CN210225873U

CN210225873U - Power device connecting structure with heat dissipation function

Info

Publication number: CN210225873U
Application number: CN201920701588.1U
Authority: CN
Inventors: Qiuxin Liao; 廖球新; Weiwei Zheng; 郑伟伟; Jingjing Lei; 雷晶晶
Original assignee: Sunwoda Electric Vehicle Battery Co Ltd
Current assignee: Xinwangda Power Technology Co ltd
Priority date: 2019-05-16
Filing date: 2019-05-16
Publication date: 2020-03-31
Anticipated expiration: 2029-05-16

Abstract

The utility model provides a connection structure of power device with heat dissipation function, including the PCB board, install in connecting piece and power device on the PCB board, a serial communication port, be equipped with at least one through-hole on the PCB board, be used for the installation power device with the connecting piece, the connecting piece is including connecting the body and the convex closure that makes progress outstanding, the convex closure passes through-hole and butt arrive power device, connect the body extend in the PCB board and with outside electrical connection. The utility model discloses a connection structure of power device is set up the through-hole on the PCB board, make electrically conductive heat conduction connecting piece pass through the through-hole with power device direct contact compares with prior art, has left out pencil wire structure, has reduced the impedance, just the connecting piece still has the heat conductivity, can improve heat conduction efficiency, can not rely on the radiator to realize the heat dissipation.

Description

Power device connecting structure with heat dissipation function

Technical Field

The utility model relates to a power battery management system technical field especially relates to a connection structure of power device with heat dissipation function.

Background

The Power Device is also called a Power Semiconductor Device (Power Semiconductor Device) and a Power electronic Device, is a core Device for realizing electric energy conversion and circuit control of an electronic Device, is mainly used for frequency conversion, rectification, voltage transformation, Power amplification, Power control and the like, and has the energy-saving effect. The power semiconductor device has the capability of processing high voltage and large current, and is widely applied to the electric and electronic fields of mobile communication, consumer electronics, new energy traffic, industrial control, origin and distribution and the like.

The power device is in most cases used as a switch for controlling the current loop to be switched on or off. With the development of power devices toward high power density, the heat per unit volume of the device is rapidly increased, in the equipment of high-power high-frequency application, the power consumption of the power device can be converted into heat, so that the power device generates heat, the junction temperature is increased, if the heat is not dissipated timely and effectively, the working performance of the power device is affected, thereby reducing the reliability of the system operation and even causing the damage of the whole system, in the prior art, in a high-power electrical product designed by using a power device, a heat dissipation device is often designed for the power device, the power device is mounted on a heat sink, the heat is radiated to the surrounding air through the heat radiating plate, the heat is radiated through natural convection, however, this heat dissipation method requires a heat dissipation device to be added to the electrical product, which results in an increase in the overall volume of the product and a relatively complex structural design of the heat dissipation system. In order to solve the problem, chinese patent CN203553912U discloses an electronic circuit and a large current device for reducing the heat generation of a power device, which adopts a mode of connecting the power device and a relay in parallel, and adopts the relay with a small contact resistance to share the transmission task of the large current when the large current passes through the power device, so as to reduce the heat generation of the power device.

Disclosure of Invention

In order to solve the above technical problems, the present invention discloses a connection structure of a power device with heat dissipation function, comprising a PCB board, a connector and a power device mounted on the PCB board,

furthermore, the PCB is provided with at least one through hole for installing the power device and the connecting piece, the power device is installed above the PCB and completely covers the through hole,

further, the connecting piece comprises a connecting body and a convex hull protruding upwards, the connecting piece is installed on the lower surface of the PCB, the convex hull penetrates through the through hole and abuts against the power device, and the connecting body extends to the PCB and is electrically connected with the outside;

furthermore, the number of the power devices and the number of the convex hulls are the same as that of the through holes, and the power devices and the convex hulls correspond to the through holes one by one;

further, the connecting piece is made of a heat-conducting and electric-conducting metal material;

further, the shape of the connecting piece can be square, round, oval and other irregular shapes.

Advantageous effects

Compared with the prior art, the connecting structure of the power device, disclosed by the invention, has the advantages that the through hole is formed in the PCB, so that the electric and heat conducting connecting piece is directly contacted with the power device through the through hole, the wire harness conducting wire structure is omitted, the impedance is reduced, the connecting piece also has heat conductivity, the heat conducting efficiency can be improved, and the heat radiation can be realized without depending on a radiator.

Drawings

FIG. 1 is a schematic view of the structure of the connecting member of the present invention

FIG. 2 is a schematic structural diagram of the connection structure of the present invention

The meaning of each label in the figure is: the PCB board 1, 11 through-holes, 2 connecting pieces, 21 connecting piece bodies, 22 convex hulls and 3 power devices, wherein the part A is a schematic diagram of complete connection of functional devices and the connecting pieces.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the invention, but are not intended to limit the scope of the invention, i.e., the invention is not limited to the described embodiments.

In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", and the like are used for convenience in describing the invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.

In the description of the present invention, it should be further noted that, unless explicitly stated or limited in the art, the terms "mounted," "connected," and "connected" are to be construed broadly and include, for example, fixed connections, detachable connections, or integral connections, either direct connections or indirect connections through intervening media. The specific meaning of the above terms in the present invention can be understood as the case may be, by those of ordinary skill in the art.

For better understanding of the present invention, the connection structure of the power device according to the embodiment of the present invention is described in detail below with reference to fig. 1 to 2.

As shown in fig. 1 and fig. 2, the present invention discloses a connection structure of a power device with a heat dissipation function, comprising a PCB board 1, a connector 2 and a power device 3 mounted on the PCB board,

in this embodiment, twelve through holes 11 are formed on the PCB board 1 for mounting the power devices 3 and the connecting members 2, the power devices 3 are mounted above the PCB board 1 and completely cover the through holes 11, that is, one power device 3 is mounted on each through hole 11 on the PCB board 1, the area of the bottom of the power device 3 is larger than that of the through hole 11 so as to completely cover the through hole 11,

in this embodiment, two connecting pieces 2 are mounted on a PCB board 1, each connecting piece 2 includes a connecting body 21 and six convex hulls 22 protruding upwards, each connecting piece 2 is mounted on the lower surface of the PCB board 1, and each convex hull 22 passes through a corresponding through hole 11 and abuts against the power device 3, that is, one convex hull 22 corresponds to one through hole 11, and when mounted, each convex hull respectively passes through the corresponding through hole 11, so that the tops of the convex hulls 22 are fully contacted with the power device 3; therefore, the power device 3 of the connecting piece 2 is directly contacted, the overcurrent area is increased, and the impedance is reduced;

further, the connecting body 21 extends to the PCB 1 and is electrically connected to the outside, that is, a part of the connecting element 2 extends after being mounted on the PCB 1 for connecting an external electrical component, as shown in fig. 2, the PCB 1 is mounted with two connecting elements 2, two ends of the PCB 1 respectively have a part of the connecting element 2 extending out for connecting an external electrical component, and the extending part of the connecting element 2 is further provided with a through hole 211 for facilitating connection with an external electrical component;

preferably, in this embodiment, the power device 3 is a MOS transistor;

further, the connecting member 2 is made of a heat-conducting and electrically-conducting metal material, preferably a copper alloy in this embodiment, because the copper alloy has good heat conductivity and electrical conductivity, and is used in connection with the power device 3, not only is impedance low, but also heat can be conducted and dissipated quickly, but from the cost, an aluminum alloy or a copper-aluminum plate strip can be selected;

further, the shape of the connecting member 2 may be square, round, oval or other irregular shapes, and in this embodiment, a rectangular strip structure is preferred.

The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To those skilled in the art to which the invention pertains, a number of simple deductions or substitutions can be made without departing from the scope of the invention, which should be considered as belonging to the scope of the present invention as defined by the appended claims.

Claims

1. The utility model provides a connection structure of power device with heat dissipation function, includes the PCB board, install in connecting piece and power device on the PCB board, its characterized in that, be equipped with at least one through-hole on the PCB board, be used for the installation power device with the connecting piece, the connecting piece is including connecting the body and the convex closure that makes progress outstanding, the convex closure passes through-hole and butt extremely power device, the connection body extend in the PCB board and with outside electrical connection.

2. The connecting structure of a power device with a heat dissipating function according to claim 1, wherein the power device is mounted above the PCB board and completely covers the through hole, and the connecting member is mounted on a lower surface of the PCB board.

3. The connection structure of power devices with a heat dissipation function as claimed in claim 1, wherein the number of the power devices and the number of the convex hulls are the same as the number of the through holes, and the power devices and the convex hulls are in one-to-one correspondence.

4. The connecting structure of a power device with a heat dissipation function as claimed in claim 1, wherein the connecting member is a heat conductive and electrically conductive metal material.

5. The connecting structure of power device with heat dissipation function as claimed in claim 1, wherein the shape of the connecting member can be square, circular, oval or other irregular shapes.