂ）上記板状体の所定位置に貫通穴をあける工程 （ｃ）上記工程を経た板状体の両面に、金属箔を重ねて
加熱加圧成形により一体化する工程6. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (c). (A) A thermosetting resin A capable of adhering to a metal foil by reheating even after heat curing is impregnated with a thermosetting resin in a sheet-like base material, dried, and heated to obtain a plate-like body. A step of coating and drying to prepare a plate-like body having a layer of thermosetting resin A on both sides (b) a step of forming a through hole at a predetermined position of the plate-like body (c) a plate-like body having undergone the above-mentioned steps A process in which metal foils are stacked on both sides and integrated by heat and pressure molding
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して粘着性がなくなる程度まで加熱硬化させ、片面に
熱硬化性樹脂Ａの層を有する離型フィルムを準備する工
程 （ｂ）上記離型フィルムを剥がして又は剥がさずに、熱
硬化性樹脂Ａの層の所定位置に貫通穴をあける工程 （ｃ）上記工程を経た熱硬化性樹脂Ａの層の両面に、金
属箔を重ねて加熱加圧成形により一体化する工程7. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (c). (A) A thermosetting resin A, which can be adhered to a metal foil by reheating even after being heat-cured, is applied to a release film and dried to heat-cure to such an extent that the tackiness disappears. A step of preparing a release film having a layer of A (b) a step of forming a through hole at a predetermined position of the layer of the thermosetting resin A with or without peeling the release film (c) the above steps A process in which metal foils are laminated on both sides of the layer of thermosetting resin A and integrated by heat and pressure molding.
方より厚いことを特徴とする請求項４〜７のいずれかに
記載の金属箔張り積層板の製造法。8. The method for producing a metal foil-clad laminate according to claim 4, wherein one of the metal foils located on both sides is thicker than the other.
徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを離型フィルムに塗布乾
燥して、片面に熱硬化性樹脂Ａの層を有する離型フィル
ムを準備する工程 （ｂ）シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの一方の面に、上記離型フィルムの熱硬化性
樹脂Ａの層側を重ね、前記プリプレグの他方の面には金
属箔を重ねて、加熱加圧成形により一体化して板状体と
する工程 （ｃ）離型フィルムを剥がして又は剥がさずに、上記板
状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の熱硬化性樹脂Ａの層側
に、金属箔を重ねて加熱加圧成形により一体化する工程9. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (d): (A) A release film having a layer of the thermosetting resin A on one side is dried by applying a thermosetting resin A to the release film, which can be adhered to a metal foil by reheating even after heat curing. Step of preparing (b) The thermosetting resin layer A of the release film is overlaid on one surface of the prepreg obtained by impregnating and drying the sheet-shaped base material with the thermosetting resin, and the other side of the prepreg is prepared. A step of stacking a metal foil on the surface and integrally forming it into a plate by heat and pressure molding. (C) A step of forming a through hole at a predetermined position of the plate without peeling or releasing the release film. (D) A step of superimposing a metal foil on the layer side of the thermosetting resin A of the plate-shaped body that has undergone the above-mentioned steps and integrating them by heat and pressure molding
特徴とする金属箔張り積層板の製造法。 （ａ）加熱硬化後においても再加熱により金属箔との接
着が可能である熱硬化性樹脂Ａを、シート状基材に熱硬
化性樹脂を含浸乾燥して得たプリプレグに塗布乾燥し
て、片面に熱硬化性樹脂Ａの層を有するプリプレグを準
備する工程 （ｂ）上記プリプレグの熱硬化性樹脂Ａの層を有しない
側に金属箔を重ね、加熱加圧成形により一体化して板状
体とする工程 （ｃ）上記板状体の所定位置に貫通穴をあける工程 （ｄ）上記工程を経た板状体の熱硬化性樹脂Ａの層側
に、金属箔を重ねて加熱加圧成形により一体化する工程10. A method for producing a metal foil-clad laminate, which comprises the following steps (a) to (d): (A) A thermosetting resin A, which can be adhered to a metal foil by reheating even after heat curing, is applied to a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-shaped base material, followed by drying. Step (b) of preparing a prepreg having a layer of thermosetting resin A on one surface (b) A metal foil is laminated on the side of the prepreg not having the layer of thermosetting resin A, and integrated by heat and pressure molding to form a plate-like body. And (c) a step of forming a through hole at a predetermined position of the plate-like body (d) a metal foil is overlaid on the layer side of the thermosetting resin A of the plate-like body that has undergone the above-mentioned steps Process to integrate
脂組成物である請求項１〜１０のいずれかに記載の金属
箔張り積層板の製造法。11. The method for producing a metal foil-clad laminate according to claim 1, wherein the thermosetting resin A is a rubber-modified thermosetting resin composition.
シ樹脂、エポキシ樹脂と反応性を有するゴム成分、硬化
剤を必須成分とすることを特徴とする請求項１１記載の
金属箔張り積層板の製造法。12. The metal foil-clad laminate according to claim 11, wherein the rubber-modified thermosetting resin composition contains an epoxy resin, a rubber component reactive with the epoxy resin, and a curing agent as essential components. Manufacturing method.
ある請求項１２記載の金属箔張り積層板の製造法。13. The method for producing a metal foil-clad laminate according to claim 12, wherein the rubber component is an epoxy-modified acrylic rubber.
載の金属箔張り積層板の製造の工程の後に、貫通穴を埋
めて又は覆って金属箔をエッチングし所定の回路に加工
することを特徴とするプリント配線板の製造法。14. After the step of manufacturing the metal foil-clad laminate according to claim 1, the metal foil is etched by filling or covering the through holes to form a predetermined circuit. A method for manufacturing a printed wiring board, comprising:
張り積層板の製造の工程の後に、金属箔をエッチングし
て所定の回路に加工することを特徴とするプリント配線
板の製造法。15. A process for producing a metal foil-clad laminate according to claim 4, wherein the metal foil is etched to form a predetermined circuit. Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27789396A JP3583241B2 (en) | 1995-10-25 | 1996-10-21 | Manufacturing method of metal foil clad laminate and manufacturing method of printed wiring board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-276061 | 1995-10-25 | ||
| JP27606195 | 1995-10-25 | ||
| JP27789396A JP3583241B2 (en) | 1995-10-25 | 1996-10-21 | Manufacturing method of metal foil clad laminate and manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09181421A true JPH09181421A (en) | 1997-07-11 |
| JP3583241B2 JP3583241B2 (en) | 2004-11-04 |
Family
ID=26551724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27789396A Expired - Fee Related JP3583241B2 (en) | 1995-10-25 | 1996-10-21 | Manufacturing method of metal foil clad laminate and manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3583241B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
| JP2003069218A (en) * | 2001-08-23 | 2003-03-07 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed wiring board having extra-fine pattern |
| JP2003094571A (en) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | Material for producing printed wiring board and its production method |
| KR20120101041A (en) | 2010-01-08 | 2012-09-12 | 다이니폰 인사츠 가부시키가이샤 | Adhesive sheet and bonding method using same |
-
1996
- 1996-10-21 JP JP27789396A patent/JP3583241B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
| JP2003069218A (en) * | 2001-08-23 | 2003-03-07 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed wiring board having extra-fine pattern |
| JP2003094571A (en) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | Material for producing printed wiring board and its production method |
| KR20120101041A (en) | 2010-01-08 | 2012-09-12 | 다이니폰 인사츠 가부시키가이샤 | Adhesive sheet and bonding method using same |
| US9512335B2 (en) | 2010-01-08 | 2016-12-06 | Dai Nippon Printing Co., Ltd. | Adhesive sheet and bonding method using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3583241B2 (en) | 2004-11-04 |
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