CN212935763U

CN212935763U - Converter device

Info

Publication number: CN212935763U
Application number: CN202021958666.5U
Authority: CN
Inventors: 吴良材; 丁永强
Original assignee: Guangdong Guriwat New Energy Co ltd
Current assignee: Guangdong Guriwat New Energy Co ltd
Priority date: 2020-09-09
Filing date: 2020-09-09
Publication date: 2021-04-09
Anticipated expiration: 2030-09-09

Abstract

The utility model provides a converter, include main PCB board and locate the radiator unit of main PCB board lower extreme, radiator unit includes ceramic radiator and locates a plurality of coupling mechanisms of ceramic radiator upper end, coupling mechanism includes semiconductor switch, locates clamp plate on the semiconductor switch, and locate the spliced pole of clamp plate upper end, main PCB board is equipped with a butt joint hole with the position that each spliced pole corresponds. According to the converter device, the switching device is directly fixed on the ceramic radiator, heat is directly radiated through the ceramic radiator, the ceramic radiator can be set to be in the largest shape which can be accommodated by the converter device, so that a larger heat radiation area is obtained, meanwhile, the ceramic radiator is made of an insulating material, a heat conduction interface material does not need to be added in the combination process, the problems of thermal resistance and insulation failure in the machining process are reduced, and the cost is further reduced.

Description

Converter device

Technical Field

The utility model relates to an electronic circuit equipment technical field, in particular to deflector.

Background

The power electronic device (power electronic equipment) is a device composed of various power electronic circuits and used for conversion and control of high-power electric energy, a source and switch, a motor speed regulation device, a direct-current transmission device, an induction heating device, a reactive compensation device, an electroplating electrolysis device, a household appliance converter device and the like.

The power electronic converter is an intelligent device which is rapidly developed in the last two decades, and stable, reliable and energy-saving energy output is obtained through conversion and control of electric energy. Semiconductor switching devices have been developed as a core device in current conversion devices, and various processes of switching devices based on different material wafers such as silicon, silicon carbide, gallium nitride and the like, as well as different processes of IGBTs, MOSFETs and the like have been continuously created.

However, all switching devices have a general problem of pursuing higher power density, and the power density is closely related to heat dissipation materials and heat dissipation processes, the most common heat dissipation material adopted in the current converter is a heat sink using aluminum as a main raw material, the existing technical scheme mainly using aluminum materials is that a semiconductor needing heat dissipation is usually fixed on an aluminum heat sink platform by crimping or screws, because the semiconductor needs to be insulated and the aluminum is a metal material, a heat-conducting interface material needs to be added between a heat source (usually a semiconductor switch tube and a diode) and a radiator, and finally a complete heat-radiating system is formed, the disadvantages of this solution are that the thermal interface material increases the thermal resistance from the heat source to the heat dissipation surface, the cost is high, and insulation failure is easy to occur (the thermal interface material is thin and easy to puncture or crush); the aluminum material has low heat conductivity coefficient, and the molding and the process are limited, so that the heat conducting area is limited, and the aluminum material is not a very ideal heat conducting mode.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a converter to solve current converter's heat dissipation scheme with high costs, the insulating problem that became invalid appears easily.

The utility model provides a converter, include main PCB board and locate the radiator unit of main PCB board lower extreme, radiator unit includes ceramic radiator and locates a plurality of coupling mechanisms of ceramic radiator upper end, coupling mechanism includes semiconductor switch, locates clamp plate on the semiconductor switch, and locate the spliced pole of clamp plate upper end, main PCB board is equipped with a butt joint hole with the position that each spliced pole corresponds.

According to the converter device, the switching device is directly fixed on the ceramic radiator, heat is directly radiated through the ceramic radiator, the ceramic radiator can be set to be in the largest shape which can be accommodated by the converter device, so that a larger heat radiation area is obtained, meanwhile, the ceramic radiator is made of an insulating material, a heat conduction interface material does not need to be added in the combination process, the problems of thermal resistance and insulation failure in the machining process are reduced, and the cost is further reduced.

Furthermore, the ceramic radiator is provided with a plurality of connecting mechanisms, and the upper end of each ceramic radiator is provided with a plurality of connecting mechanisms.

Further, the semiconductor switch is connected to the ceramic heat sink by a fastener.

Further, the fastener includes any one of a screw or a snap.

Furthermore, two clamping lugs are arranged on two sides of the connecting column.

Furthermore, the main PCB and the two positions corresponding to the clamping lugs are respectively provided with a positioning groove.

Furthermore, a gasket is flexibly arranged at the bottom of the positioning groove.

Furthermore, a positioning column is arranged at the upper end of the pressing plate, and a positioning hole is formed in the position, corresponding to the positioning column, of the main PCB.

Drawings

Fig. 1 is a schematic structural diagram of a converter device according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a main PCB board in a converter device according to a second embodiment of the present invention;

fig. 3 is an enlarged schematic view of the structure of fig. 2 at circle a.

Description of the main element symbols:

main PCB board	10	Ceramic radiator	21	Connecting column	223
						Butt joint hole	11	Connecting mechanism	22	Clamping lug	224
Locating slot	12	Semiconductor switch	221	Fastening piece	225
						Heat radiation assembly	20	Pressing plate	222

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, a converter apparatus according to a first embodiment of the present invention includes a main PCB 10 and a heat sink 20 disposed at a lower end of the main PCB 10, wherein the heat sink 20 includes a ceramic heat sink 21 and a plurality of connecting mechanisms 22 disposed at an upper end of the ceramic heat sink 21, each of the connecting mechanisms 22 includes a semiconductor switch 221, a pressing plate 222 disposed on the semiconductor switch 221, and a connecting column 223 disposed at an upper end of the pressing plate 222, and a butt-joint hole 11 is disposed at a position of the main PCB 10 corresponding to each connecting column 223.

According to the converter device, the switching device (the semiconductor switch 221) is directly fixed on the ceramic radiator 21, heat is directly radiated through the ceramic radiator 21, the ceramic radiator 21 can be set to be the largest shape which can be accommodated by the converter device, so that a larger heat radiation area is obtained, meanwhile, as the ceramic radiator 21 is made of insulating materials and mainly comprises aluminum oxide, aluminum nitride and the like, heat conduction interface materials do not need to be added in the combination process, the problems of thermal resistance and insulation failure in the machining process are solved, and the cost is reduced.

Specifically, in the present embodiment, two ceramic heat sinks 21 are provided; two ceramic radiator 21's upper end is equipped with two respectively and is three coupling mechanism 22 to obtain bigger heat radiating area, can understand the utility model discloses an in other embodiments, can be according to deflector's size adjustment ceramic radiator 21's number, deflector is big more, and ceramic radiator 21 is big more, and coupling mechanism 22 is more.

Specifically, in the present embodiment, the semiconductor switch 221 is connected to the ceramic heat sink 21 by a fastener 225. Wherein the fastener 225 may be any one of a screw or a snap.

Specifically, in this embodiment, two clamping lugs 224 are disposed on two sides of the connecting column 223, so that the connecting column 223 can be rotated after passing through the docking hole 11, and the two clamping lugs 224 abut against the edge of the docking hole 11, thereby fixing the connecting column 223 and the main PCB.

Referring to fig. 2 and fig. 3, a deflector according to a second embodiment of the present invention is different from the deflector according to the first embodiment in that a positioning groove 12 is respectively disposed at positions of the main PCB 10 corresponding to the two clamping lugs, so as to facilitate installation and positioning of the clamping lugs 224 and prevent the connecting column 223 from rotating.

Specifically, in other embodiments of the present invention, the bottom of the positioning groove 12 is provided with a flexible gasket to prevent the clamping lug 224 from damaging the main PCB 10.

Specifically, in the other embodiments of the present invention, the upper end of the pressing plate 222 is provided with a positioning column, and the position of the main PCB 10 corresponding to the positioning column is provided with a positioning hole, so that the pressing plate 222 and the main PCB 10 are positioned and mounted.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The converter device is characterized by comprising a main PCB and a heat dissipation assembly arranged at the lower end of the main PCB, wherein the heat dissipation assembly comprises a ceramic heat radiator and a plurality of connection mechanisms arranged at the upper end of the ceramic heat radiator, each connection mechanism comprises a semiconductor switch, a pressing plate arranged on the semiconductor switch and a connecting post arranged at the upper end of the pressing plate, and a butt joint hole is formed in the position, corresponding to each connecting post, of the main PCB.

2. The deflector according to claim 1, wherein a plurality of ceramic heat sinks are provided, and a plurality of said connecting mechanisms are provided at an upper end of each of said ceramic heat sinks.

3. The variable current device according to claim 1, wherein the semiconductor switch is connected to the ceramic heat sink by a fastener.

4. A deflector as claimed in claim 3, wherein the fastener comprises any one of a screw or a snap.

5. The deflector device as recited in claim 1, wherein two snap lugs are provided on both sides of the connecting column.

6. The variable flow device according to claim 5, wherein a positioning groove is respectively disposed at positions of the main PCB corresponding to the two clamping lugs.

7. The deflector of claim 6, wherein the bottom of the positioning groove is flexibly provided with a gasket.

8. The deflector according to claim 1, wherein a positioning column is disposed at an upper end of the pressing plate, and a positioning hole is disposed at a position of the main PCB corresponding to the positioning column.