CN220965478U - High heat conduction quick heat dissipation phase transition temperature regulating device - Google Patents
High heat conduction quick heat dissipation phase transition temperature regulating device Download PDFInfo
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- CN220965478U CN220965478U CN202323057112.4U CN202323057112U CN220965478U CN 220965478 U CN220965478 U CN 220965478U CN 202323057112 U CN202323057112 U CN 202323057112U CN 220965478 U CN220965478 U CN 220965478U
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- heat
- phase
- radiator
- heat conduction
- phase change
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- 230000017525 heat dissipation Effects 0.000 title claims description 30
- 230000001105 regulatory effect Effects 0.000 title claims description 4
- 230000007704 transition Effects 0.000 title claims description 4
- 239000012782 phase change material Substances 0.000 claims abstract description 23
- 230000008859 change Effects 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims description 7
- 238000004064 recycling Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000005338 heat storage Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 238000009924 canning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of phase-change temperature control technology, and particularly discloses a high-heat-conductivity rapid-radiating phase-change temperature control device which comprises a filling cavity, wherein phase-change materials are filled in the filling cavity, a shell is arranged outside the filling cavity, a heat-conducting member is embedded on the surface of the shell, and a fixedly-installed radiator is arranged on the surface of the shell embedded with the heat-conducting member. The heat source generated by the heat source surface is utilized to store heat by utilizing the phase change of the phase change material in the filling cavity, the heat stored by the phase change material is dispersed by utilizing the characteristic of high heat conductivity of the heat pipe serving as a heat conduction member, and then the heat is radiated by utilizing the dual and rapid way of the fan and the radiator, so that the overall heat flow density is reduced, the heat radiation efficiency of the device is improved, and the recycling efficiency of the phase change material is improved; the heat conducting member solves the problem of poor heat conductivity of the phase change material.
Description
Technical Field
The utility model relates to the technical field of phase-change temperature control technology, in particular to a high-heat-conductivity rapid-heat-dissipation phase-change temperature control device.
Background
With the progress of modern electronics, optics and other technologies and the improvement of the requirements on aerospace flight tasks, a series of high-power components with ultrahigh heat flux density and short-time and intermittent operation appear, the most widely applied at present is to solve the problems by using PCM phase change, the PCM phase change energy storage device has good thermostability and huge phase change latent heat, and is widely applied to aviation, aerospace, microelectronics and other systems at home and abroad, but the commonly used PCM generally has the defects of low heat conductivity, low heat dissipation efficiency and the like (after the phase change of the existing energy storage product is completed, the heat dissipation is at least required to be more than 4 hours below a phase change point), in order to improve the heat conduction performance of the phase change heat storage device, a copper-aluminum heat deposition heat storage mode is generally adopted for directly canning phase change materials in a heat storage shell, or a heat storage mode is adopted for canning phase change materials after heat conduction ribs are added in the shell, the heat storage weight of the copper-aluminum heat deposition mode is high, the heat storage density is low, and the two modes generally have the defect of low heat conduction performance directly influences the recycling efficiency of the heat storage product, and the requirements on the high-tech system and equipment of continuous and continuous updating are still difficult to meet.
Disclosure of utility model
The utility model aims to solve the technical problems of the prior art by providing a phase change temperature control device with high heat conduction and rapid heat dissipation.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a quick heat dissipation phase transition temperature regulating device of high heat conduction, includes the material filling chamber, the material filling intracavity portion filling phase change material, the material filling chamber outside is equipped with the casing, the casing surface has inlayed heat conduction component, the casing surface is equipped with the reservation recess, be equipped with the heat conduction filler in the reservation recess, the heat conduction component is installed in the reservation recess, has inlayed the casing surface of heat conduction component is equipped with fixed mounting's radiator.
Preferably, the heat conductive member is a heat pipe.
Preferably, a cover plate is provided between the heat sink and the surface of the case in which the heat conductive member is embedded.
Preferably, the radiator is a fin radiator, and a fan is arranged on the radiator.
Preferably, a filling port communicated with the filling cavity is arranged on one side of the shell.
Preferably, an end of the housing, which is far away from the radiator, is a heat source surface.
The utility model has the beneficial effects that:
The heat source generated by the heat source surface is utilized to store heat by utilizing the phase change of the phase change material in the filling cavity, the heat stored by the phase change material is dispersed by utilizing the characteristic of high heat conductivity of the heat pipe serving as a heat conduction member, and then the heat is radiated by utilizing the dual and rapid way of the fan and the radiator, so that the overall heat flow density is reduced, the heat radiation efficiency of the device is improved, and the recycling efficiency of the phase change material is improved; the phase change material is used for heat storage, the heat storage density of the phase change material is 5-10 times that of the common material, and the heat storage capacity is strong; the heat conducting member solves the problem of poor heat conductivity of the phase change material.
Drawings
For ease of illustration, the utility model is described in detail by the following detailed description and the accompanying drawings.
Fig. 1 is a schematic structural view of the present embodiment;
fig. 2 is a schematic structural view of a cross-sectional view of the housing of the present embodiment.
In the figure: 1-a filling cavity;
2-a housing; 21-reserving grooves; 22-a filling port;
3-a heat conductive member;
4-a heat sink;
5-cover plate;
6-a fan.
Detailed Description
The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments; in the following description, specific details such as specific configurations and components are provided merely to facilitate a thorough understanding of embodiments of the utility model. It will therefore be apparent to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the utility model. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
In addition, the embodiments of the present utility model and the features of the embodiments may be combined with each other without collision.
As shown in fig. 1-2, the high-heat-conductivity rapid heat-dissipation phase-change temperature control device provided by the embodiment comprises a filling cavity 1, phase-change materials are filled in the filling cavity 1, a shell 2 is arranged outside the filling cavity 1, the shell 2 plays a certain role in protecting the inside filling cavity 1, a filling opening 22 connected with the filling cavity 1 is arranged on one side of the shell 2, the phase-change materials are filled in the filling cavity 1 through the filling opening 22, after the phase-change materials are filled, the filling opening 22 needs to be packaged, the packaging of the filling opening 22 can avoid the mass change and leakage of the phase-change materials, the stability of the device in use can be guaranteed to a certain extent, a plurality of reserved grooves 21 are formed in the upper surface of the shell 2, a heat conduction member 3 is arranged in the reserved grooves 21, the heat conduction member 3 is embedded in the upper surface of the shell 2, the shell 2 is embedded with a heat pipe, a cover plate 5 fixedly arranged on the upper surface of the shell 2 through screws, a radiator 4 fixedly arranged on the cover plate 5 is arranged on the upper surface of the cover plate 5, a fan 6 fixedly connected with the radiator, the main heat-change materials can be prevented from being changed, the heat-dissipation device can be used for heat-dissipation performance of the heat-change materials is improved, the heat-dissipation device can be used for heat-dissipation performance of the heat-dissipation device, and the heat-dissipation device is used for heat-dissipation performance of the heat-dissipation device is improved, and the heat-dissipation efficiency is used for heat-dissipation performance of heat-dissipation device is used.
Further, the reserved groove 21 is internally provided with a trace heat conduction filler before the heat conduction member 3 is installed, the heat conduction filler is heat conduction silicone grease, the heat conduction member 3 and the trace heat conduction filler are embedded into the reserved groove 21 through interference fit, the heat conduction silicone grease serving as the heat conduction filler is also filled on the upper surface after the heat conduction member 3 is installed, the heat conduction filler can promote heat conduction and heat dissipation, the heat conduction efficiency is improved as a high heat conduction medium, the radiator 4 is a fin radiator, the fin radiator has a larger heat dissipation surface area, heat conduction and heat dissipation can be accelerated, the fan 6 is matched for double heat dissipation, the overall heat dissipation efficiency of the device is improved, the recycling efficiency of the phase change material is improved, meanwhile, the problem that the heat conduction of the phase change material is poor is solved, the bottom of the shell 2 is a heat source surface, when the heat of an external heat source is conducted to the phase change material in the filling cavity 1 through the bottom of the shell 2, the phase change material generates phase change, at the moment, the heat flow density above the shell 2 is increased, the heat conduction member 3 can disperse the heat above the shell 2, the heat is finally conducted to the radiator 4 through the cover plate 5, the fin radiator is utilized as the radiator 4, the heat dissipation area is increased, the forced heat dissipation area is increased, the double heat dissipation heat source is matched with the fan, and the forced heat dissipation density is high, and the forced heat dissipation density is avoided.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the application or exceeding the scope of the application as defined in the accompanying claims.
Claims (6)
1. The utility model provides a high heat conduction quick heat dissipation phase transition temperature regulating device which characterized in that includes: the filling cavity (1), filling cavity (1) inside filling phase change material, filling cavity (1) outside is equipped with casing (2), casing (2) surface has inlayed heat conduction component (3), casing (2) surface is equipped with reservation recess (21), be equipped with the heat conduction filler in reservation recess (21), heat conduction component (3) are installed in reservation recess (21), have inlayed casing (2) surface of heat conduction component (3) is equipped with fixed mounting radiator (4).
2. The rapid thermal dissipation phase change temperature control device with high thermal conductivity according to claim 1, wherein the heat conducting member (3) is a heat pipe.
3. The high-heat-conductivity rapid-radiating phase-change temperature control device according to claim 1, wherein a cover plate (5) is arranged between the surface of the shell (2) embedded with the heat-conducting member (3) and the radiator (4).
4. The high-heat-conductivity rapid-radiating phase-change temperature control device according to claim 1, wherein the radiator (4) is a fin radiator, and a fan (6) is arranged on the radiator (4).
5. The high-heat-conductivity rapid-radiating phase-change temperature control device according to claim 1, wherein a filling port (22) communicated with the filling cavity (1) is arranged on one side of the shell (2).
6. The rapid heat dissipation phase change temperature control device with high heat conduction as claimed in claim 1, wherein one end of the shell (2) far away from the radiator (4) is a heat source surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323057112.4U CN220965478U (en) | 2023-11-13 | 2023-11-13 | High heat conduction quick heat dissipation phase transition temperature regulating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323057112.4U CN220965478U (en) | 2023-11-13 | 2023-11-13 | High heat conduction quick heat dissipation phase transition temperature regulating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220965478U true CN220965478U (en) | 2024-05-14 |
Family
ID=91008923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323057112.4U Active CN220965478U (en) | 2023-11-13 | 2023-11-13 | High heat conduction quick heat dissipation phase transition temperature regulating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220965478U (en) |
-
2023
- 2023-11-13 CN CN202323057112.4U patent/CN220965478U/en active Active
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