CN213028969U

CN213028969U - Mobile phone radiator

Info

Publication number: CN213028969U
Application number: CN202020029388.9U
Authority: CN
Inventors: 雷聪
Original assignee: Individual
Current assignee: Jiangsu Lanshuo Electronic Technology Co ltd
Priority date: 2020-01-07
Filing date: 2020-01-07
Publication date: 2021-04-20
Anticipated expiration: 2030-01-07

Abstract

The utility model discloses a mobile phone radiator, which comprises a base, wherein a shell is arranged on the base, and a radiator is arranged on the base in the shell; the radiator is composed of a plurality of radiating fins with different structural styles, and the radiator also comprises a fan, wherein the fan and the radiating fins are designed in a split mode. According to the scheme, multiple radiating fins are used for radiating, so that the radiating surface is increased, and the radiating efficiency is improved; the radiator is directly adhered to the base, so that the radiating pertinence is strong; the split type design of the radiator and the fan greatly increases the air flowability inside the whole device under the condition of not influencing the heat dissipation area, and increases the heat dissipation efficiency.

Description

Mobile phone radiator

Technical Field

The utility model relates to a heat dissipation technical field especially relates to cell phone heat radiator.

Background

With the development of mobile phone applications, the mobile phone not only has simple functions of making and receiving calls, sending information and the like, but also has more and more new functional applications, such as surfing the internet, playing games, watching videos and the like, and the mobile phone is required to have strong operation industry storage functions, so that the smart mobile phone has mainstream requirements, the heat productivity of the smart mobile phone is higher and higher, the smart mobile phone can feel hot when the smart mobile phone is used for a long time, particularly when the smart mobile phone is used for playing games, the heat conversion speed of the smart mobile phone is not enough, the smart mobile phone can generate heat quickly, the working stability of the smart mobile phone can be influenced, the smart mobile phone can be halted in serious cases.

For example, the chinese patent application No. cn201921156139.x discloses a heat sink for a mobile phone, which realizes a function of partially dissipating heat of a mobile phone, but does not solve a problem of overheating of a main heat generating point, and an air duct of the heat sink is not reasonable in arrangement, so we propose the heat sink for the mobile phone.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: cell-phone radiator, including the base, its characterized in that: the base is provided with a shell, and a radiator is arranged in the shell and is arranged on the base; the radiator is composed of a plurality of radiating fins with different structural styles, and the radiator also comprises a fan, wherein the fan and the radiating fins are designed in a split mode.

Preferably, the base comprises a mounting seat and clamping heads, and the clamping heads are arranged at two ends of the mounting seat.

Preferably, the housing includes an outer shell and a plurality of vent holes provided on a side surface of the outer shell.

Preferably, the heat sink is a flat head heat sink or a slant head heat sink.

Preferably, one end of the bottom of the radiator is a rectangular surface bulge, the other end of the bottom of the radiator is a strip-shaped bulge, and the semiconductor wafer is arranged at the rectangular surface bulge at the bottom of the radiating fin and is in contact with the mounting seat.

Preferably, the radiating fins are all arranged on the radiator base, the flat-head radiating fins are arranged at one end of the radiator base, and the oblique-head radiating fins are arranged at the other end of the radiator base.

Preferably, one end of the top of the shell is higher than the other end of the top of the shell, and the top of the shell is also provided with a plurality of vent holes.

Preferably, rubber pads are arranged on the inner sides of the clamping heads positioned at the two ends of the mounting seat.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) various radiating fins are used for radiating, so that a radiating surface is increased, and the radiating efficiency is improved;

(2) the bottom of the radiator is provided with the strip-shaped bulge, so that the radiator is convenient to process, the cost is reduced, the efficiency is improved, and the installation and the positioning are convenient;

(3) the split type design of the radiator and the fan greatly increases the air flowability inside the whole device under the condition of not influencing the heat dissipation area, and increases the heat dissipation efficiency.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the present invention with the housing removed;

FIG. 3 is a schematic view of the structure of the heat sink of the present invention;

fig. 4 is a side view of the present invention;

fig. 5 is a side view of the present invention with the housing removed.

In the figure: 1. a base; 2. a housing; 3. a heat sink; 11. a mounting seat; 12. a chuck; 21. a housing; 22. a vent hole; 31. a heat sink; 32. a fan; 33. a semiconductor wafer; 310. the rectangular surface is convex; 311. strip-shaped bulges; 312. a flat-head radiating fin; 313. oblique head radiating fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a mobile phone heat sink, which comprises: cell-phone radiator, including base 1, its characterized in that: a shell 2 is arranged on the base 1, and a radiator 3 is arranged on the base 1 in the shell 2; the heat sink 3 is composed of a plurality of heat dissipation fins 31 with different structural styles, the heat sink 3 further comprises a fan 32, and the fan 32 and the heat dissipation fins 31 are in a split design.

The base 1 is used for clamping the mobile phone, directly contacts the mobile phone and conducts heat to the radiator. In this embodiment, it comprises a mounting seat 11 and a chuck 12, wherein the chuck 12 is disposed at two ends of the mounting seat 11. And rubber pads are arranged on the inner sides of the clamping heads 12 at the two ends of the mounting base 11. In this embodiment, the rubber pad is disposed inside the right cartridge 12.

The housing 2 is intended to comprise a heat sink and to provide good heat dissipation. In the present embodiment, it includes a housing 21 and a plurality of vent holes 22, the vent holes 22 being provided on the side of the housing 21. One end of the top of the shell 2 is higher than the other end, and a plurality of vent holes 22 are also arranged on the top of the shell 2. In this embodiment, a total of 10 side vents 22 and 8 top vents 22 are provided.

One end of the bottom of the heat sink 3 is a rectangular protrusion 310, and the other end is a strip protrusion 311, and the semiconductor chip 33 is disposed at the rectangular protrusion of the bottom of the heat sink 31 and contacts with the mounting seat 11. When the mobile phone is used, the contact point of the radiator 3 can be adjusted according to the heating points of different mobile phones.

The heat dissipation fins 31 are used for dissipating the whole heat to the air, and a plurality of heat dissipation fins are provided for dissipating heat. Which may be configured as flat head fins 312 or angled head fins 313. The radiating fins 31 are all arranged on the base of the radiator 3, the flat-head radiating fins 312 are arranged at one end of the base of the radiator 3, and the oblique-head radiating fins 313 are arranged at the other end of the base of the radiator 3. In the present embodiment, 36 oblique-head fins 313 and 36 flat-head fins 312 are provided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Cell-phone radiator, including base (1), its characterized in that: the base (1) is provided with a shell (2), and a radiator (3) is arranged in the shell (2) and is arranged on the base (1); the radiator (3) is composed of a plurality of radiating fins (31) with different structural styles, the radiator (3) further comprises a fan (32) and a semiconductor fin (33), and the fan (32) and the radiating fins (31) are designed in a split mode.

2. The heat sink for cellular phone of claim 1, wherein: the base (1) comprises a mounting seat (11) and chucks (12), wherein the chucks (12) are arranged at two ends of the mounting seat (11).

3. The heat sink for cellular phone of claim 1, wherein: the case (2) includes a housing (21) and a plurality of ventilation holes (22), and the ventilation holes (22) are provided on the side of the housing (21).

4. The heat sink for cellular phone of claim 1, wherein: the radiating fins (31) are flat-head radiating fins (312) or oblique-head radiating fins (313).

5. The heat sink for cellular phone of claim 2, wherein: one end of the bottom of the radiator (3) is provided with a rectangular surface bulge (310), the other end of the bottom of the radiator is provided with a strip-shaped bulge (311), and the semiconductor wafer (33) is arranged at the rectangular surface bulge at the bottom of the radiating fin (31) and is in contact with the mounting seat (11).

6. The heat sink for cellular phone according to claim 4, wherein: the radiating fins (31) are all arranged on a base of the radiator (3), the flat-head radiating fins (312) are arranged at one end of the base of the radiator (3), and the oblique-head radiating fins (313) are arranged at the other end of the base of the radiator (3).

7. The heat sink for cellular phone of claim 3, wherein: one end of the top of the shell (2) is higher than the other end of the top of the shell, and a plurality of vent holes (22) are also formed in the top of the shell (2).

8. The heat sink for cellular phone of claim 2, wherein: and rubber pads are arranged on the inner sides of the clamping heads (12) positioned at the two ends of the mounting seat (11).