CN212885693U - Novel low contact wafer centering tilting mechanism - Google Patents
Novel low contact wafer centering tilting mechanism Download PDFInfo
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- CN212885693U CN212885693U CN202021520997.0U CN202021520997U CN212885693U CN 212885693 U CN212885693 U CN 212885693U CN 202021520997 U CN202021520997 U CN 202021520997U CN 212885693 U CN212885693 U CN 212885693U
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- 230000007246 mechanism Effects 0.000 title claims abstract description 94
- 230000005540 biological transmission Effects 0.000 claims abstract description 19
- 238000004891 communication Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 37
- 229910052710 silicon Inorganic materials 0.000 abstract description 37
- 239000010703 silicon Substances 0.000 abstract description 37
- 230000007306 turnover Effects 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Abstract
The utility model relates to a novel low contact wafer centering tilting mechanism, including bearing the frame, bear the tray, the location bears the frame, revolving stage mechanism, the transmission shaft, the guide arm, lift actuating mechanism, the laser lamp, photosensitive sensor and drive circuit, bear and establish an operation chamber and a drive chamber in the frame, bear the tray and inlay in operation intracavity cloth, bear the tray bottom and establish photosensitive sensor, revolving stage mechanism up end and transmission shaft are connected, the transmission shaft is connected with the guide arm rear end face, the guide arm front end bears the frame with the location and articulates, the laser lamp equipartition bears the frame up end and end down in the location. The novel silicon wafer transfer device can effectively meet the requirements of efficient transfer, turnover, centering and positioning of silicon wafers; on the other hand adjusts the degree of freedom greatly and the running accuracy is high, can effectively satisfy multiple not isostructure silicon wafer positioning operation, and the location is this novel little with silicon wafer contact surface to very big improvement this novel commonality, flexibility and the reliability of operation.
Description
Technical Field
The utility model relates to a laser cutting plummer structure is exactly a novel low contact wafer centering tilting mechanism.
Background
At present, in the silicon wafer processing and preparing operation, the silicon wafer is often required to be centered, positioned and turned over so as to meet the requirement of the processing operation, although the turning and centering operation equipment used at present can meet the requirement of the processing, on one hand, the equipment structure is complex, the use flexibility is poor, the requirements of the turning and centering of the silicon wafer with a specific structure can be often met, the transfer capacity of the silicon wafer is relatively insufficient, and the contact surface with the silicon wafer is relatively large, so that the clamping and positioning are easy to cause the damage of the structure of the silicon wafer and the more sheltered parts on the surface of the silicon wafer during the subsequent processing, and the subsequent processing operation is seriously influenced; on the other hand, the operation freedom degree of the traditional positioning and centering equipment during operation is relatively poor, and effective monitoring measures are lacked during operation and adjustment operation, so that the operation precision of the traditional positioning and centering equipment is relatively poor.
Therefore, in view of the current situation, it is urgently required to develop a silicon wafer turning apparatus to meet the requirement of practical use.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a novel low-contact wafer centering turnover mechanism which has simple structure, flexible and convenient operation and use and good universality, and can effectively meet the requirements of high-efficiency transferring, turnover and centering positioning operation on silicon wafers on one hand, thereby greatly improving the working efficiency and precision of the positioning operation of the silicon wafers; on the other hand, the novel structure is flexible, the adjustment freedom degree is high, the operation precision is high, the positioning operation of silicon wafers with various different structures can be effectively met, the positioning operation is small compared with the contact surface of the silicon wafers, the scratch and the pollution to the surfaces of the silicon wafers can be effectively reduced, and meanwhile, the independent positioning equipment shields the silicon wafers to influence the follow-up processing operation condition, so that the universality, the flexibility and the reliability of the novel operation are greatly improved.
In order to achieve the above purpose, the present invention is realized by the following technical solution:
a novel low-contact wafer centering turnover mechanism comprises a bearing frame, a bearing tray, a positioning bearing frame, a turntable mechanism, a transmission shaft, a guide arm, a lifting driving mechanism, a laser lamp, photosensitive sensors and a driving circuit, wherein the bearing frame is a columnar frame structure with an axis vertical to a horizontal plane, an operation cavity coaxial with the bearing frame and a driving cavity with an axis parallel to the axis of the operation cavity are arranged in the bearing frame, the driving cavity is embedded in the side wall of the operation cavity, the bearing tray is of a U-shaped groove-shaped structure with an axial section and is embedded in the operation cavity and coaxial with the operation cavity, 2-6 photosensitive sensors are arranged at the bottom of the bearing tray, the photosensitive sensors are uniformly distributed in a virtual circumference range with the axis of the bearing tray as the center of a circle and the diameter of 50% -90% of the bottom of the bearing tray as the diameter, and the axes of the photosensitive sensors are vertical to the lower end surface of the bearing tray, the turntable mechanism is embedded in the driving cavity and is coaxially distributed with the driving cavity, the lower end face of the turntable mechanism is connected with the bottom of the driving cavity through a lifting driving mechanism, the upper end face of the turntable mechanism is connected with and coaxially distributed with the transmission shaft, the upper end face of the transmission shaft is connected with the rear end face of the guide arm, the guide arm is vertically distributed with the transmission shaft, the front end face of the turntable mechanism is hinged with the positioning bearing frame through the turntable mechanism, the axis of the positioning bearing frame forms an included angle of 0-90 degrees with the bottom of the bearing tray, the positioning bearing frame is of an annular frame structure with the outer diameter of 90-98 percent of the diameter of the lower end face of the bearing tray, the number of the laser lamps is consistent with the number of the photosensitive sensors, the laser lamps are uniformly distributed on the upper end face and the lower end face of the positioning bearing frame around the axis of the positioning bearing frame, and are respectively and electrically connected with the positioning bearing frame, the turntable mechanism, the guide arm, the lifting driving mechanism, the laser lamp and the photosensitive sensor.
Furthermore, bear tray lateral wall through at least two lift actuating mechanism and operation chamber lateral wall sliding connection, and bear tray and drive chamber and correspond position department, operation chamber, drive chamber lateral wall and bear tray lateral wall all establish the width and be the guide way that the guiding arm external diameter is 1.1-2.5 times, just operation chamber, drive chamber and bear the tray and communicate each other through the guide way within a definite time.
Furthermore, the positioning bearing frame comprises a fixed disc, an adjusting disc, a driving guide rail and a positioning clamp, the fixed disc and the adjusting disc are both in arc-shaped frame structures, wherein the outer side surface of the fixed disk is hinged with the front end surface of the guide arm through a turntable mechanism, the fixed disk and the adjusting disk are distributed in the same plane, and are connected with each other through two driving guide rails which are respectively connected with the lower end surfaces of the fixed disc and the adjusting disc, and are symmetrically distributed on two sides of the axial line of the fixed disk and the adjusting disk, the distance between the fixed disk and the adjusting disk is 0-20 mm, and when the distance between the fixed disk and the adjusting disk is 0, the fixed disk and the adjusting disk form a closed positive annular frame structure, 1-2 positioning fixture are all established to the medial surface of fixed disk, adjustment disk, positioning fixture encircles and bears a frame axis equipartition, drive guide rail respectively with drive circuit electrical connection.
Furthermore, the guide arm is at least two stages of electric telescopic rods, and the lifting driving mechanism is any one of a screw rod mechanism, a gear rack mechanism, an electric telescopic rod, a worm and gear mechanism, a hydraulic telescopic rod and a pneumatic telescopic rod; the turntable mechanism is any one of a two-dimensional turntable and a three-dimensional turntable.
Furthermore, at least one angle sensor is arranged on the rotary table mechanism; the lower end surface of the positioning bearing frame is provided with at least one triaxial gyroscope; all establish at least one flexible volume sensor on the lift actuating mechanism, angle sensor, triaxial gyroscope and flexible volume sensor all are connected with drive circuit electrical.
Furthermore, the laser light spot is any one of a circle and a cross shape, and the maximum diameter of the laser light spot is not more than 90% of the diameter of the upper end face of the photosensitive sensor.
Furthermore, the driving circuit is a circuit system based on any one of an industrial single chip microcomputer and a programmable controller, and is additionally provided with at least one serial communication port which is embedded in the side surface of the bearing rack.
The novel silicon wafer positioning device is simple in structure, flexible and convenient to operate and use and good in universality, and on one hand, the efficient transferring, overturning, centering and positioning operation of the silicon wafers can be effectively met, so that the working efficiency and the precision of the silicon wafer mounting operation are greatly improved; on the other hand, the novel structure is flexible, the adjustment freedom degree is high, the operation precision is high, the positioning operation of silicon wafers with various different structures can be effectively met, the positioning operation is small compared with the contact surface of the silicon wafers, the scratch and the pollution to the surfaces of the silicon wafers can be effectively reduced, and meanwhile, the independent positioning equipment shields the silicon wafers to influence the follow-up processing operation condition, so that the universality, the flexibility and the reliability of the novel operation are greatly improved.
Drawings
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic diagram of the novel structure.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1, a novel low-contact wafer centering and overturning mechanism comprises a carrier frame 1, a carrier tray 2, a positioning carrier 3, a turntable mechanism 4, a transmission shaft 5, a guide arm 6, a lifting driving mechanism 7, a laser lamp 8, photosensitive sensors 9 and a driving circuit 10, wherein the carrier frame 1 is a cylindrical frame structure with an axis perpendicular to a horizontal plane, the carrier frame 1 is internally provided with an operation cavity 101 coaxially distributed with the carrier frame 1 and a driving cavity 102 with an axis parallel to the axis of the operation cavity 101, the driving cavity 102 is embedded in the side wall of the operation cavity 101, the carrier tray 2 is of a U-shaped groove-shaped structure with an axial cross section, is embedded in the operation cavity 101 and coaxially distributed with the operation cavity 101, the bottom of the carrier tray 2 is provided with 2-6 photosensitive sensors 9, each photosensitive sensor 9 is uniformly distributed in a virtual circumference range with the axis of the carrier tray 2 as the center of a circle and the diameter of 50% -90% of the bottom of the carrier tray 2, the axes of the photosensitive sensors 9 are vertically distributed with the lower end surface of the bearing tray 2, the turntable mechanism 2 is embedded in the driving cavity 102 and coaxially distributed with the driving cavity 102, the lower end surface of the turntable mechanism 4 is connected with the bottom of the driving cavity 102 through the lifting driving mechanism 7, the upper end surface is connected with the transmission shaft 5 and coaxially distributed, the upper end surface of the transmission shaft 5 is connected with the rear end surface of the guide arm 6, the guide arm 6 is vertically distributed with the transmission shaft 5, the front end surface of the guide arm is hinged with the positioning bearing frame 3 through the turntable mechanism 4, the axes of the positioning bearing frame 3 and the bottom of the bearing tray 2 form an included angle of 0-90 degrees, the positioning bearing frame 3 is an annular frame structure with the outer diameter of 90-98 percent of the diameter of the lower end surface of the bearing tray 2, the number of the laser lamps 8 is consistent with the number of the photosensitive sensors 9, the laser lamps are uniformly, and when the locating bearing frame 3 and the bearing tray 2 are coaxially distributed, the laser lamp 8 and the photosensitive sensor 9 are coaxially distributed, and the driving circuit 10 is embedded in the outer surface of the bearing frame 1 and is respectively electrically connected with the locating bearing frame 3, the turntable mechanism 4, the guide arm 6, the lifting driving mechanism 7, the laser lamp 8 and the photosensitive sensor 9.
In this embodiment, the side wall of the carrying tray 2 is slidably connected to the side wall of the operation cavity 101 through at least two lifting driving mechanisms 7, and the carrying tray 2 corresponds to the driving cavity 102, the side walls of the operation cavity 101, the driving cavity 102 and the carrying tray 2 are all provided with guide grooves 103 having a width 1.1-2.5 times the outer diameter of the guide arm 6, and the operation cavity 101, the driving cavity 102 and the carrying tray 2 are communicated with each other through the guide grooves 103.
It is emphasized that, the positioning bearing frame 3 includes a fixed disk 31, an adjusting disk 32, a driving guide rail 33 and positioning clamps 34, the fixed disk 31 and the adjusting disk 32 are of an arc frame structure, wherein the outer side surface of the fixed disk 31 is hinged to the front end surface of the guide arm 6 through the turntable mechanism 4, the fixed disk 31 and the adjusting disk 32 are distributed on the same plane and are connected with each other through two driving guide rails 33, the driving guide rail 33 is connected with the lower end surfaces of the fixed disk 31 and the adjusting disk 32 respectively and is symmetrically distributed on two sides of the axial lines of the fixed disk 31 and the adjusting disk 32, the distance between the fixed disk 31 and the adjusting disk 32 is 0-20 mm, when the distance between the fixed disk 31 and the adjusting disk 32 is 0, the fixed disk 31 and the adjusting disk 32 form a closed positive annular frame structure, 1-2 positioning clamps 34 are arranged on the inner side surfaces of the fixed disk 31 and the adjusting disk 32, the positioning clamps 34 are uniformly, the drive rails 33 are electrically connected to the drive circuit 10, respectively.
Preferably, the guide arm 6 is at least two stages of electric telescopic rods, and the lifting driving mechanism 7 is any one of a screw mechanism, a rack-and-pinion mechanism, an electric telescopic rod, a worm gear mechanism, a hydraulic telescopic rod and a pneumatic telescopic rod; the turntable mechanism 4 is any one of a two-dimensional turntable and a three-dimensional turntable.
Meanwhile, at least one angle sensor 11 is arranged on the rotary table mechanism 4; the lower end surface of the positioning bearing frame 3 is provided with at least one triaxial gyroscope 12; all establish at least one flexible volume sensor 13 on the lift actuating mechanism 5, angle sensor 11, triaxial gyroscope 12 and flexible volume sensor 13 all with drive circuit 10 electrical connection.
In addition, the light spot of the laser lamp 8 is any one of a circle and a cross shape, and the maximum diameter of the light spot is not more than 90% of the diameter of the upper end face of the photosensitive sensor.
In this embodiment, the driving circuit 10 is a circuit system based on any one of an industrial single chip microcomputer and a programmable controller, and the driving circuit 10 is further provided with at least one serial communication port 14, and the serial communication port 14 is embedded in the side surface of the bearing rack 1.
This is novel in specifically, at first to constituting this neotype bear the frame, bear the tray, the location bears frame, revolving stage mechanism, transmission shaft, guiding arm, lift actuating mechanism, laser lamp, photosensitive sensor and drive circuit and assemble, then will assemble this neotype through bearing the frame mount appointed operating position, like on laser cutting machine, on equipment such as transport mechanism, then with this neotype drive circuit and external power system and control circuit electrical connection, can accomplish the novel assembly of cost.
After the novel assembly is completed, firstly, according to the thickness of the silicon wafer to be centered and positioned, the height of the bearing tray, the turntable mechanism and the height of each device connected with the turntable mechanism and the upper end surface of the bearing frame are simultaneously adjusted through the lifting driving mechanism, after the setting and adjustment are completed, each device connected with the turntable mechanism is driven by the lifting driving mechanism to ascend, the positioning bearing frame and the guide arm are enabled to be higher than the upper end surface of the bearing frame, then the positioning bearing frame connected with the guide arm and the guide arm is driven by the turntable mechanism through the transmission shaft to rotate, the position of the silicon wafer to be processed is located, then the driving guide rail of the positioning bearing frame is driven, the distance between the fixed disc and the adjusting disc of the positioning bearing frame is increased, the silicon wafer is clamped and positioned through the positioning fixture, and simultaneously the fixed disc and the adjusting disc are synchronously closed through the driving guide rail while, then, the positioning bearing frame connected with the guide arm and the guide arm is driven to rotate by the turntable mechanism, all the photosensitive sensors and the laser lamps are driven to work simultaneously in the rotating process, and after the laser lamps on the lower end surface of the positioning bearing frame are respectively coaxially distributed with all the photosensitive sensors of the bearing tray, the turntable mechanism is driven to move downwards by the lifting driving mechanism, so that the positioning bearing frame falls into the bearing tray, and therefore centering adjustment is completed, and subsequent processing is performed;
after finishing the processing of the current working surface, the lifting driving mechanism drives each device connected with the turntable mechanism to ascend again, the positioning bearing frame and the guide arm are enabled to be higher than the upper end surface of the bearing frame, then the turntable mechanism drives the positioning bearing frame connected with the guide arm and the guide arm to rotate through the transmission shaft, the positioning bearing frame is positioned at the outer side position of the bearing frame, then the turntable mechanism of the front end surface of the guide arm is driven to operate, the turnover operation of the positioning bearing frame and the silicon wafer connected with the positioning frame is realized, after the turnover is finished, the positioning bearing frame connected with the guide arm and the guide arm is driven to rotate again through the turntable mechanism, in the rotating process, each photosensitive sensor and each laser lamp are driven to work simultaneously, and after the end surface laser lamps at the positioning position are respectively and coaxially distributed with each photosensitive sensor of the bearing tray, the turntable mechanism is driven to descend through the lifting driving mechanism, the positioning bearing frame falls into the bearing tray, so that centering adjustment is completed, and subsequent processing is performed.
In the operation adjusting process, the novel device can accurately monitor the amount of exercise of each novel lifting driving mechanism and each novel turntable mechanism through the sensors such as each telescopic quantity sensor, each angle sensor and each three-axis gyroscope while performing centering and positioning operation through the photosensitive sensor and the laser lamp, so that the operation precision of the novel device is improved;
meanwhile, the lifting driving mechanism adjusts the positioning position of the bearing tray, the positioning bearing frame, the turntable mechanism, the transmission shaft and the guide arm in the bearing rack, so that the requirements of silicon wafer positioning processing with different structural requirements are met flexibly.
The novel silicon wafer positioning device is simple in structure, flexible and convenient to operate and use and good in universality, and on one hand, the efficient transferring, overturning, centering and positioning operation of the silicon wafers can be effectively met, so that the working efficiency and the precision of the silicon wafer mounting operation are greatly improved; on the other hand, the novel structure is flexible, the adjustment freedom degree is high, the operation precision is high, the positioning operation of silicon wafers with various different structures can be effectively met, the positioning operation is small compared with the contact surface of the silicon wafers, the scratch and the pollution to the surfaces of the silicon wafers can be effectively reduced, and meanwhile, the independent positioning equipment shields the silicon wafers to influence the follow-up processing operation condition, so that the universality, the flexibility and the reliability of the novel operation are greatly improved.
Those skilled in the art should understand that the present invention is not limited by the above embodiments. The foregoing embodiments and description have been made only for the purpose of illustrating the principles of the invention. The present invention can be further modified and improved without departing from the spirit and scope of the present invention. Such changes and modifications are intended to be within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a novel low contact wafer centering tilting mechanism which characterized in that: the novel low-contact wafer centering and overturning mechanism comprises a bearing frame, a bearing tray, a positioning bearing frame, a turntable mechanism, a transmission shaft, a guide arm, a lifting driving mechanism, a laser lamp, photosensitive sensors and a driving circuit, wherein the bearing frame is of a columnar frame structure with the axis vertical to the horizontal plane, an operation cavity coaxial with the bearing frame and a driving cavity with the axis parallel to the axis of the operation cavity are arranged in the bearing frame, the driving cavity is embedded in the side wall of the operation cavity, the bearing tray is of a U-shaped groove-shaped structure with the axial section and is embedded in the operation cavity and coaxial with the operation cavity, 2-6 photosensitive sensors are arranged at the bottom of the bearing tray, the photosensitive sensors are uniformly distributed in a virtual circumference range with the axis of the bearing tray as the center of a circle and the diameter of 50% -90% at the bottom of the bearing tray as the diameter, and the axes of the photosensitive sensors are vertical to the lower end surface of the bearing tray, the turntable mechanism is embedded in the driving cavity and coaxially distributed with the driving cavity, the lower end face of the turntable mechanism is connected with the bottom of the driving cavity through a lifting driving mechanism, the upper end face of the turntable mechanism is connected with and coaxially distributed with the transmission shaft, the upper end face of the transmission shaft is connected with the rear end face of the guide arm, the guide arm is vertically distributed with the transmission shaft, the front end face of the guide arm is hinged with the positioning bearing frame through the turntable mechanism, the axis of the positioning bearing frame forms an included angle of 0-90 degrees with the bottom of the bearing tray, the positioning bearing frame is of an annular frame structure with the outer diameter of 90-98 percent of the diameter of the lower end face of the bearing tray, the number of the laser lamps is consistent with the number of the photosensitive sensors, the laser lamps are uniformly distributed on the upper end face and the lower end face of the positioning bearing frame around the axis of the positioning bearing frame, the drive circuit is embedded in the outer surface of the bearing rack and is respectively and electrically connected with the positioning bearing frame, the turntable mechanism, the guide arm, the lifting drive mechanism, the laser lamp and the photosensitive sensor.
2. The novel low-contact wafer centering and overturning mechanism as claimed in claim 1, wherein: the bearing tray side wall is connected with the operation cavity side wall in a sliding mode through at least two lifting driving mechanisms, the bearing tray corresponds to the driving cavity in position, the operation cavity, the driving cavity side wall and the bearing tray side wall are respectively provided with a guide groove with the width being 1.1-2.5 times of the outer diameter of the guide arm, and the operation cavity, the driving cavity and the bearing tray are communicated with one another through the guide grooves.
3. The novel low-contact wafer centering and overturning mechanism as claimed in claim 1, wherein: the positioning bearing frame comprises a fixed disc, an adjusting disc, a driving guide rail and a positioning clamp, the fixed disc and the adjusting disc are both in arc-shaped frame structures, wherein the outer side surface of the fixed disk is hinged with the front end surface of the guide arm through a turntable mechanism, the fixed disk and the adjusting disk are distributed in the same plane, and are connected with each other through two driving guide rails which are respectively connected with the lower end surfaces of the fixed disc and the adjusting disc, and are symmetrically distributed on two sides of the axial line of the fixed disk and the adjusting disk, the distance between the fixed disk and the adjusting disk is 0-20 mm, and when the distance between the fixed disk and the adjusting disk is 0, the fixed disk and the adjusting disk form a closed positive annular frame structure, 1-2 positioning fixture are all established to the medial surface of fixed disk, adjustment disk, positioning fixture encircles and bears a frame axis equipartition, drive guide rail respectively with drive circuit electrical connection.
4. The novel low-contact wafer centering and overturning mechanism as claimed in claim 1, wherein: the guide arm is at least two stages of electric telescopic rods, and the lifting driving mechanism is any one of a screw rod mechanism, a gear rack mechanism, an electric telescopic rod, a worm and gear mechanism, a hydraulic telescopic rod and a pneumatic telescopic rod; the turntable mechanism is any one of a two-dimensional turntable and a three-dimensional turntable.
5. The novel low-contact wafer centering and overturning mechanism as claimed in claim 1 or 4, wherein: the turntable mechanism is provided with at least one angle sensor; the lower end surface of the positioning bearing frame is provided with at least one triaxial gyroscope; all establish at least one flexible volume sensor on the lift actuating mechanism, angle sensor, triaxial gyroscope and flexible volume sensor all are connected with drive circuit electrical.
6. The novel low-contact wafer centering and overturning mechanism as claimed in claim 1, wherein: the laser lamp facula be any one of circular and "ten" font, and the facula maximum diameter is not more than 90% of photosensitive sensor up end diameter.
7. The novel low-contact wafer centering and overturning mechanism as claimed in claim 1, wherein: the driving circuit is a circuit system based on any one of an industrial single chip microcomputer and a programmable controller, and is additionally provided with at least one serial port communication port which is embedded in the side surface of the bearing rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021520997.0U CN212885693U (en) | 2020-07-28 | 2020-07-28 | Novel low contact wafer centering tilting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021520997.0U CN212885693U (en) | 2020-07-28 | 2020-07-28 | Novel low contact wafer centering tilting mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN212885693U true CN212885693U (en) | 2021-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021520997.0U Active CN212885693U (en) | 2020-07-28 | 2020-07-28 | Novel low contact wafer centering tilting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212885693U (en) |
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2020
- 2020-07-28 CN CN202021520997.0U patent/CN212885693U/en active Active
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Address after: 214400, 1st to 2nd floors, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu General Semiconductor Co.,Ltd. Country or region after: China Address before: Room a130-10, 1st floor, building 2, entrepreneurship center, No.96 Ruida Road, Zhengzhou high tech Industrial Development Zone, Henan Province, 450000 Patentee before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |