CN113810574A - Camera module and electronic equipment - Google Patents
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- CN113810574A CN113810574A CN202111060777.3A CN202111060777A CN113810574A CN 113810574 A CN113810574 A CN 113810574A CN 202111060777 A CN202111060777 A CN 202111060777A CN 113810574 A CN113810574 A CN 113810574A
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application provides a camera module and electronic equipment, relates to the technical field of electronic equipment and aims to solve the technical problem that the camera module occupies a large space; the camera module provided by the embodiment of the application comprises a circuit board, an image sensor and a lens assembly; a first plate surface of the circuit board is provided with a concave part, and the edge of the concave part is provided with a first welding part; the image sensor is arranged in the concave part, so that the occupation of the circuit board and the image sensor on a vertical space can be reduced; a second welding part for welding with the first welding part of the circuit board is arranged at the edge of the image sensor; after the first welding part and the second welding part are welded, the image sensor and the circuit board can be fixedly connected and electrically connected; the lens assembly is arranged above the image sensor and fixed on the first board surface of the circuit board, and external light can be projected on the top surface of the image sensor after being processed by the lens assembly so as to convert optical signals into electric signals.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment.
Background
The current electronic equipment is generally provided with a camera module so as to realize the functions of image acquisition and the like; for example, in a mobile phone, at least one camera module is generally provided to implement a shooting function; with the miniaturization and light-weight design of the mobile phone, the traditional camera module has obviously restricted the miniaturization and light-weight design of the mobile phone due to the large space occupation.
For example, the camera module protrudes slightly from the shell of the mobile phone due to the large height of the camera module, so that the overall aesthetic feeling and the thickness of the mobile phone are affected; in addition, the camera module slightly protrudes out of the shell of the mobile phone, so that the camera module is easily damaged when the mobile phone is dropped and collided, and the drop prevention performance and the user experience of the mobile phone are reduced. On the other hand, some manufacturers have started to equip the mobile phone with a liftable camera module, but the height of the camera module causes the liftable camera module to have a larger volume, thereby affecting the light and thin design of the mobile phone.
Disclosure of Invention
The application provides a compact structure is convenient for realize miniaturized, frivolous design's module and electronic equipment of making a video recording.
On one hand, the embodiment of the application provides a camera module, which comprises a circuit board, an image sensor and a lens assembly; a first plate surface of the circuit board is provided with a concave part, and the edge of the concave part is provided with a first welding part; the image sensor is arranged in the concave part, so that the occupation of the circuit board and the image sensor on a vertical space can be reduced; a second welding part for welding with the first welding part of the circuit board is arranged at the edge of the image sensor; after the first welding part and the second welding part are welded (such as by adopting welding modes of laser spray welding, electron beam welding and the like), the fixed connection and the electric connection between the image sensor and the circuit board can be realized; the lens assembly is arranged above the image sensor and fixed on the first board surface of the circuit board, and external light can be projected on the top surface of the image sensor after being processed by the lens assembly so as to convert optical signals into electric signals.
In the module of making a video recording that this application embodiment provided, through the form that sets up the depressed part in the circuit board, can reduce image sensor and circuit board and occupy on vertical space, combine the setting of first weld part and second weld part, thereby can realize fixed connection and the electricity between image sensor and the circuit board and connect, also can reduce the occupation of welded structure on horizontal space and vertical space simultaneously, and then be convenient for realize making a video recording the miniaturization of module, the lightweight design, also be convenient for realize the modularization production simultaneously.
In particular implementations, the recesses may be configured as a groove structure. The outline of the groove structure can be the same as or approximately the same as the outline of the image sensor, so that the image sensor can be well arranged in the groove, meanwhile, the gap between the image sensor and the groove can be reduced, and the size of the camera module is more compact.
In one case, the height of the image sensor may be greater than, equal to, or less than the depth of the recess, and thus, in a different case, the top surface of the image sensor may protrude from the recess, be located in the recess, or be flush with the first board surface of the circuit board.
In specific implementation, after the image sensor is arranged in the groove, the bottom surface of the image sensor is attached to the bottom surface in the groove, and the top surface of the image sensor is located in the groove. In order to facilitate the realization of the welding between image sensor and the circuit board, first welding part can set up the lateral wall at the recess, and the second welding part can set up the top surface at image sensor, thereby reduce the distance between first welding part and the second welding part as far as, so as to realize the welded connection of first welding part and second welding part, also can save the use amount of solder simultaneously, so as to realize the lightweight design of the module of making a video recording.
In some embodiments, the first welding part may be disposed on a sidewall of the groove, and the second welding part may be disposed on a side surface of the image sensor; after image sensor placed in the recess, second welding part and first welding part set up relatively to realize the welding of first welding part and second welding part.
In some embodiments, when the height of the image sensor is greater than the depth of the groove, the positions of the first welding part and the second welding part may also be adaptively adjusted so as to achieve good welding of the first welding part and the second welding part.
For example, first welding part can set up on the first face of circuit board, and the second welding part can set up the top surface at image sensor to reduce the distance between first welding part and the second welding part as far as, so that realize the welded connection of first welding part and second welding part, also can save the use amount of solder simultaneously, so that realize the lightweight design of camera module.
In some cases, the second solder may also be provided at a side of the image sensor. Alternatively, the second welding part may be provided on both the top surface and the side surface of the image sensor; correspondingly, both can set up the second welding part on the lateral wall of recess and the first face of circuit board to flexibility and reliability when promoting first welding part and second welding part welding.
In practical application, the depressed part can be set to a through hole structure except that the depressed part can be set to a groove structure, namely, the depressed part on the first board surface of the circuit board penetrates through the second board surface of the circuit board, wherein the second board surface is a surface deviating from the first board surface.
When the recessed portion is configured as a through hole structure, the top surface of the image sensor may be located in the through hole or may protrude from the through hole. The bottom surface of the image sensor can be positioned in the through hole and can also protrude out of the through hole.
In addition, in order to improve the stress performance of the image sensor, in some embodiments, a lining plate can be fixed on the second plate surface of the circuit board, and the bottom surface of the image sensor can be attached to the lining plate, so that the relative position between the image sensor and the circuit board can be ensured.
In some embodiments, in order to prevent the red light (the wavelength range may be between 605nm and 700 nm) in the light from causing adverse effects such as image color distortion on the image sensor, an infrared filter may be disposed between the lens assembly and the image sensor, and the infrared filter may be fixedly connected to the circuit board or the image sensor.
In some embodiments, in order to avoid occupation of the infrared filter in space, the lens assembly may be further fixed to the circuit board through a bracket. In a specific application, the height of the bracket can be larger than or equal to the thickness of the infrared filter so as to prevent position interference between the lens assembly and the infrared filter.
On the other hand, the embodiment of the application also provides a manufacturing method for the camera module, which includes the steps of arranging the concave part on the first board surface of the circuit board, placing the image sensor in the concave part, and then welding the first welding part of the circuit board and the second welding part of the image sensor by adopting laser spray welding, electron beam welding and other modes, so that the circuit board and the image sensor are fixedly connected and electrically connected.
In some embodiments, the recess may be formed by milling, and when the recess has a groove structure, the image sensor may be directly placed in the groove, and then the first welding portion and the second welding portion are welded; when the recess is a through hole structure, an auxiliary tool can be used to assist in positioning the relative position between the image sensor and the circuit board, and then the first welding part and the second welding part are welded. In addition, in order to improve the connection stability between the image sensor and the circuit board, in some embodiments, the image sensor and the circuit board may also be bonded by an adhesive; in a specific implementation, the process of providing the adhesive may be performed after the welding of the first welding portion and the second welding portion is completed, or may be performed before the welding of the first welding portion and the second welding portion.
After the image sensor and the circuit board are welded, the infrared filter can be fixed on the first board surface of the circuit board through an adhesive or other connecting pieces, and then the lens assembly is fixed on the circuit board; in securing the lens assembly to the circuit board, the lens assembly and the circuit board may be fixedly attached using an adhesive or other attachment means.
On the other hand, this application embodiment still provides an electronic equipment, including treater and above-mentioned any kind make a video recording the module, image sensor and treater signal connection. Specifically, the electronic device may be a mobile phone, a tablet computer, a notebook computer, or the like.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a camera module according to an embodiment of the present disclosure;
fig. 2 is an exploded view of a cross-sectional structure of another camera module according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional structure view of another camera module provided in the embodiment of the present application;
fig. 4 is a schematic cross-sectional structure view of another camera module provided in the embodiment of the present application;
fig. 5 is a plan view of a camera module according to an embodiment of the present disclosure;
fig. 6 is a schematic cross-sectional structure diagram of a camera module according to an embodiment of the present disclosure;
fig. 7 is a schematic cross-sectional structure view of another camera module provided in the embodiment of the present application;
fig. 8 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 9 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 10 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 11 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 12 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 13 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 14 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 15 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 16 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 17 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 18 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;
fig. 19 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
For the convenience of understanding the camera module provided in the embodiment of the present application, an application scenario of the camera module is first described below.
The camera module provided by the embodiment of the application can be applied to electronic equipment such as a mobile phone, a tablet computer and a notebook computer and is used for realizing functions such as image acquisition. Taking a mobile phone as an example, the camera module can be arranged in the mobile phone to realize the functions of taking pictures, taking videos, self-shooting and the like. As shown in fig. 1, in a specific application, the camera module 01 may include components such as a circuit board 011 (e.g., a printed circuit board), an image sensor 012, a lens assembly 013, an infrared filter 014, a bracket 015, and the like; the image sensor 012 is a Device that converts an optical image into an electrical signal, and may specifically include a Charge-coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS); the image sensor 012 is fixed on the board surface of the circuit board 011 and electrically connected to the circuit board 011 through the conductive wire 016, so as to transmit the electrical signal to a Graphic Processing Unit (GPU) or a Central Processing Unit (CPU) in the mobile phone through the circuit board 011, thereby realizing the functions of obtaining, converting, and Processing the optical image. The lens assembly 013 is mounted on the circuit board 011 through the bracket 015, light from the external environment is projected into the image sensor 012 after passing through the lens assembly 013, and the lens assembly 013 can process (e.g., shape, adjust focal length, etc.) the light to be projected into the image sensor 012, so that the light can be efficiently projected into the image sensor 012. Infrared filter 014 is fixed on support 015 to set up between camera lens subassembly 013 and image sensor 012, light in the external environment is handled (like the plastic, adjust the focal length) back through camera lens subassembly 013, filters through infrared filter 014 the ruddiness in the light, then throws in image sensor 012, in order to prevent that ruddiness from causing harmful effects to image sensor 012's working property.
In the conventional camera module 01, since the image sensor 012 is fixed on the board surface of the circuit board 011, the height of the camera module 01 is greatly affected by the thickness of the circuit board 011 and the height of the image sensor 012; meanwhile, since the image sensor 012 and the circuit board 011 are electrically connected by the additional conductive wire 016, the conductive wire 016 occupies a certain horizontal space and a certain vertical space, in addition, since the conductive wire 016 is fragile, the infrared filter 014 and the lens component 013 can not be directly fixed on the circuit board 011, and generate position interference with the conductive wire 016, but need to be fixed on the circuit board 011 through the bracket 015 with a certain height, so as to avoid the height of the image sensor 012 and the vertical space occupied by the conductive wire 016, therefore, the conventional camera module 01 generally has a large volume, and is not convenient for realizing miniaturized design.
Therefore, the embodiment of the application provides the camera module which is compact in structure, small in occupied size and convenient to modularize and the electronic equipment applied to the camera module.
In order to facilitate understanding of the camera module provided by the present application, the camera module provided by the embodiment of the present application is specifically described below with reference to the accompanying drawings.
The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" means one, two or more. The term "and/or" is used to describe an association relationship that associates objects, meaning that three relationships may exist; for example, a and/or B, may represent: a alone, both A and B, and B alone, where A, B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
As shown in fig. 2 and 3, in one embodiment provided by the present application, the camera module 10 includes a circuit board 11, an image sensor 12, and a lens assembly 13; a first board surface (an upper board surface in the figure) of the circuit board 11 is provided with a concave portion 111, and the edge of the concave portion 111 is provided with a first welding portion 112; the image sensor 12 is disposed in the recess 111, so that the occupation of the circuit board 11 and the image sensor 12 in the vertical space can be reduced; a second welding part 121 for welding with the first welding part 112 on the circuit board 11 is arranged at the edge of the image sensor 12; as shown in fig. 3, after the first soldering portion 112 and the second soldering portion 121 are soldered by the solder 20, the image sensor 12 and the circuit board 11 can be fixedly connected and electrically connected; the lens assembly 13 is disposed above the image sensor 12 and fixed on the upper board surface of the circuit board 11, and external light can be projected on the top surface of the image sensor 12 after being processed by the lens assembly 13, so as to convert optical signals into electrical signals, thereby facilitating transmission and subsequent processing.
In the camera module 10 that this application embodiment provided, through the form that sets up depressed part 111 in circuit board 11, can reduce image sensor 12 and circuit board 11 and occupy on vertical space, combine the setting of first weld part 112 and second weld part 121, thereby can realize fixed connection and the electricity connection between image sensor 12 and the circuit board 11, also can reduce the occupation of welded structure on horizontal space and vertical space simultaneously, and then be convenient for realize camera module 10's miniaturization, the lightweight design, also be convenient for realize the modularization production simultaneously.
In specific implementation, the Circuit Board 11 may be a Printed Circuit Board (PCB), a Flexible Printed Circuit (FPC), or the like, and meanwhile, the Circuit Board 11 may be an independent component in the electronic device, or may be a motherboard in the electronic device, and components such as a processor in the electronic device may be disposed on the motherboard; when the circuit board 11 is a component independent from the motherboard, the circuit board 11 and the motherboard can be electrically connected through a connector and other devices; of course, in some embodiments, a device such as a processor in the mobile phone may also be disposed on the circuit board 11, or it is understood that the circuit board 11 may serve as a motherboard of the mobile phone.
In a specific application, the lens assembly 13 may be disposed on one side of the top surface of the image sensor 12 for processing (e.g., shaping, adjusting the focal length) the light to be irradiated on the image sensor 12.
Specifically, as shown in fig. 2, in one embodiment provided by the present application, the lens assembly 13 includes a lens assembly 131 and a voice coil motor 132, the lens assembly 131 is fixed in the voice coil motor 132, and when the voice coil motor 132 is operated, the focal length of the lens assembly 131 can be adjusted to enable light to be effectively projected on the image sensor 12.
In a specific implementation, the voice coil motor 132 may be directly fixed on the upper surface of the circuit board 11; for example, the voice coil motor 132 may be directly attached to the upper surface of the circuit board 11 by using an adhesive, or may be fixed to the circuit board 11 by using other connecting members (e.g., screws).
In practical applications, the form of the recess 111 may be various, for example, the recess 111 may be configured as a groove structure, and may also be configured as a through hole structure.
As shown in fig. 2 and 3, in one embodiment provided herein, the recess 111 is configured as a groove structure. The contour of the groove structure may be the same or substantially the same as the contour of the image sensor 12, so that the image sensor 12 can be well disposed in the groove, and at the same time, the gap between the image sensor 12 and the groove can be reduced, so that the volume of the camera module 10 is more compact.
In one case, the height of the image sensor 12 may be greater than, equal to, or less than the thickness of the circuit board 11 (or the depth of the groove 111), and thus, in a different case, the top surface of the image sensor 12 may protrude from the groove 111, be flush with the groove 111 (or the upper surface of the circuit board 11), or be located within the groove 111.
Specifically, as shown in fig. 4, in one embodiment provided herein, the height of the image sensor 12 is less than the depth of the groove 111; after the image sensor 12 is disposed in the groove 111, the bottom surface of the image sensor 12 is attached to the bottom surface of the groove 111, and the top surface of the image sensor 12 is located in the groove 111.
Referring to fig. 4, in order to facilitate the soldering between the image sensor 12 and the circuit board 11, in an embodiment provided by the present application, the first soldering portion 112 may be disposed on a sidewall of the groove 111, and the second soldering portion 121 may be disposed on a top surface of the image sensor 12, so as to reduce a distance between the first soldering portion 112 and the second soldering portion 121 as much as possible, so as to facilitate the soldering connection between the first soldering portion 112 and the second soldering portion 121, and simultaneously save the usage amount of the solder 20, so as to facilitate the light-weight design of the camera module 10. In a specific implementation, the solder 20 may be a tin-lead solder, a silver solder, a copper solder, or the like, and a laser welding method, an electron beam welding method, or the like may be adopted between the first soldering portion 112 and the second soldering portion 121 to achieve the welding between the image sensor 12 and the circuit board 11.
In specific implementation, the first welding portion 112 and the second welding portion 121 may be pad structures, bump structures, or other types of structures, and a plurality of first welding portions 112 and a plurality of second welding portions 121 may be correspondingly disposed, and the positions of the first welding portion 112 and the second welding portion 121 may also be various.
As shown in fig. 5, a plan view of the image sensor 12 after being soldered to the circuit board 11 is shown; the first welding parts 112 are provided in plurality and are arranged around the edge of the groove 111 at intervals; the second welding part 121 is also provided in plurality and spaced around the edge of the image sensor 12.
In some embodiments, the second welding part 121 may also be disposed at a side of the image sensor 12; as shown in fig. 6, in an embodiment provided by the present application, the second welding part 121 is disposed at a side of the image sensor 12, and after the image sensor 12 is placed in the groove 111, the second welding part 121 is disposed opposite to the first welding part 112, so as to weld the first welding part 112 and the second welding part 121.
It is understood that in some embodiments, both the top and side surfaces of the image sensor 12 may be provided with the second solder 121; specifically, as shown in fig. 7, in one embodiment provided in the present application, the cross section of the second welding portion 121 is L-shaped, that is, a part of the second welding portion 121 is located on the top surface of the image sensor 12, and another part is located on the side surface of the image sensor 12; when the image sensor 12 and the circuit board 11 are soldered, the second soldering portion 121 located on the top surface of the image sensor 12 may be soldered to the first soldering portion 112, or the second soldering portion 121 located on the side surface of the image sensor 12 may be soldered to the first soldering portion 112; alternatively, the second welding portion 121 located on both the top surface and the side surface of the image sensor 12 may be welded to the first welding portion 112.
In a specific application, when the height of the image sensor 12 is greater than the depth of the groove 111, the positions of the first welding part 112 and the second welding part 121 can be adjusted adaptively, so as to achieve good welding of the first welding part 112 and the second welding part 121.
Specifically, as shown in fig. 8, in one embodiment provided herein, the height of the image sensor 12 is greater than the depth of the groove 111; after the image sensor 12 is disposed in the groove 111, the bottom surface of the image sensor 12 is attached to the bottom surface of the groove 111, and the top surface of the image sensor 12 protrudes from the groove 111.
In order to facilitate the soldering between the image sensor 12 and the circuit board 11, in an embodiment provided by the present application, when the height of the image sensor 12 protruding from the groove 111 is low, the first soldering portion 112 may be disposed on the upper surface of the circuit board 11, and the second soldering portion 121 may be disposed on the top surface of the image sensor 12, so as to reduce the distance between the first soldering portion 112 and the second soldering portion 121 as much as possible, so as to facilitate the soldering connection between the first soldering portion 112 and the second soldering portion 121, and simultaneously, the usage amount of the solder 20 can be saved, so as to facilitate the light-weight design of the camera module 10.
As shown in fig. 9, in one embodiment provided by the present application, the second welding part 121 is disposed at a side of the image sensor 12 so as to achieve welding of the first welding part 112 and the second welding part 121.
It is understood that in some embodiments, both the top and side surfaces of the image sensor 12 may be provided with the second solder 121; specifically, as shown in fig. 10, in one embodiment provided in the present application, the cross section of the second welding portion 121 is L-shaped, that is, a part of the second welding portion 121 is located on the top surface of the image sensor 12, and another part is located on the side surface of the image sensor 12; when the image sensor 12 and the circuit board 11 are soldered, the second soldering portion 121 located on the top surface of the image sensor 12 may be soldered to the first soldering portion 112, or the second soldering portion 121 located on the side surface of the image sensor 12 may be soldered to the first soldering portion 112; alternatively, the second welding portion 121 located on the top surface and the side surface of the image sensor 12 may be welded to the first welding portion 112, so as to improve the flexibility and reliability of the welding of the first welding portion 112 and the second welding portion 121.
In a specific application, when the height of the image sensor 12 is the same as or approximately the same as the depth of the groove 111 (e.g., there is a certain dimensional tolerance between the height of the image sensor 12 and the depth of the groove 111 during manufacturing), the positions of the first welding portion 112 and the second welding portion 121 can be adjusted adaptively, so as to achieve good welding between the first welding portion 112 and the second welding portion 121.
Specifically, as shown in fig. 11, in one embodiment provided herein, the height of the image sensor 12 is substantially the same as the depth of the groove 111; after the image sensor 12 is disposed in the groove 111, the bottom surface of the image sensor 12 is attached to the bottom surface of the groove 111, and the top surface of the image sensor 12 is substantially flush with the upper surface of the circuit board 11.
In order to facilitate the soldering between the image sensor 12 and the circuit board 11, in an embodiment provided by the present application, when the first soldering portion 112 is disposed on the upper surface of the circuit board 11, the second soldering portion 121 may be disposed on the top surface of the image sensor 12, so as to reduce the distance between the first soldering portion 112 and the second soldering portion 121 as much as possible, so as to facilitate the soldering connection between the first soldering portion 112 and the second soldering portion 121, and simultaneously save the usage amount of the solder 20, so as to facilitate the light-weight design of the camera module 10.
In some embodiments, when the first welding part 112 is disposed on the sidewall of the groove 111, the second welding part 121 may also be disposed at the side of the image sensor 12; as shown in fig. 12, in one embodiment provided by the present application, the second welding part 121 is disposed at a side of the image sensor 12 so as to achieve welding of the first welding part 112 and the second welding part 121.
It is understood that in some embodiments, both the top and side surfaces of the image sensor 12 may be provided with the second solder 121; specifically, the cross section of the second welding part 121 may be L-shaped, that is, a part of the second welding part 121 is located on the top surface of the image sensor 12, and another part is located on the side surface of the image sensor 12. The corresponding first soldering portion 112 may also be disposed on the sidewall of the groove 111 and the upper board surface of the circuit board 11; specifically, the cross section of the first soldering portion 112 may be L-shaped, that is, a portion of the first soldering portion 112 may be located on the sidewall of the groove 111, and another portion may be located on the upper board surface of the circuit board 11, so as to improve the flexibility and reliability of soldering the first soldering portion 112 and the second soldering portion 121.
In a specific implementation, in order to improve the connection stability between the image sensor 12 and the circuit board 11, the image sensor 12 and the circuit board 11 may be fixedly connected by an adhesive (such as an acrylate adhesive, an epoxy adhesive, or the like).
As shown in fig. 13, in one embodiment provided by the present application, adhesion is performed between the bottom surface of the image sensor 12 and the bottom surface in the groove 111 by an adhesive layer 30 a; the side surface of the image sensor 12 and the side wall of the groove 111 are bonded by the adhesive layer 30 b. It is understood that in other embodiments, the connection between the image sensor 12 and the groove 111 may be made only by the solder 20, or the adhesive layer 30a may be provided only between the bottom surface of the image sensor 12 and the bottom surface of the groove 111; alternatively, the adhesive layer 30b is provided only between the side face of the image sensor 12 and the side wall of the groove 111.
In some embodiments, the recess 111 may also be configured as a via structure.
As shown in fig. 14, in an embodiment provided by the present application, a through hole 111 penetrating through a first board surface (an upper board surface in the figure) and a second board surface (a lower board surface in the figure) is provided in the circuit board 11, and the image sensor 12 is provided in the through hole 111. In practical use, the positional relationship between the image sensor 12 and the through-hole 111 may be various.
For example, as shown in fig. 14, in one embodiment provided by the present application, the bottom surface of the image sensor 12 is located in the through hole 111, i.e., the bottom surface of the image sensor 12 does not protrude from the lower plate surface of the circuit board 11. The top surface of the image sensor 12 may be a top surface protruding from the circuit board 11, may be flush with the first surface, or may be located in the through hole 111.
In some embodiments, in order to improve the force stability of the image sensor 12, the image sensor 12 may be fixed with an additional structural member. Specifically, as shown in fig. 15, in an embodiment provided by the present application, the camera module 10 further includes a liner plate 14, and the liner plate 14 is fixed on a second plate surface (i.e., a lower plate surface in the drawing) of the circuit board 11 and covers a lower end of the through hole 111; when the image sensor 12 is placed in the through hole (not shown), the bottom surface of the image sensor 12 can be attached to the surface of the lining board 14, so that the force stability of the image sensor 12 can be improved.
In a specific implementation, the lining plate 14 may be a plate body with certain rigidity so as to have good stress performance and deformation resistance. For example, the backing plate 14 may be made of a metallic material (e.g., iron, steel, copper, alloys thereof, etc.), a ceramic material.
In practical implementation, the lining board 14 may be attached to the lower board surface of the circuit board 11 by an adhesive, or may be fixed to the circuit board 11 by other connecting members (e.g., screws). The image sensor 12 and the backing plate 14 may be bonded by an adhesive to improve the stability of the connection between the image sensor 12 and the backing plate 14.
In a specific application, the position relationship between the image sensor 12 and the through hole 111 can be adaptively adjusted according to actual requirements.
Specifically, as shown in fig. 16, in one embodiment provided in the present application, the bottom surface of the image sensor 12 protrudes from the lower board surface of the circuit board 11, so that the image sensor 12 can occupy a part of the lower space (or prevent the top surface of the image sensor 12 from protruding from the upper board surface of the circuit board 11) when the upper space is insufficient.
In particular, in order to prevent the red light (the wavelength range may be between 605nm and 700 nm) in the light from causing adverse effects such as image color distortion on the image sensor 12, an infrared filter 15 may be disposed between the lens assembly 13 and the image sensor 12.
As shown in fig. 17, in an embodiment provided by the present application, the infrared filter 15 may be directly fixed on the upper surface of the circuit board 11, so as to make the structure of the camera module 10 more compact; meanwhile, as the image sensor 12 and the circuit board 11 are directly welded through the firmer solder 20, the infrared filter 15 can also be directly contacted with the solder 20, the solder 20 cannot be damaged, and the reliable connection between the image sensor 12 and the circuit board 11 cannot be damaged; that is, the infrared filter 15 may not be fixed on the circuit board 11 through a bracket or the like, so that the arrangement of the bracket or the like may be omitted, and the number and types of components in the camera module 10 may be simplified, so as to reduce the manufacturing cost and the assembly process; meanwhile, the camera module 10 is advantageous for miniaturization, light weight and thin design after components such as a bracket are omitted.
In specific implementation, as shown in fig. 18, infrared filter 15 may be directly bonded to circuit board 11 using an additional adhesive layer 30 c; in some embodiments, upon soldering between the image sensor 12 and the circuit board 11 by the solder 20, an auxiliary fixing may be performed by the adhesive layer 30c to improve the connection stability between the image sensor 12 and the circuit board 11.
In some embodiments, in order to avoid occupation of infrared filter 15 in space, lens assembly 13 may be fixed to circuit board 11 through bracket 40. In a specific application, the height of the bracket 40 may be greater than or equal to the thickness of the infrared filter 15 to prevent position interference between the lens assembly 13 and the infrared filter 15.
When the camera module 10 is manufactured, the following process flow can be adopted: first, a concave portion 111 may be formed on an upper surface of the circuit board 11, then the image sensor 12 is placed in the concave portion 111, and after the relative position between the image sensor 12 and the circuit board 11 is adjusted, the first soldering portion 112 of the circuit board 11 and the second soldering portion 121 of the image sensor 12 may be soldered by laser spray soldering, electron beam soldering, or the like, so as to achieve fixed connection and electrical connection between the circuit board 11 and the image sensor 12.
In some embodiments, the recess 111 may be formed by milling, and when the recess 111 has a groove structure, the image sensor 12 may be directly placed in the groove, and then the first welding portion 112 and the second welding portion 121 are welded; when the recess 111 has a through-hole structure, an auxiliary tool may be used to assist in positioning the relative position between the image sensor 12 and the circuit board 11, and then the first soldering portion 112 and the second soldering portion 121 may be soldered. In addition, in order to improve the connection stability between the image sensor 12 and the circuit board 11, in some embodiments, the image sensor 12 and the circuit board 11 may also be bonded by an adhesive (such as an acrylate adhesive, an epoxy adhesive, or the like); in specific implementation, the process of providing the adhesive may be performed after the welding of the first welding portion 112 and the second welding portion 121 is completed, or may be performed before the welding of the first welding portion 112 and the second welding portion 121 is performed.
After the image sensor 12 and the circuit board 11 are welded, the infrared filter 15 may be fixed on the upper board surface of the circuit board 11 by an adhesive or other connecting members, and is arranged corresponding to the image sensor 12, and then the lens assembly 13 is fixed on the circuit board 11; in securing the lens assembly 13 to the circuit board 11, the lens assembly 13 may be fixedly coupled to the circuit board 11 by an adhesive or other coupling means.
In a specific application, the camera module provided by the embodiment of the application can be applied to various electronic devices such as mobile phones, tablet computers and notebook computers.
As shown in fig. 19, taking a mobile phone as an example, the camera module 10 may be installed in the mobile phone as a front camera or a rear camera of the mobile phone. In a specific application, the circuit board 11 in the camera module 10 may be an independent component, and is connected to a main board in a mobile phone through a connector and other devices; that is, only the image sensor 12, the lens block 13, and the infrared filter 15 described above may be provided in the circuit board 11. In some embodiments, some of the electronic components (such as a graphic processor, a central processing unit, etc.) in the mobile phone may also be disposed in the circuit board 11, or the circuit board 11 and the main board of the mobile phone are an integrated structure.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a module of making a video recording which characterized in that includes:
the circuit board is provided with a concave part on a first board surface;
the image sensor is arranged in the concave part, and the edge of the image sensor is connected with the edge of the concave part;
and the lens assembly is arranged corresponding to the image sensor and is fixed on the first board surface of the circuit board.
2. The camera module of claim 1, wherein the recess is configured as a groove.
3. The camera module of claim 2, wherein a bottom surface of the image sensor is attached to a bottom surface of the recess;
the top surface of the image sensor is located in the groove, or the top surface of the image sensor protrudes out of the groove, or the top surface of the image sensor is flush with the first plate surface of the circuit board.
4. The camera module of claim 1, wherein the recess is configured as a through hole.
5. The camera module of claim 4, wherein the top surface of the image sensor is located in the recess, or the top surface of the image sensor protrudes from the recess, or the top surface of the image sensor is flush with the first surface of the circuit board.
6. The camera module of claim 1, further comprising a backing plate;
the lining plate is arranged on the second plate surface of the circuit board, and the bottom surface of the camera module is attached to the lining plate;
the second plate surface is a plate surface deviated from the first plate surface.
7. The camera module according to any one of claims 1 to 6, further comprising an infrared filter;
the infrared filter is located between the image sensor and the lens component and fixed on the first board surface of the circuit board.
8. The camera module of any one of claims 1-7, further comprising a bracket;
the support is fixed on the first face, the lens subassembly with support fixed connection.
9. An electronic device comprising a processor and a camera module according to any one of claims 1 to 8, wherein the image sensor is in signal connection with the processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111060777.3A CN113810574A (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910988784.6A CN110913097B (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
| CN202111060777.3A CN113810574A (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910988784.6A Division CN110913097B (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
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| CN113810574A true CN113810574A (en) | 2021-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111060777.3A Pending CN113810574A (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
| CN201910988784.6A Active CN110913097B (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910988784.6A Active CN110913097B (en) | 2019-10-17 | 2019-10-17 | Camera module and electronic equipment |
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| CN (2) | CN113810574A (en) |
| WO (1) | WO2021073182A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113810574A (en) * | 2019-10-17 | 2021-12-17 | 华为技术有限公司 | Camera module and electronic equipment |
| CN212211129U (en) * | 2020-04-30 | 2020-12-22 | 华为技术有限公司 | Camera module and electronic equipment |
| CN113938581A (en) * | 2020-06-29 | 2022-01-14 | 宁波舜宇光电信息有限公司 | Optical assembly and assembling method thereof |
| CN115066092B (en) * | 2021-10-09 | 2023-03-24 | 荣耀终端有限公司 | Circuit board assembly, manufacturing method and electronic equipment |
| CN115348369B (en) * | 2022-06-29 | 2023-09-05 | 荣耀终端有限公司 | Camera module and electronic equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110913097B (en) | 2021-09-17 |
| CN110913097A (en) | 2020-03-24 |
| WO2021073182A1 (en) | 2021-04-22 |
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