CN115767974B - Open type airborne electronic component mounting structure - Google Patents
Open type airborne electronic component mounting structure Download PDFInfo
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- CN115767974B CN115767974B CN202211372535.2A CN202211372535A CN115767974B CN 115767974 B CN115767974 B CN 115767974B CN 202211372535 A CN202211372535 A CN 202211372535A CN 115767974 B CN115767974 B CN 115767974B
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- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000004381 surface treatment Methods 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims abstract description 4
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention relates to an open type airborne electronic component mounting structure which comprises a module case, an adapter case, rib plates and a bottom plate. The adapter case is positioned at the rear side of the bottom plate, the rib plates are positioned at the two sides of the bottom plate and the adapter case, and the rib plates are fixedly connected with the adapter case and the bottom plate. The front end of the module case is fixed on the bottom plate, and the adapter case comprises a rectangular connector plug, a round connector, an adapter circuit module and an adapter case shell. The module case is of a single-side cover opening structure and comprises a cover plate, a heat conducting rubber pad, a conductive rubber pad, a functional circuit module, a rectangular connector socket, a module case shell, radiating fins and a locking handle. The functional circuit module is independently packaged in the module case, the heating device is adhered to the wall plate for heat dissipation, the heat of the wall plate is directly dissipated to the environment, and the heat dissipation efficiency is high. The module case and the adapter case are subjected to conductive oxidation surface treatment, and the conductive rubber ropes and the conductive rubber pads are arranged at the joint gaps, so that electromagnetic interference among all functional circuit modules is effectively avoided.
Description
Technical Field
The invention belongs to the field of mechanical and electronic structural design, and particularly relates to an open type mounting structure of an airborne electronic component, which can meet the requirements of heat dissipation, electromagnetic shielding, sealing and quick release of airborne electronic equipment.
Background
The traditional airborne electronic chassis adopts a box-type mounting structure, a large number of functional circuit modules are intensively mounted in a slot of the sealed chassis through wedge-shaped locking devices, the interconnection of internal and external signals is realized through a transfer mother board and a round connector on a panel, and heat generated by a heating device on the functional circuit modules is transferred to the locking devices through cold plates and then transferred to a chassis shell through the locking devices; the form of centralized installation also increases the electromagnetic interference among the functional circuit modules; when the functional circuit module breaks down, the chassis is often required to be disassembled, and the cover plate is opened to replace the functional circuit module, so that the maintenance is inconvenient. As the requirements of the on-board electronic devices for heat dissipation, electromagnetic compatibility and maintainability are increasing, a new on-board electronic component mounting structure is needed to solve the problem.
Disclosure of Invention
In order to overcome the defects of low heat dissipation efficiency, poor electromagnetic compatibility and poor maintainability of the traditional airborne electronic chassis, the invention provides an open type airborne electronic component mounting structure.
The technical scheme adopted for solving the technical problems is as follows:
An open type airborne electronic component mounting structure comprises a module case, an adapter case, rib plates and a bottom plate.
The adapter box is positioned at the rear side of the bottom plate. The rib plates are positioned on two sides of the bottom plate and the adapter case, and the rib plates are fixedly connected with the adapter case and the bottom plate. The front end of the module case is fixed on the bottom plate.
The adapter case comprises a rectangular connector plug, a round connector, an adapter circuit module and an adapter case shell.
The rectangular connector plug, the round connector and the switching circuit module are all arranged on the switching machine case shell. The rectangular connector plug, the round connector and the switching circuit module are in signal interconnection. The circular connector is arranged on the upper side of the adapter case shell and is used for connecting an on-board cable.
The rectangular connector plug is arranged on the front side of the adapter case shell, namely, one side close to the module case, the rectangular connector socket at the rear end of the module case is fixedly inserted with the rectangular connector plug of the adapter case, namely, the rectangular connector plug is inserted into the rectangular connector socket, so that signal connection and mechanical fixation of the module case and the adapter case are realized.
The mounting structure is characterized in that the module case is of a single-side cover opening structure, and comprises a cover plate, a heat conducting rubber pad, a conductive rubber pad, a functional circuit module, a rectangular connector socket, a module case shell, radiating fins and a locking handle.
The module case housing is provided with a boss to which the functional circuit module is fixedly mounted. The outer sides of the wall plates and the cover plates of the module case shell are provided with radiating fins, and the inner sides of the wall plates and the cover plates are provided with radiating bosses.
The surface treatment mode of the module case shell is conductive oxidation surface treatment.
The functional circuit module is mounted on the module case housing.
The rectangular connector socket is arranged at the rear end of the module case shell and is inserted with the rectangular connector plug on the adapter case, so that signal interconnection and mechanical fixation of the rear end of the module case are realized.
The locking handle is arranged at the front end of the shell of the module case, and the front end of the module case is locked by being matched with the tensioner on the bottom plate.
The cover plate is arranged on the module case shell, a mounting groove for mounting the conductive rubber rope is formed in the mounting surface of the cover plate, the conductive rubber rope is positioned in the mounting groove, and the cover plate and the module case shell are sealed through the conductive rubber rope. The installation surface of the rectangular connector socket is provided with the conductive rubber pad and is subjected to gluing treatment, so that the sealing of the chassis is realized.
The heat radiation boss corresponds to the heating device on the functional circuit module. And the heat-conducting rubber pad is stuck between the heat-radiating boss and the heating device.
The mounting structure comprises a bottom plate body, a strainer and a fan.
The tensioner is arranged at the front end of the bottom plate main body and matched with the locking handle of the module case to lock the front end of the module case.
The fan is arranged at the bottom of the bottom plate main body and used for radiating heat of the module case.
The beneficial effects of the invention are as follows:
the open type airborne electronic component mounting structure has the advantages that the case shell adopts an integrated machine addition type, the structure is simple, and the strength is high.
According to the mounting structure, the functional circuit module is independently packaged in the module case, the heating device directly adheres to the wall for heat dissipation, the thermal resistance is low, and the heat dissipation area of the heat dissipation fins on the case wall plate can be increased; the module case is installed in an open mode, heat of the wall plates can be directly emitted to the environment, and heat dissipation efficiency is high.
According to the mounting structure, the conductive rubber ropes are mounted on the lap joint surfaces of the chassis, the conductive rubber pads are mounted on all the connector mounting surfaces, and meanwhile, glue is coated on the gaps, so that the tightness of the structure is ensured.
According to the mounting structure, the module case and the adapter case, the structural members adopt a conductive oxidized surface treatment mode, and the conductive rubber ropes and the conductive rubber pads at the lap joint gaps are matched, so that electromagnetic shielding is realized, and electromagnetic interference among all functional circuit modules can be effectively avoided.
According to the mounting structure, the rear end of the module case is interconnected with the signal of the adapter case and mechanically fixed through the rectangular connector, and the front end of the module case is fixed on the bottom plate through the B-type locking device, so that the boosting and pulling-up and quick disassembly of the functional module are ensured.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a view showing the assembly of the mounting structure;
FIG. 3 is a three-dimensional effect diagram of a module chassis when the cover is opened;
FIG. 4 is a cross-sectional view of an attachment of a functional circuit module heat sink;
Fig. 5 is a diagram showing the configuration of the adapter case when the cover plate is hidden.
In the figure: 1. a module chassis; 2. a switch cabinet; 3. rib plates; 4. a bottom plate; 5. a rectangular connector plug; 6. a circular connector; 7. a fan; 8. a module chassis cover plate; 9. a heat generating device; 10. a heat conducting rubber pad; 11. a conductive rubber pad; 12. a functional circuit module; 13. a mounting groove; 14. rectangular connector sockets; 15. a module chassis housing; 16. a heat radiation fin; 17. a heat dissipation boss; 18. a switching circuit module; 19. a switch chassis housing; 20. a locking handle; 21. a tensioner.
Detailed Description
Examples
An open type airborne electronic component mounting structure comprises a module case 1, an adapter case 2, rib plates 3 and a bottom plate 4, as shown in fig. 1.
As shown in fig. 1, the adapter housing 2 is mounted on the rear side of the bottom plate 4. The rib plates 3 are arranged on two sides of the bottom plate 4 and the adapter case 2, and are fixedly connected with the adapter case 2 and the bottom plate 4 through screws, so that the installation stability of the adapter case 2 is ensured in an auxiliary manner. The rear end of the module case 1 is connected with the signal of the adapter case 2 and mechanically fixed through a rectangular connector, and the front end of the module case is fixed on the bottom plate 4 through a B-type locking device.
As shown in fig. 3, the module case 1 has a one-sided lid opening structure, and the functional circuit module 12 is mounted in the module case 1.
The module case 1 includes a cover plate 8, a heat conductive rubber pad 10, a conductive rubber pad 11, a functional circuit module 12, a rectangular connector socket 14, a module case housing 15, heat radiating fins 16, and a latch handle 20. As shown in fig. 3, 4 and 5.
As shown in fig. 3, the functional circuit module 12 is mounted on the module case housing 15 by screws, and a boss for fixedly mounting the functional circuit module 12 is provided on the module case housing 15. The outer sides of the wall plates and the cover plate 8 of the module case shell 15 are provided with radiating fins 16, the inner sides of the wall plates and the cover plate 8 are provided with radiating bosses 17, and the radiating bosses 17 correspond to the heating devices 9 on the functional circuit module 12. And a heat-conducting rubber pad 10 is stuck between the heat-radiating boss 17 and the heating device 9, and the heat-conducting rubber pad 10 plays a role in reducing contact thermal resistance and simultaneously is compatible with installation errors, so that the contact reliability is ensured.
The rectangular connector socket 14 is arranged at the rear end of the module case shell 15 and is inserted with the rectangular connector plug 5 on the adapter case 2, so that signal interconnection and mechanical fixation of the rear end of the module case 1 are realized.
The locking handle 20 is mounted at the front end of the module case housing 15, and is matched with a tensioner on the bottom plate 4 to lock the front end of the module case 1.
The cover plate 8 is arranged on the module case shell 15, the module case shell 15 is provided with a mounting groove 13 of a conductive rubber rope on the mounting surface of the cover plate 8, the conductive rubber rope is positioned in the mounting groove 13, and the sealing of a mounting seam is realized between the cover plate 8 and the module case shell 15 through the conductive rubber rope. The rectangular connector socket 14 is provided with a conductive rubber gasket 11 on its mounting surface and is subjected to a glue coating treatment to seal the chassis.
The module case shell 15 adopts a surface treatment mode of conductive oxidation to ensure the conductivity of structural members, and the conductive rubber gasket 11 and the conductive rubber rope can avoid electromagnetic leakage at the gap of the case and ensure that the module case 1 has good electromagnetic shielding effect.
The adaptor box 2 comprises a rectangular connector plug 5, a circular connector 6, an adaptor circuit module 18, and an adaptor box housing 19.
The rectangular connector plug 5, the round connector 6 and the transfer circuit module 18 are all arranged on the transfer case shell 19, and the rectangular connector plug 5 and the round connector 6 can be in a welding or pressing connection mode to realize signal interconnection with the transfer circuit module 18 according to requirements.
The circular connector 6 is mounted on the upper side of the adaptor housing 19 for connection of on-board cables.
The rectangular connector plug 5 is mounted on the front side of the adapter case housing 19, i.e. the side close to the module case 1, and when the module case 1 is mounted in place, the rectangular connector socket 14 at the rear end of the module case 1 is fixed with the rectangular connector plug 5 of the adapter case 2 in a plugging manner, so that the rectangular connector plug 5 can be inserted into the rectangular connector socket 14, and signal connection and mechanical fixation of the module case 1 and the adapter case 2 are realized.
As shown in fig. 2, the floor 4 includes a fan 7, a tensioner 21, and a floor body.
The fan 7 and the tensioner 21 are both mounted on the floor body. The tensioner 21 is mounted at the front end of the bottom plate 4 and cooperates with the locking handle of the module case 1 to lock the front end of the module case 1. The fan 7 is installed at the bottom of the bottom plate 4 for heat dissipation of the module case 1.
Claims (2)
1. An open type airborne electronic component mounting structure is characterized by comprising a module case (1), an adapter case (2), rib plates (3) and a bottom plate (4);
the adapter case (2) is positioned at the rear side of the bottom plate (4); the rib plates (3) are positioned on two sides of the bottom plate (4) and the adapter case (2), and the rib plates (3) are fixedly connected with the adapter case (2) and the bottom plate (4); the front end of the module case (1) is fixed on the bottom plate (4);
the adapter case (2) comprises a rectangular connector plug (5), a round connector (6), an adapter circuit module (18) and an adapter case shell (19);
The rectangular connector plug (5), the round connector (6) and the switching circuit module (18) are all arranged on a switching machine case shell (19); the rectangular connector plug (5), the round connector (6) and the switching circuit module (18) are in signal interconnection; the circular connector (6) is arranged on the upper side of the adapter case shell (19) and is used for connecting an on-board cable;
The rectangular connector plug (5) is arranged on the front side of the adapter case shell (19), namely, one side close to the module case (1), and the rectangular connector socket (14) at the rear end of the module case (1) is fixedly inserted with the rectangular connector plug (5) of the adapter case (2), namely, the rectangular connector plug (5) is inserted into the rectangular connector socket (14), so that signal connection and mechanical fixation of the module case (1) and the adapter case (2) are realized;
The module case (1) is of a single-side uncapping structure, the module case (1) comprises a cover plate (8), a heat conducting rubber pad (10), a conductive rubber pad (11), a functional circuit module (12), a rectangular connector socket (14), a module case shell (15), radiating fins (16) and a locking handle (20);
The module case shell (15) is provided with a boss for fixedly mounting the functional circuit module (12); the outer sides of the wall plates and the cover plates (8) of the module case shell (15) are provided with radiating fins (16), and the inner sides of the wall plates and the cover plates are provided with radiating bosses (17);
The surface treatment mode of the module case shell (15) is conductive oxidation surface treatment;
the functional circuit module (12) is mounted on the module case housing (15);
The rectangular connector socket (14) is arranged at the rear end of the module case shell (15) and is inserted with the rectangular connector plug (5) on the adapter case (2) to realize signal interconnection and mechanical fixation at the rear end of the module case (1);
the locking handle (20) is arranged at the front end of the module case shell (15), and is matched with the tensioner (21) on the bottom plate (4) to lock the front end of the module case (1);
The cover plate (8) is arranged on the module case shell (15), an installation groove (13) for installing a conductive rubber rope is formed in the installation surface of the cover plate (8), the conductive rubber rope is positioned in the installation groove (13), and the sealing of an installation joint is realized between the cover plate (8) and the module case shell (15) through the conductive rubber rope; the installation surface of the rectangular connector socket (14) is provided with the conductive rubber pad (11) and is subjected to gluing treatment, so that the sealing of the chassis is realized;
the heat radiation boss (17) corresponds to a heating device (9) on the functional circuit module (12);
And the heat-conducting rubber pad (10) is stuck between the heat-radiating boss (17) and the heating device (9).
2. An open on-board electronic component mounting structure according to claim 1, characterized in that the base plate (4) comprises a fan (7), a tensioner (21), a base plate body;
The tensioner (21) is arranged at the front end of the bottom plate main body and matched with a locking handle of the module case (1) to lock the front end of the module case (1);
The fan (7) is arranged at the bottom of the bottom plate main body and used for radiating heat of the module case (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211372535.2A CN115767974B (en) | 2022-11-03 | 2022-11-03 | Open type airborne electronic component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211372535.2A CN115767974B (en) | 2022-11-03 | 2022-11-03 | Open type airborne electronic component mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115767974A CN115767974A (en) | 2023-03-07 |
| CN115767974B true CN115767974B (en) | 2024-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211372535.2A Active CN115767974B (en) | 2022-11-03 | 2022-11-03 | Open type airborne electronic component mounting structure |
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| Country | Link |
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| CN (1) | CN115767974B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244683A (en) * | 2014-10-09 | 2014-12-24 | 中国航空工业集团公司洛阳电光设备研究所 | Electronic case |
| CN113741646A (en) * | 2021-08-01 | 2021-12-03 | 贵阳航空电机有限公司 | Machine carries equipment heat dissipation machine case |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI626875B (en) * | 2016-08-18 | 2018-06-11 | 建碁股份有限公司 | Electronic device |
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2022
- 2022-11-03 CN CN202211372535.2A patent/CN115767974B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244683A (en) * | 2014-10-09 | 2014-12-24 | 中国航空工业集团公司洛阳电光设备研究所 | Electronic case |
| CN113741646A (en) * | 2021-08-01 | 2021-12-03 | 贵阳航空电机有限公司 | Machine carries equipment heat dissipation machine case |
Non-Patent Citations (4)
| Title |
|---|
| 基于ANSYS Icepak的密闭机箱散热仿真分析;李玲娜;蔺佳;;光电技术应用;20121215(06);全文 * |
| 基于JVPX连接器的模块化插件结构与热设计分析;冷同同;王炜方;江守利;李佳;;电子机械工程;20171215(第06期);全文 * |
| 机载电子设备轻量化设计;周海亮;;科学技术创新;20200205(第04期);全文 * |
| 电磁屏蔽在电子机箱设计中的应用;刘银广;《 黑龙江科技信息》;20170305;全文 * |
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| CN115767974A (en) | 2023-03-07 |
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