CN108990380A - A kind of water-cooled microwave components - Google Patents
A kind of water-cooled microwave components Download PDFInfo
- Publication number
- CN108990380A CN108990380A CN201810888448.XA CN201810888448A CN108990380A CN 108990380 A CN108990380 A CN 108990380A CN 201810888448 A CN201810888448 A CN 201810888448A CN 108990380 A CN108990380 A CN 108990380A
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- Prior art keywords
- water
- radio
- waterbaffle
- local oscillator
- cavity
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the present application provides a kind of water-cooled microwave components, which includes: the container for accommodating radio-frequency devices and local oscillator power splitter part；The container is divided into the first cavity and the second cavity by being equipped with the waterbaffle of water-cooling channel；The radio-frequency devices are connect with the local oscillator power splitter part, and are arranged in the first cavity and/or the second cavity；The waterbaffle is connected to external container, is microwave components heat dissipation by recirculated water cooling mode.Herein described technical solution can effectively solve the problem that the heat dissipation problem at the chip that heat flow density is big in component, can make the heat dissipation problem for disposably solving all components in component；It radiates in effective volume space to all devices to the maximum extent, and does not influence the integral layout of device in component.
Description
Technical field
This application involves microwave components field, in particular to a kind of water cooling microwave components structure.
Background technique
Existing microwave components generally use air-cooled heat dissipation, and the universal volume of fan-cooled radiator is big, excess weight, very big
Microwave components are limited in degree and are developed toward light-weighted direction is minimized, while when heat dissipation capacity is big, the noise of blower also structure greatly
Disadvantage when being used at component.Present most of water-cooling heat radiating devices are single side heat dissipation, are unfavorable for heating device mostly and concentrate
Components distribution, present microwave components integrated level is high, and the big heat dissipation capacity of power is big, needs significantly more efficient radiating mode.
Traditional microwave transmitting and receiving component only carries out data transmission and handles by microwave signal, rather than carries out the place of number
Reason, so need to incorporate digital processing part in transmitting-receiving subassembly, but each funtion part of component internal, cause assembly volume
Greatly, structure is not compact.
Summary of the invention
One of in order to solve the above problem, this application provides a kind of water-cooled microwave components.
According to the first aspect of the embodiment of the present application, a kind of water-cooled microwave components are provided, which includes: to be used for
Accommodate the container of radio-frequency devices 2 and local oscillator power splitter part 3；
The container is divided into the first cavity and the second cavity by being equipped with the waterbaffle 14 of water-cooling channel；
The radio-frequency devices 2 are connect with the local oscillator power splitter part 3, and are arranged in the first cavity and/or the second cavity；
The waterbaffle 14 is connected to external container, is microwave components heat dissipation by recirculated water cooling mode.
Preferably, the waterbaffle 14 enters water swivel 7 and water outlet connector 7 and external container by being arranged on container
Water source connection.
Preferably, the radio-frequency devices 2 include: the first radio-frequency module and the second radio-frequency module；
First radio-frequency module and the second radio-frequency module are separately positioned in the first cavity and the second cavity, and with the water cooling
Partition 14 is fixed.
Preferably, the radio-frequency module is equipped with bulge-structure, and the bulge-structure is bonded with the waterbaffle 14.
Preferably, the local oscillator power splitter part 3 includes: the first local oscillator function scoreboard and the second local oscillator function scoreboard；
The first local oscillator function scoreboard passes through the first connector 8 and the first radio-frequency module grafting, and with setting on container
Local oscillator input connector 9 connect；
The second local oscillator function scoreboard passes through the first connector 8 and the second radio-frequency module grafting, and with setting on container
Local oscillator input connector 9 connect.
Preferably, the component further include: be arranged in the first cavity or the intracorporal digiboard 4 of the second chamber；The digiboard 4
It is fixed with the waterbaffle 14.
Preferably, the digiboard 4 is equipped with multiple heating elements；The heating element and it is set in advance in water cooling
Bulge-structure on partition 14 abuts against.
Preferably, heat-conducting piece is equipped between the surface that the bulge-structure of the radio-frequency module and waterbaffle 14 contact；With/
Or,
It is equipped with and leads between heating element on the digiboard 4 and the bulge-structure being set in advance on waterbaffle 14
Warmware.
Preferably, the component further include: be arranged in the first cavity or the intracorporal power module 5 of the second chamber and power filter
Plate 6；
The power module 5 and power filter plate 6 are fixed on waterbaffle 14.
Preferably, the digiboard 4, power module 5, power filter plate 6 it is one or more be arranged on container
The connection of second connector.
Herein described technical solution can effectively solve the problem that the heat dissipation problem at the chip that heat flow density is big in component, can make
The disposable heat dissipation problem for solving all components in component；All devices are carried out in effective volume space to the maximum extent
Heat dissipation, and the integral layout of device in component is not influenced.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 shows the schematic diagram of herein described water-cooled microwave components.
Drawing reference numeral
1, box body, 2, radio-frequency devices, 3, local oscillator power splitter part, 4, digiboard, 5, power module, 6, power filter plate, 7,
Water swivel, the 8, first connector, 9, local oscillator input connector, 10, third connector, 11, cable, 12, upper cover plate, 13, lower cover
Plate, 14, waterbaffle.
Specific embodiment
In order to which technical solution in the embodiment of the present application and advantage is more clearly understood, below in conjunction with attached drawing to the application
Exemplary embodiment be described in more detail, it is clear that described embodiment be only the application a part implement
Example, rather than the exhaustion of all embodiments.It should be noted that in the absence of conflict, embodiment and reality in the application
The feature applied in example can be combined with each other.
The core ideas of this programme is the partition by the way that a built-in water-cooling channel is arranged in component internal, not only saving group
The use of part inner space, moreover, the advantage wide by waterbaffle heat dissipation area, can be simultaneously the chip in component, member
Device etc. radiates simultaneously.
Embodiment 1
As shown in Figure 1, this example discloses a kind of water-cooled microwave components, which includes: for accommodating radio-frequency devices 2
With the container of local oscillator power splitter part 3；The container is divided into the first cavity and the by being equipped with the waterbaffle 14 of water-cooling channel
Two cavitys；The radio-frequency devices 2 are connect with the local oscillator power splitter part 3, and are arranged in the first cavity and/or the second cavity；
The waterbaffle 14 is connected to external container, is microwave components heat dissipation by recirculated water cooling mode.
Container described in this programme can be the solid of rule；In practical application, can be according to the inside of referenced device
Vessel Design is any solid structure for meeting use space by space.In this example, the container can be to pass through oxidation
The cube structure that aluminum material is processed into, the structure include: box body 1, upper cover plate 12 and lower cover plate 13；Upper cover plate 12 and lower cover
Plate 13 is fixed by the modes and the box body 1 such as being spirally connected, being clamped respectively.
In this example, the container is divided into the first cavity and the second cavity by waterbaffle 14.The water cooling
Water-cooling channel is processed on partition 14, it is fluted in water-cooling channel edge in order not to allow water-cooling channel is naked to be exposed on the external, it will
Passage cover plate is welded in groove, to play the role of covering water-cooling channel.Waterbaffle 14 is connect by two water respectively
First 7 are connected to external water source, and one of water swivel 7 is connected to as entering water swivel with the water inlet of waterbaffle 14, another
It is connected to as water outlet connector with the water outlet of waterbaffle 14.
In this example, the radio-frequency devices 2 include: the first radio-frequency module and the second radio-frequency module；First radio-frequency module and
Second radio-frequency module is separately positioned in the first cavity and the second cavity, and is fixed with the waterbaffle 14 by screw.This
In example, even number radio-frequency module is provided in microwave components, radio-frequency module symmetrically is distributed in the first cavity and
In two cavitys.Wherein, radio-frequency module is equipped with a radio-frequency channel, and each cavity of microwave components is designed with n radio-frequency module, therefore,
The connector quantity that the quantity of microwave components front passage, i.e. microwave components dock antenna element is 2na.In this example, penetrate
The bulge-structure for being partially provided with cubic shaped on one side that frequency module is contacted with waterbaffle 14, the bulge-structure and water cooling every
The fitting of 14 plane of plate；In order to increase thermal conductivity, the radio-frequency module bulge-structure and waterbaffle 14 contact surface it
Between be pressed heat-conducting piece, to improve thermal conductivity；Preferably, heat-conducting piece can be the thermally conductive sheet of indium material.
In this example, the local oscillator power splitter part 3 includes: the first local oscillator function scoreboard and the second local oscillator function scoreboard；Described
One local oscillator function scoreboard is connected by the first connector 8 and the first radio-frequency module grafting, and with the local oscillator input being arranged on container
Device 9 connects；The second local oscillator function scoreboard passes through the first connector 8 and the second radio-frequency module grafting, and with setting on container
Local oscillator input connector 9 connect.In this example, region will form a space between waterbaffle 14 and radio-frequency module, at this
Local oscillator function scoreboard is placed in space, local oscillator function scoreboard is mounted on waterbaffle 14 by screw, has 2na above local oscillator function scoreboard
A first connector 8 is connect with the connector blindmate of radio-frequency module bottom surface；In addition, there are one the first connections in local oscillator function scoreboard
Device 8 is connect by the local oscillator input connector 9 being arranged on cable 11 and microwave components；First local oscillator function scoreboard and the second local oscillator function
Scoreboard is symmetrically arranged in the first cavity and the second cavity.
In this example, the top latter half of the waterbaffle 14 in microwave components installs a digiboard by screw
4；The digiboard 4 side Denso opposite with waterbaffle 14 has multiple heating elements, due to heating element calorific value
It is larger, therefore, several and the sizable bulge-structure of heating element, heating element are processed on waterbaffle 14
Press bulge-structure.To increase the thermal conductivity between heating element and bulge-structure, further paste between them thermally conductive
Gasket.
In this example, the lower section latter half of the waterbaffle 14 in microwave components is equipped with power module by screw
5 and power filter plate 6；Power module 5 is placed close to local oscillator function scoreboard side；Power filter plate 6 is close to the tail portion of microwave components.
Digiboard 4, power module 5 and power filter plate 6 are connected by the second connector being arranged on cable 11 and container.
It can effectively solve the problem that the heat dissipation problem at heat flow density is big in component chip through the above technical solution, one can be made
Secondary property solves the heat dissipation problem of all components in component；All devices are carried out in effective volume space to the maximum extent scattered
Heat, and the integral layout of device in component is not influenced.
Embodiment 2
As shown in Figure 1, present embodiments providing a kind of water-cooled microwave components comprising: box body 1, radio frequency mould module, sheet
Shake function scoreboard, digiboard 4, power module 5, power filter plate 6, water swivel 7, the first connector 8, local oscillator input connector 9, the
Two connectors, cable 11, upper cover plate 12, lower cover plate 13 and waterbaffle 14.
In this example, box body 1 uses cube structure, is divided box body 1 for up and down there are two cavity by waterbaffle 14,
For placing a variety of electric function components such as radio-frequency module, local oscillator function scoreboard, digiboard 4 in cavity；Upper and lower two cover plates pass through
Screw covers box body 1.In this example, waterbaffle 14 be in the middle position of box body 1, can be respectively as two cavitys
Weight tray.Machining water-cooling channel on waterbaffle 14, then water-cooling channel cover board is welded on above water-cooling channel
Water-cooling channel is formed in groove；Using be mounted on two water swivels 7 of 1 tail end of box body respectively with the entery and delivery port of water-cooling channel
It is connected to, water cooling liquid is filled in water-cooling channel, for the heat dissipation to heating module and heating device in microwave components.This example
In, the shape tendency of water-cooling channel can design, water-cooling channel pair according to the distributing position of microwave components internal heat generation component
It should be positioned close to the position of heating element, and be close to heating device as far as possible, reduced between heater device and water-cooling channel
Thermal contact resistance.
In this example, radio-frequency module is cube structure of the bottom end with local crowning, and raised plane is bonded waterbaffle
14 place, and can be pressed indium sheet between 14 plane of plane and waterbaffle of bulge-structure to improve thermal conductivity, radio-frequency module is logical
It crosses on the waterbaffle 14 that screw is mounted in box body 1.The number of radio-frequency module is even number, and radio-frequency module symmetrically is distributed
Above and below in box body 1 in two cavitys, each cavity is equipped with n radio-frequency module, and radio-frequency module needs to design according to specific design
At a radio-frequency channel is contained in a module, microwave components front passage quantity, that is, microwave components dock the connection of antenna element
Device quantity is 2na
In this example, local oscillator function scoreboard is located in box body 1 sky that region between waterbaffle 14 and radio-frequency module is formed
In, and be mounted on the waterbaffle 14 in box body 1 by screw；Local oscillator function scoreboard passes through 2na the first connectors 8 and penetrates
The connector blindmate of frequency module bottom surface connects；In addition, in local oscillator function scoreboard there are one the first connector 8 by cable 11 with it is micro-
The local oscillator input connector 9 of wave component tail end connects；Waterbaffle 14 in box body 1 space symmetrical above and below also has another
Vibration function scoreboard, connection and installation are as described above；
In this example, digiboard 4 is mounted on latter half of above the waterbaffle 14 in 1 internal upper part cavity of box body by screw
Point, there are multiple heating elements with the 4 bottom surface Denso of digiboard of 14 opposite side of waterbaffle, since calorific value is big, in box body 1
Waterbaffle 14 on process several and the sizable bulge-structure of heating element, heating element presses raised knot
Structure pastes heat-conducting pad between them, for reducing thermal contact resistance, improves water-cooled plate to the radiating efficiency of heating element.
In this example, power module 5 and power filter plate 6 are mounted under the water cooling in box body 1 in lower chamber by screw
Square latter half；Power module 5 is positioned close to local oscillator function scoreboard side, and power filter plate 6 is positioned close to microwave components tail
End；Digiboard 4, power module 5 and power filter plate 6 are connected by cable 11 with the second connector of microwave components tail end.
This programme is able to solve the heat dissipation problem at the big chip of heat flow density, meanwhile, it is capable to disposably solve in component
The heat dissipation problem of all components.This programme can in the rational deployment in effective volume space, place Imitating transmitting-receiving subassembly,
Each electric part structures such as digiboard, local oscillator power splitter part, power module for receiving transmitting digital signal, improve microwave group
The integrated level of part.
Although the preferred embodiment of the application has been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (10)
1. a kind of water-cooled microwave components, which is characterized in that the component includes: for accommodating radio-frequency devices (2) and local oscillator function point
The container of device (3)；
The container is divided into the first cavity and the second cavity by being equipped with the waterbaffle (14) of water-cooling channel；
The radio-frequency devices (2) connect with the local oscillator power splitter part (3), and are arranged in the first cavity and/or the second cavity；
The waterbaffle (14) is connected to external container, is microwave components heat dissipation by recirculated water cooling mode.
2. a kind of water-cooled microwave components according to claim 1, which is characterized in that the waterbaffle (14) is by setting
Enter water swivel and the water outlet connector set on container are connected to external container water source.
3. a kind of water-cooled microwave components according to claim 1, which is characterized in that the radio-frequency devices (2) include:
One radio-frequency module and the second radio-frequency module；
First radio-frequency module and the second radio-frequency module are separately positioned in the first cavity and the second cavity, and with the waterbaffle
(14) fixed.
4. a kind of water-cooled microwave components according to claim 3, which is characterized in that the radio-frequency module is equipped with protrusion
Structure, the bulge-structure are bonded with the waterbaffle (14).
5. a kind of water-cooled microwave components according to claim 3, which is characterized in that local oscillator power splitter part (3) packet
It includes: the first local oscillator function scoreboard and the second local oscillator function scoreboard；
The first local oscillator function scoreboard by the first connector (8) and the first radio-frequency module grafting, and be arranged on container
Local oscillator input connector (9) connection；
The second local oscillator function scoreboard by the first connector (8) and the second radio-frequency module grafting, and be arranged on container
Local oscillator input connector (9) connection.
6. a kind of water-cooled microwave components according to claim 1, which is characterized in that the component further include: setting exists
First cavity or the intracorporal digiboard of the second chamber (4)；The digiboard (4) and the waterbaffle (14) are fixed.
7. a kind of water-cooled microwave components according to claim 6, which is characterized in that the digiboard (4) is equipped with more
A heating element；The heating element is abutted against with the bulge-structure being set in advance on waterbaffle (14).
8. a kind of water-cooled microwave components according to claim 4 or 7, which is characterized in that the protrusion of the radio-frequency module
Heat-conducting piece is equipped between structure and the surface of waterbaffle (14) contact；And/or
It is equipped with and leads between heating element on the digiboard (4) and the bulge-structure being set in advance on waterbaffle (14)
Warmware.
9. a kind of water-cooled microwave components according to claim 1, which is characterized in that the component further include: setting exists
First cavity or the intracorporal power module of the second chamber (5) and power filter plate (6)；
The power module (5) and power filter plate (6) are fixed on waterbaffle (14).
10. a kind of water-cooled microwave components according to claim 6 or 9, which is characterized in that the digiboard (4), power supply
Module (5), the one or more of power filter plate (6) connect with the second connector being arranged on container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810888448.XA CN108990380A (en) | 2018-08-07 | 2018-08-07 | A kind of water-cooled microwave components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810888448.XA CN108990380A (en) | 2018-08-07 | 2018-08-07 | A kind of water-cooled microwave components |
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| Publication Number | Publication Date |
|---|---|
| CN108990380A true CN108990380A (en) | 2018-12-11 |
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ID=64555926
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810888448.XA Pending CN108990380A (en) | 2018-08-07 | 2018-08-07 | A kind of water-cooled microwave components |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854479A (en) * | 2019-11-26 | 2020-02-28 | 北京无线电测量研究所 | Microwave assembly |
| CN111031757A (en) * | 2019-12-20 | 2020-04-17 | 北京无线电测量研究所 | Microwave assembly |
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| US6903931B2 (en) * | 2002-06-13 | 2005-06-07 | Raytheon Company | Cold plate assembly |
| JP2009277694A (en) * | 2008-05-12 | 2009-11-26 | Mitsubishi Electric Corp | Liquid-cooled electronic apparatus |
| CN103592633A (en) * | 2013-11-20 | 2014-02-19 | 中国船舶重工集团公司第七二四研究所 | S-wave-band miniaturization digital T/R assembly design method |
| CN103945677A (en) * | 2014-05-05 | 2014-07-23 | 万建岗 | Double-faced heat source forced liquid cooling design of integrated TR (transmitter and receiver) module |
| CN106654645A (en) * | 2016-12-30 | 2017-05-10 | 上海航天科工电器研究院有限公司 | Interconnected commutated board card integration and heat dissipation integrated control box |
| CN107561504A (en) * | 2017-07-27 | 2018-01-09 | 中国船舶重工集团公司第七二四研究所 | A kind of multichannel T/R inside modules three-dimensional blindmate structure implementation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6903931B2 (en) * | 2002-06-13 | 2005-06-07 | Raytheon Company | Cold plate assembly |
| JP2009277694A (en) * | 2008-05-12 | 2009-11-26 | Mitsubishi Electric Corp | Liquid-cooled electronic apparatus |
| CN103592633A (en) * | 2013-11-20 | 2014-02-19 | 中国船舶重工集团公司第七二四研究所 | S-wave-band miniaturization digital T/R assembly design method |
| CN103945677A (en) * | 2014-05-05 | 2014-07-23 | 万建岗 | Double-faced heat source forced liquid cooling design of integrated TR (transmitter and receiver) module |
| CN106654645A (en) * | 2016-12-30 | 2017-05-10 | 上海航天科工电器研究院有限公司 | Interconnected commutated board card integration and heat dissipation integrated control box |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110854479A (en) * | 2019-11-26 | 2020-02-28 | 北京无线电测量研究所 | Microwave assembly |
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| CN111031757A (en) * | 2019-12-20 | 2020-04-17 | 北京无线电测量研究所 | Microwave assembly |
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Application publication date: 20181211 |