CN220440979U - High etching factor secondary power supply circuit board - Google Patents

Abstract

The utility model discloses a high-etching-factor secondary power circuit board which comprises a circuit board body and a heat pipe, wherein the circuit board body comprises a high-etching-factor wiring layer and a substrate, the high-etching-factor wiring layer and the substrate are provided with heat dissipation layers, the heat pipe is in a serpentine shape and is attached to the top of the heat dissipation layers, two sides of the heat pipe are arranged outside the heat dissipation layers, a plurality of heat dissipation fins are fixedly connected to the positions, located outside the heat dissipation layers, of the two ends of the heat pipe, and a plurality of arc-shaped through grooves are formed in the bottom of the heat dissipation layers. According to the high-etching-factor secondary power circuit board, the heat generated by the circuit board body during working is quickly led down through the heat dissipation layer matched with the heat pipe and led out to the outside through the heat pipe, the contact area between the heat dissipation fins and the outside is increased, the heat dissipation is further accelerated, the arc-shaped through grooves are formed in the bottom of the heat dissipation layer, the contact area between the bottom of the heat dissipation layer and the outside air can be increased, and the heat dissipation rate is further improved.

Description

High etching factor Secondary power supply circuit board

Technical Field

The utility model belongs to the technical field of power circuit boards, and particularly relates to a high-etching-factor secondary power circuit board.

Background

The secondary power supply, i.e. the device for converting the electric energy of the main power supply into the electric energy of another form or specification, is used for meeting the requirements of different electric equipment. The direct-current voltage can be converted into alternating-current voltage or high-voltage direct-current voltage, and is a main component of a common emergency power supply.

The patent with the application number of CN202222369818.3 discloses a protective power circuit board which comprises a circuit board body, four side mounting protection plates are fixedly arranged at four edges of the circuit board body, protection plate mounting bases are arranged at intervals outside the side mounting protection plates, the left side and the right side of fastening screw hole fixedly connected with expelling parasite box, expelling parasite box's bottom inner wall bonds has places the collet, and places the upper surface of collet and fill has the mosquito repellent granule.

When the circuit board body is used, the side installation protection plate is installed, the side installation protection plate can be fixed through the protection plate installation base and the fastening threaded holes, then the sealing release film on the upper surface of the breathable film is torn, then mosquito-repellent particles inside the insect-repellent box can diffuse and expel mosquito smell through the breathable film, insects are driven away, the circuit board body cannot be bitten by the insects as much as possible, safety of the circuit board body in use is improved, but when the circuit board is used, heat generated when the circuit board works cannot be rapidly led out, and the power circuit board is easy to damage due to overhigh temperature in use.

Disclosure of Invention

In order to solve the technical problems, the utility model aims to provide a secondary power circuit board with high etching factor, so as to solve the technical defect that the conventional power circuit board cannot rapidly conduct out the heat generated during the operation of the circuit board, and the power circuit board is easy to damage due to overhigh temperature during the use.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a high etching factor secondary power supply circuit board, includes circuit board body and heat pipe, circuit board body is including high etching factor wiring layer and base plate, high etching factor wiring layer with the base plate is provided with the heat dissipation layer, the heat pipe is the snakelike laminating at the top of heat dissipation layer, the both sides of heat pipe all set up the outside of heat dissipation layer.

As a preferable scheme of the utility model, the heat dissipation layer is a graphene heat conduction layer, and a heat conduction insulating layer is arranged between the heat dissipation layer and the high etching factor wiring layer.

As a further scheme of the utility model, the heat-conducting insulating layer is a heat-conducting silicone grease layer.

As a further preferable scheme of the utility model, a plurality of radiating fins are fixedly connected to the positions, which are positioned outside the radiating layer, of the two ends of the heat pipe.

As a further scheme of the utility model, a plurality of arc-shaped through grooves are formed in the bottom of the heat dissipation layer.

As a further scheme of the utility model, the top of the circuit board body is provided with a mounting hole.

Compared with the prior art, the high-etching-factor secondary power circuit board provided by the utility model has the following beneficial effects: the heat generated by the circuit board body during working can be quickly led down through the heat dissipation layer matched with the heat pipe, and is led out to the outside through the heat pipe, and the contact area between the heat dissipation layer and the outside is increased through the heat dissipation fins, so that the heat dissipation is accelerated; the arc through groove is formed in the bottom of the heat dissipation layer, so that the contact area between the bottom of the heat dissipation layer and the outside air can be increased, and the heat dissipation rate is further improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only examples of embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an embodiment of the present utility model;

FIG. 2 is a schematic view of a partial explosion structure according to an embodiment of the present utility model;

fig. 3 is an enlarged schematic view of the structure at a in fig. 1.

Reference numerals:

1. a circuit board body; 101. a high etching factor wiring layer; 102. a thermally conductive silicone grease layer; 103. a heat dissipation layer; 104. a substrate; 2. a mounting hole; 3. a heat pipe; 4. a heat radiation fin; 5. arc through groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the implementation routine of the present utility model is provided with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the description of the embodiments of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "inner", "outer", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model.

In the description of the embodiments of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, integrally connected, or detachably connected; may be a communication between the interiors of two elements; either directly or indirectly through intermediaries, the specific meaning of the terms in the embodiments of the utility model will be understood by those skilled in the art in the specific case.

Referring to fig. 1-3, an embodiment of the present utility model provides a high etching factor secondary power circuit board, which includes a circuit board body 1 and a heat pipe 3.

The mounting hole 2 has been seted up at the top of circuit board body 1, and then make things convenient for the fixed of circuit board body 1, circuit board body 1 includes that high etching factor walks line layer 101 and base plate 104, and wherein high etching factor walks line layer 101 adopts the copper foil layer, leads to having good heat conductivility, and the etching is comparatively ripe moreover, and etching effect is good, and high etching factor walks line layer 101 and base plate 104 and is provided with heat dissipation layer 103, and heat pipe 3 is the serpentine laminating at the top of heat dissipation layer 103, and the both sides of heat pipe 3 all set up in the outside of heat dissipation layer 103.

The high etching factor secondary power circuit board adopting the technical scheme is composed of the circuit board body 1 and the heat pipe 3, heat generated during operation of the circuit board body 1 can be quickly led down through the heat dissipation layer 103 matched with the heat pipe 3, and is led out to the outside through the heat pipe 3, the contact area between the heat dissipation fin 4 and the outside is increased, and heat dissipation is further accelerated.

In order to ensure heat conduction efficiency, the heat dissipation layer 103 is a graphene heat conduction layer, and a heat conduction insulating layer 102 is arranged between the heat dissipation layer 103 and the high-etching-factor wiring layer 101 so as to avoid that the graphene layer interferes with normal operation of a circuit.

The heat conduction insulating layer 102 is a heat conduction silicone grease layer, and the heat dissipation layer 103 and the high etching factor wiring layer 101 are tightly attached through the heat conduction silicone grease layer, so that the heat conduction effect is ensured.

The parts of the two ends of the heat pipe 3 outside the heat dissipation layer 103 are fixedly connected with a plurality of heat dissipation fins 4, and the heat dissipation fins 4 increase the contact area with the outside, so that the heat dissipation is accelerated.

A plurality of arc through grooves 5 are formed in the bottom of the heat dissipation layer 103, and the arc through grooves 5 increase the contact area between the bottom of the heat dissipation layer 103 and the outside air, so that the heat dissipation rate is further improved.

To sum up: the heat dissipation layer 103 is matched with the heat pipe 3, so that heat generated by the circuit board body 1 during working can be quickly led down and led out to the outside through the heat pipe 3, and the contact area between the heat dissipation layer and the outside is increased through the heat dissipation fins 4, so that the heat dissipation is accelerated; an arc through groove 5 is formed at the bottom of the heat dissipation layer 103 to increase the contact area between the bottom of the heat dissipation layer 103 and the outside air, and further improve the heat dissipation rate.

While the basic principles of the present utility model have been shown and described, the foregoing is provided by way of illustration of a preferred embodiment of the utility model, and not by way of limitation, the foregoing embodiment and description are merely illustrative of the principles of the utility model, and any modifications, equivalents, improvements or modifications not within the spirit and scope of the utility model should be included within the scope of the utility model.

Claims (6)

1. The utility model provides a high etching factor secondary power circuit board, includes circuit board body and heat pipe (3), its characterized in that: the circuit board body (1) comprises a high-etching-factor wiring layer (101) and a substrate (104), the high-etching-factor wiring layer (101) and the substrate (104) are provided with a heat dissipation layer (103), the heat pipe (3) is in serpentine fit with the top of the heat dissipation layer (103), and both sides of the heat pipe (3) are arranged outside the heat dissipation layer (103).

2. The high etching factor secondary power circuit board of claim 1, wherein: the heat dissipation layer (103) is a graphene heat conduction layer, and a heat conduction insulating layer (102) is arranged between the heat dissipation layer (103) and the high-etching-factor wiring layer (101).

3. The high etching factor secondary power wiring board as claimed in claim 2, wherein: the heat-conducting insulating layer (102) is a heat-conducting silicone grease layer.

4. A high etching factor secondary power wiring board as described in claim 3, wherein: and the parts of the two ends of the heat pipe (3) outside the heat dissipation layer (103) are fixedly connected with a plurality of heat dissipation fins (4).

5. The high etching factor secondary power circuit board of claim 4, wherein: a plurality of arc-shaped through grooves (5) are formed in the bottom of the heat dissipation layer (103).

6. The high etching factor secondary power wiring board as claimed in claim 2, wherein: the top of the circuit board body (1) is provided with a mounting hole (2).