CN213028684U - Camera module and camera device - Google Patents
Camera module and camera device Download PDFInfo
- Publication number
- CN213028684U CN213028684U CN202021966146.9U CN202021966146U CN213028684U CN 213028684 U CN213028684 U CN 213028684U CN 202021966146 U CN202021966146 U CN 202021966146U CN 213028684 U CN213028684 U CN 213028684U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible
- board
- printed circuit
- transient suppression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The application provides a camera module and a camera device. The camera module comprises a camera circuit board and a heat dissipation film; the camera circuit board comprises a flexible circuit board, a printed circuit board and at least one structure reinforcing plate, wherein the flexible circuit board is provided with at least one transient suppression diode region; the flexible circuit board is connected with the printed circuit board, and the transient suppression diode area is arranged adjacent to the printed circuit board; each structure reinforcing plate corresponds to a transient suppression diode region, and each structure reinforcing plate is connected with one surface of the flexible circuit board, which is far away from the transient suppression diode region; the heat increasing and dissipating film is positioned at the joint of the printed circuit board and the flexible circuit board. The back of the transient suppression diode region is provided with the structure reinforcing plate, so that the reliability of the camera module is improved, and the heat dissipation increasing and dissipating film is additionally arranged at the joint of the printed circuit board and the flexible circuit board, so that the heat dissipation performance of the joint of the flexible circuit board and the printed circuit board is improved.
Description
Technical Field
The utility model relates to a camera technical field especially relates to a module and camera device make a video recording.
Background
With the rapid development of image acquisition technology, high definition of image acquisition and high quality of formed photos have become standards for judging image level in the field of camera shooting technology. Besides the special requirement that a single lens reflex camera needs high pixels, a mobile phone has become a mainstream device for acquiring high-pixel images, and people can conveniently shoot a required scene by utilizing a camera module in the mobile phone.
After a camera module in a mobile phone is used for a long time, particularly, a picture is frequently taken outdoors, so that the camera module is in violent shaking, a position where a transient suppression diode is installed is located at an edge corner of an FPC (Flexible Printed Circuit) in a traditional camera module, and the transient suppression diode has a surge absorption function, namely, reverse voltage impact can be borne in a very short time, a voltage clamp between two electrodes is located at a specific voltage, the situation that a Circuit behind the Circuit is impacted is avoided, and overvoltage protection is also conducted on the Circuit board.
The camera probe component in the camera module carries out signal transmission through the current passing through the circuit board, so that the control chip controls the camera probe. However, in the long-term use of the camera module, the working time of the working current on the circuit board is long, so that the heat on the circuit board is increased, especially at the connection between the FPC and other printed circuit boards. The circuit on the two circuit boards is formed by welding the disconnected copper foils, so that the end parts of the copper foils at the connection parts of the two circuit boards generate an eddy current effect, and further, the heat at the connection parts is quickly gathered, so that the heat at the connection parts of the FPC and other printed circuit boards is too large, and the probability of burning out the whole circuit board is increased. In addition, when the module that makes a video recording receive rocks when great, the junction of printed wiring board and FPC receives the easy pine of vibration and take off, and then makes printed wiring board and FPC alternate segregation, leads to making a video recording the use reliability of module relatively poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a heat dissipation and the module of making a video recording and camera device of reliability that improve the flexible line way board.
The purpose of the utility model is realized through the following technical scheme:
a camera module, comprising: a camera circuit board and a heat dissipation film; the camera circuit board comprises a flexible circuit board, a printed circuit board and at least one structure reinforcing plate, wherein the flexible circuit board is provided with at least one transient suppression diode area, and the transient suppression diode area is used for welding a transient suppression diode; the flexible circuit board is connected with the printed circuit board, the transient suppression diode region is arranged adjacent to the printed circuit board, and the transient suppression diode region is positioned at the corner of the flexible circuit board; each structural reinforcing plate corresponds to one transient suppression diode region, and is connected with one surface of the flexible circuit board, which is far away from the transient suppression diode region; the heat increasing and dissipating film is located at the joint of the printed circuit board and the flexible circuit board, and the heat increasing and dissipating film is further connected with the printed circuit board and the flexible circuit board respectively.
In one implementation, the camera module further comprises a connection enhancement film, the connection enhancement film is located on one surface of the flexible circuit board, which is far away from the heat dissipation film, and the connection enhancement film is bonded to the printed circuit board and the flexible circuit board.
In one implementation, the heat dissipation film is provided with a through groove, and the opening direction of the through groove is away from the linear circuit board.
In one implementation, the connection enhancement film has a thickness of 1mm to 3 mm.
In one implementation, the camera module further comprises an adhesion reinforcing film, and the adhesion reinforcing film is respectively connected with the printed circuit board, the flexible circuit board and the connection reinforcing film.
In one embodiment, the camera module further comprises a protective layer, and the protective layer is connected to the surface of the connection enhancement film.
In one implementation, the flexible printed circuit board includes a first flexible connecting board, a bent connecting board and a second flexible connecting board, the first flexible connecting board is connected with the second flexible connecting board through the bent connecting board, the printed circuit board is connected with one side of the first flexible connecting board far away from the bent connecting board, and the transient suppression diode region is located on the first flexible connecting board; the bending connecting plate and the first flexible connecting plate are obliquely arranged.
In one implementation, the camera module further comprises an electromagnetic shielding film, and the electromagnetic shielding film is connected with two side surfaces of the flexible circuit board respectively.
In one implementation, the projection of the electromagnetic shielding film on the flexible circuit board at least partially overlaps the flexible circuit board.
The utility model provides a camera device, includes shell, camera probe, drive control chip and any above-mentioned embodiment the module of making a video recording, the through-hole has been seted up to the shell, camera probe wears to locate in the through-hole, drive control chip and the module of making a video recording is located in the shell, camera probe with the printed wiring board is connected, drive control chip with flexible line way connects.
Compared with the prior art, the utility model discloses at least, following advantage has:
the back of the transient suppression diode area is provided with the structure reinforcing plate to provide strength compensation for the flexible circuit board, so that the strength of the area welded with the transient suppression diode on the flexible circuit board is improved, the reliability of a camera module is improved, the shaking amplitude of the flexible circuit board is reduced, the excessive bending probability of the transient suppression diode area on the flexible circuit board is reduced, the damage probability of the transient suppression diode on the flexible circuit board is reduced, in addition, a heat dissipation film is additionally arranged at the joint of the printed circuit board and the flexible circuit board and is respectively connected with the printed circuit board and the flexible circuit board, a level with a heat dissipation effect is provided for the printed circuit board and the flexible circuit board, the heat dissipation performance of the joint of the flexible circuit board and the printed circuit board is improved, and the service lives of the flexible circuit board and the printed circuit board are prolonged, thereby the life of the camera module is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a diagram illustrating a camera module according to an embodiment;
FIG. 2 is a cross-sectional view of the camera module shown in FIG. 1 taken along the direction A-A;
fig. 3 is a schematic view of another view angle of the camera module shown in fig. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The utility model relates to a module of making a video recording. In one embodiment, the camera module comprises a camera circuit board and a heat dissipation film. The camera circuit board comprises a flexible circuit board, a printed circuit board and at least one structural reinforcing board. The flexible wiring board has at least one transient suppression diode region. The transient suppression diode region is used for welding a transient suppression diode. The flexible circuit board is connected with the printed circuit board. The transient suppression diode region is disposed adjacent to the printed wiring board, and the transient suppression diode region is located at a corner of the flexible wiring board. Each structural reinforcing plate corresponds to one transient suppression diode region, and each structural reinforcing plate is connected with one surface of the flexible circuit board, which is far away from the transient suppression diode region. The heat increasing and dissipating film is located at the joint of the printed circuit board and the flexible circuit board, and the heat increasing and dissipating film is further connected with the printed circuit board and the flexible circuit board respectively. The back of the transient suppression diode area is provided with the structure reinforcing plate to provide strength compensation for the flexible circuit board, so that the strength of the area welded with the transient suppression diode on the flexible circuit board is improved, the reliability of a camera module is improved, the shaking amplitude of the flexible circuit board is reduced, the excessive bending probability of the transient suppression diode area on the flexible circuit board is reduced, the damage probability of the transient suppression diode on the flexible circuit board is reduced, in addition, a heat dissipation film is additionally arranged at the joint of the printed circuit board and the flexible circuit board and is respectively connected with the printed circuit board and the flexible circuit board, a level with a heat dissipation effect is provided for the printed circuit board and the flexible circuit board, the heat dissipation performance of the joint of the flexible circuit board and the printed circuit board is improved, and the service lives of the flexible circuit board and the printed circuit board are prolonged, thereby the life of the camera module is prolonged.
Please refer to fig. 1 and fig. 2, which are schematic diagrams of a camera module according to an embodiment of the present invention.
The camera module 10 of an embodiment includes a camera circuit board 100 and a heat dissipation film 400. Referring also to fig. 3, the camera wiring board 100 includes a flexible wiring board 110, a printed wiring board 120, and at least one structural reinforcement board 130. The flexible wiring board 110 has at least one transient suppression diode region 112. The transient suppression diode region 112 is used to weld a transient suppression diode. The flexible wiring board 110 is connected to the printed wiring board 120. The transient suppression diode region 112 is disposed adjacent to the printed wiring board 120, and the transient suppression diode region 112 is located at a corner of the flexible wiring board 110. Each of the structural reinforcing plates 130 corresponds to one of the transient suppression diode regions 112, and each of the structural reinforcing plates 130 is connected to a surface of the flexible printed circuit 110 away from the transient suppression diode region 112. The heat dissipation film 400 is located at a connection position of the printed circuit board 120 and the flexible circuit board 110, and the heat dissipation film 400 is further connected to the printed circuit board 120 and the flexible circuit board 110, respectively.
In the embodiment, the structure reinforcing plate is arranged on the back of the transient suppression diode area to provide strength compensation for the flexible circuit board, so that the strength of the area welded with the transient suppression diode on the flexible circuit board is improved, the reliability of the camera module is improved, the shaking amplitude of the flexible circuit board is reduced, and the excessive bending probability of the transient suppression diode area on the flexible circuit board is reduced, thereby reducing the damage probability of the transient suppression diode on the flexible circuit board, moreover, a heat dissipation film is additionally arranged at the joint of the printed circuit board and the flexible circuit board and is respectively connected with the printed circuit board and the flexible circuit board, so that a hierarchy with a heat dissipation effect is provided for the printed circuit board and the flexible circuit board, the heat dissipation performance of the joint of the flexible circuit board and the printed circuit board is improved, and the service lives of the flexible circuit board and the printed circuit board are, thereby the life of the camera module is prolonged.
In one embodiment, referring to fig. 1 and fig. 2, the camera module 10 further includes a connection enhancement film 200, the connection enhancement film 200 is located on a side of the flexible circuit board 110 away from the heat dissipation film 400, and the connection enhancement film 200 is adhered to the printed circuit board 120 and the flexible circuit board 110. In the present embodiment. The connection reinforcing film 200 is additionally arranged at the joint of the printed circuit board and the flexible circuit board 110, the connection reinforcing film 200 is respectively connected with the printed circuit board and the flexible circuit board 110, more connecting force is provided for the printed circuit board and the flexible circuit board 110, the mechanical connection strength between the printed circuit board and the flexible circuit board 110 is improved, the flexible circuit board 110 and the overall mechanical strength of the printed circuit board 120 are improved, the service life of the flexible circuit board 110 is prolonged, and the service life of the camera module is further prolonged.
Further, the thickness of the connection reinforcing film 200 is 1mm to 3 mm. Through addding connect enhancement film 200, improve the whole mechanical strength of circuit board of making a video recording, however, in order to ensure flexible line way board 110's the ability of buckling, connect enhancement film 200 can not the excess thickness, in order to avoid flexible line way board 110 can't reach required degree of buckling, consequently, will connect the thickness of enhancement film 200 and set up to 1mm ~ 3mm, compromise the improvement the whole mechanical strength of circuit board of making a video recording, guaranteed again flexible line way board 110's the performance of buckling.
Still further, referring to fig. 1 and fig. 2, the camera module 10 further includes an adhesion reinforcing film 500, and the adhesion reinforcing film 500 is connected to the printed circuit board 120, the flexible circuit board 110, and the connection reinforcing film 200 respectively. In order to reduce the probability of the connection enhancement film 200 falling off, the adhesion enhancement film 500 is additionally arranged, and the adhesion enhancement film 500 fixes the printed wiring board 120, the flexible wiring board 110 and the connection enhancement film 200 together, so that the connection strength between the connection enhancement film 200 and the printed wiring board 120 and the flexible wiring board 110 is improved, the connection enhancement film 200 is conveniently bonded on the printed wiring board 120 and the flexible wiring board 110, and the probability of the connection enhancement film 200 falling off from the camera wiring board is reduced.
Furthermore, the camera module further comprises a protective layer connected to the surface of the connection enhancement film. In order to further reduce the falling probability of the connection reinforcing film, one side of the bonding reinforcing film, which is far away from the connection reinforcing film, is connected with the protective layer, namely the protective layer is connected to one side of the bonding reinforcing film, which is far away from the connection reinforcing film, and the protective layer has the advantages of reducing the contact probability of the bonding reinforcing film with external dust and moisture and reducing the falling probability of the connection reinforcing film caused by abrasion loss due to weathering of the bonding reinforcing film. Wherein, when the adhesive reinforcing film is weathered and disappears, the connection strength between the connection reinforcing film and the flexible wiring board and the printed wiring board is reduced, thereby causing the connection reinforcing film to fall off.
In one embodiment, the heat dissipation film is provided with a through groove, and the opening direction of the through groove is away from the flexible circuit board. In this embodiment, the heat dissipation film absorbs heat from the flexible printed circuit board and the printed circuit board, and dissipates the absorbed heat to the external environment, and the through groove increases the heat dissipation area of the heat dissipation film, so that the heat exchange rate on the heat dissipation film is increased, the heat dissipation efficiency of the heat dissipation film is increased, and the temperature at the connection position of the printed circuit board and the flexible printed circuit board is reduced.
In one embodiment, referring to fig. 1, the flexible printed circuit board 110 includes a first flexible connecting board 114, a bent connecting board 116 and a second flexible connecting board 118, the first flexible connecting board 114 is connected to the second flexible connecting board 118 through the bent connecting board 116, the printed circuit board 120 is connected to a side of the first flexible connecting board 114 away from the bent connecting board 116, and the transient suppression diode region 112 is located on the first flexible connecting board 114. In this embodiment, the first flexible connecting board 114 is located between the bending connecting board 116 and the printed circuit board 120, that is, the printed circuit board 120 is connected to the bending connecting board 116 through the first flexible connecting board 114, that is, the printed circuit board 120 and the bending connecting board 116 are respectively located at two sides of the first flexible connecting board 114. The transient suppression diode region 112 is located on the first flexible connecting board 114, and the transient suppression diode region 112 is located at an edge corner of the first flexible connecting board 114, for example, a transient suppression diode region 112 is provided at a connection point of the first flexible connecting board 114 and the printed wiring board 120; as another example; a transient suppression diode region 112 is provided at a corner of the first flexible connecting plate 114 remote from the bent connecting plate 116. Since the transient suppression diode region 112 is located at the edge corner of the first flexible connecting board 114, when the flexible circuit board 110 is bent, the bending amplitude at the corner is larger than that at other positions. Due to the arrangement of the structural reinforcing plate 130, the transient suppression diode region 112 at the edge corner of the flexible printed circuit 110 has a smaller bending amplitude, so that the transient suppression diode region 112 on the flexible printed circuit 110 is subjected to intensity compensation, the probability of excessive bending of the transient suppression diode region 112 on the flexible printed circuit 110 is reduced, and the probability of damage to the transient suppression diode on the flexible printed circuit 110 is reduced.
Further, the bending connection plate 116 and the first flexible connection plate 114 are disposed obliquely. In this embodiment, since the circuit is disposed on the bending connection plate 116, the bending connection plate 116 needs to be bent during an actual installation process, and the size of the bending radius of the circuit on the bending connection plate 116 affects the operation stability of the circuit thereon, that is, the larger the bending radius of the circuit on the bending connection plate 116 is, the more stable the operation of the circuit is. By tilting the bending webs 116 relative to the first flexible webs 114, the length of the bending webs 116 is increased, so that the bending arc length of the bending webs 116 in the bent state is increased. In this way, when the bending angle of the bending connection plate 116 is constant, the bending radius of the bending connection plate 116 is increased, so that the operation stability of the circuit on the bending connection plate 116 is improved. Furthermore, the included angle between the bent circuit board and the first connecting circuit board is 110-150 degrees.
In one embodiment, referring to fig. 1 and 3, the projection of the structural reinforcing plate 130 onto the flexible circuit board 110 at least partially overlaps the transient suppression diode region 112. In this embodiment, the structural reinforcing plate 130 corresponds to the transient suppression diode region 112, the relative area between the two is the reinforcing connection area between the structural reinforcing plate 130 and the transient suppression diode region 112, and the strength compensation degree of the structural reinforcing plate 130 on the flexible wiring board is affected by the relative area between the structural reinforcing plate 130 and the transient suppression diode region 112. Further, the projection of the structural reinforcing plate 130 on the flexible wiring board overlaps with the transient suppression diode region 112, so that the intensity compensation degree of the structural reinforcing plate 130 on the flexible wiring board is maximized, the probability of excessive bending of the transient suppression diode region 112 on the flexible wiring board is further reduced, and the probability of damage to the transient suppression diode on the flexible wiring board is further reduced.
In one embodiment, at least a portion of a side of the connection enhancement film 200 adjacent to the printed wiring board 120 is connected to the printed wiring board 120. In this embodiment, the printed circuit board 120 is connected to a camera head, and the camera head is connected to the flexible circuit board 110 through an internal copper foil circuit of the printed circuit board 120, so that the camera head can be controlled by a control chip. At least a part of one surface of the connection enhancement film 200 close to the printed wiring board 120 is connected with the printed wiring board 120, so that the part of the connection enhancement film 200 protrudes out of the printed wiring board 120, that is, the connection enhancement film 200 is higher than the printed wiring board 120, that is, the protruding height of the connection enhancement film 200 on the flexible wiring board 110 is larger than the protruding height of the printed wiring board 120 on the flexible wiring board 110. In this way, the part of the connection enhancement film 200 is connected to the camera, and the camera is connected to the printed wiring board 120, so that the connection area between the printed wiring board 120 and the connection enhancement film 200 is further increased, the connection strength between the flexible wiring board 110 and the printed wiring board 120 is increased, and the connection stability between the flexible wiring board 110 and the printed wiring board 120 is further improved.
In one embodiment, referring to fig. 1 and fig. 2, the camera module 10 further includes an electromagnetic shielding film 300, and the electromagnetic shielding film 300 is connected to two side surfaces of the flexible circuit board 110 respectively. In this embodiment, the electromagnetic shielding film 300 is attached to the flexible circuit board 110, and covers the flexible circuit board 110, so that the circuit on the flexible circuit board 110 is isolated from the outside, thereby achieving electromagnetic shielding between the circuit on the flexible circuit board 110 and other external electronic devices, and ensuring the normal operation of the camera circuit board 100. Further, the projection of the electromagnetic shielding film 300 on the flexible circuit board 110 is at least partially overlapped with the flexible circuit board 110, so that the connection area of the electromagnetic shielding film 300 and the flexible circuit board 110 is increased, that is, the shielding coverage area of the electromagnetic shielding film 300 on the flexible circuit board 110 is increased, and the shielding capability of the flexible circuit board 110 on external interference signals is improved.
The application still provides a camera device, including shell, camera probe, drive control chip and any one of the above-mentioned embodiments the module of making a video recording, the through-hole has been seted up to the shell, camera probe wears to locate in the through-hole, drive control chip and the module of making a video recording is located in the shell, camera probe with the printed wiring board is connected, drive control chip with the flexible line way is connected. In this embodiment, the camera module includes a camera circuit board and a heat dissipation film. The camera circuit board comprises a flexible circuit board, a printed circuit board and at least one structural reinforcing board. The flexible wiring board has at least one transient suppression diode region. The transient suppression diode region is used for welding a transient suppression diode. The flexible circuit board is connected with the printed circuit board. The transient suppression diode region is disposed adjacent to the printed wiring board, and the transient suppression diode region is located at a corner of the flexible wiring board. Each structural reinforcing plate corresponds to one transient suppression diode region, and each structural reinforcing plate is connected with one surface of the flexible circuit board, which is far away from the transient suppression diode region. The heat increasing and dissipating film is located at the joint of the printed circuit board and the flexible circuit board, and the heat increasing and dissipating film is further connected with the printed circuit board and the flexible circuit board respectively. The back of the transient suppression diode area is provided with the structure reinforcing plate to provide strength compensation for the flexible circuit board, so that the strength of the area welded with the transient suppression diode on the flexible circuit board is improved, the reliability of a camera module is improved, the shaking amplitude of the flexible circuit board is reduced, the excessive bending probability of the transient suppression diode area on the flexible circuit board is reduced, the damage probability of the transient suppression diode on the flexible circuit board is reduced, in addition, a heat dissipation film is additionally arranged at the joint of the printed circuit board and the flexible circuit board and is respectively connected with the printed circuit board and the flexible circuit board, a level with a heat dissipation effect is provided for the printed circuit board and the flexible circuit board, the heat dissipation performance of the joint of the flexible circuit board and the printed circuit board is improved, and the service lives of the flexible circuit board and the printed circuit board are prolonged, thereby the life of the camera module is prolonged.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a module of making a video recording which characterized in that includes:
the camera shooting circuit board comprises a flexible circuit board, a printed circuit board and at least one structure reinforcing plate, wherein the flexible circuit board is provided with at least one transient suppression diode area, and the transient suppression diode area is used for welding a transient suppression diode; the flexible circuit board is connected with the printed circuit board, the transient suppression diode region is arranged adjacent to the printed circuit board, and the transient suppression diode region is positioned at the corner of the flexible circuit board; each structural reinforcing plate corresponds to one transient suppression diode region, and is connected with one surface of the flexible circuit board, which is far away from the transient suppression diode region;
the heat increases and looses the membrane, the heat increases and looses the membrane and is located the printed wiring board with the junction of flexible line way board, the heat increases and looses the membrane still respectively with the printed wiring board with the flexible line way board is connected.
2. The camera module of claim 1, further comprising a connection enhancement film, wherein the connection enhancement film is located on a side of the flexible printed circuit board facing away from the heat dissipation film, and the connection enhancement film is bonded to the printed circuit board and the flexible printed circuit board.
3. The camera module of claim 2, wherein the thickness of the connection enhancing film is 1mm to 3 mm.
4. The camera module of claim 2, further comprising an adhesive reinforcement film, wherein the adhesive reinforcement film is connected to the printed wiring board, the flexible wiring board, and the connection reinforcement film, respectively.
5. The camera module of claim 4, further comprising a protective layer attached to the surface of the connection enhancement film.
6. The camera module of claim 1, wherein the heat dissipation film defines a through-slot, and an opening of the through-slot is directed away from the flexible printed circuit board.
7. The camera module according to claim 1, wherein the flexible printed circuit board comprises a first flexible connecting board, a bending connecting board and a second flexible connecting board, the first flexible connecting board is connected with the second flexible connecting board through the bending connecting board, the printed circuit board is connected with one side of the first flexible connecting board far away from the bending connecting board, and the transient suppression diode region is located on the first flexible connecting board; the bending connecting plate and the first flexible connecting plate are obliquely arranged.
8. The camera module of claim 1, further comprising electromagnetic shielding films, wherein the electromagnetic shielding films are respectively connected to two side surfaces of the flexible printed circuit.
9. The camera module of claim 8, wherein a projection of the electromagnetic shielding film on the flexible printed circuit at least partially overlaps the flexible printed circuit.
10. A camera device, characterized in that, includes shell, camera probe, drive control chip and the module of making a video recording of any one of claims 1 to 9, the shell has seted up the through-hole, camera probe wears to locate in the through-hole, drive control chip and the module of making a video recording is located in the shell, camera probe with the printed wiring board is connected, drive control chip with the flexible wiring board is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021966146.9U CN213028684U (en) | 2020-09-09 | 2020-09-09 | Camera module and camera device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021966146.9U CN213028684U (en) | 2020-09-09 | 2020-09-09 | Camera module and camera device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213028684U true CN213028684U (en) | 2021-04-20 |
Family
ID=75475581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021966146.9U Active CN213028684U (en) | 2020-09-09 | 2020-09-09 | Camera module and camera device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213028684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114669963A (en) * | 2022-03-26 | 2022-06-28 | 广东誉品实业有限公司 | Manufacturing process of periscopic camera module shell |
-
2020
- 2020-09-09 CN CN202021966146.9U patent/CN213028684U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114669963A (en) * | 2022-03-26 | 2022-06-28 | 广东誉品实业有限公司 | Manufacturing process of periscopic camera module shell |
| CN114669963B (en) * | 2022-03-26 | 2022-10-18 | 广东誉品实业有限公司 | Manufacturing process of periscopic camera module shell |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5277105B2 (en) | The camera module | |
| CN102036001B (en) | Camera module | |
| US8115856B2 (en) | Camera module | |
| CN104580852A (en) | Image pick-up device of mobile phone and mobile phone | |
| CN108174080B (en) | camera module and mobile terminal | |
| CN213028684U (en) | Camera module and camera device | |
| US20210397072A1 (en) | Camera module with improved heat dissipation function and electronic device | |
| TWI736954B (en) | Camera device and mobile terminal | |
| CN113810574A (en) | Camera module and electronic equipment | |
| JP2018536367A (en) | CAMERA MODULE, ELECTRIC SUPPORT AND ASSEMBLY | |
| KR20080031570A (en) | Image sensor module and camera module comprising the same | |
| CN107370932A (en) | Grounding assembly, CCD camera assembly and mobile terminal | |
| JP4270455B2 (en) | Solid-state imaging device | |
| CN112702498B (en) | Camera module and electronic equipment | |
| CN207283659U (en) | Grounding assembly, camera module and mobile terminal | |
| CN211378099U (en) | Camera module and electronic device with same | |
| CN213028679U (en) | Camera circuit board and camera module | |
| CN213028244U (en) | Camera circuit board and camera equipment | |
| CN102377919A (en) | Camera module and portable electronic device utilizing same | |
| CN107395943A (en) | Grounding assembly, camera module and mobile terminal | |
| CN213028706U (en) | Flexible circuit board assembly and camera equipment | |
| KR100959862B1 (en) | Dual camera module | |
| CN107566558B (en) | Method for manufacturing electronic assembly | |
| CN210168120U (en) | Camera module and electronic equipment | |
| KR20200142366A (en) | Image sensor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |