CN113685406A - Automatic bonding device of acceleration sensor - Google Patents
Automatic bonding device of acceleration sensor Download PDFInfo
- Publication number
- CN113685406A CN113685406A CN202111068037.4A CN202111068037A CN113685406A CN 113685406 A CN113685406 A CN 113685406A CN 202111068037 A CN202111068037 A CN 202111068037A CN 113685406 A CN113685406 A CN 113685406A
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- shell
- chip
- tool
- acceleration sensor
- axis moving
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- 230000001133 acceleration Effects 0.000 title claims abstract description 23
- 238000003825 pressing Methods 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 230000000007 visual effect Effects 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000007689 inspection Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Automatic Assembly (AREA)
Abstract
The utility model provides an automatic bonding device of acceleration sensor, includes that frame part, material loading part, point glue part, pressfitting part, unloading part, bottom paste part and detection part all set up on frame part, and material loading part, point glue part, pressfitting part, unloading part, bottom paste part and detection part connect its characterized in that in proper order: and the pressing part is provided with an upper support frame, a lower support frame, a position moving device and a rotating device, and the chip is automatically pasted to different positions of the shell through the position moving device and the rotating device. The automatic bonding device for the acceleration sensor can realize automatic glue dispensing and bonding, has strong compatibility, meets the clamping requirements of various shells and chips of customers by the tool, and improves the production efficiency, reduces the cost and improves the bonding quality compared with the traditional manual bonding.
Description
Technical Field
The invention relates to the field of MEMS sensor assembly, in particular to an automatic pasting device for an acceleration sensor.
Background
The acceleration sensor is used as an important branch of the MEMS sensor, has the advantages of small volume, light weight, good reliability, large measurement range, low cost and the like, and is widely applied to the fields of automotive electronics, wireless communication, aerospace, biomedicine, industry, agriculture and the like. With the rapid development of these industries, the demand of acceleration sensors is increasing, and the requirement of the accuracy is also increasing. Because the casing shape is more complicated, and the face of pasting is more, and the bonding of casing and chip often can only be accomplished by the manual work at present, however manual operation is inefficient, and the precision is not high, and this just causes holistic production efficiency to hang down. The acceleration sensor pasting device needs to be improved, automatic gluing and pasting solidification are achieved through accurate position movement and rotation, the technical requirements for manpower are reduced, and meanwhile production efficiency and pasting precision are improved.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an automatic pasting device for an acceleration sensor.
The invention is realized by the following modes:
the utility model provides an automatic bonding device of acceleration sensor, includes that frame part, material loading part, point glue part, pressfitting part, unloading part, bottom paste part and detection part all set up on frame part, and material loading part, point glue part, pressfitting part, unloading part, bottom paste part and detection part connect its characterized in that in proper order: and the pressing part is provided with an upper support frame, a lower support frame, a position moving device and a rotating device, and the chip is automatically pasted to different positions of the shell through the position moving device and the rotating device.
Further, the rotating device comprises a rotating platform, a rotating disc, a rotary clamping cylinder, a shell tool and a pressing cylinder, wherein the rotating disc is arranged on the rotating platform, the shell tool is arranged on the rotating disc, the rotary clamping cylinder and the pressing cylinder are arranged on two sides of the shell tool, the shell tool is used for placing the shell, and the rotary clamping cylinder and the pressing cylinder fix the shell; the position moving device comprises an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a chip tool, wherein the chip is fixed on the chip tool through vacuum adsorption, the chip tool is regulated and controlled to move and position through the X-axis moving platform, the Y-axis moving platform and the Z-axis moving platform, the chip is moved to the inside of the shell after the positioning is completed, and the Z-axis moving platform moves upwards to paste the chip on the shell.
Further, the feeding part comprises a core tray disc and a shell tray disc, the shell and the chip are respectively placed on the shell tray disc and the core tray disc, the shell and the chip are fixed in a vacuum adsorption mode, and then the core tray disc and the shell tray disc are transferred to a working position.
Further, the dispensing component comprises a dispensing valve, a shell sucker, a chip sucker and a linear unit; the straight line unit conveys the shell sucker to the feeding position, the shell sucker sucks the shell and then moves to the shell tooling position, the straight line unit moves again to suck the chip by the chip sucker and move to the chip tooling position, and the dispensing valve dispenses on the upper surface of the chip.
Further, the part is pasted to bottom includes accurate sharp slip table, chip and adsorbs frock, casing location frock, and chip vacuum adsorption fixes on the chip adsorbs the frock, and the casing is placed at casing location frock, drives the chip through accurate sharp slip table and adsorbs the frock and push down the chip to the casing bottom surface.
Further, the detection component comprises a detection platform, a light source, a visual camera and a visual display screen; the chip shell is placed on the detection platform, the chip shell is irradiated through the light source, the visual camera shoots the picture, and the result is displayed on the visual display screen.
Further, the rack part comprises a lower rack and an upper rack, the lower rack is provided with a detection part and a bottom surface pasting part, and the upper rack is provided with a visual display screen and a touch screen.
Furthermore, the X-axis moving platform, the Y-axis moving platform and the Z-axis moving platform of the position moving device are constructed by high-precision crossed roller guide rails, ball screws and motors, and the motors of the Z-axis moving platform can feed back the torque in real time in the pressing process.
Furthermore, the lower frame is welded by adopting a square steel pipe, the frame is fixedly supported by feet, 4 hole position mounting trundles are designed, and the front side of the lower frame is provided with a manual operation position.
Further, the upper frame is composed of an aluminum profile, a transparent PVC plate is arranged outside the upper frame to serve as an outer cover, safety doors are arranged on the front face and two side faces of the upper frame, and feeding and discharging positions are arranged on two sides of the front face.
The invention has the beneficial effects that: the automatic bonding device for the acceleration sensor can realize automatic glue dispensing and bonding, has strong compatibility, meets the clamping requirements of various shells and chips of customers by the tool, and improves the production efficiency, reduces the cost and improves the bonding quality compared with the traditional manual bonding.
Drawings
FIG. 1 is a schematic view of the overall apparatus of the present invention;
FIG. 2 is a schematic view of a housing piece of the present invention;
FIG. 3 is a schematic view of a chip workpiece according to the present invention;
FIG. 4 is a schematic view of the position of the chip attached to the housing;
FIG. 5 is a schematic view of a frame assembly of the present invention;
FIG. 6 is a schematic view of a loading unit according to the present invention;
FIG. 7 is a schematic view of a dispensing component of the present invention;
FIG. 8 is a schematic view of a press-fit component of the present invention;
FIG. 9 is a schematic view of a rotary device of the present invention;
FIG. 10 is a schematic view of a position shifting apparatus of the present invention;
FIG. 11 is a schematic view of a bottom attachment member of the present invention;
FIG. 12 is a schematic view of a detecting member in the present invention.
In the figure: 1. a frame member; 2. a feeding part; 3. a dispensing component; 4. a press-fit member; 5. a blanking part; 6. a bottom pasting member; 7. a detection section; 8. a housing; 9. a chip; 10. a lower frame; 11. an upper frame; 12. a touch screen; 13. a visual display screen; 14. a button box; 15. a core tray; 16. a housing tray; 17. dispensing a glue valve; 18. a housing suction cup; 19. chip sucker; 20. a linear unit; 21. a lower support frame; 22. an upper support frame; 23. a turntable mechanism; 24. a position moving device; 25. a rotating device; 26. a turntable; 27. a rotary clamping cylinder; 28. a shell tool; 29. a pressing cylinder; 30. an X-axis moving platform; 31. a Y-axis moving platform; 32. a Z-axis moving platform; 33. chip tooling; 34. a precision linear sliding table; 35. a chip adsorption tool; 36. a shell positioning tool; 37. a detection platform; 38. a light source; 39. a vision camera.
Detailed Description
The present invention will now be described in detail with reference to the drawings and specific embodiments, wherein the exemplary embodiments and descriptions are provided only for the purpose of illustrating the present invention and are not to be construed as limiting the present invention.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, an automatic bonding device for an acceleration sensor includes a frame member 1, a feeding member 2, a dispensing member 3, a pressing member 4, a discharging member 5, a bottom pasting member 6 and a detecting member 7, wherein the feeding member 2, the dispensing member 3, the pressing member 4, the discharging member 5, the bottom pasting member 6 and the detecting member 7 are all disposed on the frame member 1, and the feeding member 2, the dispensing member 3, the pressing member 4, the discharging member 5, the bottom pasting member 6 and the detecting member 7 are sequentially connected, which is characterized in that: an upper support frame 22, a lower support frame 21, a position moving device 24 and a rotating device 23 are arranged on the pressing component 4, and the chip 9 is automatically pasted to different positions of the shell 8 through the position moving device 24 and the rotating device 23.
As shown in fig. 5, the frame part 1 is composed of a lower frame 10 and an upper frame 11, the lower frame 11 is welded by square steel pipes, the frame is fixedly supported by feet, 4-hole-site installation casters are designed and can move in a short distance, the front side of the lower frame is a manual operation site, and a detection part 7 and a bottom surface pasting part 6 are placed on the upper surface of the lower frame; the upper frame 11 is made of aluminum profiles, a transparent PVC plate is used as an outer cover, so that people can observe the operation condition of the device conveniently outside, safety doors are arranged on the front surface and two side surfaces of the upper frame 11, the device maintenance is convenient, feeding and discharging positions are arranged on two sides of the front surface, the manual feeding and discharging are convenient, and the progress of other actions is not influenced during the feeding and discharging, so that the beat is shortened, and the production efficiency is improved; the upper frame 11 is provided with a visual display screen 13 and a touch screen 12.
As shown in fig. 6, the feeding member 2 includes a core tray 15 and a shell tray 16, the shell 8 and the chip 9 are respectively placed on the shell tray 16 and the core tray 15, the shell 8 and the chip 9 are fixed by vacuum suction, and the core tray 15 and the shell tray 16 are transferred to a working position.
As shown in fig. 7, the dispensing component 3 includes a dispensing valve 17, a housing suction cup 18, a chip suction cup 19 and a straight unit 20; the linear unit 20 conveys the shell sucker 18 to a material loading position, the shell sucker 18 sucks the shell 8 and then moves to a shell tool, the linear unit 20 moves again to suck the chip 19 and suck the chip 9 and move to a chip tool position, and the dispensing valve 17 dispenses glue on the upper surface of the chip 9.
As shown in fig. 8, 9 and 10, the rotating device 23 includes a rotating platform 25, a turntable 26, a rotary clamping cylinder 27, a housing fixture 28 and a pressing cylinder 29, the turntable 26 is disposed on the rotating platform 25, the housing fixture 28 is disposed on the turntable 26, the rotary clamping cylinder 27 and the pressing cylinder 29 are disposed on two sides of the housing fixture 28, the housing fixture 28 is used for placing the housing 8, and the rotary clamping cylinder 27 and the pressing cylinder 29 are used for fixing the housing 8; position mobile device 24 includes X axle moving platform 30, Y axle moving platform 31, Z axle moving platform 32 and chip frock 33, chip 9 passes through vacuum adsorption to be fixed at chip frock 33, through X axle moving platform 30, Y axle moving platform 31, Z axle moving platform 32 regulation and control chip frock 33 position mobile location, move chip 9 to inside the casing 8 after the location is accomplished, Z axle moving platform 32 rebound pastes chip 9 on casing 8, in the pressfitting in-process, but Z axle motor real time feedback moment, convenient adjustment, according to the demand of difference, through accurate position mobile device and rotary device, paste the chip to the different positions of casing automatically.
As shown in fig. 11, the bottom pasting component 6 includes a precision linear sliding table 34, a chip adsorption tool 35, and a shell positioning tool 36, the chip 9 is fixed on the chip adsorption tool 35 by vacuum adsorption, the shell 8 is placed on the shell positioning tool 36, the button is pressed, the precision linear sliding table 34 drives the chip adsorption tool 35 to press the chip 9 to the bottom surface of the shell 8, and in this process, the precision linear sliding table 34 can feed back a torque in real time, so as to ensure that a proper pressing force is kept during pressing.
As shown in fig. 12 and 5, the inspection part 7 includes an inspection platform 37, a light source 38, a vision camera 39 and a vision display 13; the chip shell which is well pasted is placed on the detection platform 37, the chip shell is irradiated by the light source 38, the picture is taken by the vision camera 39, and the result is displayed on the vision display screen 13. The adhered workpiece is placed on the inspection stage 37, and the visual camera 39 inspects the adhering quality of the chip.
The invention has various types of shells, and the number and the positions of the chips adhered on a single shell are more, such as the upper side, the lower side and the side of the inner wall of the shell. The invention designs the compatible tool clamp corresponding to different shells and chips according to the characteristics of the workpiece and considering the simplification of manual operation. The automatic bonding device for the acceleration sensor can realize automatic glue dispensing and bonding, has strong compatibility, meets the clamping requirements of various shells and chips of customers by the tool, and improves the production efficiency, reduces the cost and improves the bonding quality compared with the traditional manual bonding.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present invention are included in the scope of the present invention.
Claims (10)
1. The utility model provides an automatic bonding device of acceleration sensor, includes that frame part, material loading part, point glue part, pressfitting part, unloading part, bottom paste part and detection part all set up on frame part, and material loading part, point glue part, pressfitting part, unloading part, bottom paste part and detection part connect its characterized in that in proper order: and the pressing part is provided with an upper support frame, a lower support frame, a position moving device and a rotating device, and the chip is automatically pasted to different positions of the shell through the position moving device and the rotating device.
2. The automatic bonding device for an acceleration sensor according to claim 1, characterized in that: the rotating device comprises a rotating platform, a rotating disc, a rotary clamping cylinder, a shell tool and a pressing cylinder, wherein the rotating disc is arranged on the rotating platform, the shell tool is arranged on the rotating disc, the rotary clamping cylinder and the pressing cylinder are arranged on two sides of the shell tool, the shell tool is used for placing a shell, and the rotary clamping cylinder and the pressing cylinder fix the shell; the position moving device comprises an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a chip tool, wherein the chip is fixed on the chip tool through vacuum adsorption, the chip tool is regulated and controlled to move and position through the X-axis moving platform, the Y-axis moving platform and the Z-axis moving platform, the chip is moved to the inside of the shell after the positioning is completed, and the Z-axis moving platform moves upwards to paste the chip on the shell.
3. The automatic bonding device for an acceleration sensor according to claim 1, characterized in that: the feeding part comprises a core tray disc and a shell tray disc, the shell and the chip are respectively placed on the shell tray disc and the core tray disc, the shell and the chip are fixed in a vacuum adsorption mode, and then the core tray disc and the shell tray disc are transferred to a working position.
4. The automatic bonding device for an acceleration sensor according to claim 1, characterized in that: the dispensing component comprises a dispensing valve, a shell sucker, a chip sucker and a linear unit; the straight line unit conveys the shell sucker to the feeding position, the shell sucker sucks the shell and then moves to the shell tooling position, the straight line unit moves again to suck the chip by the chip sucker and move to the chip tooling position, and the dispensing valve dispenses on the upper surface of the chip.
5. The automatic bonding device for an acceleration sensor according to claim 1, characterized in that: the bottom pasting component comprises a precise linear sliding table, a chip adsorption tool and a shell positioning tool, the chip is fixed on the chip adsorption tool in a vacuum adsorption mode, the shell is placed on the shell positioning tool, and the chip adsorption tool is driven to press the chip to the bottom surface of the shell through the precise linear sliding table.
6. The automatic bonding device for an acceleration sensor according to claim 1, characterized in that: the detection part comprises a detection platform, a light source, a visual camera and a visual display screen; the chip shell is placed on the detection platform, the chip shell is irradiated through the light source, the visual camera shoots the picture, and the result is displayed on the visual display screen.
7. The automatic bonding device for an acceleration sensor according to claim 1, characterized in that: the rack part consists of a lower rack and an upper rack, the lower rack is provided with a detection part and a bottom surface pasting part, and the upper rack is provided with a visual display screen and a touch screen.
8. The acceleration sensor automatic bonding device according to claim 1 or 2, characterized in that: the X-axis moving platform, the Y-axis moving platform and the Z-axis moving platform of the position moving device are constructed by high-precision crossed roller guide rails, ball screws and motors, and the motors of the Z-axis moving platform can feed back torque in real time in the pressing process.
9. The acceleration sensor automatic bonding device according to claim 1 or 7, characterized in that: the lower rack is welded by adopting a square steel pipe, the rack is fixedly supported by feet, 4 hole position mounting trundles are designed, and the front side of the lower rack is provided with a manual operation position.
10. The acceleration sensor automatic bonding device according to claim 1 or 7, characterized in that: the upper frame is composed of an aluminum section, a transparent PVC plate is arranged outside the upper frame to serve as an outer cover, safety doors are arranged on the front face and two side faces of the upper frame, and feeding and discharging positions are arranged on two sides of the front face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111068037.4A CN113685406B (en) | 2021-09-13 | 2021-09-13 | Automatic bonding device of acceleration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111068037.4A CN113685406B (en) | 2021-09-13 | 2021-09-13 | Automatic bonding device of acceleration sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113685406A true CN113685406A (en) | 2021-11-23 |
| CN113685406B CN113685406B (en) | 2023-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111068037.4A Active CN113685406B (en) | 2021-09-13 | 2021-09-13 | Automatic bonding device of acceleration sensor |
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| Country | Link |
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| CN (1) | CN113685406B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114233730A (en) * | 2021-12-06 | 2022-03-25 | 四川光恒通信技术有限公司 | Device and method for automatically pasting isolator on V300 three-way shell |
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| CN103928374A (en) * | 2014-05-02 | 2014-07-16 | 广州市佑航电子有限公司 | Automation device and method for manufacturing sensor |
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| CN212915713U (en) * | 2020-07-06 | 2021-04-09 | 深圳市万福达精密设备股份有限公司 | Automatic biochip assembling device |
| CN112705934A (en) * | 2020-12-03 | 2021-04-27 | 深圳市道和实业有限公司 | Intelligent chip assembling and processing device |
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2021
- 2021-09-13 CN CN202111068037.4A patent/CN113685406B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928374A (en) * | 2014-05-02 | 2014-07-16 | 广州市佑航电子有限公司 | Automation device and method for manufacturing sensor |
| WO2016150080A1 (en) * | 2015-03-20 | 2016-09-29 | 北京中电科电子装备有限公司 | Flip chip bonding device |
| CN205021122U (en) * | 2015-10-12 | 2016-02-10 | 苏州达恩克精密机械有限公司 | Chip mounting machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114233730A (en) * | 2021-12-06 | 2022-03-25 | 四川光恒通信技术有限公司 | Device and method for automatically pasting isolator on V300 three-way shell |
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| Publication number | Publication date |
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| CN113685406B (en) | 2023-01-06 |
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