CN213637540U

CN213637540U - Inverter with sealed heat dissipation structure

Info

Publication number: CN213637540U
Application number: CN202021534262.3U
Authority: CN
Inventors: 虞明; 王威; 曹文峰; 沈翔刚; 钱波
Original assignee: Changzhou Anerwei New Energy Technology Co ltd
Current assignee: Changzhou Anerwei New Energy Technology Co ltd
Priority date: 2020-07-29
Filing date: 2020-07-29
Publication date: 2021-07-06
Anticipated expiration: 2030-07-29

Abstract

The utility model relates to an inverter with a sealed heat dissipation structure, which is provided with a columnar shell which is communicated from front to back, a front panel which is used for plugging the front port of the shell and a back panel which is used for plugging the back port of the shell; a circuit board distributed with components is arranged in the shell; a heat conducting device is arranged in the shell; the heat conduction device comprises a first heat conduction device and a second heat conduction device which is tightly attached to the chip; and a heat dissipation structure is arranged outside the shell. The utility model aims at overcoming the defect that prior art exists, provide an inverter with sealed heat radiation structure with waterproof, dustproof and can reduce the consumption.

Description

Inverter with sealed heat dissipation structure

Technical Field

The utility model relates to an inverter especially relates to an inverter with sealed heat radiation structure.

Background

An inverter is a device that converts direct current electric energy (batteries, storage batteries) into alternating current (generally 220v, 50HZ sine or square wave), and may also be referred to simply as a device that converts DC into AC. The inverter is named because 220V alternating current is generally rectified into direct current for use and the effect of the inverter is opposite to that of the direct current. The inverter consists of an inverter bridge, control logic and a filter circuit. In the current 'mobile' era, mobile leisure and entertainment of mobile office mobile communication requires not only low-voltage direct current supplied by a battery or a storage battery, but also 220V alternating current which is indispensable in daily environment, and an inverter can meet the requirement. However, the existing heat dissipation structure of the inverter has the problems of poor waterproof and dustproof performance, complex electrical structure, large power consumption and the like. It is therefore important to design an inverter with a sealed heat dissipation structure that is waterproof, dustproof, and can reduce power consumption.

Disclosure of Invention

The utility model aims at overcoming the defect that prior art exists, provide an inverter with sealed heat radiation structure with waterproof, dustproof and can reduce the consumption.

Realize the utility model discloses the technical scheme of purpose is: an inverter with a sealed heat dissipation structure is provided with a columnar shell which is penetrated through from front to back, a front panel used for plugging a front port of the shell and a rear panel used for plugging a rear port of the shell; a circuit board distributed with components is arranged in the shell; a heat conducting device is arranged in the shell; the heat conduction device comprises a first heat conduction device and a second heat conduction device which is installed and clings to the surface of the chip; heat-conducting glue is coated between the second heat-conducting device and the chip; and a heat dissipation structure is arranged outside the shell.

Furthermore, the first heat conduction device is composed of a plurality of first cooling fins which are parallel and vertically intersected with the same bottom plate plane.

Furthermore, the second heat conduction device is composed of a plurality of second cooling fins which are parallel and vertically intersected with the same bottom plate plane.

Furthermore, reinforcing ribs are arranged at the waist line of the shell and in the middle of the upper end surface and the lower end surface which are parallel to the waist line; the front end face and the rear end face of the reinforcing rib are provided with mounting holes for fixing the front panel and the rear panel.

Furthermore, a plurality of mutually parallel radiating fins are arranged between every two adjacent reinforcing ribs at equal intervals to form the radiating structure.

Further, the heat sink and the housing are integrally formed.

Further, the shell is made of cast aluminum materials in a pouring mode.

Furthermore, the first radiating fin, the second radiating fin and the radiating fins are all rectangular radiating fins.

After the technical scheme is adopted, the utility model discloses following positive effect has:

(1) the utility model discloses the shell adopts sealed structure, and the shell adopts cast aluminium material, and the surface design is peak valley structure, increase heat radiating area.

(2) The utility model discloses the inside first heat conduction device of passing to the inside chip heat through second heat conduction device of dc-to-ac converter, later through first heat conduction device with heat conduction to the shell, finally distribute the heat outside the shell through the fin on the shell, ensure the heat dispersion of dc-to-ac converter promptly, but realize good leakproofness and waterproof dirt-proof effect again.

(3) The utility model discloses save fan heat radiation structure, reduce the consumption, reduce electrical interference to reduce the fault rate.

Drawings

In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is given in conjunction with the accompanying drawings, in which

FIG. 1 is an overall exploded view of the present invention;

FIG. 2 is a general dispersion view of the present invention;

fig. 3 is an enlarged schematic structural diagram of a part a of the present invention.

The reference numbers in the drawings are as follows: the heat sink comprises a shell 10, a reinforcing rib 11, a mounting hole 12, a heat sink 13, a front panel 20, a rear panel 30, a first heat conduction device 40, a first heat sink 41, a second heat conduction device 50 and a second heat sink 51.

Detailed Description

(example 1)

Referring to fig. 1 to 3, the present invention has a cylindrical housing 10 penetrating from front to back, a front panel 20 for sealing the front end of the housing 10, and a rear panel 30 for sealing the rear end of the housing 10; a circuit board 60 with components is arranged in the shell 10, and the circuit board 60 is matched, locked and fixed with the bottom end part of the inner periphery of the shell 10 through bolts; a heat conducting device is arranged in the shell 10; the heat conducting device comprises a first heat conducting device 40 and a second heat conducting device 50 which is installed to be attached to the surface of the chip in a clinging mode, and the second heat conducting device 50 is in surface contact with the chip; a heat conducting glue is coated between the second heat conducting device 50 and the chip; a heat dissipation structure is disposed outside the housing 10.

More specifically, in the present embodiment, the first heat conducting device 40 is composed of a plurality of first heat dissipating fins 41 which are parallel to each other and perpendicularly intersect with the same base plate plane, and the first heat dissipating fins 41 are connected to the base plate by high frequency welding.

More specifically, in the present embodiment, the second heat conducting device 50 is composed of a plurality of second heat dissipating fins 51 which are parallel to each other and perpendicularly intersect with the same base plate plane, and the second heat dissipating fins 51 are connected to the base plate by high frequency welding.

In this embodiment, more specifically, the middle of the upper and lower end surfaces of the housing 10 at the waistline and parallel to the waistline is provided with the reinforcing ribs 11; mounting holes 12 for fixing the front panel 20 and the rear panel 30 are formed in the front end face and the rear end face of the reinforcing rib 11; the front panel 20 and the rear panel 30 are fastened to the front and rear ends of the housing 10 by bolts.

More specifically, in the present embodiment, a plurality of mutually parallel heat dissipation fins 13 are arranged between two adjacent reinforcing ribs 11 at equal intervals to form the heat dissipation structure.

More specifically, in the present embodiment, the heat sink 13 is integrally formed with the housing 10.

More specifically, in the present embodiment, the first heat sink 41, the second heat sink 51, and the heat sink 13 are all rectangular heat sinks.

More specifically, in this embodiment, the housing 10 is cast from a cast aluminum material.

The utility model discloses a theory of operation does: the inside of the inverter transfers the heat of the chip to the internal first heat conduction device 40 through the second heat conduction device 50, and then transfers the heat to the housing 10 through the first heat conduction device 40, and finally, the heat is radiated to the outside of the housing 10 through the heat radiation fins 13 on the housing 10.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. An inverter with a sealed heat dissipation structure comprises a cylindrical shell (10) which penetrates through the front and the back, a front panel (20) for sealing the front port of the shell (10) and a back panel (30) for sealing the back port of the shell (10); a circuit board (60) distributed with components is arranged in the shell (10); the method is characterized in that: a heat conducting device is arranged in the shell (10); the heat conducting device comprises a first heat conducting device (40) and a second heat conducting device (50) which is mounted on the surface of the chip in a clinging mode; heat-conducting glue is coated between the second heat-conducting device (50) and the chip; and a heat dissipation structure is arranged outside the shell (10).

2. The inverter with the sealed heat dissipation structure as recited in claim 1, wherein: the first heat conducting device (40) is composed of a plurality of first radiating fins (41) which are parallel and vertically intersected with the same bottom plate plane.

3. The inverter with the sealed heat dissipation structure as recited in claim 1, wherein: the second heat conducting device (50) is composed of a plurality of second radiating fins (51) which are parallel and vertically intersected with the same bottom plate plane.

4. The inverter with the sealed heat dissipation structure according to claim 1, 2 or 3, wherein: reinforcing ribs (11) are arranged at the waist line of the shell (10) and in the middle of the upper end surface and the lower end surface which are parallel to the waist line; the front end face and the rear end face of the reinforcing rib (11) are provided with mounting holes (12) used for fixing the front panel (20) and the rear panel (30).

5. The inverter with the sealed heat dissipation structure according to claim 4, wherein: a plurality of mutually parallel radiating fins (13) are arranged between every two adjacent reinforcing ribs (11) at equal intervals to form the radiating structure.

6. The inverter with the sealed heat dissipation structure according to claim 5, wherein: the radiating fins (13) and the shell (10) are integrally formed.

7. The inverter with the sealed heat dissipation structure as recited in claim 1, wherein: the shell (10) is made of cast aluminum materials in a pouring mode.

8. The inverter with the sealed heat dissipation structure according to claim 2, wherein: the first radiating fins (41) are rectangular radiating fins.

9. The inverter with the sealed heat dissipation structure as recited in claim 3, wherein: the second heat radiating fins (51) are rectangular heat radiating fins.

10. The inverter with the sealed heat dissipation structure according to claim 5, wherein: the radiating fins (13) are rectangular radiating fins.