CN111902029A - Three-dimensional structure phase change cold plate based on additive manufacturing - Google Patents
Three-dimensional structure phase change cold plate based on additive manufacturing Download PDFInfo
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- CN111902029A CN111902029A CN202010816800.6A CN202010816800A CN111902029A CN 111902029 A CN111902029 A CN 111902029A CN 202010816800 A CN202010816800 A CN 202010816800A CN 111902029 A CN111902029 A CN 111902029A
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- cold plate
- phase change
- heat
- circuit board
- heat conduction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention discloses a three-dimensional structure phase change cold plate based on additive manufacturing, and relates to the technical field of heat dissipation structures. The purpose of light weight is achieved, the heat dissipation effect is enhanced through the cold plate heat conduction enhancement tissue, and the problems that the heat of the existing equipment is high, and the phase change material structure which is ordinarily arranged is difficult to meet the high heat dissipation requirement are solved.
Description
Technical Field
The invention relates to a heat dissipation structure, in particular to a three-dimensional structure phase change cold plate based on additive manufacturing.
Background
Aerospace electronic equipment faces many limitations in working, for example, the space is closed and narrow, cooling resources such as air cooling and liquid cooling cannot be provided, the volume and weight are limited, and the heat sink capacity is not enough. Along with the development and application of integration and miniaturization of electronic equipment, the integration density and heat flux density of components are higher and higher, and the heat dissipation problem of aerospace electronic equipment is more and more prominent. At present, one of the main heat dissipation approaches of aerospace electronic equipment is to perform passive heat dissipation by means of a phase-change material, and the phase-change material has the main functions of: the heat is absorbed by the latent heat of phase change, so that the temperature rising process caused by the work heating of the electronic components is delayed, the temperature is relatively stable in the phase change process, and the thermal stress and thermal shock of the electronic components are greatly relieved.
However, with the further improvement of the heat flow density of the electronic device, because the thermal conductivity of the phase change material is low, the heat dissipation structures such as the heat dissipation reinforcing ribs with simple geometric shapes, such as aluminum powder and copper powder doped in the phase change material or metal fins, needle-shaped ribs and annular ribs arranged in the phase change cold plate, which are widely used at present, are difficult to continuously meet the higher heat dissipation requirements.
Disclosure of Invention
The invention aims to provide a three-dimensional structure phase change cold plate based on additive manufacturing, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a three-dimensional spatial structure phase transition cold plate based on additive manufacturing, includes the circuit board, the lower surface of circuit board is provided with and is used for radiating phase transition cold plate, and the inside of phase transition cold plate is provided with heat conducting phase transition material.
As a further scheme of the invention: the both sides that the phase transition cold drawing is close to the circuit board all are provided with the fixed slot, and the inside of fixed slot is provided with fixed knot and constructs, and fixed knot constructs including movable rod, spring and stopper, and stopper fixed connection is on the surface of movable rod, and stopper swing joint is in the inside of fixed slot, and the spring activity cup joints on the surface of movable rod, and movable rod swing joint is in the inside of fixed slot, and the phase transition cold drawing passes through the surface of plastics buckle joint at the circuit board.
As a further scheme of the invention: the phase change cold drawing includes cold drawing casing, cold drawing heat conduction reinforcing tissue and cold drawing apron, and one side that the cold drawing casing is close to the circuit board is provided with the heat conduction boss, and one side that the circuit board was kept away from to the cold drawing casing is provided with the cavity, and the inside of cavity is provided with cold drawing heat conduction reinforcing tissue, and one side of cavity is provided with the cold drawing apron, and one side that the circuit board was kept away from to one side that the cold drawing apron is close to the cavity and cold drawing heat conduction reinforcing tissue swing joint, phase change material fixed connection is in the inside of.
As a further scheme of the invention: the upper surface of cold drawing apron inlays and has the fixed column, and the upper surface of cold drawing apron is provided with the bar groove, and phase change material fills the mouth has been seted up at the back of cold drawing apron, and phase change material fills the inside threaded connection of mouth and has the screw that seals.
As a further scheme of the invention: and a sealing gasket is fixedly sleeved on the surface of the sealing screw.
As a further scheme of the invention: the phase change cold plate is integrally formed by adopting a selective laser melting technology and a synchronous material feeding forming technology.
As a further scheme of the invention: the cold plate heat conduction enhanced tissue is designed by a three-dimensional lattice technology or a topological technology, and the structure of the cold plate heat conduction enhanced tissue is in a structural form of a three-dimensional complex lattice, a bionic heat dissipation tree shape and the like.
As a still further scheme of the invention: the heat dissipation steps are as follows:
step one, phase change materials are injected into the cold plate heat conduction enhancing structure through a phase change material filling port, then a cold plate cover plate is covered, and heat generated during working of a circuit board is transferred to a cold plate shell attached to the circuit board;
secondly, the cold plate shell transfers heat to the cold plate heat conduction enhancing organization, and the cold plate heat conduction enhancing organization transfers heat to the phase change material;
and step three, the phase change material absorbs a large amount of heat through phase change latent heat, so that the heat of the circuit board is absorbed and dissipated.
Compared with the prior art, the invention has the beneficial effects that: compared with the traditional phase change cold plate, the three-dimensional structure phase change cold plate based on additive manufacturing is characterized in that a heat dissipation structure form is innovatively designed by means of a three-dimensional lattice technology or a topology optimization technology, the optimal distribution of heat conduction materials is realized by optimizing and arranging a high-heat-conduction metal material and a low-heat-conduction phase change material, generally speaking, the optimally designed heat conduction and heat dissipation structure is complex in shape, the additive manufacturing technology is adopted, the machining and forming of parts with ultra-complex shapes which cannot be realized by the traditional process can be realized, the heat exchange area of a heat conduction enhanced tissue in a unit volume is greatly increased by the optimal distribution of the high-heat-conduction enhanced tissue under a certain volume, the heat exchange efficiency is improved, the volume ratio of the heat conduction enhanced tissue to the phase change material is reduced, the heat sink capacity of the phase change material is increased, and the effective storage and, and because the volume ratio of the heat conduction reinforcing tissue is reduced, the weight of the system is further reduced, the problem of light weight requirement to a certain extent is realized, the purpose of light weight is achieved, the heat dissipation effect is enhanced through the heat conduction reinforcing tissue of the cold plate, and the problems that the heat of the existing equipment is high, and the phase-change material structure which is arranged commonly hardly meets the higher heat dissipation requirement are solved.
Drawings
Fig. 1 is a schematic overall structure diagram of a three-dimensional structure phase-change cold plate based on additive manufacturing.
Fig. 2 is a structural exploded view of a three-dimensional structural phase-change cold plate based on additive manufacturing.
Fig. 3 is a front sectional view of a three-dimensional structure phase change cold plate based on additive manufacturing, wherein the position of a fixed structure is located.
Fig. 4 is an enlarged view of a structure at a in fig. 3 in the three-dimensional phase-change cold plate based on additive manufacturing.
Fig. 5 is a structural schematic diagram of a sealing screw in a three-dimensional structure phase-change cold plate based on additive manufacturing.
As shown in the figure: 1. a circuit board; 2. a phase change cold plate; 3. a cold plate housing; 4. the cold plate heat conduction enhances the organization; 5. a cold plate cover plate; 6. a material filling port; 7. a sealing screw; 8. fixing grooves; 9. a fixed structure; 901. a movable rod; 902. a spring; 903. a limiting block; 10. fixing a column; 11. a strip-shaped groove; 12. and a gasket.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 5, in the embodiment of the present invention, a phase change cold plate with a three-dimensional structure based on additive manufacturing includes a circuit board 1, a phase change cold plate 2 for dissipating heat is disposed on a lower surface of the circuit board 1, the phase change cold plate 2 is integrally formed by using a laser selective melting technique and a synchronous material feeding forming technique, the phase change cold plate 2 includes a cold plate housing 3, a cold plate heat conduction enhancing tissue 4, and a cold plate cover plate 5, a heat conduction boss is disposed on a side of the cold plate housing 3 close to the circuit board 1, a cavity is disposed on a side of the cold plate housing 3 away from the circuit board 1, the cold plate heat conduction enhancing tissue 4 is disposed inside the cavity, the cold plate cover plate 5 is disposed on one side of the cavity, the cold plate cover plate 5 and the cold plate housing 3 form a closed cavity structure, the cold plate heat conduction enhancing tissue 4 is, the fixing column 10 is made of copper, so that the heat conduction effect is achieved while the cold plate heat conduction enhancing tissue 4 is prevented from wrinkling, the input quantity is rapidly transmitted to the bottom of the phase change cold plate 2, the strip-shaped groove 11 is formed in the upper surface of the cold plate cover plate 5 and is also used for heat dissipation, the phase change material filling opening 6 is formed in the back surface of the cold plate cover plate 5, the sealing screw 7 is connected to the inner thread of the phase change material filling opening 6, the sealing gasket 12 is fixedly sleeved on the surface of the sealing screw 7 to increase the sealing performance, so that the internal phase change material is not prone to leakage, one side, close to the cavity, of the cold plate cover plate 5 is movably connected with one side, far away from the circuit board 1, of the cold plate heat conduction enhancing tissue 4, the phase change material is fixedly connected inside the cavity, the phase change material is separated by, the cold plate heat conduction reinforced tissue 4 is designed by a three-dimensional lattice technology or a topological technology, the structure of the cold plate heat conduction reinforced tissue 4 is in a structural form of a three-dimensional complex lattice, a bionic heat dissipation tree form and the like, the average heat exchange area between the phase change material and the cold plate heat conduction reinforced tissue 4 is greatly increased, the heat exchange efficiency is improved, the volume ratio of the heat conduction reinforced tissue to the phase change material is reduced, the heat sink capacity of the phase change material is increased, the effective storage and conversion of higher energy are realized, the system weight is further reduced due to the reduction of the volume ratio of the heat conduction reinforced tissue, the light weight requirement on a certain degree is realized, both sides of the phase change cold plate 2 close to the circuit board 1 are provided with fixed grooves 8, the fixed structures 9 are arranged inside the fixed grooves 8, each fixed structure 9 comprises a movable rod 901, a spring 902 and a, the limiting block 903 is movably connected inside the fixing groove 8, the spring 902 is movably sleeved on the surface of the movable rod 901, the movable rod 901 is movably connected inside the fixing groove 8, the fixing structure 9 enables the phase change cold plate 2 to be more firmly attached to the circuit board 1, a cushion is arranged at the bottom of the movable rod 901 and used for protecting the circuit board 1 and preventing the circuit board 1 from being abraded, the phase change cold plate 2 is clamped on the surface of the circuit board 1 through a plastic buckle, and a heat conduction phase change material is arranged inside the phase change cold plate 2;
the heat dissipation steps are as follows:
step one, phase change materials are injected onto the cold plate heat conduction enhancing tissue 4 through the phase change material filling port 6, then the cold plate cover plate 5 is covered, and heat generated when the circuit board 1 works is transferred to the cold plate shell 3 attached to the circuit board;
secondly, the cold plate shell 3 transfers heat to the cold plate heat conduction enhancing tissue 4, and the cold plate heat conduction enhancing tissue 4 transfers heat to the phase change material;
and step three, the phase change material absorbs a large amount of heat through phase change latent heat, so that the heat of the circuit board 1 is absorbed and dissipated.
When in use, the phase change cold plate 2 is clamped on the lower surface of the circuit board 1 through the plastic buckle, then the phase change material is injected into the cavity through the phase change material filling port 6, so that the phase change material is combined with the cold plate heat conduction enhancing tissue 4, when the circuit board 1 works to dissipate heat, the heating chip on the circuit board 1 transfers the heat to the cold plate shell 3 attached to the circuit board, the cold plate shell 3 transfers the heat to the phase change material adjacent to the cold plate shell through the cold plate heat conduction enhancing tissue 4, the phase change material absorbs a large amount of heat through phase change latent heat, thereby ensuring normal operation of the heating chip without overtemperature, solving the problem of heat dissipation of aerospace high-power electronic equipment, and by means of a three-dimensional lattice technology or a topology optimization technology, the heat dissipation structure is innovatively designed, and the optimal design of the heat dissipation enhancement structure is realized by optimizing the arrangement of the high-heat-conductivity metal material and the low-heat-conductivity phase-change material.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention without departing from the spirit and scope of the invention.
Claims (8)
1. The three-dimensional structure phase change cold plate based on additive manufacturing comprises a circuit board (1) and is characterized in that a phase change cold plate (2) used for heat dissipation is arranged on the lower surface of the circuit board (1), and a heat conduction phase change material is arranged inside the phase change cold plate (2).
2. The three-dimensional structure phase change cold plate based on additive manufacturing according to claim 1, characterized in that both sides of phase change cold plate (2) close to circuit board (1) are provided with fixed slots (8), the inside of fixed slot (8) is provided with fixed structure (9), fixed structure (9) includes movable rod (901), spring (902) and stopper (903), stopper (903) fixed connection is on the surface of movable rod (901), stopper (903) swing joint is in the inside of fixed slot (8), spring (902) activity cup joints the surface of movable rod (901), movable rod (901) swing joint is in the inside of fixed slot (8), phase change cold plate (2) passes through the plastics buckle joint on the surface of circuit board (1).
3. The three-dimensional structure phase change cold plate based on additive manufacturing according to claim 1, wherein the phase change cold plate (2) comprises a cold plate shell (3), a cold plate heat conduction enhancing tissue (4) and a cold plate cover plate (5), a heat conduction boss is arranged on one side, close to the circuit board (1), of the cold plate shell (3), a cavity is arranged on one side, away from the circuit board (1), of the cold plate shell (3), the cold plate heat conduction enhancing tissue (4) is arranged inside the cavity, the cold plate cover plate (5) is arranged on one side of the cavity, one side, close to the cavity, of the cold plate cover plate (5) is movably connected with one side, away from the circuit board (1), of the cold plate heat conduction enhancing tissue (4), the phase change material is fixedly connected inside the cavity, and the phase change material is movably connected with the.
4. The three-dimensional structure phase change cold plate based on additive manufacturing according to claim 2, characterized in that the upper surface of cold plate cover plate (5) is inlaid with fixed columns (10), the upper surface of cold plate cover plate (5) is provided with strip-shaped grooves (11), the back of cold plate cover plate (5) is provided with phase change material filling opening (6), and the internal thread of phase change material filling opening (6) is connected with sealing screw (7).
5. The three-dimensional structure phase-change cold plate based on additive manufacturing is characterized in that a sealing gasket (12) is fixedly sleeved on the surface of the sealing screw (7).
6. The three-dimensional structure phase-change cold plate based on additive manufacturing is characterized in that the phase-change cold plate (2) is integrally formed by adopting a selective laser melting technology and a synchronous material feeding forming technology.
7. The three-dimensional stereo structure phase change cold plate based on additive manufacturing according to claim 2, wherein the cold plate heat conduction enhanced tissue (4) is designed by a three-dimensional lattice technology or a topological technology, and the structure of the cold plate heat conduction enhanced tissue (4) is in a three-dimensional complex lattice, bionic heat dissipation tree-shaped structure and the like.
8. The method for dissipating heat of the phase-change cold plate with the three-dimensional structure based on the additive manufacturing according to claim 1, wherein the heat dissipation steps are as follows:
step one, phase change materials are injected onto a cold plate heat conduction enhancing tissue (4) through a phase change material filling port (6), then a cold plate cover plate (5) is covered, and heat generated when a circuit board (1) works is transferred to a cold plate shell (3) attached to the circuit board;
secondly, the cold plate shell (3) transfers heat to the cold plate heat conduction enhancing tissue (4), and the cold plate heat conduction enhancing tissue (4) transfers heat to the phase change material;
and step three, the phase change material absorbs a large amount of heat through phase change latent heat, so that the heat of the circuit board (1) is absorbed and dissipated.
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| CN202010816800.6A CN111902029B (en) | 2020-08-14 | 2020-08-14 | Three-dimensional structure phase change cold plate based on additive manufacturing |
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| CN202010816800.6A CN111902029B (en) | 2020-08-14 | 2020-08-14 | Three-dimensional structure phase change cold plate based on additive manufacturing |
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| CN111902029B CN111902029B (en) | 2022-11-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113805673A (en) * | 2021-08-24 | 2021-12-17 | 中航光电科技股份有限公司 | Split type liquid cooling cold drawing fixed knot of CPU or GPU constructs |
| CN114423236A (en) * | 2022-01-19 | 2022-04-29 | 中国电子科技集团公司第十研究所 | Preparation method of phase change heat reservoir of electronic equipment |
| US11920877B2 (en) | 2021-11-18 | 2024-03-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | 3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards |
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