CN213071103U - Integrated chip, electric control assembly and air conditioner - Google Patents

Integrated chip, electric control assembly and air conditioner Download PDF

Info

Publication number
CN213071103U
CN213071103U CN202022110037.3U CN202022110037U CN213071103U CN 213071103 U CN213071103 U CN 213071103U CN 202022110037 U CN202022110037 U CN 202022110037U CN 213071103 U CN213071103 U CN 213071103U
Authority
CN
China
Prior art keywords
chip
mounting
integrated chip
conductive
mounting bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202022110037.3U
Other languages
Chinese (zh)
Inventor
严允健
苏宇泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiken Semiconductor Technology Co ltd
Original Assignee
GD Midea Air Conditioning Equipment Co Ltd
Chongqing Midea Refrigeration Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GD Midea Air Conditioning Equipment Co Ltd, Chongqing Midea Refrigeration Equipment Co Ltd filed Critical GD Midea Air Conditioning Equipment Co Ltd
Priority to CN202022110037.3U priority Critical patent/CN213071103U/en
Application granted granted Critical
Publication of CN213071103U publication Critical patent/CN213071103U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The utility model discloses an integrated chip, automatically controlled subassembly and air conditioner, this integrated chip includes: the chip packaging structure is provided with a conductive connecting part; the mounting support is provided with a containing groove, the chip packaging structure is contained in the containing groove, mounting pins are arranged on the bottom wall of the containing groove corresponding to the conductive connecting parts, and the mounting pins are detachably and electrically connected with the conductive connecting parts. The utility model discloses be favorable to improving integrated chip's installation and convenience of use, can also avoid damaging the chip when changing simultaneously, be favorable to improving the chip reliability.

Description

Integrated chip, electric control assembly and air conditioner
Technical Field
The utility model relates to an electronic circuit technical field, in particular to integrated chip, automatically controlled subassembly and air conditioner.
Background
In recent years, with the rapid development of portable electronic components in the fields of mobile communication and mobile computers, small-sized packaging and high-density assembly technologies have been developed greatly; meanwhile, a series of strict requirements are provided for the packaging technology, such as chip structure reinforcement, so that the chip can be replaced more easily, and the overall cost is effectively reduced. The qfn (quad Flat No Lead package) type multi-coil IC chip flip-chip packaging technology is a new type of micro high-density packaging technology developed in recent years, and is one of the most advanced surface mount packaging technologies. However, this packaging technique has no plug structure, and if the chip is broken, it can only be blown off physically, which is likely to cause machine damage to the chip.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an integrated chip, automatically controlled subassembly and air conditioner, aim at improving integrated chip's installation and convenience of use.
In order to achieve the above object, the present invention provides an integrated chip, which comprises:
the chip packaging structure is provided with a conductive connecting part; and
the chip packaging structure comprises a mounting support, wherein the mounting support is provided with a containing groove, the chip packaging structure is contained in the containing groove, a mounting pin is arranged on the bottom wall of the containing groove corresponding to the conductive connecting part, and the mounting pin is detachably and electrically connected with the conductive connecting part.
Optionally, the chip package structure further includes:
the mounting substrate is provided with a first side surface and a second side surface which are arranged oppositely, and the second side surface is provided with a first mounting position and a second mounting position;
the chip body is arranged on the first mounting position;
one end of the conductive connecting part is arranged on the second mounting position.
Optionally, the conductive connection portion includes:
the fixed connecting section is arranged on the second mounting position and is fixedly connected with the mounting substrate;
and the coupling connecting section extends from one end, far away from the mounting substrate, of the fixed connecting section, and the coupling connecting section is detachably and electrically connected with the mounting pin.
Optionally, the conductive connecting portion is disposed in a U shape, or in an L shape, or the conductive connecting portion is disposed in a straight shape.
Optionally, the chip package structure further includes a package housing, the conductive connecting portion is packaged in the package housing, and at least a portion of the conductive connecting portion is protruded on a surface of the package housing.
Optionally, the mounting pin includes a contact portion disposed in the accommodating groove and a pin portion penetrating through the bottom wall of the mounting bracket, and the contact portion is detachably and electrically connected to the conductive connection portion;
the contact part and the pin part are connected in a T shape.
Optionally, the bottom wall of the mounting bracket is provided with a first groove and a mounting hole, the first groove penetrates through the bottom wall, the contact portion is embedded in the first groove, and the pin portion extends out of the mounting hole.
Optionally, the height of the contact portion in the first groove is lower than the height of the notch of the first groove to form a second groove, and the portion of the conductive connection portion protruding from the surface of the package housing is mounted in the second groove.
Optionally, a positioning gap is provided on a side wall of the accommodating groove of the mounting bracket, so that the chip packaging structure can be positioned when being mounted to the mounting bracket.
Optionally, a positioning portion is further disposed on the chip packaging structure, and the positioning portion corresponds to the positioning gap.
Optionally, the chip packaging structure and the mounting bracket are respectively provided with a fixed connection portion, and the chip packaging structure and the mounting bracket are fixedly connected through the fixed connection portion.
The utility model also provides an electric control component, which comprises an electric control board and the integrated chip; the integrated chip is arranged on the electric control board.
The utility model also provides an air conditioner, which comprises the integrated chip; and/or the air conditioner comprises the electric control assembly.
The integrated chip of the utility model is provided with a chip packaging structure and a mounting bracket by arranging the integrated chip into two parts, and the chip packaging structure is provided with a conductive connecting part; and arranging a containing groove on the mounting support so as to contain the chip packaging structure in the containing groove, and arranging a mounting pin at the position, corresponding to the conductive connecting part, of the bottom wall of the containing groove, so that the mounting pin is detachably and electrically connected with the conductive connecting part. The utility model discloses can realize that two parts of chip packaging structure and installing support can dismantle the electricity and connect to back on installing support installation to automatically controlled board, again with chip packaging structure installation to the mounting groove of installing support in, need update the software program at integrated chip, or overhaul, when changing, only need change chip packaging structure, and need not to dismantle the installing support from automatically controlled board and get off, be favorable to integrated chip's installation and use, can also avoid damaging the chip when changing simultaneously, be favorable to improving the chip reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of an integrated chip according to the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of an integrated chip according to the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a mounting bracket in an integrated chip according to the present invention;
fig. 4 is a schematic structural diagram of an embodiment of a chip package structure in an integrated chip according to the present invention.
The reference numbers illustrate:
Figure BDA0002697686440000031
Figure BDA0002697686440000041
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The utility model provides an integrated chip.
Referring to fig. 1, in an embodiment of the present invention, the integrated chip includes:
the chip package structure 100, wherein a conductive connection portion 130 is arranged on the chip package structure 100; and
the mounting bracket 200 has a receiving groove 210, the chip package structure 100 is received in the receiving groove 210, a mounting pin 220 is disposed on a bottom wall of the receiving groove 210 corresponding to the conductive connection portion 130, and the mounting pin 220 is detachably and electrically connected to the conductive connection portion 130.
In this embodiment, the chip package structure 100 further includes:
a mounting substrate 110, wherein the mounting substrate 110 has a first side surface and a second side surface which are oppositely arranged, and the second side surface is provided with a first mounting position and a second mounting position;
a chip body 120 disposed on the first mounting position;
one end of the conductive connecting portion 130 is disposed on the second mounting position.
In this embodiment, the mounting substrate 110 may be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate. The mounting substrate 110 is a mounting carrier of the chip body 120, and the shape of the mounting substrate 110 may be determined according to the specific position, number and size of the chip body 120, and may be a square, but is not limited to a square. The mounting substrate 110 is provided with a circuit wiring layer, and the circuit wiring layer forms corresponding lines and mounting positions, i.e., pads, for mounting each electronic component in the chip body 120 on the mounting substrate 110 according to the circuit design of the integrated chip.
When the mounting substrate 110 is implemented using the aluminum nitride ceramic mounting substrate 110, the aluminum nitride ceramic mounting substrate 110 includes an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When the mounting substrate 110 made of a metal material is used, the mounting substrate 110 includes a metal heat dissipation mounting substrate 110, an insulating layer laid on the metal heat dissipation mounting substrate 110, and a circuit wiring layer formed on the insulating layer. The insulating layer is sandwiched between the circuit wiring layer and the metal mounting substrate 110, and is used for realizing electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate 110 and reflecting external electromagnetic interference, so that the external electromagnetic radiation is prevented from interfering with the normal operation of the chip body 120, and the interference influence of the electromagnetic radiation in the surrounding environment on electronic elements in the integrated chip is reduced. The insulating layer may be made of thermoplastic glue or thermosetting glue, so as to achieve the fixed connection and insulation between the mounting substrate 110 and the circuit wiring layer. The insulating layer can be realized by a high-heat-conductivity insulating layer which is realized by mixing one or more materials of epoxy resin, aluminum oxide and high-heat-conductivity filling material. In the process of manufacturing the mounting substrate 110, after an insulating layer is provided on the mounting substrate 110, a copper foil may be laid on the insulating layer, and the copper foil may be etched according to a predetermined circuit design, thereby forming a circuit wiring layer. The chip body 120 and the chip pins are electrically connected through the circuit wiring layer, a metal lead is not required to be arranged, and the problem that the chip fails and cannot be used due to the breakage of the metal lead can be prevented.
The mounting substrate 110 may be a single-sided wiring board, that is, the first mounting location and the second mounting location are disposed on the same side of the mounting substrate 110, and the first mounting location and the second mounting location are connected by a circuit wiring layer. Or a double-sided board is used, wherein the first mounting position and the second mounting position are respectively arranged at two sides of the mounting substrate 110. In this embodiment, a double-sided board may be optionally used to implement the electrical connection, and the chip body 120 and the conductive connection portion 130 may be electrically connected through a jumper wire, that is, a metal binding wire, or a conductive hole is disposed on the double-sided board, and the chip body 120 and the conductive connection portion 130 are electrically connected through the conductive hole. In addition, the copper foil circuit can be added in the mounting substrate 110, and the later upgrading can be prepared.
The chip body 120 may be a surface mount electronic component or a bare die wafer, a bonding pad is disposed on the mounting substrate 110, and the chip body 120 may be bonded to the bonding pad formed on the mounting substrate 110 by solder, conductive adhesive, or the like. The present embodiment may optionally be implemented by a flip-chip packaged half-package chip. The integrated chip can be any semiconductor device, and the embodiment can be selectively applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment and the like, in particular to variable-frequency household appliances. The integrated chip can be a driving chip to drive an inverter circuit composed of a plurality of power tubes to work, and in practical application, the driving chip outputs corresponding PWM control signals to drive and control the corresponding power switch tubes to be switched on/off, so that driving electric energy is output to drive a motor and other loads to work.
The integrated chip may also be a main control chip, such as an MCU of an outdoor unit and an indoor unit of an air conditioner, and the like, in which a logic controller, a memory, a data processor, and the like, and a software program and/or module stored on the memory and operable on the data processor are integrated, and the MCU outputs a corresponding control signal to a driving chip of the intelligent power module by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so that the driving chip drives the corresponding power switching tube to be turned on/off according to the received control signal, so as to drive a fan, a compressor, a motor, and other loads to operate. Or the PFC module is driven to work, so that power factor correction of the accessed direct-current power supply is realized.
The conductive connection part 130 is used for electrically connecting the chip body 120 with an external circuit through the mounting pins 220, and the conductive connection part 130 can be realized by beryllium copper alloy pins so as to improve the heat dissipation efficiency, high hardness and wear resistance, high creep resistance and corrosion resistance, excellent mechanical and physical properties, high annealing resistance and excellent wear resistance of the integrated chip. High hardness and high wear resistance, and can further prolong the service life of the integrated chip. And the tensile strength, the yield strength and the hardness are all proper values, so that the steel has good processability. The conductivity can be good at high temperature, so that the integrated chip can work at high temperature and other extreme environments, and the application range of the integrated chip is favorably improved. The number of the conductive connection portions 130 is plural, and the plurality of chip pins are disposed along the width direction of the chip package structure 100 and are respectively disposed at two sides of the length direction. Of course, the conductive connection portion 130 may be disposed around the chip package structure 100 or disposed in a length direction of the package structure, which is not limited herein.
The mounting pins 220 of the mounting bracket 200 are used for connecting and fixing the integrated chip and the electronic control board. The number of circuit pins can be adjusted to adapt to different numbers, the mounting pins 220 can be electrically connected with the conductive connecting portions 130 of the chip package structure 100 in a detachable manner, and the specific mounting pins 220 can be electrically connected with the conductive connecting portions 130 of the chip package structure 100 in a contact manner. After the mounting bracket 200 is disposed on the electric control board, the chip package structure 100 is mounted in the mounting bracket 200, and the mounting pins 220 and the conductive connecting portion 130 can be implemented by metal clips, pogo pins, etc. to increase the contact area between them and achieve good connection. The mounting bracket 200 is disposed such that the conductive connection portion 130 of the chip package structure 100 can be electrically connected to the electronic control board through the mounting pin 220. The mounting bracket 200 and the chip packaging structure 100 are detachably arranged, so that when the chip packaging structure 100 needs to be replaced, detected or updated, the chip packaging structure 100 is directly taken out from the mounting bracket 200, the mounting bracket 200 is still fixedly arranged on the electric control board, and the chip packaging structure 100 can be separated from the electric control board. Compare in directly with fixed the setting on automatically controlled board of chip package structure 100, when chip package structure 100 needs to be changed, need just can realize the separation through instruments such as welder, hot blast, lead to the chip to produce the machine damage, can dismantle between the chip package structure 100 of this embodiment and the installing support 200 and be connected, need not to follow automatically controlled board with installing support 200 and detach, can avoid the damage of chip package structure 100. The load-bearing capacity of the integrated chip can be reduced by arranging the mounting bracket 200, and the chip packaging structure 100 can be prevented from being extruded and deformed or damaged when the integrated chip is mounted on the electric control board.
The integrated chip of the utility model is arranged into the chip packaging structure 100 and the mounting bracket 200, and the chip packaging structure 100 is provided with the conductive connecting part 130; and arranging a receiving groove 210 on the mounting bracket 200 to receive the chip package structure 100 in the receiving groove 210, and arranging a mounting pin 220 on a position of the bottom wall of the receiving groove 210 corresponding to the conductive connection portion 130, so that the mounting pin 220 is detachably and electrically connected to the conductive connection portion 130. The utility model discloses can realize that chip packaging structure 100 and two parts of installing support 200 can dismantle the electricity and connect, thereby after installing support 200 to automatically controlled board, install chip packaging structure 100 to the mounting groove of installing support 200 again, need update the software program at integrated chip, or overhaul, when changing, only need change chip packaging structure 100, and need not to dismantle installing support 200 from automatically controlled board, be favorable to integrated chip's installation and use, can also avoid damaging the chip when changing simultaneously, be favorable to improving the chip reliability.
In one embodiment, the conductive connection part 130 includes:
a fixed connection section 131 disposed on the second mounting position, wherein the fixed connection section 131 is fixedly connected to the mounting substrate 110;
a coupling segment 132 extending from an end of the fixed connecting segment 131 away from the mounting substrate 110, the coupling segment 132 abutting against the mounting pin 220.
In this embodiment, the coupling connection segment 132 is used to fixedly electrically connect the chip package structure 100 to the mounting bracket 200, and the fixed connection segment 131 is used to electrically connect the conductive connection portion 130 to the mounting substrate 110 to electrically connect the chip body 120 and the mounting bracket 200, so that when the mounting bracket 200 is soldered to the electronic control board, the chip body 120 is electrically connected to the electronic control board through the conductive connection and the mounting pins 220 of the mounting bracket 200. The conductive connection portion 130 is further provided with a lead connection portion 133, and the lead connection portion 133 electrically connects the conductive connection portion 130 and the chip body 120 through a lead. The lead connecting portion 133, the coupling connecting section 132 and the fixing connecting section 131 are integrally disposed therebetween and electrically connected. The lead connecting portion 133 and the fixed connecting section 131 are respectively provided at both ends of the coupling connecting section 132. The conductive connecting portion 130 is disposed in a U shape, or in an L shape, or the conductive connecting portion 130 is disposed in a line shape. So set up, can improve the area of contact between coupling connection section 132 and the installation pin 220 to and improve the joint strength between fixed connection section 131 and installing support 200, can also improve integrated chip's compressive capacity simultaneously, further prevent that the chip from splitting when falling.
In an embodiment, the chip package structure 100 further includes a package housing 140, the conductive connecting portion 130 is packaged in the package housing 140, and at least a portion of the conductive connecting portion 130 is protruded from a surface of the package housing 140.
In this embodiment, the package housing 140 may be made of epoxy resin, aluminum oxide, and a heat conductive filling material, wherein the heat conductive filling material may be boron nitride or aluminum nitride, and the aluminum nitride and the boron nitride have good insulation, high thermal conductivity, good heat resistance, and good thermal conductivity, so that the aluminum nitride and the boron nitride have high heat transfer capability. When the package case 140 is manufactured, materials such as epoxy resin, aluminum oxide, boron nitride, aluminum nitride or the like may be mixed, and then the mixed package material is heated; after cooling, the packaging material is crushed, the packaging shell 140 is formed by rolling through an ingot molding process to form the packaging shell 140, and the chip body 120 and the mounting substrate 110 are packaged in the packaging shell 140. Or the mounting substrate 110 with the chip mounted thereon is placed in a mold through an injection molding process and a packaging mold, and then a packaging material is injected into the mold to package the chip and the mounting substrate 110 in the package housing 140, so as to form the package housing 140 after molding. Therefore, the chip can be insulated, and the EMI performance of the integrated chip can be improved.
The chip pins 30 of the present embodiment are packaged in the package housing 140, and integrally disposed with the package housing 140, the chip body 120 and the mounting substrate 110, only the coupling connection segments 132 are partially exposed on the surface of the package housing 140, compared to the gull-wing-shaped pins and the straight pins, the conductive connection portion 130 of the chip package structure 100 of the present embodiment is packaged in the package housing 140, the coupling connection segments 132 of the pins are attached to the mounting pins 220 of the mounting bracket 200, so as to improve the fastening performance of the conductive connection portion, which is beneficial to preventing the pins of the chip package structure 100 from being broken when the electronic control board falls. It can be understood that the package housing 140 generally has insulation and electromagnetic shielding properties, and encapsulating the pins in the package housing 140 can further improve the electromagnetic interference resistance of the integrated chip, and can also reduce the occurrence of short circuit and other faults due to adhesion between the conductive connection portions 130.
In an embodiment, the mounting pin 220 includes a contact portion 221 disposed in the receiving groove 210 and a pin portion 222 penetrating the bottom wall of the mounting bracket 200, and the contact portion 221 is electrically connected to the conductive connecting portion 130 in a detachable manner.
In this embodiment, the lead portion 222 is a straight pin, and when the mounting substrate 110 is fixedly mounted on the electronic control board, the lead portion 222 is electrically connected to the electronic control board. The contact portion 221 is used for achieving contact connection with the conductive connection portion 130 of the chip package structure 100, the shape of the contact portion 221 may be arranged corresponding to the conductive connection portion 130, in an embodiment, the contact portion 221 and the pin portion 222 are connected in a T shape, so as to increase a contact area between the mounting pin 220 and the chip package structure 100, achieve good contact between the conductive connection portion 130 of the chip package structure 100 and the mounting bracket 200, and avoid poor electrical contact between the chip package structure 100 and the mounting bracket 200.
In one embodiment, the bottom wall of the mounting bracket 200 is provided with a first groove (not shown) and a mounting hole (not shown) penetrating through the bottom wall from the first groove, the contact portion 221 is embedded in the first groove, and the lead portion 222 extends out of the mounting hole.
In this embodiment, the mounting hole may be a countersunk hole, the mounting pin 220 is mounted in the first groove, and the pin portion 222 extends out from the mounting hole, so that when the mounting bracket 200 is fixedly mounted on the electronic control board, the pin portion 222 can be mounted in a pad of the electronic control board, thereby realizing the fixed electrical connection between the mounting bracket 200 and the electronic control board.
Further, in the above embodiment, the height of the contact portion 221 in the first groove is lower than the height of the notch of the first groove to form a second groove, and the portion of the conductive connection portion 130 protruding from the surface of the package housing 140 is mounted in the second groove. The mounting pins 220 of the mounting bracket 200 are recessed, i.e. formed as concave pins, the conductive connection portion 130 is partially protruded on the surface of the package housing 140, i.e. formed as convex pins, and the positions and shapes of the concave pins and the convex pins are correspondingly arranged.
In this embodiment, a boss is formed between the groove wall of the second groove and the bottom wall of the mounting bracket 200, that is, the groove body surrounded by the boss surrounds the portion of the conductive connecting portion 130 protruding from the surface of the package housing 140. When the chip package structure 100 is mounted on the mounting bracket 200, the portion of the conductive connecting portion 130 protruding from the surface of the package housing 140 may be partially or completely inserted into the slot of the second groove, and this embodiment may be partially or completely inserted. With such an arrangement, the bottom of the second groove and the portion of the chip conductive connection portion 130 protruding from the surface of the package housing 140 can be better attached to each other, and the bottom wall of the chip package structure 100 and the bottom wall of the mounting bracket 200 can also be better attached to each other, so that the chip package structure 100 can be better accommodated in the mounting bracket 200. The height of the contact portion 221 in the first groove is lower than the height of the notch of the first groove to form a second groove, the chip conductive connection portion 130 is partially protruded in the package housing 140, and each of the convex pins can correspond to the concave pin, and can also play a role of clamping, that is, the conductive connection portion 130 of the chip package structure 100 is clamped in the second groove, so as to prevent poor contact between the conductive connection portion 130 of the chip package structure 100 and the mounting pin 220 of the mounting bracket 200 due to relative movement between the mounting bracket 200 and the chip package structure 100 after the mounting bracket 200 and the chip package structure 100 are fixedly mounted on the electronic control board.
It can be understood that, when the chip package structure 100 and the mounting bracket 200 are packaged, the conductive connection portions 130 of the chip package structure 100 and the mounting pins 220 can be connected by the lead frame structures, respectively, and after the chip package structure is integrally placed in a mold for packaging, the pins are cut, and the lead frames are further provided with circular holes respectively for fixing and positioning, so as to prevent the chip package structure 100 from being reversely mounted, and thus the chip package structure 100 cannot normally work or damage the chip package structure 100. The chip pin structure is U-shaped and can be basically butted with the mounting bracket 200 below the chip packaging structure 100; the support pins are T-shaped and can be vertically attached to the U-shaped pins of the chip package structure 100, i.e., the U-shaped conductive connection portions 130, so as to achieve fixed electrical connection. Compared with the existing packaging structure, the utility model discloses chip packaging structure 100 uses new pin frame structure, and this structure can be in the same place with the installing support 200 combination that supplements again in addition to when chip packaging structure 100 became invalid, it is more convenient to replace, makes whole chip packaging structure 100's reliability obtain improving, the utility model provides a novel multi-structure chip packaging structure 100.
In an embodiment, a positioning gap 230 is disposed on a sidewall of the receiving groove 210 of the mounting bracket 200, so that the chip package structure 100 can be positioned when mounted to the mounting bracket 200;
the chip package structure 100 is further provided with a positioning portion 150, and the positioning portion 150 corresponds to the positioning gap 230.
In this embodiment, positioning gap 230 is seted up on a lateral wall of installing support 200 storage tank 210, it can be understood that, be interference fit between chip package structure 100 and installing support 200, distance and installing support 200 are not combined completely about chip package structure 100, through positioning gap 230, be favorable to chip package structure 100, take out from installing support 200, thereby conveniently replace, also enable the user when carrying out automatically controlled board setting and using through positioning gap 230 simultaneously, whether the better laminating in the bottom of the installing support 200 of inspection chip package structure 100 and lower part that can be better.
In an embodiment, the chip package structure 100 and the mounting bracket 200 are respectively provided with a fixing connection portion 250(160), and the chip package structure 100 and the mounting bracket 200 are fixedly connected through the fixing connection portion 250 (160).
In this embodiment, the fixing connection portion 250(160) can be made of magnetic material. The number of the fixing connection portions 250(160) may be multiple, for example, the fixing connection portions are symmetrically arranged in the width direction of the chip packaging structure 100 and the mounting bracket 200, that is, the magnets are located at the left and right sides of the chip packaging structure 100 and the mounting bracket 200, and the chip packaging structure 100 and the mounting bracket 200 can both increase the adhesion degree by using the magnets, thereby preventing the problem that the conductive connection portions 130 of the chip packaging structure 100 are not in poor conductive contact with the mounting pins 220 due to incomplete mounting.
The utility model also provides an electric control component, which comprises an electric control board and the integrated chip;
the integrated chip is arranged on the electric control board.
In this embodiment, the integrated chip is disposed on the electric control board and electrically connected to the electronic components on the electric control board through the circuit wiring. The electric control board is also provided with a power input interface for accessing an alternating current power supply and a communication interface for communicating with an external device, such as an air conditioner indoor unit, and the integrated chip and other circuit elements on the electric control board form the electric control board for controlling other components in the air conditioner to work.
The utility model also provides an air conditioner, which comprises the integrated chip; and/or the air conditioner comprises the electric control assembly.
The detailed structure of the integrated chip can refer to the above embodiments, and is not described herein again; it can be understood that, because the utility model discloses used above-mentioned integrated chip in the air conditioner, consequently, the utility model discloses the embodiment of air conditioner includes all technical scheme of the whole embodiments of above-mentioned integrated chip, and the technological effect that reaches is also identical, no longer gives unnecessary details here.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims (13)

1. An integrated chip, comprising:
the chip packaging structure is provided with a conductive connecting part; and
the chip packaging structure comprises a mounting support, wherein the mounting support is provided with a containing groove, the chip packaging structure is contained in the containing groove, a mounting pin is arranged on the bottom wall of the containing groove corresponding to the conductive connecting part, and the mounting pin is detachably and electrically connected with the conductive connecting part.
2. The integrated chip of claim 1, wherein the chip packaging structure further comprises:
the mounting substrate is provided with a first side surface and a second side surface which are arranged oppositely, and the second side surface is provided with a first mounting position and a second mounting position;
the chip body is arranged on the first mounting position;
one end of the conductive connecting part is arranged on the second mounting position.
3. The integrated chip of claim 2, wherein the conductive connection comprises:
the fixed connecting section is arranged on the second mounting position and is fixedly connected with the mounting substrate;
and the coupling connecting section extends from one end, far away from the mounting substrate, of the fixed connecting section, and the coupling connecting section is detachably and electrically connected with the mounting pin.
4. The integrated chip of claim 3, wherein the conductive connection portion is disposed in a U-shape, or the conductive connection portion is disposed in an L-shape, or the conductive connection portion is disposed in a straight shape.
5. The integrated chip of claim 1, wherein the chip package structure further comprises a package housing, and the conductive connecting portion is packaged in the package housing, and at least a portion of the conductive connecting portion protrudes from a surface of the package housing.
6. The IC chip of claim 5, wherein the mounting pins comprise contact portions disposed in the receiving cavity and pin portions extending through the bottom wall of the mounting bracket, the contact portions being detachably and electrically connected to the conductive connection portions;
the contact part and the pin part are connected in a T shape.
7. The integrated chip of claim 6, wherein the bottom wall of the mounting bracket is provided with a first groove and a mounting hole penetrating the bottom wall from the first groove, the contact portion is embedded in the first groove, and the lead portion protrudes from the mounting hole.
8. The integrated chip of claim 7, wherein the contact portion has a height in the first recess that is lower than a height of the notch of the first recess to form a second recess in which a portion of the conductive connection portion protruding from the package housing surface is mounted.
9. The integrated chip of claim 5, wherein a positioning gap is disposed on a sidewall of the receiving groove of the mounting bracket for positioning the chip package structure when the chip package structure is mounted to the mounting bracket.
10. The integrated chip of claim 9, wherein the chip package structure further comprises a positioning portion, and the positioning portion corresponds to the positioning gap.
11. The integrated chip according to any one of claims 1 to 9, wherein the chip package structure and the mounting bracket are respectively provided with a fixing connection portion, and the chip package structure and the mounting bracket are fixedly connected through the fixing connection portion.
12. An electronic control assembly comprising an electronic control board and an integrated chip according to any one of claims 1 to 8;
the integrated chip is arranged on the electric control board.
13. An air conditioner, characterized in that the air conditioner comprises an integrated chip according to any one of claims 1 to 8;
and/or the air conditioner comprises an electric control assembly according to claim 12.
CN202022110037.3U 2020-09-23 2020-09-23 Integrated chip, electric control assembly and air conditioner Expired - Fee Related CN213071103U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022110037.3U CN213071103U (en) 2020-09-23 2020-09-23 Integrated chip, electric control assembly and air conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022110037.3U CN213071103U (en) 2020-09-23 2020-09-23 Integrated chip, electric control assembly and air conditioner

Publications (1)

Publication Number Publication Date
CN213071103U true CN213071103U (en) 2021-04-27

Family

ID=75559669

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022110037.3U Expired - Fee Related CN213071103U (en) 2020-09-23 2020-09-23 Integrated chip, electric control assembly and air conditioner

Country Status (1)

Country Link
CN (1) CN213071103U (en)

Similar Documents

Publication Publication Date Title
JP4675379B2 (en) Electric motor drive circuit and air conditioner outdoor unit
CN208257678U (en) Highly integrated intelligent power module and electrical equipment
US8664755B2 (en) Power module package and method for manufacturing the same
CN109300883B (en) High-integration electric control board and electric appliance
CN111162051B (en) Power terminal, power module packaging structure and packaging method
CN110060991B (en) Intelligent power module and air conditioner
CN213071103U (en) Integrated chip, electric control assembly and air conditioner
CN205657051U (en) Full siC power semiconductor module of half -bridge structure
CN110601552A (en) High-integration intelligent power module and electrical equipment
CN110958771B (en) Integrated circuit board and electronic equipment
CN111162057B (en) Semiconductor power device and power processing assembly for semiconductor power device
CN108054148A (en) Intelligent power module and its manufacturing method, air conditioner
CN111081457A (en) Mounting mode of satellite-borne planar transformer
CN110085579A (en) Highly integrated intelligent power module and preparation method thereof and air conditioner
CN211650663U (en) Electric control assembly and air conditioner
CN115279015A (en) High-temperature packaging body and packaging method of semiconductor silicon carbide power module
CN211630488U (en) Electronic module
CN221508151U (en) Compact packaging structure of integrated circuit
CN212750880U (en) Integrated chip, intelligent power module and air conditioner
CN108123614B (en) Power module
CN110752758A (en) High-integration intelligent power module and air conditioner
CN221201155U (en) Chip packaging structure and integrated circuit board
CN110601549A (en) High-integration intelligent power module and electrical equipment
CN210840224U (en) Electric control assembly and air conditioner
CN217522973U (en) Heating element and control circuit integrated heating sheet

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230119

Address after: 400064 plant 1, No. 70, Meijia Road, Nan'an District, Chongqing

Patentee after: Meiken Semiconductor Technology Co.,Ltd.

Address before: 400060 No. 4, Rongying Building, No. 4, No. 8 Yuma Road, Nanan District, Chongqing

Patentee before: CHONGQING MIDEA REFRIGERATION EQUIPMENT Co.,Ltd.

Patentee before: GD MIDEA AIR-CONDITIONING EQUIPMENT Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210427