CN219203148U

CN219203148U - Parallel air duct radiator

Info

Publication number: CN219203148U
Application number: CN202223475762.6U
Authority: CN
Inventors: 陈�峰
Original assignee: Qingdao Nuoya Industry Equipment Co ltd
Current assignee: Qingdao Nuoya Industry Equipment Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-06-16
Anticipated expiration: 2032-12-26

Abstract

The utility model discloses a parallel air duct radiator, which relates to the technical field of semiconductor switching tubes and comprises the following components: a plurality of semiconductor switch tubes and IGBT circuit boards which are electrically connected with each other, further comprising: the fixing piece is of a hollowed-out structure, and a first heat dissipation area and a second heat dissipation area are formed in the fixing piece through a partition board; the first heat dissipation area and the second heat dissipation area are respectively internally provided with a heat dissipation piece; a plurality of parallel air channels are arranged in the heat dissipation part, a heat dissipation fan is arranged on one side of the heat dissipation part, and the air outlet direction of the heat dissipation fan faces the parallel air channels; the semiconductor switching tubes are respectively connected with the heat dissipation piece. The beneficial effects are that: the semiconductor switch tube integrated on the IGBT circuit board is arranged on the radiating piece to conduct heat, so that the heat conduction efficiency is high, the heat is dissipated through the cooperation of the radiating fan and the parallel air duct, the wind resistance coefficient of the parallel air duct is small, the overall heat dissipation effect is remarkable, and meanwhile, the fixing piece is used for fixing the radiating piece, so that the insulation reliability of the semiconductor switch tube is improved.

Description

Parallel air duct radiator

Technical Field

The utility model relates to the technical field of semiconductor switching tubes, in particular to a parallel air duct radiator.

Background

Semiconductor switching tubes, such as MOSFETs (metal-oxide semiconductor field effect transistors), are continuously turned on and off rapidly as switching devices in dc converters, and generate a lot of heat during their operation. The efficient heat dissipation structure of the semiconductor switching tube is one of key structures for ensuring the normal operation of the direct current converter. In addition, in the dc converter, since the voltage of the primary side of the semiconductor switching tube is high, the insulation requirement thereof needs to be considered.

The current common heat radiation structure of semiconductor switch tube adopts the semiconductor switch tube to weld on the printed circuit board often, has one deck heat conduction gel and one deck insulating heat dissipation pad between the boss of printed circuit board and casing to above-mentioned printed circuit board, heat conduction gel, insulating heat dissipation pad pass through the screw fastening on the boss, realize closely laminating between printed circuit board, heat conduction gel 3, insulating heat dissipation pad and the boss. The heat conducting gel can reduce interface thermal resistance in the heat conducting process, and the insulating heat dissipation pad not only can realize the insulating requirement of the semiconductor switch tube and the shell, but also can conduct heat generated by the semiconductor switch tube to the boss of the shell together with the heat conducting gel, and the heat is finally transferred to the outside through the radiator on the shell.

However, in the heat dissipation structure of the semiconductor switching tube, heat generated by the semiconductor switching tube is mainly conducted to the shell through the heat conduction gel and the insulating heat dissipation pad, but the heat conduction coefficient of the heat conduction gel and the insulating heat dissipation pad is low, generally only 1-3W/m.K, and the heat conduction capability is poor. And above-mentioned heat radiation structure equipment is comparatively loaded down with trivial details, need paste insulating heat dissipation pad to the boss earlier, scribble heat conduction gel on insulating heat dissipation pad again, is unfavorable for automated production. In addition, the contact of the insulating heat dissipation pad and the boss is easy to damage, and once the heat dissipation pad is damaged, the insulation requirement of the semiconductor switch tube cannot be guaranteed.

For the problems in the related art, no effective solution has been proposed at present.

Disclosure of Invention

Aiming at the problems in the related art, the utility model aims to provide a parallel air duct radiator, which is characterized in that a semiconductor switching tube integrated on an IGBT circuit board is arranged on a radiating piece to conduct heat, so that the heat conduction efficiency is high, the radiating fan is matched with a parallel air duct to conduct heat radiation, the wind resistance coefficient of the parallel air duct is small, the whole radiating effect is obvious, and meanwhile, the fixing piece is used for fixing the radiating piece, so that the reliability of the insulation of the semiconductor switching tube is improved, and the technical problems in the prior art are overcome.

The technical scheme of the utility model is realized as follows:

a parallel air duct radiator comprising: a plurality of semiconductor switch tubes and IGBT circuit boards which are electrically connected with each other, further comprising: the fixing piece is of a hollowed-out structure, and a first heat dissipation area and a second heat dissipation area are formed in the fixing piece through a partition board;

the first heat dissipation area and the second heat dissipation area are respectively internally provided with a heat dissipation piece;

a plurality of parallel air channels are arranged in the heat dissipation part, a heat dissipation fan is arranged on one side of the heat dissipation part, and the air outlet direction of the heat dissipation fan faces the parallel air channels;

the semiconductor switching tubes are respectively connected with the heat dissipation piece.

Further, the heat sink includes: the air conditioner comprises a substrate and a plurality of fins, wherein the fins are horizontally arranged on the substrate in an array manner, and parallel air channels are formed between the adjacent fins.

Further, the fins are of a V-shaped structure.

Further, the IGBT circuit boards are at least two groups, and the two groups of IGBT circuit boards are respectively located at two sides of the fixing member.

Further, the fixing piece and the partition plate are made of insulating plastic respectively.

The utility model has the beneficial effects that:

according to the utility model, the semiconductor switch tube integrated on the IGBT circuit board is arranged on the heat dissipation piece to conduct heat, so that the heat conduction efficiency is high, the heat dissipation fan is matched with the parallel air duct to conduct heat, the wind resistance coefficient of the parallel air duct is small, the overall heat dissipation effect is remarkable, and meanwhile, the fixing piece is used for fixing the heat dissipation piece, so that the insulation reliability of the semiconductor switch tube is improved.

Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and drawings.

In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a parallel air duct radiator according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a radiator element of a parallel duct radiator according to an embodiment of the utility model;

fig. 3 is a schematic diagram of fins of a parallel air duct radiator according to an embodiment of the utility model.

In the figure:

1. a semiconductor switching tube; 2. an IGBT circuit board; 3. a fixing member; 4. a partition plate; 5. a first heat dissipation area; 6. a second heat dissipation area; 7. a heat sink; 8. parallel air channels; 9. a heat radiation fan; 10. a substrate; 11. and (5) fins.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.

According to an embodiment of the utility model, a parallel air duct radiator is provided.

As shown in fig. 1-3, a parallel air duct radiator includes: a plurality of semiconductor switch tubes 1 and IGBT circuit boards 2 that are electrically connected with each other, still include: the fixing piece 3 is of a hollowed-out structure, and a first heat dissipation area 5 and a second heat dissipation area 6 are formed in the fixing piece 3 through the partition board 4;

the first heat dissipation area 5 and the second heat dissipation area 6 are respectively provided with a heat dissipation piece 7;

a plurality of parallel air channels 8 are arranged in the heat dissipation piece 7, a heat dissipation fan 9 is arranged on one side of the heat dissipation piece 7, and the air outlet direction of the heat dissipation fan 9 faces to the parallel air channels 8;

the semiconductor switching tubes 1 are each connected to a heat sink 7.

In addition, the heat sink 7 includes: the air conditioner comprises a substrate 10 and a plurality of fins 11, wherein the fins 11 are horizontally arranged on the substrate 10 in an array manner, and parallel air channels 8 are formed between the adjacent fins 11.

By means of the scheme, the semiconductor switch tube 1 integrated on the IGBT circuit board 2 is arranged on the radiating piece 7 to conduct heat, so that not only is the heat conduction efficiency high, but also the heat is dissipated through the cooling fan 9 matched with the parallel air duct 8, the wind resistance coefficient of the parallel air duct 8 is small, the overall heat dissipation effect is remarkable, and meanwhile, the fixing piece 3 is used for fixing the radiating piece 7, so that the insulation reliability of the semiconductor switch tube is improved.

In this technical scheme, fin 11 is V-shaped structure. By designing the fins 11 with V-shaped structures, the ventilation area of the parallel air duct 8 is increased, and the overall heat dissipation effect is improved.

In addition, the IGBT circuit boards 2 are at least two groups, and the two groups of IGBT circuit boards 2 are respectively located at two sides of the fixing member 3.

According to the technical scheme, the IGBT circuit boards 2 are arranged on two sides respectively, and the independent radiating pieces 7 are used for radiating heat, so that the working efficiency is improved.

The fixing member 3 and the partition plate 4 are made of insulating plastic materials, respectively.

According to the technical scheme, the fixing piece 3 made of insulating plastic material improves the insulating reliability of the semiconductor switching tube.

In summary, by means of the above technical solution of the present utility model, the following effects can be achieved:

through locating the semiconductor switch tube 1 integrated at IGBT circuit board 2 on the radiating member 7 and conducting heat, not only heat conduction efficiency is high, dispels the heat through radiator fan 9 cooperation parallel wind channel 8 moreover, and its parallel wind channel 8 windage coefficient is little, and whole radiating effect is showing, simultaneously through the fixed part 3 to the fixed of radiating member 7, has improved the insulating reliability of semiconductor switch tube.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. A parallel air duct radiator comprising: a plurality of semiconductor switch tubes (1) and IGBT circuit board (2) of mutual electric connection, its characterized in that still includes: the fixing piece (3), the fixing piece (3) is of a hollow structure, and a first heat dissipation area (5) and a second heat dissipation area (6) are formed in the fixing piece (3) through the partition board (4);

the first heat dissipation area (5) and the second heat dissipation area (6) are respectively provided with a heat dissipation piece (7);

a plurality of parallel air channels (8) are arranged in the heat dissipation part (7), a heat dissipation fan (9) is arranged on one side of the heat dissipation part (7), and the air outlet direction of the heat dissipation fan (9) faces the parallel air channels (8);

the semiconductor switching tubes (1) are respectively connected with the heat dissipation piece (7).

2. A parallel duct radiator according to claim 1, characterized in that the radiator element (7) comprises: the air conditioner comprises a substrate (10) and a plurality of fins (11), wherein the fins (11) are horizontally arranged on the substrate (10) in an array manner, and parallel air channels (8) are formed between the adjacent fins (11).

3. A parallel duct radiator according to claim 2, characterized in that the fins (11) are of V-shaped configuration.

4. The parallel air duct radiator according to claim 1, wherein the IGBT circuit boards (2) are at least two groups, and the two groups of IGBT circuit boards (2) are respectively located at two sides of the fixing member (3).

5. A parallel duct radiator according to claim 1, characterized in that the material of the fixing element (3) and the partition (4) is respectively an insulating plastic material.