CN104244683A - Electronic case - Google Patents
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- CN104244683A CN104244683A CN201410528514.4A CN201410528514A CN104244683A CN 104244683 A CN104244683 A CN 104244683A CN 201410528514 A CN201410528514 A CN 201410528514A CN 104244683 A CN104244683 A CN 104244683A
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Abstract
The invention relates to an electronic case, in particular to electronic cases applicable to the field of aviation. The electronic case comprises a housing case, circuit board assemblies, main inorganic thermal conductance pipes and side inorganic thermal conductance pipes. The circuit board assemblies are arranged in the housing case and are provided with heating elements; the main inorganic thermal conductance pipes are thermally connected with the heating elements of the circuit board assemblies; the side inorganic thermal conductance pipes are arranged between the circuit board assemblies; heat generated by the heating elements can be conducted to the housing case via the main inorganic thermal conductance pipes and/or the side inorganic thermal conductance pipes. The electronic case has the technical advantage that heat of electronic heating modules can be quickly exchanged.
Description
Technical field
The present invention relates to electronic cabinet, particularly for the airborne electronic equipment cabinet of the quick heat radiating of aviation field.
Background technology
The heat exchange Transfer Medium of current electronic cabinet heater element generally uses the metallic plate process such as the good aluminium alloy of heat conductivility, copper alloy, and the heat exchange being carried out cabinet by radiating modes such as natural cooling, air-cooled, ring controls is dispelled the heat.Along with the function of avionic device, performance requirement constantly promote, the demand of the heater element power application in electronic cabinet is increasing, meanwhile, airborne equipment is miniaturized and light-weighted demand is more and more harsher, and the heat dissipation problem of avionic device restricts it and further develops.
The cooling system of electronic cabinet is related to power use restriction and the service efficiency of heater element, and how the efficient heat by heater element is quickly transferred to the region can implementing cooling provision is the difficult problem faced.
Summary of the invention
Because the defect existing for above-mentioned prior art, the object of the invention is to, a kind of electronic cabinet is provided, its Rapid Thermal solving electronic heating module is exchangeed problem.
To achieve these goals, according to a kind of electronic cabinet that the present invention proposes, comprise casing and be installed in the circuit board component in this casing, this circuit board component is provided with heater element, this electronic cabinet also comprises: main inorganic heat conduit, with the heater element hot link of this circuit board component; And side inorganic heat conduit, be arranged between this circuit board component and this circuit board component; Wherein, the heat that this heater element occurs, via this main inorganic heat conduit and/or this inorganic heat conducting tube to this casing.
The present invention also can be applied to the following technical measures to achieve further.
Aforesaid electronic cabinet, wherein said circuit board component is also provided with support column; This main inorganic heat conduit contacts with this heater element, and the two ends of this main inorganic heat conduit are connected with this support column respectively.
Aforesaid electronic cabinet, wherein said side inorganic heat conduit is arranged in the groove of this support column, and with this casing Elastic Contact.
Aforesaid electronic cabinet, it also comprises heat conduction cold drawing, is stacked at this circuit board component side, and this main inorganic heat conduit is arranged on this heat conduction cold drawing.
Aforesaid electronic cabinet, wherein said heat conduction cold drawing is provided with inorganic heat conduit, inorganic heat conduit and this casing Elastic Contact on this.
Aforesaid electronic cabinet, it also comprises end inorganic heat conduit, and this casing internal is provided with the girder construction for installing this end inorganic heat conduit.
Aforesaid electronic cabinet, wherein said casing comprises enclosing cover and lower enclosing cover, is installed on the upper and lower of this casing respectively; The madial wall of this casing is provided with board in circuit board slot.
Aforesaid electronic cabinet, wherein said casing arranged outside has outer inorganic heat conduit and radiating fin, and this outer inorganic heat conduit extends to this radiating fin.
Aforesaid electronic cabinet, the back of wherein said casing is provided with the air cooling system for dispelling the heat, and this air cooling system comprises air-cooled driving and low-temperature receiver bracing frame, and this air-cooled driving is fixed on this low-temperature receiver support, and this low-temperature receiver bracing frame is provided with air outlet.
Aforesaid electronic cabinet, the back of wherein said casing is provided with the environmental control system of control temperature, and this environmental control system comprises ring control driving and ring control bracing frame, and this ring control drives and is fixed on this ring control support, and this ring control bracing frame is provided with air outlet.，
The present invention is a kind of device solving Rapid Thermal and exchange, and comprises electronic equipment and is installed in the heat-exchange device of described electronic equipment.Described electronic equipment comprises cabinet and is installed in the circuit board component in described cabinet, described circuit board component comprises circuit board and the constitutional detail for fixing circuit board, described circuit board there is a heater element, described heat-exchange device is used for the quick exchange of described heater element heat, described heat-exchange device comprises the inorganic heat conduit of a connecting circuit plate member and the constitutional detail for being connected and cooling device, described heat-exchange device is connected with electronic equipment chassis and cabinet inside girder construction, described cabinet inside beam mechanism and the laminating of described heat-exchange device, described cabinet has cooling region, described heat-exchange device is partly or entirely fixed on described box body, the heat in the cooling region of described cabinet reduces rapidly by the cooling device of described heat-exchange device.
In sum, the present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, electronic cabinet of the present invention, at least has following advantages:
One, electronic cabinet of the present invention, while cabinet girder construction strengthens cabinet intensity, fully expands heat conductive contact area and territory, heat distribution zone.
Two, electronic cabinet of the present invention, heat exchange contact region makes full use of cabinet top, the sidewall of cabinet slot and rear wall, makes to utilize the impact of non-metallic pad or silicone grease class bridging agent greatly to reduce, and reduces assembly technology difficulty.
Three, electronic cabinet of the present invention, heat abstractor and circuit devcie can integrated setting, and maintainability is good.
Four, electronic cabinet of the present invention, heater element and housing temperature homogenizing, be convenient to state of temperature test and the monitoring of electronic apparatus.
Five, electronic cabinet of the present invention, high-power electronic device is the rapid homogenizing of heat in little spatial volume, effectively avoids heater members local temperature too high, meets miniaturized, top load plant capacity demand.
Six, electronic cabinet of the present invention, improves the hot operation limit of electronic equipment complete machine, expands the mobility of aircraft more extensive region.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the first embodiment of electronic cabinet of the present invention.
Fig. 2 is the part isometric schematic diagram of the first embodiment of electronic cabinet of the present invention.
Fig. 3 is the circuit board component schematic perspective view of the first embodiment of electronic cabinet of the present invention.
Fig. 4 is the schematic perspective view of the variant embodiment of the circuit board component of the first embodiment of electronic cabinet of the present invention.
Fig. 5 A is longitudinal cross-sectional schematic of the second embodiment of electronic cabinet of the present invention.
Fig. 5 B is the horizontal cross-sectional schematic of the second embodiment of electronic cabinet of the present invention.
Fig. 6 is the circuit board component schematic perspective view of the second embodiment of electronic cabinet of the present invention.
Fig. 7 is the schematic perspective view of the variant embodiment of the circuit board component of the second embodiment of electronic cabinet of the present invention.
Fig. 8 is the schematic perspective view of another variant embodiment of the circuit board component of the second embodiment of electronic cabinet of the present invention.
Fig. 9 is the schematic perspective view of a variant embodiment again of the circuit board component of the second embodiment of electronic cabinet of the present invention.
Figure 10 A is longitudinal cross-sectional schematic of the 3rd embodiment of electronic cabinet of the present invention.
Figure 10 B is the horizontal cross-sectional schematic of the 3rd embodiment of electronic cabinet of the present invention.
Figure 11 is the circuit board component schematic perspective view of the 3rd embodiment of electronic cabinet of the present invention.
Figure 12 is the schematic perspective view of the variant embodiment of the 3rd embodiment of electronic cabinet of the present invention.
Figure 13 A is the schematic side view of the 4th embodiment of electronic cabinet of the present invention.
Figure 13 B is the horizontal cross-sectional schematic of the 4th embodiment of electronic cabinet of the present invention.
Figure 14 is the schematic perspective view of the 4th embodiment of electronic cabinet of the present invention.
Figure 15 is the schematic perspective view of the first variant embodiment of the 4th embodiment of electronic cabinet of the present invention.
Figure 16 is the schematic perspective view of the second variant embodiment of the 4th embodiment of electronic cabinet of the present invention.Figure 17 A is the schematic side view of the 5th embodiment of electronic cabinet of the present invention.
Figure 17 B is the horizontal cross-sectional schematic of the 5th embodiment of electronic cabinet of the present invention.
Figure 18 is the schematic perspective view of the 5th embodiment of electronic cabinet of the present invention.
Figure 19 is the schematic perspective view of the variant embodiment of the 5th embodiment of electronic cabinet of the present invention.
Embodiment
For further setting forth the present invention for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of aviation electronics cabinet proposed according to the present invention, step, structure, feature and effect thereof are described in detail.
Referring to shown in Fig. 1, Fig. 2 and Fig. 3, is the schematic perspective view of the first embodiment of electronic cabinet of the present invention, part isometric schematic diagram and circuit board component schematic perspective view.
The electronic cabinet of the present invention first preferred embodiment, comprises, circuit board component 10, upper enclosing cover 62, casing 63, end inorganic heat conduit 64, lower enclosing cover 65, connects pressing plate 66 and motherboard 67.
Described casing 63 inside is provided with the girder construction 88 for installing end inorganic heat conduit 64, the lateral wall of this casing 63 is provided with radiating fin 89, the madial wall of this casing 63 is provided with board in circuit board slot 80.This lower enclosing cover 65 is installed on bottom casing 63, and on this, enclosing cover 62 is installed on the top of casing 63, defines inner space.This circuit board component 10 is inserted by the board in circuit board slot 80 that casing 63 is offered, and is connected bottom this circuit board component 10 with motherboard 67 by contact pin.This circuit board component 10 is fixed on this motherboard 67 by this connection pressing plate 66.
Described circuit board component 10 comprises, containing bullet pad 17, rear inorganic heat conduit 18 after the board 11 of heater element 19, locking device 12, heat conduction side bullet pad 13, side inorganic heat conduit 14, main inorganic heat conduit 15, two support columns 16, heat conduction.Two support columns 16 lay respectively at the left and right sides of board 11, and with board 11 weldedization; Locking device 12 is fixed on support column 16; After heat conduction side bullet pad 13, side inorganic heat conduit 14, heat conduction, bullet pad 17 and rear inorganic heat conduit 18 are distributed in the preformed groove of support column 16; Main inorganic heat conduit 15 contacts with heater element 19, the two ends of main inorganic heat conduit 15 weld together with two support columns 16 respectively.
The strain of this heat conduction side bullet pad 13 ensures that side inorganic heat conduit 14 is connected with casing 63; After this heat conduction, the strain of bullet pad 16 ensures that rear inorganic heat conduit 17 is connected with casing 63; This locking device 12 makes circuit board component 10 be fixed in board in circuit board slot 80; This connection pressing plate 66 compresses end inorganic heat conduit 64, is connected with the rear inorganic heat conduit 17 of circuit board component 10 simultaneously.
When the electronic cabinet of the present embodiment works, the heat that heater element 19 produces exchanges to support column 16 by main inorganic heat conduit 15 instantaneous heat, be fixed on side inorganic heat conduit 14 on support column 16 and rear inorganic heat conduit 18 rapidly by thermal homogenization, casing 63 is conducted to by bullet pad 16 after heat conduction side bullet pad 13 and heat conduction, heat conduction is extremely connected pressing plate 66 by main inorganic heat conduit 15 simultaneously, heat is delivered to casing 63 wall by end inorganic heat conduit 64 further, and the heat dissipation region eventually through radiating fin 89 completes cooling.
Inorganic heat conduit (end inorganic heat conduit 64, main inorganic heat conduit 15, side inorganic heat conduit 14, rear inorganic heat conduit 18) described in the present embodiment be selected from Dezhou Chuan Mao heat energy Science and Technology Ltd. produce Qu Shi inorganic heat conduit, heat transfer efficiency is even up to more than 90%, after hundreds of operation everyday, performance is undamped continuously, conductivity is more than 1.0X106W/ (mK), it is more than thousand times of conventional metal alloys, even up to several ten thousand times.The electronic cabinet of the present embodiment, compared to traditional type of cooling, the temperature of heater element declines more than 20 °.
Described aviation electronics cabinet is the important air environment installing and protect various circuit unit, components and parts and component of machine; for the various complex environment of elimination to the interference of equipment; ensure device security, stablize, reliably work; the service efficiency of raising equipment, life-span, and the convenience etc. strengthening equipment installation, maintenance plays very important effect.Can be applicable to, in the middle of the assemblies such as inertial navigation system (INS), comprehensive task treatment system (IMS), head-up indicator (HUD), Helmet Mounted Display (HMD), flight control system, carrier aircraft radar, global positioning system (GPS), flight management system, Data-Link system, environmental control system, integrated data recording equipment (IDMS), atmospheric engine and photoelectric detection equipment.
Described aviation electronics cabinet can be operated in the environment compared with strong vibration and impact under normal circumstances,-40 DEG C ~+60 DEG C high and low temperatures can be adapted to, possess certain suppression electromagnetic interference capability, its high reliability, good maintainability and economy also can be expanded to be applied to avionics equipment, Shipborne Electronic Equipment, vehicle electronic device, continental rise electronic equipment.
Referring to shown in Fig. 4, is the schematic perspective view of the variant embodiment of the circuit board component of the first embodiment of electronic cabinet of the present invention.The circuit board component of the present embodiment is compared with the circuit board component 10 of the first embodiment, and main inorganic heat conduit 15T vertical direction connects heater element 19, completes the homogenizing of heat top and the bottom.
Referring to shown in Fig. 5 A, Fig. 5 B, Fig. 6, is longitudinal cross-sectional schematic of the second embodiment of electronic cabinet of the present invention, horizontal cross-sectional schematic and circuit board component schematic perspective view respectively.
The electronic cabinet of the second embodiment comprises, circuit board component 10A, upper enclosing cover 62A, casing 63A, end inorganic heat conduit 64A, lower enclosing cover 65A, connects pressing plate 66A and motherboard 67A.
Described casing 63A inside is provided with the girder construction 88A for installing end inorganic heat conduit 64A, the lateral wall of this casing 63A is provided with radiating fin 89A, the madial wall of this casing 63A is provided with board in circuit board slot 80A.This lower enclosing cover 65A is installed on bottom casing 63A, and on this, enclosing cover 62A is installed on the top of casing 63A, defines inner space.This circuit board component 10A is inserted by the board in circuit board slot 80A that casing 63 is offered, and is connected bottom this circuit board component 10A with motherboard 67A by contact pin.This circuit board component 10A is fixed on this motherboard 67A by this connection pressing plate 66A.
Described circuit board component 10A comprises, containing bullet pad 17A, rear inorganic heat conduit 18A, heat conduction cold drawing 20A after board 11A, the locking device 12A of heater element 19A, heat conduction side bullet pad 13A, side inorganic heat conduit 14A, main inorganic heat conduit 15A, two support column 16A, heat conduction, bullet pad 21A in heat conduction, upper inorganic heat conduit 22A.Two support column 16A lay respectively at the left and right sides of board 11A, and with board 11A weldedization; Locking device 12A is fixed on support column 16A; After heat conduction side bullet pad 13A, side inorganic heat conduit 14A, heat conduction, bullet pad 17A and rear inorganic heat conduit 18A is distributed in the preformed groove of support column 16A; Heat conduction cold drawing 20A is stacked at board 11A side, the heat that the heater element 19A on Conductive cardboard 11A occurs, and heat conduction cold drawing 20A and support column 16A screw are fixed or riveting; Main inorganic heat conduit 15A is weldingly fixed in heat conduction cold drawing 20A preformed groove, and by heat-conducting silicone grease or phase transformation silicon cream and heater element 19A close contact.
The strain of this heat conduction side bullet pad 13A ensures that side inorganic heat conduit 14A is connected with casing 63A; After this heat conduction, the strain of bullet pad 17A ensures that rear inorganic heat conduit 17A is connected with casing 63A; This locking device 12A makes circuit board component 10A be fixed in board in circuit board slot 80A; This connection pressing plate 66A compresses end inorganic heat conduit 64A, is connected with the rear inorganic heat conduit 17A of circuit board component 10A simultaneously.
When the electronic cabinet of the present embodiment works, the heat that heater element 19A produces exchanges to heat conduction cold drawing 20A and support column 16A by main inorganic heat conduit 15A instantaneous heat, be fixed on side inorganic heat conduit 14A on support column 16A and rear inorganic heat conduit 18A rapidly by thermal homogenization, casing 63A is conducted to by bullet pad 17A after heat conduction side bullet pad 13A and heat conduction, heat conduction is extremely connected pressing plate 66A by main inorganic heat conduit 15A simultaneously, heat is delivered to casing 63A wall by inorganic heat conduit 64A further at the end, upper cover plate 62A compresses bullet pad 21A in heat conduction, heat is passed to upper inorganic heat conduit 22A homogenizing from heat conduction cold drawing 20A, upper outer cover plate 62A is conducted to again by bullet pad 21A in heat conduction, cooling is completed eventually through the heat dissipation region of radiating fin 89A and the radiating fin of upper outer cover plate 62A.
Referring to shown in Fig. 7, is the schematic perspective view of the variant embodiment of the circuit board component of the second embodiment of electronic cabinet of the present invention.The circuit board component 10AT of this variant embodiment is compared with the circuit board component 10A of the second embodiment, the heat of main inorganic heat conduit 15AT vertical direction top homogenizing heater element 19AT, heat is passed to upper inorganic heat conduit 22A homogenizing from heat conduction cold drawing 20AT, conduct to shell by bullet pad 21A in heat conduction again, complete cooling.
Referring to shown in Fig. 8, is the schematic perspective view of another variant embodiment of the circuit board component of the second embodiment of electronic cabinet of the present invention.The circuit board component 10AT2 of this variant embodiment is compared with the circuit board component 10A of the second embodiment, the heat of main inorganic heat conduit 15AT2 horizontal direction homogenizing heater element 19AT2, heat conduction cold drawing 20AT2 upper contact area increases, simultaneously, in upper inorganic heat conduit 22AT2 and heat conduction, bullet pad 21A expands contact area, more available heat transmission.
Referring to shown in Fig. 9, is the schematic perspective view of a variant embodiment again of the circuit board component of the second embodiment of electronic cabinet of the present invention.The circuit board component 10AT3 of this variant embodiment is compared with the circuit board component 10A of the second embodiment, the heat of main inorganic heat conduit 15A horizontal direction homogenizing heater element 19A, heat conduction cold drawing 20AT2 upper contact area increases, simultaneously, in upper inorganic heat conduit 22AT2 and heat conduction, bullet pad 21AT2 expands contact area, more available heat transmission.
Referring to shown in Figure 10 A, Figure 10 B, Figure 11, is longitudinal cross-sectional schematic of the 3rd embodiment of electronic cabinet of the present invention, horizontal cross-sectional schematic and circuit board component schematic perspective view respectively.
The electronic cabinet of the 3rd embodiment comprises, the circuit board component 10B of a built-in heat-exchange device, upper enclosing cover 62B, casing 63B, end inorganic heat conduit 64B, lower enclosing cover 65B, connects pressing plate 66B, motherboard 67B and outer inorganic heat conduit 68B.
Described casing 63B inside is provided with the girder construction 88B for installing end inorganic heat conduit 64B, the lateral wall of this casing 63B is provided with radiating fin 89B, the madial wall of this casing 63B is provided with board in circuit board slot 80B.This lower enclosing cover 65B is installed on bottom casing 63B, and on this, enclosing cover 62B is installed on the top of casing 63B, defines inner space.This circuit board component 10B is inserted by the board in circuit board slot 80B that casing 63B offers, and is connected bottom this circuit board component 10B with motherboard 67A by contact pin.This circuit board component 10B is fixed on this motherboard 67AB by this connection pressing plate 66B.Wherein radiating fin 89B can make of aluminium or inorganic thermal conducting material.This outer inorganic heat conduit 68B is arranged at the outside of this casing 63B, extends to this radiating fin 89B.
Described circuit board component 10B comprises, containing bullet pad 17B, rear inorganic heat conduit 18B, heat conduction cold drawing 20B after board 11B, the locking device 12B of heater element 19B, heat conduction side bullet pad 13B, side inorganic heat conduit 14B, main inorganic heat conduit 15B, two support column 16B, heat conduction, bullet pad 21B in heat conduction, upper inorganic heat conduit 22B.Two support column 16B lay respectively at the left and right sides of board 11B, and with board 11B weldedization; Locking device 12B is fixed on support column 16B; After heat conduction side bullet pad 13B, side inorganic heat conduit 14B, heat conduction, bullet pad 17B and rear inorganic heat conduit 18B is distributed in the preformed groove of support column 16B; Heat conduction cold drawing 20B is stacked at board 11A side, the heat that the heater element 19A on Conductive cardboard 11A occurs, and heat conduction cold drawing 20B and support column 16B screw are fixed or riveting; Main inorganic heat conduit 15B is weldingly fixed in heat conduction cold drawing 20B preformed groove, and by heat-conducting silicone grease or phase transformation silicon cream and heater element 19B close contact.
The strain of this heat conduction side bullet pad 13B ensures that side inorganic heat conduit 14B is connected with casing 63B; After this heat conduction, the strain of bullet pad 16B ensures that rear inorganic heat conduit 17B is connected with casing 63B; Locking device 12B makes circuit board component 10B be fixed in board in circuit board slot 80B; Connect pressing plate 66B and compress end inorganic heat conduit 64B, be connected with the rear inorganic heat conduit 17B of circuit board component 10B simultaneously; This outer inorganic heat conduit 68B installs in the reserving installation hole road of casing 63B, and some fixed support post 16B close contacts of circuit board component 10B, and contacts with radiating fin 89B.
When the electronic cabinet of the present embodiment works, the heat that heater element 19B produces exchanges to heat conduction cold drawing 20B and support column 16B by main inorganic heat conduit 15B instantaneous heat, be fixed on side inorganic heat conduit 14B on support column 16B and rear inorganic heat conduit 17B rapidly by thermal homogenization, casing 63B is conducted to by bullet pad 16B after heat conduction side bullet pad 13B and heat conduction, heat conduction is extremely connected pressing plate 66B by main inorganic heat conduit 15B simultaneously, heat is delivered to casing 63B wall by inorganic heat conduit 64B further at the end, simultaneously, heat is passed to outer inorganic heat conduit 68B along some support column 16B, transfer of heat is completed by the radiating fin 89B of contact, upper cover plate 62B compresses bullet pad 21B in heat conduction, and heat is passed to upper inorganic heat conduit 22B homogenizing from heat conduction cold drawing 20B, then by bullet pad 21B heat conduction in heat conduction to upper cover plate 62B.Cooling is completed eventually through the heat dissipation region of radiating fin 89B and the radiating fin of upper cover plate 62B.
Referring to shown in Figure 12, is the schematic perspective view of the variant embodiment of the 3rd embodiment of electronic cabinet of the present invention.
In this variant embodiment, heat conducts outer cage 63BT by the girder construction 88BT of casing 63BT, heat conduction to the cooled region of radiating fin 89BT, is completed the conduction of heat by the upper inorganic heat conduit 69BT on the outer inorganic heat conduit 68BT on outer cage 63BT and upper cover plate 62BT.
Referring to shown in Figure 13 A, Figure 13 B and Figure 14, is the schematic side view of the 4th embodiment of electronic cabinet of the present invention, horizontal cross-sectional schematic and schematic perspective view respectively.
The difference of the electronic cabinet of fourth embodiment of the invention and the electronic cabinet of the 3rd embodiment is, the back of casing 63C increases air cooling system 69C.
Described air cooling system 69C comprises air-cooled driving 71C and low-temperature receiver bracing frame 72C, and air-cooled driving 71C is fixed on low-temperature receiver support 72C, and low-temperature receiver bracing frame 72C has air outlet 91C.
When the electronic cabinet of the present embodiment works, the heat moment homogenizing that heater element produces, is transferred to casing 63C, and by outer inorganic heat conduit 68C homogenizing to radiating fin 89C, heat is sent air outlet 91C by forced convertion by some air-cooled driving 71C, completes the exchange of heat.
Referring to shown in Figure 15, Figure 16, is the schematic perspective view of the first variant embodiment of the 4th embodiment, the schematic perspective view of the second variant embodiment.
In in this first variant embodiment, air-cooled driving 71CT and 73CT has coordinated powerful heat exchange.In second variant embodiment, the upper inorganic heat conduit 69CT on the outer inorganic heat conduit 68CT on outer cage 63CT and upper cover plate 62CT by heat conduction to the cooled region of outer cage 63CT rear end.
Referring to shown in Figure 17 A, Figure 17 B and Figure 18, is the schematic side view of the 5th embodiment of electronic cabinet of the present invention, horizontal cross-sectional schematic and schematic perspective view respectively.
The electronic cabinet of fifth embodiment of the invention and the difference of the 3rd execution mode are, casing 63D back increase environmental control system 69D.
Described environmental control system 69D comprises, and ring control drives 71D and ring control bracing frame 72D, and ring control drives 71D to be fixed on ring control support 72D, and ring control bracing frame 72D has air outlet 91D.
When the electronic cabinet of the present embodiment works, the heat moment homogenizing of heater element, is transferred to casing 63D, and by outer inorganic heat conduit 68D homogenizing to radiating fin 89D, some ring controls drive 71D, by forced convertion, heat is sent air outlet 91D, complete the exchange of heat.
Referring to shown in Figure 19, is the schematic perspective view of the variant embodiment of the 5th embodiment.In this variant embodiment, heat conduction to the cooled region of outer cage 63DT1 rear end, is cooled by environmental control system 69D by the upper inorganic heat conduit 69DT1 on the outer inorganic heat conduit 68DT1 on outer cage 63DT1 and upper cover plate 62DT1.
Although the present invention discloses as above with preferred embodiment, so and be not used to limit scope of the invention process, the simple equivalence change done according to claims of the present invention and description with modify, still belong in the scope of technical solution of the present invention.
Claims (10)
1. an electronic cabinet, comprise casing and be installed in the circuit board component in this casing, this circuit board component is provided with heater element, it is characterized in that this electronic cabinet also comprises:
Main inorganic heat conduit, with the heater element hot link of this circuit board component; And
Side inorganic heat conduit, is arranged between this circuit board component and this circuit board component,
Wherein, the heat that this heater element occurs, via this main inorganic heat conduit and/or this inorganic heat conducting tube to this casing.
2. electronic cabinet as claimed in claim 1, is characterized in that wherein said circuit board component is also provided with support column; This main inorganic heat conduit contacts with this heater element, and the two ends of this main inorganic heat conduit are connected with this support column respectively.
3. electronic cabinet as claimed in claim 2, is characterized in that wherein said side inorganic heat conduit is arranged in the groove of this support column, and with this casing Elastic Contact.
4. the electronic cabinet as described in claim arbitrary in claims 1 to 3, is characterized in that it also comprises heat conduction cold drawing, is stacked at this circuit board component side, and this main inorganic heat conduit is arranged on this heat conduction cold drawing.
5. electronic cabinet as claimed in claim 4, is characterized in that wherein said heat conduction cold drawing is provided with inorganic heat conduit, inorganic heat conduit and this casing Elastic Contact on this.
6. the electronic cabinet as described in claim arbitrary in claim 1 to 5, is characterized in that it also comprises end inorganic heat conduit, and this casing internal is provided with the girder construction for installing this end inorganic heat conduit.
7. the electronic cabinet as described in claim arbitrary in claim 1 to 6, is characterized in that wherein said casing comprises enclosing cover and lower enclosing cover, is installed on the upper and lower of this casing respectively; The madial wall of this casing is provided with board in circuit board slot.
8. the electronic cabinet as described in claim arbitrary in claim 1 to 7, is characterized in that wherein said casing arranged outside has outer inorganic heat conduit and radiating fin, and this outer inorganic heat conduit extends to this radiating fin.
9. the electronic cabinet as described in claim arbitrary in claim 1 to 8, it is characterized in that the back of this casing is provided with the air cooling system for dispelling the heat, this air cooling system comprises air-cooled driving and low-temperature receiver bracing frame, this air-cooled driving is fixed on this low-temperature receiver support, and this low-temperature receiver bracing frame is provided with air outlet.
10. the electronic cabinet as described in claim arbitrary in claim 1 to 8, it is characterized in that the back of this casing is provided with the environmental control system of control temperature, this environmental control system comprises ring control driving and ring control bracing frame, this ring control drives and is fixed on this ring control support, and this ring control bracing frame is provided with air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410528514.4A CN104244683A (en) | 2014-10-09 | 2014-10-09 | Electronic case |
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| CN201410528514.4A CN104244683A (en) | 2014-10-09 | 2014-10-09 | Electronic case |
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| CN104244683A true CN104244683A (en) | 2014-12-24 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107508184A (en) * | 2017-09-29 | 2017-12-22 | 河北天创管业有限公司 | One kind is based on outdoor environment response type box-type substation |
| CN111902029A (en) * | 2020-08-14 | 2020-11-06 | 中国电子科技集团公司第十四研究所 | Three-dimensional structure phase change cold plate based on additive manufacturing |
| CN115767974A (en) * | 2022-11-03 | 2023-03-07 | 中国航空工业集团公司洛阳电光设备研究所 | Open airborne electronic component mounting structure |
| CN115767974B (en) * | 2022-11-03 | 2024-04-30 | 中国航空工业集团公司洛阳电光设备研究所 | Open type airborne electronic component mounting structure |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0863696A2 (en) * | 1997-03-05 | 1998-09-09 | Nortel Networks Corporation | Electronic unit |
| JPH11330758A (en) * | 1998-05-13 | 1999-11-30 | Fujikura Ltd | Cooling device for card for outside installation communication equipment |
| US6713675B2 (en) * | 2001-04-25 | 2004-03-30 | Northrop Grumman Corporation | Satellite direct radiating electronic packaging and related method |
| US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
| US20060146496A1 (en) * | 2005-01-06 | 2006-07-06 | The Boeing Company | Cooling apparatus, system, and associated method |
| CN201054111Y (en) * | 2007-05-15 | 2008-04-30 | 讯凯国际股份有限公司 | Enclosure heat radiation structure |
| CN203054703U (en) * | 2012-11-16 | 2013-07-10 | 雷志辉 | Non-fan heat dissipation structure of computer host |
| CN204145975U (en) * | 2014-10-09 | 2015-02-04 | 中国航空工业集团公司洛阳电光设备研究所 | Electronic cabinet |
-
2014
- 2014-10-09 CN CN201410528514.4A patent/CN104244683A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0863696A2 (en) * | 1997-03-05 | 1998-09-09 | Nortel Networks Corporation | Electronic unit |
| JPH11330758A (en) * | 1998-05-13 | 1999-11-30 | Fujikura Ltd | Cooling device for card for outside installation communication equipment |
| US6713675B2 (en) * | 2001-04-25 | 2004-03-30 | Northrop Grumman Corporation | Satellite direct radiating electronic packaging and related method |
| US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
| US20060146496A1 (en) * | 2005-01-06 | 2006-07-06 | The Boeing Company | Cooling apparatus, system, and associated method |
| CN101095386A (en) * | 2005-01-06 | 2007-12-26 | 波音公司 | Cooling apparatus, system, and associated method |
| CN201054111Y (en) * | 2007-05-15 | 2008-04-30 | 讯凯国际股份有限公司 | Enclosure heat radiation structure |
| CN203054703U (en) * | 2012-11-16 | 2013-07-10 | 雷志辉 | Non-fan heat dissipation structure of computer host |
| CN204145975U (en) * | 2014-10-09 | 2015-02-04 | 中国航空工业集团公司洛阳电光设备研究所 | Electronic cabinet |
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Application publication date: 20141224 |