CN212970243U

CN212970243U - Compound heat conduction wave-absorbing gasket

Info

Publication number: CN212970243U
Application number: CN202021828717.2U
Authority: CN
Inventors: 林秋燕; 黎海涛; 徐保
Original assignee: Dongguan Hanpin Electronics Co ltd
Current assignee: Dongguan Hanpin Electronics Co ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2021-04-13
Anticipated expiration: 2030-08-27

Abstract

The utility model discloses a compound heat conduction and wave absorption gasket, including the metal forming, metal forming one side complex has first heat conduction type ya keli double-sided glued membrane, first heat conduction type ya keli double-sided glued membrane keeps away from metal forming one side coating and has first silica gel processing layer, first silica gel processing layer is kept away from first heat conduction type ya keli double-sided glued membrane one side and is provided with first heat conduction and wave absorption gasket, first heat conduction and wave absorption gasket keeps away from first silica gel processing layer one side and still is provided with from the type membrane, and after this structure is compound with heat conduction and wave absorption gasket and copper foil, it has dual heat conduction advantage, has good compressibility, shock absorption efficiency, heat conductivity and electromagnetic shield stack efficiency simultaneously, and this gasket surface compatibility is good, the single face is from taking viscidity, and consequently it has excellent operability.

Description

Compound heat conduction wave-absorbing gasket

Technical Field

The utility model relates to an electron trade field, in particular to compound heat conduction inhale ripples gasket.

Background

The heat conducting gasket fills the air gap between the heat generating device and the heat sink or metal base, and its flexibility and elasticity make it possible to cover very uneven surfaces, and the heat is conducted from the separate device or the entire PCB to the metal casing or the diffusion plate, thereby improving the efficiency and the service life of the heat generating electronic assembly, and the current heat conducting gasket has the following disadvantages:

1. the single-layer wave absorbing material and the heat conduction wave absorbing gasket have poor heat conduction effect, poor wetting effect and low strength.

2. The wave-absorbing material is compounded with the copper foil, but the surface of the wave-absorbing material is not sticky, has no compressibility and no shock absorption, the product hardness is high, the use thickness is limited, and the problem of heat conduction and heat dissipation cannot be well solved in a special application scene.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide a compound heat conduction and inhale ripples gasket that has dual heat conduction advantage, has good compressibility and shock-absorbing efficiency.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a compound heat conduction gasket of inhaling, includes the metal forming, metal forming one side complex has first heat conduction type ya keli double faced adhesive film, first heat conduction type ya keli double faced adhesive film keeps away from metal forming one side coating and has a first silica gel to handle the layer, first silica gel is handled the layer and is kept away from first heat conduction type ya keli double faced adhesive film one side and is provided with first heat conduction gasket of inhaling, first heat conduction gasket of inhaling is kept away from first silica gel and is handled layer one side and still be provided with from the type membrane.

Further, the method comprises the following steps: the metal foil is far away from the first heat conduction type acrylic double-sided adhesive film and is sequentially provided with a second heat conduction type acrylic double-sided adhesive film, a second silica gel treatment layer and a second heat conduction wave-absorbing gasket.

Further, the method comprises the following steps: the metal foil is copper foil or aluminum foil.

Further, the method comprises the following steps: the thickness of the metal foil is 0.01 mm-0.02 mm.

Further, the method comprises the following steps: the thickness of the first silica gel treatment layer is 0.002 mm-0.003 mm.

Further, the method comprises the following steps: the total thickness of the metal foil and the first heat-conducting acrylic double-sided adhesive film is 0.02-0.025 mm.

The utility model has the advantages that: after the heat-conducting wave-absorbing gasket and the copper foil are compounded, the structure has the advantages of dual heat conduction, good compressibility, good damping efficiency, good heat conductivity and good electromagnetic shielding superposition efficiency, and the gasket has good surface compatibility and self-adhesive single surface, so the gasket has excellent operability. The structure solves the problem of heat conduction in the material, can inhibit unnecessary electromagnetic energy coupling, resonance and EMI (electro-magnetic interference) generated by electromagnetic interference, and has wide application prospect in the field of millimeter wave high-frequency transmission.

Drawings

Fig. 1 is a schematic diagram of a composite heat-conducting wave-absorbing gasket.

Labeled as: the heat-conducting wave-absorbing film comprises a metal foil 1, a first heat-conducting acrylic double-sided adhesive film 2, a first silica gel treatment layer 3, a first heat-conducting wave-absorbing gasket 4 and a release film 5.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The composite heat-conducting wave-absorbing gasket shown in fig. 1 comprises a metal foil 1, wherein a first heat-conducting acrylic double-sided adhesive film 2 is compounded on one side of the metal foil 1, a first silica gel treatment layer 3 is coated on one side, away from the metal foil 1, of the first heat-conducting acrylic double-sided adhesive film 2, a first heat-conducting wave-absorbing gasket 4 is arranged on one side, away from the first heat-conducting acrylic double-sided adhesive film 2, of the first silica gel treatment layer 3, and a release film 5 is further arranged on one side, away from the first silica gel treatment layer 3, of the first heat-conducting wave-absorbing gasket 4;

specifically, the metal foil 1 is a copper foil or an aluminum foil, the thickness of the metal foil 1 is 0.01mm to 0.02mm, the thickness of the first silica gel treatment layer 3 is 0.002mm to 0.003mm, the total thickness of the metal foil 1 and the first heat-conducting acrylic double-sided adhesive film 2 is 0.02mm to 0.025mm,

the specific embodiment is as follows:

1. a layer of 10um non-base material heat-conducting acrylic double-sided adhesive film is compounded on the surface of a 10um copper foil, and the total thickness is about 20 u-25 u.

2. And then 2 um-3 um of silica gel treatment agent is coated on one side of the copper foil composite substrate-free heat-conducting acrylic double-sided adhesive film, so that the adhesiveness between the copper foil and the substrate-free heat-conducting acrylic double-sided adhesive film surface and the heat-conducting wave-absorbing gasket is enhanced.

3. The heat-conducting wave-absorbing gasket and the two are compounded together, and the total thickness is about 0.1 mm-15 mm.

The heat-conducting wave-absorbing gasket and the copper foil are compounded, so that the heat-conducting wave-absorbing gasket has double heat-conducting advantages, and has good compressibility, shock absorption efficiency, heat conductivity and electromagnetic shielding superposition efficiency. The structure solves the problem of heat conduction in the material, can inhibit unnecessary electromagnetic energy coupling, resonance and EMI (electro-magnetic interference) generated by electromagnetic interference, and has wide application prospect in the field of millimeter wave high-frequency transmission.

On the basis, the metal foil 1 is far away from the first heat-conducting acrylic double-sided adhesive film 2, and a second heat-conducting acrylic double-sided adhesive film, a second silica gel treatment layer and a second heat-conducting wave-absorbing gasket are sequentially arranged, so that the structure adopts a double-sided composite heat-conducting wave-absorbing gasket, and the heat-conducting advantage is more obvious.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a compound heat conduction gasket of absorbing ripples which characterized in that: including foil (1), foil (1) one side complex has first heat conduction type ya keli double faced adhesive film (2), foil (1) one side coating has first silica gel to handle layer (3) is kept away from in first heat conduction type ya keli double faced adhesive film (2), first silica gel is handled layer (3) and is kept away from first heat conduction type ya keli double faced adhesive film (2) one side and is provided with first heat conduction and inhale ripples gasket (4), first heat conduction is inhaled ripples gasket (4) and is kept away from first silica gel and handle layer (3) one side and still be provided with from type membrane (5).

2. A composite heat-conducting and wave-absorbing gasket according to claim 1, characterized in that: the metal foil (1) is far away from the first heat-conducting acrylic double-sided adhesive film (2) and is sequentially provided with a second heat-conducting acrylic double-sided adhesive film, a second silica gel treatment layer and a second heat-conducting wave-absorbing gasket.

3. A composite heat-conducting and wave-absorbing gasket according to claim 1, characterized in that: the metal foil (1) is a copper foil or an aluminum foil.

4. A composite heat-conducting and wave-absorbing gasket according to claim 1, characterized in that: the thickness of the metal foil (1) is 0.01 mm-0.02 mm.

5. A composite heat-conducting and wave-absorbing gasket according to claim 1, characterized in that: the thickness of the first silica gel treatment layer (3) is 0.002 mm-0.003 mm.

6. A composite heat-conducting and wave-absorbing gasket according to claim 1, characterized in that: the total thickness of the metal foil (1) and the first heat-conducting acrylic double-sided adhesive film (2) is 0.02-0.025 mm.