CN212915713U

CN212915713U - Automatic biochip assembling device

Info

Publication number: CN212915713U
Application number: CN202021309695.9U
Authority: CN
Inventors: 方林华
Original assignee: Shenzhen Wanfuda Precision Equipment Co ltd
Current assignee: Shenzhen Wanfuda Precision Equipment Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2021-04-09
Anticipated expiration: 2030-07-06

Abstract

The utility model discloses an automatic assembly device for biological chips, which comprises a machine table, a rotating component, a manipulator component, a dispensing component, a laminating component and a curing component, wherein the rotating component comprises an object stage and a driving component which are rotatably arranged on the machine table, and the object stage comprises an operating platform; the manipulator assembly is used for transferring the silicon wafer to an operating platform positioned at the feeding and discharging station and moving a finished product down from the operating platform positioned at the feeding and discharging station; the dispensing assembly is used for adding shadowless glue on a preset site of the silicon wafer on the operating platform at the dispensing station; the laminating assembly is used for laminating the glass sheet on the silicon wafer on the operating platform at the laminating station; the curing assembly is used for irradiating the glass sheet on the operating platform of the curing station so as to connect the glass sheet with the silicon wafer to form a finished product. The technical scheme of the utility model improves the packaging efficiency of biochip.

Description

Automatic biochip assembling device

Technical Field

The utility model relates to a chip assembly technical field, in particular to automatic assembly device of biochip.

Background

Biochip technology is an emerging technology in the field of life science and biomedical research in recent years, and has a wide range of applications in the fields of biology, biotechnology, and biomedicine, such as point mutation detection, DNA sequencing, gene expression analysis, drug screening, and clinical diagnosis. Biochips are a type of miniaturized device that can be used for chemical or biological reactions, fabricated using microelectronics and microfabrication techniques and other related technologies of the semiconductor industry, to integrate and simplify existing discrete chemical or biochemical analysis processes and devices into microchip-based devices. The assembly work of the biochip is mostly completed manually, more manpower is needed, the assembly efficiency is low, and the cost is high.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an automatic chip assembling device, which aims at improving the assembling efficiency of biochips.

In order to achieve the above object, the present invention provides an automatic biochip assembling apparatus, which includes a machine table, a rotation assembly, a manipulator assembly, a dispensing assembly, a laminating assembly, and a curing assembly, wherein the rotation assembly includes a stage and a driving assembly rotatably mounted on the machine table, the stage includes an operation platform, the driving assembly is used for driving the stage to rotate, and the operation platform has a feeding and discharging station, a dispensing station, a laminating station, and a curing station; the manipulator assembly is arranged on the machine table and used for transferring the silicon wafer to the operating platform at the feeding and discharging station and moving a finished product down from the operating platform at the feeding and discharging station; the dispensing assembly is arranged on the machine table and used for adding shadowless glue on a preset point of the silicon wafer on the operating platform at the dispensing station; the laminating assembly is arranged on the machine table and used for laminating a glass sheet on the silicon sheet on the operating platform at the laminating station; the curing assembly is arranged on the machine table and used for irradiating the glass sheet on the operating platform of the curing station so as to connect the glass sheet with the silicon wafer to form the finished product.

Optionally, the number of the operating platforms is four, and four the operating platforms are in the circumferential direction of the machine platform is in sequence distributed at intervals, and each operating platform is provided with a feeding and discharging station, a dispensing station, a fitting station and a curing station.

Optionally, the object stage further comprises a vacuum air passage arranged in the operation platform, a suction hole is formed in the operation platform and communicated with the vacuum air passage, and the suction hole is used for fixing the silicon wafer to the operation platform.

Optionally, the attaching assembly comprises a material taking module, an attaching moving assembly and a pressure head assembly arranged on the attaching moving assembly, the material taking module is arranged on the machine table, and the material taking module is used for clamping the glass sheet; the laminating moving assembly is used for moving the pressure head assembly; the pressure head component is used for adsorbing the glass sheet and attaching and pressing the glass sheet on the silicon wafer.

Optionally, the reclaiming module comprises a rotary pneumatic clamp for clamping and rotating the glass sheet to lay the glass sheet flat.

Optionally, the pressure head assembly comprises a pressure head and a pressure sensor connected to the pressure head, wherein the pressure head is used for adsorbing the glass sheet and pressing the glass sheet on the silicon wafer; the pressure sensor is used for monitoring the pressure of the pressure head.

Optionally, the pressure head subassembly still includes the UV pointolite, the UV pointolite install in the laminating removes the subassembly, the pressure head orientation the light trap has been seted up to the one side of board, the UV pointolite is used for seeing through the light trap shines the glass piece, in order to right the glass piece with the silicon chip is solidification in advance.

Optionally, the dispensing assembly includes a dispensing moving assembly and a dispensing member mounted on the dispensing moving assembly, the dispensing member is configured to add a shadowless glue to a preset location of the silicon wafer, and the dispensing moving assembly is configured to move a position of the dispensing member, so that the dispensing member moves according to a preset track.

Optionally, the automatic biochip assembling device further comprises a first visual positioning assembly, the first visual positioning assembly is mounted on the dispensing moving assembly, and the first visual positioning assembly is used for detecting a shadowless glue track on the silicon wafer.

Optionally, the manipulator assembly comprises a six-axis manipulator and a clamping portion, the clamping portion is mounted on the six-axis manipulator, and the clamping portion is a flexible clamp.

The utility model discloses technical scheme has adopted rotating assembly, manipulator subassembly, point to glue subassembly, laminating subassembly and solidification subassembly, goes up the unloading operation through manipulator subassembly, has reduced the manual work and has reduced contaminated probability to silicon chip and off-the-shelf contact. The dispensing assembly is used for dispensing the silicon wafer, so that the dispensing precision is high, and the glue amount is accurately controlled; the glass sheet is attached to the silicon wafer by the attaching assembly, the glass sheet is solidified to be connected with the silicon wafer by the solidifying assembly, manual operation is not needed in the assembling process, and feeding, discharging, dispensing, attaching and solidifying are automatically completed, so that the assembling efficiency of the biochip is greatly improved, the manual workload is reduced, and the labor cost is reduced. This automatic assembly device of chip is small, for many single equipments of traditional use, has reduced area by a wide margin, saves the place, and automatic assembly device of chip has realized all kinds of silicon chips in the equipment of glass piece simultaneously, and the commonality is high, the popularization of the automatic assembly device of chip of being convenient for.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural view of an embodiment of the automated biochip assembling apparatus of the present invention;

FIG. 2 is another view of the automated biochip assembling apparatus shown in FIG. 1;

fig. 3 is a schematic structural diagram of an embodiment of the rotating assembly of the present invention;

FIG. 4 is another perspective diagrammatic view of the rotating assembly of FIG. 3;

FIG. 5 is a schematic structural view of an embodiment of the bonding assembly of the present invention;

FIG. 6 is another perspective view of the conformable assembly of FIG. 4;

fig. 7 is a schematic structural view of an embodiment of the dispensing assembly of the present invention;

FIG. 8 is another perspective view of the adhesive assembly of FIG. 7;

FIG. 9 is a further view of the adhesive assembly of FIG. 7;

fig. 10 is a partially enlarged view of a portion a in fig. 1.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides an automatic assembly device of biochip.

In the embodiment of the present invention, as shown in fig. 1 to 3, the automatic biochip assembling apparatus 10 includes a machine table 100, a rotating assembly 200, a manipulator assembly 300, a dispensing assembly 400, a pasting assembly 500, and a curing assembly 600, wherein the rotating assembly 200 includes a stage 210 rotatably mounted on the machine table 100 and a driving assembly, the stage 210 includes an operating platform 211, and the driving assembly is configured to drive the stage 210 to rotate, so that the operating platform 211 has a feeding and discharging station, a dispensing station, a pasting station, and a curing station; the robot assembly 300 is installed on the machine table 100, and the robot assembly 300 is used for transferring the silicon wafer 20 to the operation platform 211 at the loading/unloading station and for removing a finished product (not shown) from the operation platform 211 at the loading/unloading station. As shown in fig. 1 to 2, the dispensing assembly 400 is mounted on the machine table 100, and the dispensing assembly 400 is used for adding an shadowless adhesive on a preset position of the silicon wafer 20 on the operating platform 211 at the dispensing station; the bonding assembly 500 is installed on the machine table 100, and the bonding assembly 500 is used for bonding a glass sheet (not shown) to the silicon wafer 20 on the operating platform 211 of the bonding station; the curing assembly 600 is installed on the machine 100, and the curing assembly 600 is used for irradiating the glass sheet on the operation platform 211 of the curing station, so that the glass sheet is connected with the silicon wafer 20 to form the finished product.

Specifically, the finished product is formed by bonding and connecting a silicon wafer 20 and a glass sheet, and the finished product is a biochip and can be used for gene detection, storage, reading and the like. The silicon wafer 20 may be a silicon wafer, and the silicon wafer 20 may be fixed with a gene probe before assembly, or may be fixed with a probe after assembly of a finished product, which is not limited herein. The glass sheet may be etched glass, i.e. a glass sheet that has been subjected to an etching process.

As shown in fig. 1, the machine 100 is used for placing components such as a rotating assembly 200, a manipulator assembly 300, a dispensing assembly 400, etc., a hood may be disposed on the machine 100, the hood is used for covering the components on the machine 100, and a transparent window, a driving button, a control panel, etc. may be disposed on the hood. A camera light source controller, a UV light source controller, a motor starter, a dispensing driver, etc. may be installed in the machine 100, and in addition, a weight may be installed in the machine 100 to increase the stability of the machine 100.

As shown in fig. 2 to 3, the machine 100 is provided with a rotating assembly 200, the rotating assembly 200 includes a stage 210 and a driving assembly, the stage 210 includes an operating platform 211, and the driving assembly is used for driving the stage 210 to rotate, so that the operating platform 211 has a loading and unloading station, a dispensing station, a bonding station, and a curing station. The driving assembly may include a direct drive rotating motor 220, and the direct drive rotating motor 220 is installed below the stage 210, thereby achieving precise positioning of the stage 210.

As shown in fig. 1 to 2, the robot assembly 300 is mounted on the machine table 100, and the feeding cassette 110 and the discharging cassette 120 are also mounted on the machine table 100, and since the robot assembly 300 is used for feeding and discharging, the feeding cassette 110 and the discharging cassette 120 can be mounted beside the robot assembly 300 for convenient robot pick-and-place. The upper magazine 110 is used to store silicon wafers 20, and the lower magazine 120 is used to store finished products. It is understood that the process of feeding and discharging may be performed manually without the need for the robot assembly 300. Since the biochip has a high requirement for cleanliness, a first blowing unit (not shown) may be further installed on the stage 100, and blows air to the silicon wafer 20 to clean the silicon wafer 20 after the robot assembly 300 grips the silicon wafer 20. The gas blown by the first blowing assembly can be inert gas, air with high cleanliness, oxygen-containing gas (such as O2, CO and CO2), nitrogen-containing gas (such as N2, HN3, NO2 and NO), and the like.

As shown in fig. 1 to 2, when the operation platform 211 is at the loading/unloading station, the robot assembly 300 grips the silicon wafer 20 and moves to the operation platform 211 at the loading/unloading station. When the operation platform 211 performs the dispensing operation on the silicon wafer 20 at the dispensing station, the dispensing assembly 400 performs the dispensing operation. When the operation platform 211 is at the bonding station, the bonding assembly 500 bonds the glass sheet to the silicon wafer 20. When the operation platform 211 is at the curing station, the curing assembly 600 irradiates the glass sheet to cure the shadowless adhesive, so that the glass sheet is connected to the silicon wafer 20 to form a finished product. When the finished product is completed, the robot assembly 300 removes the finished product on the operation platform 211 at the loading and unloading station, thereby completing an assembly process of the finished product.

The utility model discloses technical scheme has adopted rotating assembly 200, manipulator subassembly 300, has glued subassembly 400, laminating subassembly 500 and solidification subassembly 600 a little, carries out the unloading operation of going up through manipulator subassembly 300, has reduced the manual work and has reduced contaminated probability to silicon chip 20 and off-the-shelf contact. The dispensing assembly 400 dispenses the silicon wafer 20, so that the dispensing precision is high, and the dispensing amount is controlled accurately; the glass sheet is attached to the silicon wafer 20 by the attaching assembly 500, and the glass sheet is cured by the curing assembly 600 to be connected with the silicon wafer 20, so that the loading, unloading, dispensing, attaching and curing are automatically completed in the assembling process without manual operation, the assembling efficiency of the biochip is greatly improved, the manual workload is reduced, and the labor cost is reduced. This automatic assembly device of chip is small, for many single equipments of traditional use, has reduced area by a wide margin, saves the place, and automatic assembly device of chip has realized all kinds of silicon chips 20 in the equipment of glass piece simultaneously, and the commonality is high, the popularization of the automatic assembly device of chip of being convenient for.

Further, as shown in fig. 1 to 3, in some embodiments, four operation platforms 211 are provided, and the four operation platforms 211 are sequentially distributed at intervals in the circumferential direction of the machine table 100, and each operation platform 211 has a feeding and discharging station, a dispensing station, a bonding station, and a curing station.

As shown in fig. 3, the object stage 210 may further include a rotating platform 212, the rotating platform 212 is connected to four operation platforms 211, a direct-drive rotating motor 220 is installed below the rotating platform 212, and the direct-drive rotating motor 220 is configured to drive the rotating platform 212 to rotate, so as to drive the operation platforms 211 to rotate. The four operation platforms 211 may include a first operation platform 211, a second operation platform 211, a third operation platform 211, and a fourth operation platform 211, and are sequentially distributed in the circumferential direction of a circle, the first operation platform 211 and the third operation platform 211 may be disposed relatively, and the second operation platform 211 and the fourth operation platform 211 may be disposed relatively.

When the first operating platform 211 is located at the feeding and discharging station, the second operating platform 211 is located at the dispensing station, the third operating platform 211 is located at the bonding station, the fourth operating platform 211 is located at the curing station, the rotating platform 212 rotates, when the first operating platform 211 is located at the dispensing station, the second operating platform 211 is located at the bonding station, the third operating platform 211 is located at the curing station, the fourth operating platform 211 is located at the feeding and discharging station, and when the rotating platform 212 rotates again, the stations where the four operating platforms 211 are located sequentially change. Through the four operation platforms 211, the robot assembly 300, the dispensing assembly 400, the attaching assembly 500 and the curing assembly 600 can be operated simultaneously, thereby further improving the assembly efficiency of the biochip.

In order to prevent the silicon wafer 20 on the operation platform 211 from falling off when the stage 210 rotates, as shown in fig. 2 to 3, in some embodiments, the stage 210 further includes a vacuum air channel disposed in the operation platform 211, the operation platform 211 is provided with a suction hole, the suction hole is communicated with the vacuum air channel, and the suction hole is used for fixing the silicon wafer 20 on the operation platform 211.

One side of operation platform 211 can be equipped with the vacuum trachea 213 of connecting the vacuum airway, and vacuum trachea 213 one end is connected the vacuum airway, and the other end can be connected the gas-electric slip ring, through vacuum trachea 213 evacuation to make the silicon chip 20 of placing on operation platform 211 adsorb fixedly, silicon chip 20 takes place to shift when avoiding silicon chip 20 to drop or some glue subassembly 400 to glue the operation at the point when objective table 210 rotates. The operation platform 211 may be configured to hold a plurality of silicon wafers 20, and the number of the fine holes may be plural.

The structure of the attaching assembly 500 is various, as shown in fig. 5 to 6, in some embodiments, the attaching assembly 500 includes a material taking module 510, an attaching moving assembly 520, and a pressing head assembly 530 mounted on the attaching moving assembly 520, the material taking module is mounted on the machine platform 100, and the material taking module 510 is used for clamping the glass sheet; the attaching and moving assembly 520 is used for moving the pressure head assembly 530; the pressure head component 530 is used for adsorbing the glass sheet and attaching and pressing the glass sheet on the silicon wafer 20.

As shown in fig. 5, the attaching assembly 500 may include a supporting frame 501, an attaching moving assembly 520 mounted on the supporting frame 501, and a pressing head assembly 530 mounted on the attaching moving assembly 520. The attaching moving assembly 520 comprises a first X-axis linear motor 521, a first Y-axis linear motor 522 and a first Z-axis linear motor 523, the first Y-axis linear motor 522 is installed on the support frame 501, the first X-axis linear motor 521 is installed on the first Y-axis linear motor 522, the first X-axis linear motor 521 is provided with the first Z-axis linear motor 523, and the pressure head assembly 530 is installed on the first Z-axis linear motor 523. The position of the ram assembly 530 is moved by actuation of the engagement moving assembly 520.

As shown in fig. 5 to 6, when the operation platform 211 is at the bonding station, the material taking module 510 takes in the glass sheet, the pressure head assembly 530 moves through the bonding moving assembly 520, and adsorbs a single glass sheet from the material taking module 510, and then bonds the glass sheet to the silicon wafer 20 on the operation platform 211 at the bonding station, thereby completing the bonding operation of the glass sheet. In order to clean the glass sheet, the machine 100 may further include a second air blowing assembly (not shown), and when the material taking module 510 clamps the glass sheet, the second air blowing assembly blows air to the glass sheet to clean the glass sheet, so as to ensure cleanliness of the bonding surface of the glass sheet. The curing assembly 600 may include a UV curing lamp (not shown) for irradiating the glass sheet on the work platform 211 at the curing station to secure the shadowless adhesive sufficiently to secure the glass sheet to the silicon wafer 20 to form a finished product.

There are a variety of configurations for the reclaimer module 510, as shown in fig. 6. in some embodiments, the reclaimer module 510 includes a rotary pneumatic gripper 511, and the rotary pneumatic gripper 511 is configured to grip and rotate the glass sheet to lay the glass sheet flat.

After the glass sheet is removed by the rotary air clamp 511, the rotary air clamp 511 may be rotated at an angle such that the glass sheet faces downward to facilitate the retrieval of the glass sheet from the rotary air clamp 511 by the pressure head assembly 530. As shown in fig. 5 to 6, the glass sheets may be stored in the glass material box 130, the glass material box 130 may store a plurality of glass sheets, the glass sheets may be vertically placed, and the plurality of glass sheets may be laterally spaced in the glass material box 130. A positioning block (not shown) may be disposed in the glass material box 130, the positioning block may be made of polyetheretherketone material, and a positioning groove is disposed on the positioning block, and the glass sheet is placed in the positioning grooves of the two positioning blocks, so as to position the glass sheet. It is understood that the upper magazine 110 and the lower magazine 120 may be arranged with reference to the structure of the glass material magazine 130, and thus, the description thereof is omitted.

The structure of the indenter assembly 530 can be varied, as shown in fig. 5 to 6, and in some embodiments, the indenter assembly 530 comprises an indenter 531 and a pressure sensor 532 connected to the indenter 531, wherein the indenter 531 is used for attracting the glass sheet and for pressing the glass sheet onto the silicon wafer 20; the pressure sensor 532 is used to monitor the pressure of the ram 531.

After the glass sheet is attached to the silicon wafer 20, the pressure head 531 can press the glass sheet, and the pressure sensor 532 is connected to the pressure head 531 to monitor the pressure of the pressure head 531 on the glass sheet. The pressing time can be 5 seconds or 30 seconds, and the specific time is not limited; the pressure of the pressing can be 0-60N, and the pressing can be set according to actual conditions. It is understood that the number of the indenters 531 may be plural, and each indenter 531 may be connected to a pressure sensor 532.

Further, in some embodiments, the pressure head assembly 530 further includes a UV point light source (not shown) installed on the bonding moving assembly 520, a light hole is opened on a surface of the pressure head 531 facing the machine 100, and the UV point light source is configured to irradiate the glass sheet through the light hole to pre-cure the glass sheet and the silicon wafer 20.

When the pressing head 531 presses the glass sheet, or after the pressing is completed, the UV point light source irradiates the glass sheet through the light hole of the pressing head 531, so that the shadowless glue is cured, and the glass sheet is pre-cured, so that the relative position between the glass sheet and the silicon wafer 20 is prevented from moving when the operation platform 211 is transferred to the curing station, and the yield of the biochip is improved.

As shown in fig. 7 to 9, in some embodiments, the dispensing assembly 400 includes a dispensing moving assembly 410 and a dispensing member 420 mounted on the dispensing moving assembly 410, the dispensing member 420 is used for adding an shadowless adhesive on a predetermined position of the silicon wafer 20, and the dispensing moving assembly 410 is used for moving the position of the dispensing member 420, so that the dispensing member 420 moves according to a predetermined track.

As shown in fig. 7 to 8, the dispensing member 420 may include a dispensing cylinder 421 and a needle mounted on the dispensing cylinder 421, and the shadowless glue is stored in the dispensing cylinder 421 and is output through the needle. The dispensing cylinder 421 can control the amount of glue to be output, which is beneficial to improving the yield of the biochip. The dispensing assembly 400 may further include a base plate 401, the dispensing moving assembly 410 is mounted on the base plate 401, the dispensing moving assembly 410 may include a second X-axis linear motor 411, a second Y-axis linear motor 412 and a Z-axis motor 413, the second Y-axis linear motor 412 is mounted on the base plate 401, the second X-axis linear motor 411 is mounted on the second Y-axis linear motor 412, the Z-axis motor 413 is mounted on the second X-axis linear motor 411, and the dispensing barrel 421 is mounted on the Z-axis motor 413. By the movement of the dispensing moving assembly 410, the dispensing member 420 moves according to a predetermined trajectory, so that the shadowless adhesive on the silicon wafer 20 has a certain adhesive path. A height measuring sensor 430 can be further installed on the Z-axis motor 413 to detect the height of the dispensing cylinder 421, so as to ensure the dispensing quality.

Further, as shown in fig. 9, in some embodiments, the automatic biochip assembling apparatus 10 further includes a first visual positioning assembly 700, the first visual positioning assembly 700 is mounted on the dispensing moving assembly 410, and the first visual positioning assembly 700 is configured to detect the shadowless glue trace on the silicon wafer 20.

Through the first visual positioning assembly 700, the silicon wafer 20 on the operating platform 211 at the dispensing station can be photographed to detect whether the glue path on the silicon wafer 20 is qualified or whether the width of the shadowless glue on the silicon wafer 20 reaches the standard, so that the quality of the biochip is controlled. It should be noted that the first visual positioning assembly 700 may also take a picture of the silicon wafer 20 before dispensing to obtain the position information and the preset site information of the silicon wafer 20, so as to facilitate subsequent dispensing work.

The first visual alignment assembly 700 may include a CCD camera on which a lens is mounted, and a light source that may be mounted between the lens and the silicon wafer 20 to provide a light source. The light source may be a low angle shadowless light source in order to accurately capture a sharp picture of the silicon wafer 20.

The robot assembly 300 may have various configurations, as shown in fig. 1 and 10, and in some embodiments, the robot assembly 300 includes a six-axis robot 310 and a gripper 320, the gripper 320 is mounted to the six-axis robot 310, and the gripper 320 is a flexible gripper.

The six-axis manipulator 310 operates by utilizing the rotation and movement of the x, y and z axes, has six degrees of freedom, clamps the silicon wafer 20 in the feeding box 110 through the clamping part 320 arranged on the six-axis manipulator 310, and places the silicon wafer on the operation platform 211 at a certain angle, or clamps the finished product on the operation platform 211 and moves the finished product into the discharging box 120, further improves the automation degree of the biochip automatic assembling device 10, greatly reduces the labor intensity of workers, and saves the labor power. The clamping portion 320 may include a servo chuck for gripping the silicon wafer 20 or the finished product.

Further, as shown in fig. 10, in some embodiments, the automatic biochip assembling apparatus 10 further includes a second visual positioning assembly 800, the second visual positioning assembly 800 is mounted on the six-axis robot 310, and the second visual positioning assembly 800 is used for acquiring the position of the silicon wafer 20 or the finished product and checking the quality of the finished product.

The second visual positioning assembly 800 is used for photographing the silicon wafer 20 or the finished product to obtain the position of the silicon wafer 20 or the finished product, so that the six-axis manipulator 310 can accurately clamp the silicon wafer 20 or the finished product. Since the second visual positioning assembly 800 is mounted on the six-axis robot 310 and moves along with the six-axis robot 310, the second visual positioning assembly 800 can also be used to inspect the quality of the finished product or the quality of the silicon wafer 20 and identify defective products, thereby further improving the automation degree of the automatic biochip assembling apparatus 10. It is understood that the structure of the second visual positioning assembly 800 can be arranged with reference to the structure of the first visual positioning assembly 700, and the detailed description thereof is omitted.

Further, as shown in fig. 2 and 10, in some embodiments, the automatic biochip assembling apparatus 10 further includes a defective product sorting module, the defective product sorting module may include a marking module 910 and a defective product box 920, the defective product box 920 may be placed on the machine 100, and the structure of the defective product box 920 may be set with reference to the structure of the glass material box 130, which is not described in detail herein. The marking unit 910 may be installed on the six-axis robot 310, and when the defective product is identified by the second visual positioning unit 800, the marking unit 910 marks the defective product, and then the defective product is moved into the defective product box 920 by the robot unit 300.

The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. An automated biochip assembly apparatus (10), comprising:

a machine table (100);

the rotating assembly (200) comprises an object stage (210) and a driving assembly, wherein the object stage (210) is rotatably mounted on the machine table (100), the object stage (210) comprises an operation platform (211), and the driving assembly is used for driving the object stage (210) to rotate and enabling the operation platform (211) to be provided with a feeding and discharging station, a dispensing station, a gluing station and a curing station;

the mechanical arm assembly (300), the mechanical arm assembly (300) is installed on the machine table (100), the mechanical arm assembly (300) is used for transferring the silicon wafer (20) to the operating platform (211) at the loading and unloading station, and is used for moving finished products off from the operating platform (211) at the loading and unloading station;

the dispensing assembly (400), the dispensing assembly (400) is installed on the machine table (100), and the dispensing assembly (400) is used for adding shadowless glue on a preset position of the silicon wafer (20) on the operating platform (211) at the dispensing station;

the laminating assembly (500) is installed on the machine table (100), and the laminating assembly (500) is used for laminating a glass sheet on the silicon wafer (20) on the operating platform (211) at the laminating station; and

a curing assembly (600), the curing assembly (600) being mounted to the machine table (100), the curing assembly (600) being configured to irradiate the glass sheet on the operation platform (211) at the curing station to join the glass sheet with the silicon wafer (20) to form the finished product.

2. The automated biochip assembling apparatus (10) of claim 1, wherein four operation platforms (211) are provided, and the four operation platforms (211) are sequentially spaced apart from each other in the circumferential direction of the machine table (100), and each operation platform (211) has a loading/unloading station, a dispensing station, a bonding station, and a curing station.

3. The automated biochip assembly apparatus (10) of claim 1, wherein the stage (210) further comprises a vacuum channel disposed in the operation platform (211), the operation platform (211) having a suction hole, the suction hole communicating with the vacuum channel, the suction hole being used to fix the silicon wafer (20) to the operation platform (211).

4. The automated biochip assembling apparatus (10) of claim 1, wherein the attaching assembly (500) comprises a material taking module (510), an attaching moving assembly (520), and a pressing head assembly (530) mounted on the attaching moving assembly (520), the material taking module is mounted on the machine table (100), and the material taking module (510) is used for clamping the glass sheet; the attaching and moving assembly (520) is used for moving the pressure head assembly (530); the pressure head component (530) is used for adsorbing the glass sheet and attaching and pressing the glass sheet on the silicon wafer (20).

5. The automated biochip assembly apparatus (10) of claim 4, wherein the pick-up module (510) comprises a rotary pneumatic gripper (511), the rotary pneumatic gripper (511) configured to grip and rotate the glass sheet to lay the glass sheet flat.

6. The automated biochip assembly apparatus (10) according to claim 4, wherein the pressure head assembly (530) comprises a pressure head (531) and a pressure sensor (532) connected to the pressure head (531), the pressure head (531) being configured to attract the glass sheet and to press the glass sheet onto the silicon wafer (20); the pressure sensor (532) is used for monitoring the pressure of the pressure head (531).

7. The automated biochip assembly apparatus (10) of claim 6, wherein the pressure head assembly (530) further comprises a UV point light source, the UV point light source is mounted on the bonding movement assembly (520), a light hole is formed in a surface of the pressure head (531) facing the machine table (100), and the UV point light source is configured to irradiate the glass sheet through the light hole to pre-cure the glass sheet and the silicon wafer (20).

8. The automated biochip assembling apparatus (10) according to any one of claims 1 to 7, wherein the dispensing assembly (400) comprises a dispensing moving assembly (410) and a dispensing member (420) mounted on the dispensing moving assembly (410), the dispensing member (420) is configured to add a shadowless adhesive to a predetermined position of the silicon wafer (20), and the dispensing moving assembly (410) is configured to move the position of the dispensing member (420) so that the dispensing member (420) moves according to a predetermined trajectory.

9. The automated biochip assembling apparatus (10) according to claim 8, wherein the automated biochip assembling apparatus (10) further comprises a first visual positioning assembly (700), the first visual positioning assembly (700) is mounted to the dispensing moving assembly (410), and the first visual positioning assembly (700) is configured to detect a shadowless adhesive track on the silicon wafer (20).

10. The automated biochip assembly apparatus (10) according to any one of claims 1 to 7, wherein the robot assembly (300) comprises a six-axis robot (310) and a gripper (320), the gripper (320) being mounted to the six-axis robot (310), the gripper (320) being a flexible gripper.