CN112105139A

CN112105139A - Processing method for improving asymmetric processing warping of laminated board and laminated board thereof

Info

Publication number: CN112105139A
Application number: CN202010882786.XA
Authority: CN
Inventors: 熊文华; 钟舜; 吴卫生; 程智; 袁彦松; 黄晓蕊; 蒋枭; 邱积丰
Original assignee: Zhongke Weihe Technology Zhaoqing Co ltd
Current assignee: Zhongke Weihe Technology Zhaoqing Co ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2020-12-18

Abstract

The invention discloses a processing method for improving asymmetric processing warping of a laminated board, which comprises the following steps: a cavity is arranged on the middle core layer of the laminated board corresponding to the area to be processed of the surface layer; filling a high-strength material in the cavity of the middle core layer; symmetrically paving surface layer materials on the upper surface and the lower surface of the middle core layer, and performing hot-pressing curing under the conditions of high temperature, high pressure and vacuum; and performing finish machining operation on the area to be processed of the surface layer of the laminated board formed by hot pressing and curing. The invention also discloses a laminated board obtained by the processing method, which comprises an intermediate core layer and surface layers laid on the upper surface and the lower surface of the intermediate core layer, wherein a through cavity is formed in the position, corresponding to the surface layer to be processed area of the upper surface, on the intermediate core layer, and the cavity is filled with a high-strength material. The invention improves the phenomenon of unbalanced internal stress caused by milling and removing part of the surface layer material in the finish machining process, improves the strength of the laminated board and avoids the occurrence of warping.

Description

Processing method for improving asymmetric processing warping of laminated board and laminated board thereof

Technical Field

The invention relates to the technical field of composite boards, in particular to a processing method for improving asymmetric processing warpage of a laminated board and the laminated board.

Background

The laminated board is also called a sandwich board, and is generally formed by laminating two or more high-strength thin boards serving as surface layers and a light sandwich layer filled between the upper surface layer and the lower surface layer. In recent years, with the high requirements of electronic products on portability and durability, sandwich plates with surface layers made of carbon fiber composite materials and core layers made of light glass fiber reinforced epoxy resin composite materials are more and more widely applied to 3C electronic products. Due to their multilayer composite structure, they are more prone to warping than homogeneous materials, for which reason sandwich panels are generally designed as symmetrical structures to minimize warping. However, when a sandwich panel is used, it is usually necessary to process a single surface of the sandwich panel, for example, to design some grooves, holes, etc. for placing some functional electronic components. As the finish machining performed on a single face of the sandwich panel breaks the symmetry of the sandwich panel structure, asymmetric internal stresses are generated, resulting in significant warpage of the sandwich panel. However, the current field of electronic products, such as 3c electronic products, has higher requirements on the warpage of the sandwich panel, and the excessive warpage will affect the installation of functional electronic components on the sandwich panel and the overall assembly of the sandwich panel.

Therefore, the above-mentioned existing problems have become a technical problem to be solved.

Disclosure of Invention

The invention aims to provide a processing method for improving the asymmetric processing warpage of a laminated board and the laminated board, wherein a cavity is arranged on a middle core layer corresponding to a region to be processed of a surface layer, and a high-strength material is filled in the cavity, so that the phenomenon of unbalanced internal stress caused by milling and removing part of the surface layer material in the finish processing process is improved, the strength of the laminated board is improved, and the occurrence of warpage is avoided.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: a process for improving the asymmetric processing warpage of a laminate, the process comprising: a cavity is arranged on the middle core layer of the laminated board corresponding to the area to be processed of the surface layer; filling a high-strength material in the cavity of the middle core layer; symmetrically paving surface layer materials on the upper surface and the lower surface of the middle core layer, and performing hot-pressing curing under the conditions of high temperature, high pressure and vacuum; and performing finish machining operation on the area to be processed of the surface layer of the laminated board formed by hot pressing and curing.

By adopting the technical scheme, the part of the middle core layer corresponding to the area to be processed of the surface layer is provided with the cavity and is replaced by the high-strength material, and when the area to be processed on the surface layer is subjected to fine processing, the high-strength material below the fine processing area plays a role in strengthening and supporting, the phenomenon of unbalanced internal stress is improved, the warping phenomenon is prevented, and the strength and the quality of the laminated board are improved.

In the processing method for improving the asymmetric processing warpage of the laminated board, the cavity penetrates through the middle core layer.

According to the processing method for improving the asymmetric processing warpage of the laminated board, the thickness of the high-strength material filled in the cavity of the middle core layer is the same as the depth of the cavity.

According to the processing method for improving the asymmetric processing warpage of the laminated board, the plane area of the cavity on the middle core layer is larger than the area of the area to be processed on the surface layer. During finish machining, the machining area on the surface layer can be supported by the high-strength material filled in the cavity, and buckling deformation is avoided.

According to the processing method for improving the asymmetric processing warpage of the laminated board, the high-strength material filled in the middle core layer comprises at least one of a high-strength glass fiber material, a high-strength carbon fiber material and a high-strength aramid fiber material.

According to the processing method for improving the asymmetric processing warpage of the laminated board, the middle core layer is made of the light glass fiber reinforced epoxy resin composite material.

The other technical scheme provided by the invention is as follows: the laminated board obtained by the processing method comprises a middle core layer and surface layers laid on the upper surface and the lower surface of the middle core layer, wherein a through cavity is formed in the position, corresponding to a to-be-processed area of the surface layer on the upper surface, of the middle core layer, and high-strength materials are filled in the cavity.

According to the technical scheme, the cavity is formed in the middle core layer in the laminated board, and the high-strength material is filled in the cavity, so that the strength of the laminated board is improved, the phenomenon of unbalance of internal stress caused by milling and removing part of the surface layer material in the finish machining process is improved, and the warping phenomenon is prevented.

The beneficial effects obtained by the invention are as follows: the processing method is simple and strong in operability, effectively improves the strength of the laminated board, improves the imbalance of internal stress caused by asymmetric processing, avoids the occurrence of warping phenomenon, enables the surface of the laminated board to be flat after finish machining, and does not influence the assembly of electronic components in a finish machining area.

Drawings

FIG. 1 is a schematic exploded view of a laminate according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of the laminate of FIG. 1 according to an embodiment of the present invention.

Detailed Description

The invention is further described with reference to the following figures and detailed description.

Referring to fig. 1 and 2, a process for improving asymmetric processing warpage of a laminate, the process comprising:

cavities

3a and 3b are arranged on the middle core layer 1 of the laminated board corresponding to the

areas

4a and 4b to be processed of the surface layer 2A;

filling the

cavities

3a, 3b of the intermediate core layer 1 with high-strength materials 3a1, 3b 1;

symmetrically paving surface layer materials on the upper surface and the lower surface of the middle core layer 1, and performing hot-pressing curing under the conditions of high temperature, high pressure and vacuum;

and finishing the

areas

4a and 4b to be processed of the surface layer of the laminated board formed by hot pressing and curing.

In this processing method, the

cavities

3a and 3b penetrate the intermediate core layer 1.

The high-strength material 3a1, 3b1 filled in the

cavities

3a, 3b of the intermediate core layer 1 has the same thickness as the depth of the

cavities

3a, 3 b.

The planar area of the

cavities

3a, 3b on the intermediate core layer 1 is greater than the area of the

areas

4a, 4b to be machined on the facing layers.

The high-strength material 3a1, 3b1 filled on the intermediate core layer 1 includes at least one of a high-strength glass fiber material, a high-strength carbon fiber material, and a high-strength aramid fiber material.

The middle core layer 1 is made of a light glass fiber reinforced epoxy resin composite material.

As shown in fig. 1 and 2, a laminated board obtained by the processing method according to the above embodiment includes an intermediate core layer 1 and

surface layers

2A and 2B laid on the upper and lower surfaces of the intermediate core layer 1, through cavities 3a and 3B are opened at positions on the intermediate core layer 1 corresponding to regions to be processed 4a and 4B of the surface layer 2A on the upper surface, and high-strength materials 3a1 and 3B1 are filled in the cavities 3a and 3B.

In the specific implementation of the invention, the cavities 3a and 3B are formed in the middle core layer 1 corresponding to the positions of the areas 4a and 4B to be processed on the surface layer 2A, and then the high-strength materials 3a1 and 3B1 are filled in the positions of the cavities 3a and 3B, wherein the thicknesses of the high-strength materials 3a1 and 3B1 are the same as the depth of the cavities, so that the whole thickness of the middle core layer 1 is flat, the

surface layers

2A and 2B are symmetrically laid on the middle core layer 1, and when the areas 4a and 4B to be processed on the surface layer 2A are finely processed, the filled high-strength materials 3a1 and 3B1 play a role in supporting the surface layer 2A, thereby avoiding the phenomenon of warping caused by internal stress imbalance due to an asymmetric processing mode, and improving the structural strength of the laminated board.

The high-strength material described in this embodiment may be a prepreg of high-strength fibers, or may be a cured high-strength fiber composite material. In the present invention, the cavities include, but are not limited to, the cavity 3a and the cavity 3b, and in other embodiments, the cavities and the amount of the high-strength material to be filled should be designed according to the actual processing requirements.

In summary, the actual samples of the present invention are prepared according to the description and the drawings, and after a plurality of usage tests, the effect of the usage tests proves that the present invention can achieve the expected purpose, and the practical value is undoubted. The above-mentioned embodiments are only for convenience of illustration and not intended to limit the invention in any way, and those skilled in the art will be able to make equivalents of the features of the invention without departing from the technical scope of the invention.

Claims

1. A process for improving the asymmetric processing warpage of a laminate, the process comprising:

cavities (3a, 3b) are arranged on the middle core layer (1) of the laminated board corresponding to the regions (4a, 4b) to be processed of the surface layer (2A);

filling high-strength material (3a1, 3b1) in the cavities (3a, 3b) of the intermediate core layer (1);

surface layer materials are symmetrically paved on the upper surface and the lower surface of the middle core layer (1), and hot-pressing solidification is carried out under the conditions of high temperature, high pressure and vacuum;

and finishing the areas (4a, 4b) to be processed of the surface layer of the laminated board formed by hot-pressing and curing.

2. The process for improving asymmetric processing warpage of a laminate according to claim 1, wherein: the cavities (3a, 3b) extend through the intermediate core layer (1).

3. The process for improving asymmetric processing warpage of a laminate according to claim 1, wherein: the high-strength material (3a1, 3b1) filled in the cavities (3a, 3b) of the intermediate core layer (1) has the same thickness as the depth of the cavities (3a, 3 b).

4. The process for improving asymmetric processing warpage of a laminate according to claim 1, wherein: the plane area of the cavities (3a, 3b) on the middle core layer (1) is larger than the area of the areas (4a, 4b) to be processed on the surface layer.

5. A process for improving the asymmetric processing warpage of a laminate according to claim 1 or 3, wherein: the high-strength materials (3a1, 3b1) filled on the middle core layer (1) comprise at least one of high-strength glass fiber materials, high-strength carbon fiber materials and high-strength aramid fiber materials.

6. The process for improving asymmetric processing warpage of a laminate according to claim 1, wherein: the middle core layer (1) is made of a light glass fiber reinforced epoxy resin composite material.

7. A laminate obtained by the process according to any one of the preceding claims 1 to 6, characterized in that: including middle sandwich layer (1) and lay surface course (2A, 2B) on middle sandwich layer (1) upper and lower surface, the cavity (3a, 3B) that link up is seted up in the position department of waiting to process regional (4a, 4B) corresponding to surface course (2A) of upper surface on middle sandwich layer (1) the packing has high strength material (3a1, 3B1) on cavity (3a, 3B).