CN213071115U

CN213071115U - Novel phase-change material packaging structure for controlling temperature of electronic device

Info

Publication number: CN213071115U
Application number: CN202022236639.3U
Authority: CN
Inventors: 谢金龙; 吴文浩; 李晓曼; 吴舟
Original assignee: Yangzhong Shenyang Heat Exchange Equipment Co ltd; Guangzhou University
Current assignee: Yangzhong Shenyang Heat Exchange Equipment Co ltd; Guangzhou University
Priority date: 2020-10-10
Filing date: 2020-10-10
Publication date: 2021-04-27
Anticipated expiration: 2030-10-10

Abstract

The utility model discloses a novel phase change material packaging structure for temperature control of electronic devices, which comprises a base and a metal heat dissipation structure, wherein a closed space is formed in the base, the closed space comprises a filling space and an expansion space, the expansion space is positioned at the top of the closed space, the filling space is used for filling phase change material, and the expansion space is used after the phase change material expands; the outer side surface of the base is provided with a connecting groove, the connecting groove is positioned at the top end or the bottom end of the base, the depth of the connecting groove is less than the thickness of the base, and the connecting groove is used for connecting a heat source; the metal heat radiation structure is connected in the base, and metal heat radiation structure's shape is arborization, and metal heat radiation structure's root and the base of spread groove department are connected, and metal heat radiation structure's branch portion and phase change material are connected: the metal heat dissipation structure is dendritic, the forming material of the metal heat dissipation structure is a metal material, and finally the usage amount of the metal material can be reduced and the heat storage amount of the unit volume of the packaging structure can be improved under the same heat exchange efficiency.

Description

Novel phase-change material packaging structure for controlling temperature of electronic device

Technical Field

The utility model relates to an electronic equipment and electronic components heat dissipation technical field, concretely relates to novel phase change material packaging structure for electronic device temperature control.

Background

With the rapid development of advanced information technologies, such as cloud computing, big data technology, etc., the wide use of high performance chips and large and very large scale integrated circuits has put higher demands on the working performance and operation stability of electronic devices. Statistics show that 55% of failures of electronic equipment are caused by operating temperatures exceeding specified values. The passive phase-change temperature control technology which is rapidly developed in recent years is one of the effective ways to solve the problem, but the application has a remarkable defect that the thermal conductivity of the material is very low. How to improve the phase change heat exchange rate of the phase change material package is a main research direction and a hotspot for developing a novel phase change temperature control technology of electronic equipment. Therefore, a new temperature control technology is needed to meet the future requirement of high-performance electronic device package.

At present, the main approach for improving the heat exchange performance of phase change material packaging is to uniformly fill a nano material or a metal structure with high heat conductivity coefficient into the phase change material to improve the overall heat conductivity coefficient, but neglect the influence of liquid phase material convection heat exchange related to the metal structure in the phase change process.

Disclosure of Invention

An object of the utility model is to provide a novel phase change material packaging structure for electron device temperature control to packaging structure heat transfer performance is poor among the solution prior art problem.

In order to achieve the purpose, the utility model is realized by adopting the following technical scheme:

a novel phase-change material packaging structure for controlling the temperature of an electronic device comprises a base and a metal heat dissipation structure, wherein a closed space is formed in the base and comprises a filling space and an expansion space, the expansion space is located at the top of the closed space and is used for filling a phase-change material, and the expansion space is used for the phase-change material after being expanded;

the outer side surface of the base is provided with a connecting groove, the connecting groove is positioned at the top end or the bottom end of the base, the depth of the connecting groove is smaller than the thickness of the base, and the connecting groove is used for connecting a heat source; the metal heat dissipation structure is connected in the base, the metal heat dissipation structure is dendritic, the root of the metal heat dissipation structure is connected with the base at the connecting groove, and the branch of the metal heat dissipation structure is connected with the phase-change material.

Further, the size of the cross-sectional area ratio of the metal heat dissipation structure is adjustable.

Further, the cross-sectional area ratio of the metal heat dissipation structure is 12.5%.

Further, the cross-sectional area ratio of the metal heat dissipation structure is 15%.

Further, the cross-sectional area ratio of the metal heat dissipation structure is 20%.

Further, the heat source and the connecting groove are in transition fit connection.

Further, heat-conducting silicone grease or heat-conducting adhesive is filled between the heat source and the connecting groove.

Furthermore, the metal heat dissipation structure and the base are integrally formed.

Further, the metal heat dissipation structure is manufactured and molded by adopting a 3D printing technology.

Further, the metal heat dissipation structure is made of silicon-magnesium alloy.

According to the above technical scheme, the embodiment of the utility model has following effect at least:

1. the packaging structure of the utility model, the shape of the metal heat dissipation structure is dendritic, the molding material is metal material, the usage amount of the metal material can be reduced and the heat storage amount of the unit volume of the packaging structure can be improved under the same heat exchange efficiency;

2. the utility model discloses a reduce current metal heat radiation structure's proportion, improve phase change material's volume and quality in the packaging structure and account for than, through the branch shape after SIMP method is optimized to metal heat radiation structure topology, the experimental result shows that, under the same heat exchange efficiency, the required metal quality of metal heat radiation structure after the structural optimization compares with traditional plate-fin metal heat radiation structure, can reduce half at most.

Drawings

FIG. 1 is a diagram of a package structure in the prior art;

FIG. 2 is a diagram of a package structure in the prior art;

FIG. 3 is a schematic view of a base and an internal metal heat dissipation structure thereof according to an embodiment of the present invention;

FIG. 4 is a schematic view of a first form of a package structure according to an embodiment of the present invention;

FIG. 5 is a diagram illustrating a second form of a package structure according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a third form of a package structure according to an embodiment of the present invention.

Wherein: 1. a heat source; 2. filling the space; 3. a base; 4. a metal heat dissipation structure; 5. a phase change material; 6. an expansion space.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

It should be noted that, in the description of the present invention, the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer", etc. indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for convenience of description of the present invention but do not require the present invention to be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention. As used in the description of the present invention, the terms "front," "back," "left," "right," "up," "down" and "in" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

The utility model provides a demand that is used for electron device temperature control's novel phase change material packaging structure to satisfy future electronic equipment packaging design. The method fully considers the free design advantages given by the advanced manufacturing technology and the fixed value type design capability of the structural topology optimization method, and can effectively develop a new generation of light and efficient electronic equipment phase change temperature control technology. The heat exchanger has the advantages of high heat exchange efficiency, reasonable heat conduction path, high heat conduction efficiency, natural convection promotion, heat transfer enhancement and the like.

As shown in fig. 3 to 6, a novel phase change material packaging structure for temperature control of an electronic device includes a base 3 and a metal heat dissipation structure 4, wherein a closed space is formed in the base 3, the closed space includes a filling space 2 and an expansion space 6, the expansion space 6 is located at the top of the closed space, the filling space 2 is used for filling a phase change material 5, and the expansion space 6 is used after the phase change material 5 expands.

The outer side surface of the base 3 is provided with a connecting groove, the connecting groove is positioned at the top end or the bottom end of the base 3, the depth of the connecting groove is less than the thickness of the base 3, and the connecting groove is used for connecting a heat source 1; the metal heat dissipation structure 4 is connected in the base 3, the shape of the metal heat dissipation structure 4 is dendritic, the root of the metal heat dissipation structure 4 is connected with the base 3 at the connecting groove, and the branch part of the metal heat dissipation structure 4 is connected with the phase-change material 5.

The shape of the metal heat dissipation structure 4 in the structure is dendritic, the forming material is a metal material, and finally the usage amount of the metal material can be reduced and the heat storage amount of the unit volume of the packaging structure can be improved under the same heat exchange efficiency.

The dendritic metal heat dissipation structure 4 can greatly improve the heat diffusion efficiency of the whole packaging structure and simultaneously generate the effect of strengthening convective heat transfer, thereby achieving the purposes of reducing the volume fraction of the metal heat dissipation structure 4 in the whole packaging structure and improving the phase change heat storage volume of the packaging. The specific expression is that under the same heat exchange efficiency, the metal mass (or volume) required by the dendritic metal heat dissipation structure 4 is only half of that of the traditional plate-fin metal heat dissipation structure; the volume ratio of the branches of the metal heat dissipation structure 4, that is, the cross-sectional area ratio of the metal heat dissipation structure 4, can be adjusted to directly influence the heat diffusion efficiency and the convection heat exchange effect of the package structure.

Specifically, in a certain cross-sectional area ratio of the metal heat dissipation structure 4, when the cross-sectional area ratio of the metal heat dissipation structure 4 is increased, the enhancement effect on convection heat exchange is more remarkable. Taking the wax-based phase-change material as an example, the cross-sectional area of the metal heat dissipation structure 4 is more excellent than that of 10% -20%.

According to experimental data, under the condition of applying the wax-based phase-change material, compared with the traditional straight-fin metal heat dissipation structure 2, the safe temperature working time of the metal heat dissipation structure 4 with the heat conduction topology optimization within the range of 10% -20% of the cross-sectional area of the metal heat dissipation structure can be improved by 3-15 times (specifically depending on the safe working temperature and the phase-change temperature of the phase-change material). At present, the ratio of the metal cross-sectional area of 12.5%, 15% and 20% is more suitable.

Particularly, it is known from experimental analysis that the thermal conductivity of the material of the metal heat dissipation structure 4 is related to the key effect of the thermal response under the impact of high thermal load, but too many heat dissipation fins can not necessarily improve the heat exchange performance of the metal heat dissipation structure, and the surface of the base 3 contacting with the heat source (chip) 1 is not limited to be under the metal heat dissipation structure 4, and can be disposed at the top end, and the specific position thereof depends on the position of the heat source 1. In terms of experimental results, when the heat source 1 is located below the metal heat dissipation structure 4, the result of enhanced convection heat transfer is more obvious under the action of gravity, and the melting rate of the phase-change material is higher.

The enhanced heat exchange effect is the enhanced convection heat exchange caused by the improvement of the heat conduction efficiency of the heat dissipation structure and the local complex shape of the structure, which is embodied in that the complex shape can optimize a heat conduction path and inhibit the nonuniformity of temperature, thereby effectively reducing the temperature of a heat source.

In a further embodiment of the present invention, the outer periphery of the base 3 is wrapped with a heat insulating material to ensure the heat storage effect in the package structure. The shape of the base 3 is not limited to the square box structure in the drawing of the present embodiment, and may be any shape such as a trapezoidal shape, a columnar shape, and a circular truncated cone shape. The base 3 serves as a fixing function for fixing both the heat exchanger workpiece and the metal heat dissipation structure 4.

In a further embodiment of the present invention, the metal heat dissipation structure 4 and the base 3 are integrally formed, and the integral formation can enhance the effect of the base 3 conducting to the metal heat dissipation structure 4 after absorbing heat. After the heat is conducted to the metal heat dissipation structure 4 through the base 3, a part of the heat can be taken away by the metal heat dissipation structure 4 through a convection heat exchange mode.

In a further embodiment of the present invention, the metal heat dissipation structure 4 is formed by special processing, and can be formed by 3D metal printing manufacturing technology (the material is silicon-magnesium metal alloy powder) or by wire electrical discharge machining, but not limited to these two processing methods, according to the complexity of the structure.

In a further embodiment of the present invention, the metal heat dissipation base 3 and the surface of the heat source 1 should be attached as much as possible. The two can adopt plug-in connection or hot melt connection, and the plug-in connection can adopt a transition fit connection form to ensure the tight connection of the two. In order to prevent insufficient heat conduction, the bonded gap should be filled with a heat dissipation part having relatively high thermal conductivity and relatively good fluidity, such as a heat dissipation pad, heat dissipation silicone grease, heat conduction paste, and liquid metal.

It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of the invention or which are equivalent to the scope of the invention are embraced by the invention.

Claims

1. A novel phase change material packaging structure for temperature control of an electronic device is characterized by comprising a base (3) and a metal heat dissipation structure (4), wherein a closed space is formed in the base (3), the closed space comprises a filling space (2) and an expansion space (6), the expansion space (6) is located at the top of the closed space, the filling space (2) is used for filling a phase change material (5), and the expansion space (6) is used after the phase change material (5) expands;

a connecting groove is formed in the outer side face of the base (3), the connecting groove is located at the top end or the bottom end of the base (3), the depth of the connecting groove is smaller than the thickness of the base (3), and the connecting groove is used for being connected with a heat source (1); the metal heat dissipation structure (4) is connected in the base (3), the metal heat dissipation structure (4) is dendritic, the root of the metal heat dissipation structure (4) is connected with the base (3) at the connecting groove, and the branch of the metal heat dissipation structure (4) is connected with the phase-change material (5).

2. The phase change material encapsulation structure according to claim 1, wherein the size of the cross-sectional area ratio of the metal heat dissipation structure (4) is adjustable.

3. The phase change material encapsulation structure according to claim 2, wherein the metal heat dissipation structure (4) has a cross-sectional area ratio of 12.5%.

4. The phase change material encapsulation structure according to claim 2, wherein the metal heat dissipation structure (4) has a cross-sectional area ratio of 15%.

5. The phase change material encapsulation structure according to claim 2, wherein the metal heat dissipation structure (4) has a cross-sectional area ratio of 20%.

6. The phase change material encapsulation structure according to claim 1, wherein the heat source (1) and the connection slot are transition fit connected.

7. The phase change material packaging structure according to any one of claims 1 or 6, wherein a gap between the heat source (1) and the connecting groove is filled with a thermally conductive silicone grease or a thermally conductive adhesive.

8. The phase-change material package structure of claim 1, wherein the metal heat sink structure (4) and the base (3) are integrally formed.

9. The phase change material packaging structure of claim 1, wherein the metal heat dissipation structure is fabricated using 3D printing technology.

10. The phase change material package structure of any one of claims 1 or 9, wherein the material of the metal heat dissipation structure is silicon-magnesium alloy.