CN111031757B - Microwave assembly - Google Patents
Microwave assembly Download PDFInfo
- Publication number
- CN111031757B CN111031757B CN201911323206.7A CN201911323206A CN111031757B CN 111031757 B CN111031757 B CN 111031757B CN 201911323206 A CN201911323206 A CN 201911323206A CN 111031757 B CN111031757 B CN 111031757B
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- Prior art keywords
- microwave assembly
- microwave
- shell
- element device
- assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a microwave assembly, which comprises a shell with a containing cavity and an inner wall contained in the containing cavity, wherein the shell is provided with the containing cavity; the shell comprises a first shell forming a first cavity with the inner wall, and the first cavity is provided with a first heating element device group; the second shell and the inner wall form a second cavity, and a second heating element device group is arranged in the second cavity; at least one group of fin groups consisting of a plurality of fins is formed on the inner wall, and an air channel penetrating through the side walls on the two sides of the shell is arranged between the adjacent fins. The microwave assembly provided by the invention can effectively reduce the size, further reduce the volume, simultaneously improve the heat dissipation capacity of the microwave assembly, meet the air-cooling heat dissipation requirement of the microwave assembly, and has the advantages of attractive overall layout, convenience in assembly and contribution to improving the production and assembly efficiency.
Description
Technical Field
The invention relates to the technical field of microwaves, in particular to a microwave assembly.
Background
With the development of economy and the advancement of technology, microwave signals are increasingly applied to communication. The microwave signal receiving and sending needs to be completed through combination and cooperation of various microwave assemblies, the microwave assemblies are precise instruments, and need to be properly protected in the using process, particularly the heat dissipation problem in the working process of the microwave assemblies, and especially needs to be optimized. In the design of the microwave assembly, a heating element is installed inside the microwave assembly, and the application scene of the microwave assembly can only adopt the condition of an air cooling heat dissipation mode. Therefore, a reasonable heat dissipation structure and a reasonable heat dissipation method are needed, otherwise, heat of the heating element is easy to accumulate in the working process of the microwave assembly, and thus the function failure of the microwave assembly is caused.
According to the heat dissipation design of the microwave assembly in the prior art, single-side assembly is generally adopted, namely corresponding heat dissipation fins are arranged on the bottom surface corresponding to the heating component in the microwave assembly to dissipate heat for the heating component, and the heat can be directly led out through the fins. However, the microwave module with such a structure has a large size, and is difficult to meet the requirement of the existing microwave system for a small-sized microwave module; in addition, aiming at the condition that a plurality of heating components are arranged in the microwave assembly, the microwave assembly in the prior art has single heat dissipation form and low heat dissipation efficiency, and is difficult to meet the heat dissipation requirement of the high-power microwave assembly.
Therefore, in order to overcome the technical defects of the prior art, a novel microwave assembly needs to be provided.
Disclosure of Invention
The invention aims to provide a microwave assembly, which can effectively reduce the size, further reduce the volume of the microwave assembly, improve the heat dissipation capacity of the microwave assembly and meet the air cooling heat dissipation requirement of the microwave assembly.
In order to achieve the above object, the present invention provides a microwave assembly, which includes a housing formed with an accommodating cavity and an inner wall accommodated in the accommodating cavity; the shell comprises a first shell forming a first cavity with the inner wall, and the first cavity is provided with a first heating element device group; the second shell and the inner wall form a second cavity, and a second heating element device group is arranged in the second cavity; at least one group of fin groups consisting of a plurality of fins is formed on the inner wall, and an air channel penetrating through the side walls on the two sides of the shell is arranged between the adjacent fins.
The size of the microwave assembly can be effectively reduced, so that the size of the microwave assembly is reduced, and the requirement of miniaturization of the microwave assembly is met; meanwhile, the first heating element device group and the second heating element device group can be discharged through air ducts on two sides of the fin group, so that the heat dissipation capacity of the microwave assembly is further improved, the air-cooling heat dissipation requirement of the high-power microwave assembly is met, and the reliability of the microwave assembly is improved.
Optionally, a first heat conducting member is disposed between the first heat generating element group and the fin group.
Optionally, the first heat conducting member is a heat pipe or a heat conducting gasket.
Optionally, the second heating element device group is located on the bottom surface of the second housing, and a second heat conducting element is disposed between the second heating element device group and the fin group.
Optionally, the second heat conducting member is a heat pipe or a heat conducting gasket.
Optionally, the microwave assembly includes a through hole penetrating through upper and lower side surfaces of the inner wall and a connector located in the through hole, and the first heating element device group and the second heating element device group are electrically interconnected through the connector.
Optionally, the microwave assembly comprises a shielding portion disposed on the electrical connector.
The electromagnetic interference between the heating components caused by the through holes can be prevented while the connection of the heating components is realized.
Optionally, the surface of the inner wall facing away from the first housing is recessed inward to form at least one groove, and the electrical connector is disposed in the groove.
The connector of being convenient for adjusts mounting height, reduces the overall structure height of microwave subassembly, plays the effect that subtracts heavy simultaneously, realizes the light-dutyization of microwave subassembly.
Optionally, the connector is a radio frequency blind mate connector.
The connection is convenient, the assembly efficiency is improved, and meanwhile, the maintenance and repair of heating components inside the microwave assembly are facilitated.
The invention has the following beneficial effects:
1. according to the microwave assembly provided by the invention, the first heating element device group and the second heating element device group are arranged on the two sides of the fin group, so that the size of the microwave assembly can be effectively reduced, the size of the microwave assembly is further reduced, and the requirement of a miniaturized microwave assembly is met; meanwhile, the first heating element device group and the second heating element device group can be discharged through air ducts on two sides of the fin group, so that the heat dissipation capacity of the microwave assembly is further improved, the air-cooling heat dissipation requirement of the high-power microwave assembly is met, and the reliability of the microwave assembly is improved; and the microwave assembly is attractive in overall layout and convenient to assemble, and is beneficial to improving the production and assembly efficiency.
2. The microwave assembly provided by the invention is provided with the blind plug connector, is convenient to connect, is beneficial to improving the assembly efficiency, and is also beneficial to maintaining and repairing heating components inside the microwave assembly.
3. The shielding part of the microwave assembly arranged on the electric connector can ensure that the heating components are connected and prevent electromagnetic interference caused by the through holes among the heating components.
4. The microwave assembly provided by the invention is provided with the groove, so that the installation height of the connector can be conveniently adjusted, the overall structural height of the microwave assembly is reduced, a weight reduction effect is achieved, and the light weight of the microwave assembly is realized.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows a schematic structural diagram of a microwave assembly in an embodiment of the present invention.
Fig. 2 shows an exploded structural front view of a microwave assembly in an embodiment of the present invention.
Fig. 3 shows an exploded structural side view of a microwave assembly in an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
In the heat dissipation design of the microwave component in the prior art, single-sided assembly is generally adopted, that is, corresponding heat dissipation fins are arranged on the bottom surface corresponding to the heating component in the microwave component to dissipate heat for the heating component, and the heat can be directly led out through the fins. However, the microwave module with such a structure has a large size, and is difficult to meet the requirement of the existing microwave system for a small-sized microwave module; in addition, aiming at the condition that a plurality of heating components are arranged in the microwave assembly, the microwave assembly in the prior art has single heat dissipation form and low heat dissipation efficiency, and is difficult to meet the heat dissipation requirement of the high-power microwave assembly.
In order to solve the above technical drawbacks, the present invention provides a microwave assembly, as shown in fig. 1-3, the microwave assembly includes a housing 10 formed with a receiving cavity and an inner wall 20 received in the receiving cavity; the shell 10 comprises a first shell 11 forming a first cavity with the inner wall 20, and a first heating element device group 30 is arranged in the first cavity; and a second housing 12 forming a second cavity with the inner wall 20, the second cavity having a second heat generating element device group (not shown) disposed therein; the first housing 11 and the second housing 12 may be combined by means of screws, glue or laser welding to form a microwave assembly with multiple functions. In a specific embodiment, the first heat generating element device group 30 includes a plurality of high power components, the high power components are used for power amplification and switching, it can be understood that the second heat generating element device group includes a plurality of high power components, the high power components of the second heat generating element device group are used for transceiving data information; or in another embodiment, the first heat-generating element device group is a transmitting element device group, and the second heat-generating element device group is a receiving element device group, it is understood that the first heat-generating element device group and the second heat-generating element device group may include other high-power components known to those skilled in the art, and the invention is not limited thereto. At least one group of fin groups 40, such as 2 or 4 groups of fin groups, formed by a plurality of fins is formed on the inner wall 20, as shown in fig. 3, an air duct 50 penetrating through the two side walls of the housing 10 is disposed between the adjacent fins, and the air duct is used for discharging heat in the microwave assembly from the two side walls of the housing 10 along the air duct 50. The side wall of the first housing 11 and the side wall of the second housing 12 are respectively provided with a connection port 60 for electrically connecting the first heat generating element device group 30 and the second heat generating element device group to the outside. In a preferred embodiment, in order to further improve the heat dissipation efficiency of the microwave module, a blocking wall is disposed in the second cavity and corresponds to the inner wall, a second fin group is disposed on the blocking wall and is in butt joint with the fin group, and the second heating element device group is disposed on a side surface of the blocking wall facing away from the inner wall.
When the microwave assembly works, heat generated by the first heating element device group 30 and the second heating element device group is conducted out from the side walls of the two sides of the shell 10 through the air duct 50 on the fin group 40. Compared with the structure of single-side assembly and single-side heat dissipation in the prior art, the microwave assembly provided by the invention has the advantages that the first heating element device group and the second heating element device group are arranged on the two sides of the fin group, so that the simultaneous heat dissipation in two directions of the side walls of the two sides of the shell can be realized, the first heating element device group and the second heating element device group can be quickly conducted out of the microwave assembly, the heat dissipation capacity of the microwave assembly is further improved, the air-cooling heat dissipation requirement of the high-power microwave assembly is met, and the reliability of the microwave assembly is improved; meanwhile, the microwave assembly structure provided by the invention effectively reduces the size of the microwave assembly, so that the volume of the microwave assembly is reduced, and the requirement of miniaturization of the microwave assembly is met; and the microwave assembly is attractive in overall layout and convenient to assemble, and is beneficial to improving the production and assembly efficiency.
In a specific example, as shown in fig. 2, a first heat conducting member 70 is disposed between the first heat generating element device group 30 and the fin group 40, the first heat generating element device group 30 includes a plurality of high power components, and the first heat conducting member 70 is located right below a heat source of the plurality of high power components. Preferably, the first heat conducting member with corresponding power can be selected according to the heat source power consumption of the high-power component, and the fin group 40 with corresponding heat dissipation area is designed under the first heat conducting member 70 according to the heat source power consumption requirement of the high-power component, so as to meet the heat dissipation requirements of a plurality of high-power components. Preferably, the first heat conduction member 70 is a heat pipe or a heat conduction pad. Through the first heat conducting piece arranged between the first heat generating element device group and the fin group, the air thermal resistance between the first heat generating element device group and the fin group can be effectively reduced, and the heat dissipation efficiency of the fin group on the first heat generating element device is improved; meanwhile, it can be understood that, in another specific embodiment, the second heat generating component group is located on the bottom surface of the second casing 12 away from the inner wall 20, and a second heat conducting member (not shown in the figure) is disposed between the second heat generating component group and the fin group. Preferably, the second heat conduction member is a heat pipe or a heat conduction gasket. Through the arrangement of the second heat conducting piece, air thermal resistance between the second heating element device group and the fin group can be reduced, and the heat dissipation efficiency of the fin group to the second heating element device group is improved.
In a specific embodiment, when there is an electrical connection requirement between the components of the first heat generating element device group 30 and the components of the second heat generating element device group, the microwave module further includes a through hole penetrating through the upper and lower side surfaces of the inner wall 20 and a connector 80 located in the through hole 20, and the components of the first heat generating element device group 30 are electrically interconnected with the components of the second heat generating element device group through the connector 80. Preferably, the connector 80 is a radio frequency blind-mate connector, so that the connection between the components of the first heating element device group and the components of the second heating element device group is more convenient, which is beneficial to improving the assembly efficiency of the microwave assembly, and meanwhile, when the heating elements in the microwave assembly break down and need to be replaced, the blind-mate connector is also beneficial to quick disassembly, thereby facilitating the maintenance and repair of the heating elements in the microwave assembly.
In a preferred embodiment, the microwave assembly includes a shield (not shown) disposed on the electrical connector 80. The shielding part is used for fixing the connector and simultaneously covering the through hole on the inner wall; through setting up the shielding part, can guarantee to realize being connected between the part of first heating element device group and the part in the second heating element device group, prevent because of the electromagnetic interference that the through-hole brought, guarantee microwave assembly's normal work. In one particular example, the shield may be a flange.
In a specific embodiment, as shown in fig. 3, the surface of the inner wall 20 facing away from the first housing 11 is recessed to form at least one groove 21, and the electrical connector 80 is disposed in the groove 21. The connector is arranged in the groove, so that the installation height of the connector can be conveniently adjusted, the interference of the connector on the assembly of the first shell and the second shell is avoided, the overall structure height of the microwave assembly can be reduced, and the volume of the microwave assembly is further reduced; meanwhile, the grooves can play a role in reducing weight, and the lightening of the microwave assembly is promoted.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (9)
1. A microwave assembly, characterized in that the microwave assembly comprises:
a shell body with an accommodating cavity and an inner wall accommodated in the accommodating cavity; the housing comprises
The first shell and the inner wall form a first cavity, and a first heating element device group is arranged in the first cavity; and
the second shell and the inner wall form a second cavity, and a second heating element device group is arranged in the second cavity;
at least one group of fin groups consisting of a plurality of fins is formed on the inner wall, and an air channel penetrating through the side walls on the two sides of the shell is arranged between the adjacent fins.
2. The microwave assembly of claim 1,
and a first heat conducting piece is arranged between the first heat generating element component group and the fin group.
3. The microwave assembly of claim 2,
the first heat conducting piece is a heat pipe or a heat conducting gasket.
4. The microwave assembly of claim 1,
the second heating element component group is positioned on the bottom surface of the second shell, and a second heat conducting piece is arranged between the second heating element component and the fin group.
5. The microwave assembly of claim 4,
the second heat conducting piece is a heat pipe or a heat conducting gasket.
6. The microwave assembly of claim 1,
the microwave assembly comprises a through hole penetrating through the upper surface and the lower surface of the inner wall and an electric connector positioned in the through hole, and the first heating element device group and the second heating element device group are electrically interconnected through the electric connector.
7. The microwave assembly of claim 6,
the microwave assembly comprises a shielding part arranged on the electric connector.
8. The microwave assembly of claim 6,
the surface of the inner wall, which is far away from the first shell, is inwards sunken to form at least one groove, and the electric connector is arranged in the groove.
9. The microwave assembly of claim 6, wherein the electrical connector is a radio frequency blind mate connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911323206.7A CN111031757B (en) | 2019-12-20 | 2019-12-20 | Microwave assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911323206.7A CN111031757B (en) | 2019-12-20 | 2019-12-20 | Microwave assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111031757A CN111031757A (en) | 2020-04-17 |
| CN111031757B true CN111031757B (en) | 2021-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911323206.7A Active CN111031757B (en) | 2019-12-20 | 2019-12-20 | Microwave assembly |
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| Country | Link |
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| CN (1) | CN111031757B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116367480B (en) * | 2023-06-02 | 2023-08-08 | 成都贡爵微电子有限公司 | High-isolation airtight microwave assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0930466A3 (en) * | 1998-01-14 | 2000-02-23 | Schott Glas | Auxiliary heater |
| CN201766071U (en) * | 2010-07-23 | 2011-03-16 | 天津市鼎曦光学科技有限公司 | Heat dissipation structure of power semiconductor |
| CN203086450U (en) * | 2012-12-25 | 2013-07-24 | 西安天伟电子系统工程有限公司 | High-power transmitter module combination device |
| CN209710577U (en) * | 2019-01-08 | 2019-11-29 | 安徽瞭望科技有限公司 | A kind of Connectors for Active Phased Array Radar assembly radiating structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990380A (en) * | 2018-08-07 | 2018-12-11 | 北京无线电测量研究所 | A kind of water-cooled microwave components |
-
2019
- 2019-12-20 CN CN201911323206.7A patent/CN111031757B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0930466A3 (en) * | 1998-01-14 | 2000-02-23 | Schott Glas | Auxiliary heater |
| CN201766071U (en) * | 2010-07-23 | 2011-03-16 | 天津市鼎曦光学科技有限公司 | Heat dissipation structure of power semiconductor |
| CN203086450U (en) * | 2012-12-25 | 2013-07-24 | 西安天伟电子系统工程有限公司 | High-power transmitter module combination device |
| CN209710577U (en) * | 2019-01-08 | 2019-11-29 | 安徽瞭望科技有限公司 | A kind of Connectors for Active Phased Array Radar assembly radiating structure |
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| CN111031757A (en) | 2020-04-17 |
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