JPS63318196A - Glass fiber fabric reinforced printed wiring board - Google Patents
Glass fiber fabric reinforced printed wiring boardInfo
- Publication number
- JPS63318196A JPS63318196A JP62153393A JP15339387A JPS63318196A JP S63318196 A JPS63318196 A JP S63318196A JP 62153393 A JP62153393 A JP 62153393A JP 15339387 A JP15339387 A JP 15339387A JP S63318196 A JPS63318196 A JP S63318196A
- Authority
- JP
- Japan
- Prior art keywords
- glass fiber
- printed wiring
- fiber fabric
- wiring board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003365 glass fiber Substances 0.000 title claims abstract description 40
- 239000004744 fabric Substances 0.000 title claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 16
- 239000000835 fiber Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009990 desizing Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- RVIXKDRPFPUUOO-UHFFFAOYSA-N dimethylselenide Chemical compound C[Se]C RVIXKDRPFPUUOO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
Landscapes
- Woven Fabrics (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は産業機器、を子機器、電気通信機器等に利用さ
れる電気絶縁板または印刷配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical insulating board or printed wiring board used in industrial equipment, child equipment, telecommunication equipment, etc.
前記分野の印刷配線板において最も要求される特性とし
て１寸法安定性９機械的強度、電気特性。The most required properties for printed wiring boards in the above field are 1-dimensional stability, 9 mechanical strength, and electrical properties.
耐熱性、耐薬品性等があるが、それらの特性を兼ねそな
えた印刷配線板用の基材として、従来、ガラス繊維織物
が一般的に用いられている。BACKGROUND OF THE INVENTION Conventionally, glass fiber fabrics have been commonly used as base materials for printed wiring boards that have heat resistance, chemical resistance, etc.
前記印刷配線板用の素材は熱硬化性樹脂を結合剤として
複数の織物ｔ−積層成形して得られるが、印刷配線板用
素材はその積層成形工程での熱と圧力により、ま７’Ｃ
樹脂の硬化収縮による応力により寸法変化を生じ、積層
板のそりねじれ、スルホールメッキの切断等の致命的な
欠陥が発生する。従来は、印刷配線板用の基材として、
ガラス繊維織物を用い、そのたて糸及びよこ糸を効果的
に変更し、寸法安定性を改良する試みが行われていた。The printed wiring board material is obtained by laminating a plurality of woven fabrics using a thermosetting resin as a binder.
Stress caused by curing and shrinkage of the resin causes dimensional changes, resulting in fatal defects such as warping of the laminate and cutting of through-hole plating. Conventionally, it was used as a base material for printed wiring boards.
Attempts have been made to effectively modify the warp and weft of glass fiber fabrics to improve their dimensional stability.
すなわち前記基材として用いられるガラス繊維織物と印
刷配線板の寸法安定性との関係は、たて糸の打ち込み本
数とよこ糸の打ち込み本数をなるべく等しくすることに
よって改善できるという考方と、これに対して特開昭５
４−１０８２７０号公報に開示されているように、たて
糸の打ち込み本数とよと糸の打ち込み本数を変化させた
り、糸に単糸を用いることによって改善される等の考方
がある。In other words, the relationship between the glass fiber fabric used as the base material and the dimensional stability of the printed wiring board can be improved by making the number of warp yarns and the number of weft yarns as equal as possible, and a special Kaisho 5
As disclosed in Japanese Patent Application No. 4-108270, there are ideas that improvements can be made by changing the number of warp yarns and the number of weft yarns, or by using single yarns.
しかしながら、近年、印刷配線板、特に、多層印刷配線
板の高密度化の要請が強く、従って印刷配線板用素材の
寸法安定性が現在のレベルでは不満足となり、よシ高度
に寸法安定性のある印刷配線板用素材が必要となってき
ｆｃっ
本発明は、この分野における印刷配線板において要求さ
れる特性のうち、特に寸法安定性に優れた印刷配線板全
提供することを目的とする。However, in recent years, there has been a strong demand for higher density printed wiring boards, especially multilayer printed wiring boards, and the dimensional stability of materials for printed wiring boards is therefore unsatisfactory at the current level. There has been a need for materials for printed wiring boards, and an object of the present invention is to provide a printed wiring board that is particularly excellent in dimensional stability among the characteristics required for printed wiring boards in this field.
本発明者らは、従来のガラス繊維織物のみを基材として
用いた積層板と比較して殆んど遜色のない機械的強度、
電気特性、耐熱性、耐梨品性などの特性を保有し、且つ
非常に優れた寸法安定性を有するガラス繊維織物補強積
層板を開発すべく鋭意研究した結果、基材のガラス繊維
織物の織構造を改良することにより、上記の目的が達せ
られること全見出し、本発明全完成するに至った。すな
わち、本発明に係るガラス繊維織物補強印刷配線板は、
熱硬化性樹脂を結合剤として複数のガラス繊維織物を積
層成形してなる積層板において、ガラス繊維紛物が通常
ななこ織であることを特徴とするＯ
以下本発明によるガラス繊維織物補強印刷配線板の基材
として用いられるガラス繊維織物の一例金示す添付図面
を参照して本発明を詳述する。The present inventors have discovered that the mechanical strength is almost comparable to that of conventional laminates using only glass fiber fabric as a base material.
As a result of intensive research to develop a glass fiber fabric reinforced laminate that possesses properties such as electrical properties, heat resistance, and pear resistance, as well as excellent dimensional stability, we found that The present invention has been completed based on the discovery that the above objects can be achieved by improving the structure. That is, the glass fiber fabric reinforced printed wiring board according to the present invention is
A laminate formed by laminating and molding a plurality of glass fiber fabrics using a thermosetting resin as a binder, characterized in that the glass fiber powder is usually a Nanako weave O Hereinafter, a glass fiber fabric reinforced printed wiring board according to the present invention The present invention will now be described in detail with reference to the accompanying drawings, which show an example of a glass fiber fabric used as a base material.
第１図に前記ガラス繊維織物の組織図を示し、第１図Ａ
は２／２ななこ織であシ、第１図Ｂは３／３ななこ賊で
ある。FIG. 1 shows the organization chart of the glass fiber fabric, and FIG.
is 2/2 Nanako weave, and Figure 1 B is 3/3 Nanako yoshi.
本発明で用いるガラス繊維織物はこれまで印刷配線板用
のガラス織物として使用されたことはないタイプのもの
であシ、その特徴は第１図に示すように、■経糸、緯糸
とも２本以上全同時に浮沈させること、■平織を拡大さ
せたように組織さｉること である。好ましくは、経糸
、緯糸とも２本以上、５本以下同時に浮沈させることが
望ましい。６本以上の場合には、繊維織を維持すること
が極めて困難となる。The glass fiber fabric used in the present invention is of a type that has never been used as a glass fabric for printed wiring boards, and its characteristics are as shown in Figure 1. It is to float and sink all at the same time, and to be organized like an enlarged plain weave. Preferably, two or more warps and wefts, and five or less, are floated and sunk at the same time. If there are six or more fibers, it becomes extremely difficult to maintain the fiber weave.
経糸、緯糸が同数でかつ、複数本を同時に浮沈させる組
織をもったガラス繊維織物を用いることによって、印刷
配線板の寸法安定性が著しく向上したのは、驚くべきこ
とである。It is surprising that the dimensional stability of the printed wiring board was significantly improved by using a glass fiber fabric with the same number of warp and weft yarns and a structure in which a plurality of yarns float and sink at the same time.
本発明に用いられるガラス繊維織物は、極めて高度な寸
法安定性が要求される多層印刷配線板に対して、その性
能が特に効果的に機能する。多１８印刷配線板のうち、
内層である銅張積層板とグリプレグの両方に使用しても
、いずれか一方に使用しても、効果が現れることは勿論
であり、なかんづくプリプレグに用いるのが好適である
。The glass fiber fabric used in the present invention functions particularly effectively in multilayer printed wiring boards that require extremely high dimensional stability. Of the 18 printed wiring boards,
Of course, it is effective whether it is used for both the copper-clad laminate (which is the inner layer) and Gripreg, or for either one, and it is especially suitable for use in prepreg.
本発明に用いられるガラス繊維織物に使用される糸は、
ガラス長繊維であれば単糸径、収束本数等に制限はない
っまたガラスの組成も格別の制限はない。The yarn used in the glass fiber fabric used in the present invention is
As long as it is a long glass fiber, there are no restrictions on the diameter of the single fibers, the number of converged fibers, etc., and there are no particular restrictions on the composition of the glass.
本発明で結合剤として用いる熱硬化性樹脂とは、熱で硬
化しうる樹脂をいい、たとえば従来ガラス繊維織物を基
材とする積層板の製造に常用されるエバ？キシ痛脂、ｙ
Ｊ４リイミド樹脂、フェノール樹脂。The thermosetting resin used as a binder in the present invention refers to a resin that can be cured by heat. Kishi pain fat, y
J4 limide resin, phenolic resin.
ポリエステル樹脂、シリコーン哨脂、ポリワレタン樹脂
、ポリビニルブチラール樹脂及びその混合物等が使用で
きるが、もとよりこれらのもののみに限定されるもので
はない。Polyester resins, silicone resins, polyurethane resins, polyvinyl butyral resins, mixtures thereof, and the like can be used, but are not limited to these.
本発明の印刷回路板用素材の寸法安定性の絶対値は勿論
使用する熱硬化性樹脂の種類によシ異るが、その偏差の
程度は従来のガラス繊維織物を用いた場合と相対的に同
じ傾向を示すのであって、使用する樹脂の種類によって
本発明により達成された特徴が損なわれることはない。The absolute value of the dimensional stability of the printed circuit board material of the present invention naturally varies depending on the type of thermosetting resin used, but the degree of deviation is relative to that when conventional glass fiber fabric is used. They show the same tendency, and the characteristics achieved by the present invention are not impaired by the type of resin used.
本発明に用いられるガラス繊維織物は高温脱糊処理を施
した後に、前記樹脂を含浸させりにあたって、表面処理
剤、たとえば、シランカップリング剤で処理することは
、通常行われる通りであり、これに限定されるものでは
ない。After the glass fiber fabric used in the present invention has been subjected to high-temperature desizing treatment, it is usually treated with a surface treatment agent, such as a silane coupling agent, in order to impregnate it with the resin. It is not limited to.
印刷回路板用素材の製造は常法に従って行うことができ
る。即ち、一般的にはガラス繊維織物に樹脂を含浸させ
て半硬化したプリプレグを重ね合わせ、圧縮加熱成形を
行う。その際、プリプレグは十分含浸して気泡を含まな
いのが好ましく、さらに基材であるガラス横１維織物が
全部潰われているのが好ましい。″また注型による方法
や低圧加熱の方法も可能である。また通常、銅箔等の金
属膜と積層板の一面ま友は両面に貼着形成するが、アデ
ィティブ法のごとく、回路形成材を成形後に付着する方
法も可能でちる。The material for printed circuit boards can be manufactured according to conventional methods. That is, generally, semi-cured prepregs made by impregnating glass fiber fabric with a resin are stacked on top of each other, and compression and heat molding is performed. In this case, it is preferable that the prepreg is sufficiently impregnated and does not contain air bubbles, and furthermore, it is preferable that the glass weft monofilament fabric that is the base material is completely crushed. ``Also, casting methods and low-pressure heating methods are also possible.Also, normally, a metal film such as copper foil and one side of a laminate are bonded to both sides, but as in the additive method, it is possible to form a circuit forming material on both sides. It is also possible to attach it after molding.
以下本発明によるガラス繊維織物補強印刷配線板および
その基材として用いられるガラス繊維織物についての実
施例を示し、併せて比較例との性能比較を示す。Examples of the glass fiber fabric-reinforced printed wiring board according to the present invention and the glass fiber fabric used as its base material will be shown below, and a performance comparison with comparative examples will also be shown.
性能比較として用いられる印刷回路板の寸法安定性の測
定は下記方法で行った。The dimensional stability of printed circuit boards used for performance comparison was measured by the following method.
寸法安定性を測定するために、所定のガラス繊維織物に
樹脂を含浸させて半硬化したプリプレグ８枚を重ね合わ
せ、その両面に厚さ３５μの銅箔を貼着、圧縮加熱成形
全行い、第２図に示すような寸法を有する印刷回路板を
作成した。本測定法においては回路形成にかえで銅張積
層板の表面の銅箔上９箇所に部分的に標点２をつけ、そ
の標点２間距離を経方向、緯方向それぞれ６点測定（測
定値＆）シた後、標点部分を除いて銅箔をエツチング除
去した。その後、１７０°Ｃ，３０分間の加熱処理を施
した後、再度、標点間距離を測定（測定値ｂ）し、測定
値ａと測定値すの差の測定値ａに対する割合を寸法変化
量として寸法安定性を評価した。In order to measure dimensional stability, eight semi-cured prepregs made by impregnating a predetermined glass fiber fabric with resin were stacked together, copper foil with a thickness of 35μ was pasted on both sides, and the entire prepreg was compressed and heated. A printed circuit board having dimensions as shown in Figure 2 was prepared. In this measurement method, instead of forming a circuit, gauge points 2 are partially placed at 9 locations on the copper foil on the surface of the copper-clad laminate, and the distance between the gauge points 2 is measured at 6 points each in the longitudinal and latitudinal directions (measured values &) After removing the copper foil, the copper foil was removed by etching except for the gauge portions. After that, after heat treatment at 170°C for 30 minutes, measure the distance between gauges again (measured value b), and calculate the ratio of the difference between measured value a and measured value to measured value a as the amount of dimensional change. The dimensional stability was evaluated as follows.
実施例１
経糸および緯糸が、ＥＣＧ ７５１１０ で構成され
、密度が経４４本／ ２５ ｙｎｘ ＋緯３２本／２５
朋からなシ、織組織が、経、緯とも２本づつが同時に浮
沈する通常ななこ＆（第１図△参照）からなるガラス繊
維織物を製織した。Example 1 The warp and weft are composed of ECG 75110, and the density is 44 warp/25 ynx + weft 32/25
A glass fiber fabric was woven with a normal woven structure in which two fibers rise and fall at the same time in both warp and weft (see Fig. 1, △).
実施例２
経糸および緯糸が、ＥＣＧ ７５１１０ で構成され
、密度が経４４本／２５冨ｎ、緯３２本７２５朋からな
シ、織組織が、経、緯とも３本づつが同時に浮沈する通
常ななこ織（第１図Ｂ参照）からなるガラス繊維織換金
製織した。Example 2 The warp and weft are made of ECG 75110, and the density is 44 warp/25 m, and the weft is 32 725. A glass fiber woven fabric (see FIG. 1B) was woven.
比較例１
経糸および緯糸がＥＣＧ ７５１１０ で構成され、
密度が経４４本／２５龍、緯３２本７２５龍からな如織
組織が平織からなるガラス繊維織換金製織した。Comparative Example 1 The warp and weft are made of ECG 75110,
Glass fibers were woven using plain weave with a density of 44 warps/25 threads and 32 wefts of 725 threads.
実施例３
実施例１で製織したガラス繊維織物に下記配合例のエポ
キシ樹脂フェスを含浸させ、１２５℃にて加熱乾燥させ
てプリプレグを作成した。このプリプレグ８枚と表面に
３５μの銅箔を重ねて、１７５℃、３０ｋｇ／α２で圧
縮成形して、１．６順厚の銅張積層板を得た。Example 3 The glass fiber fabric woven in Example 1 was impregnated with an epoxy resin face of the following formulation example, and heated and dried at 125° C. to produce a prepreg. Eight sheets of this prepreg were layered with 35 μm copper foil on the surface, and compression molded at 175° C. and 30 kg/α2 to obtain a copper-clad laminate with a normal thickness of 1.6.
樹脂フェス配合
ＡＥＲ−７１１（脂化成製エポキシ樹脂） １０
０部ジシアンノアミド９ ２．５部ベ
ンジルジメチルアミン ０．２部ジメチルホ
ルムアミド １２部メチルセルンルプ
１２部メチルエチルケトン
２５部本実施例３の印刷配線板の寸法変化量全第１
表に示す。Resin face combination AER-711 (epoxy resin made by Fukkasei) 10
0 parts dicyanamide 9 2.5 parts benzyldimethylamine 0.2 parts dimethylformamide 12 parts methyl selenium
12 parts methyl ethyl ketone
25 copies Total dimensional change of printed wiring board of Example 3
Shown in the table.
実施例４
実施例２で製織したガラス繊維織物を用い、実施例３と
同様にして、銅張積層板全書た。本実施例４の印刷配線
板の寸法変化量を第１表に示す。Example 4 Using the glass fiber fabric woven in Example 2, a copper-clad laminate was prepared in the same manner as in Example 3. Table 1 shows the amount of dimensional change of the printed wiring board of Example 4.
比較例２
１で製織したガラス繊維織物を用い、実施例３と同様に
して、銅張積層板金得た。本比較例２の印刷配線板の寸
法変化ｆを第１表に示す。Comparative Example 2 A copper-clad laminate sheet metal was obtained in the same manner as in Example 3 using the glass fiber fabric woven in 1. Table 1 shows the dimensional change f of the printed wiring board of Comparative Example 2.
以下余日
〔発明の効果〕
本発明によるガラス繊維織物補強印刷配線板は、前述の
ように、ななこ繊のガラス繊維織物を基材として用いて
形成されているので、従来の印刷配線板では見られない
優れた寸法安定性を有する。[Effects of the Invention] As mentioned above, the glass fiber fabric reinforced printed wiring board according to the present invention is formed using Nanako fiber glass fiber fabric as a base material, so it is different from conventional printed wiring boards. It has excellent dimensional stability.
第１図は本発明によるガラス繊維織物補強印刷配線板の
基材として用いられるガラス繊維織物の組織の一例を示
す組織図であシ第１図Ａはｌななこ織、第１図Ｂは３／
３ななこ熾であシ、第２図は寸法安定性測定用積層板の
サイズおよび標点の位置を示す積層板の平面図である。
ｌ・・・寸法安定性測定用積層板、
２・・・標点。Fig. 1 is an organization chart showing an example of the structure of the glass fiber fabric used as the base material of the glass fiber fabric-reinforced printed wiring board according to the present invention.
Figure 2 is a plan view of the laminate showing the size and the position of the gauge points of the dimensional stability measuring laminate. l... Laminated plate for measuring dimensional stability, 2... Gauge.
Claims (1)
を積層成形してなる積層板において、ガラス繊維織物が
通常ななこ織であることを特徴とするガラス繊維織物補
強印刷配線板。1. A glass fiber fabric-reinforced printed wiring board, which is a laminate formed by laminating and molding a plurality of glass fiber fabrics using a thermosetting resin as a binder, characterized in that the glass fiber fabrics are usually a Nanako weave.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62153393A JP2523649B2 (en) | 1987-06-22 | 1987-06-22 | Glass fiber woven reinforced printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62153393A JP2523649B2 (en) | 1987-06-22 | 1987-06-22 | Glass fiber woven reinforced printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63318196A true JPS63318196A (en) | 1988-12-27 |
| JP2523649B2 JP2523649B2 (en) | 1996-08-14 |
Family
ID=15561509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62153393A Expired - Lifetime JP2523649B2 (en) | 1987-06-22 | 1987-06-22 | Glass fiber woven reinforced printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523649B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752155A (en) * | 1993-08-20 | 1995-02-28 | Matsushita Electric Works Ltd | Prepreg and laminated sheet |
| JPH0760903A (en) * | 1993-08-24 | 1995-03-07 | Matsushita Electric Works Ltd | Laminated sheet |
| JPH0766513A (en) * | 1993-08-24 | 1995-03-10 | Matsushita Electric Works Ltd | Laminated board |
| JPH0790096A (en) * | 1993-09-22 | 1995-04-04 | Matsushita Electric Works Ltd | Prepreg and laminate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571840A (en) * | 1978-11-22 | 1980-05-30 | Hisayoshi Kageyama | Long glass fiber bulky roving cross for frp and frp laminate product using same |
| JPS59231895A (en) * | 1983-06-14 | 1984-12-26 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS61192452A (en) * | 1985-02-21 | 1986-08-27 | Fanuc Ltd | Location monitoring method |
| JPS61194252A (en) * | 1985-02-19 | 1986-08-28 | 日東紡績株式会社 | Inorganic fiber fabric and its production |
| JPS63165442A (en) * | 1986-12-15 | 1988-07-08 | シーメンス、アクチエンゲゼルシヤフト | Production of prepreg |
-
1987
- 1987-06-22 JP JP62153393A patent/JP2523649B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571840A (en) * | 1978-11-22 | 1980-05-30 | Hisayoshi Kageyama | Long glass fiber bulky roving cross for frp and frp laminate product using same |
| JPS59231895A (en) * | 1983-06-14 | 1984-12-26 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS61194252A (en) * | 1985-02-19 | 1986-08-28 | 日東紡績株式会社 | Inorganic fiber fabric and its production |
| JPS61192452A (en) * | 1985-02-21 | 1986-08-27 | Fanuc Ltd | Location monitoring method |
| JPS63165442A (en) * | 1986-12-15 | 1988-07-08 | シーメンス、アクチエンゲゼルシヤフト | Production of prepreg |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752155A (en) * | 1993-08-20 | 1995-02-28 | Matsushita Electric Works Ltd | Prepreg and laminated sheet |
| JP2550510B2 (en) * | 1993-08-20 | 1996-11-06 | 松下電工株式会社 | Prepreg and laminated board |
| JPH0760903A (en) * | 1993-08-24 | 1995-03-07 | Matsushita Electric Works Ltd | Laminated sheet |
| JPH0766513A (en) * | 1993-08-24 | 1995-03-10 | Matsushita Electric Works Ltd | Laminated board |
| JPH0790096A (en) * | 1993-09-22 | 1995-04-04 | Matsushita Electric Works Ltd | Prepreg and laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2523649B2 (en) | 1996-08-14 |
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