CN212874540U

CN212874540U - Thermoelectric separation type high-power surface-mounted LED raised head lamp bead

Info

Publication number: CN212874540U
Application number: CN202022232165.5U
Authority: CN
Inventors: 尚五明
Original assignee: Shenzhen Yuliang Optoelectronic Technology Co ltd
Current assignee: Shenzhen Yuliang Optoelectronic Technology Co ltd
Priority date: 2020-10-09
Filing date: 2020-10-09
Publication date: 2021-04-02
Anticipated expiration: 2030-10-09

Abstract

The utility model discloses a high-power paster plush copper LED lamp pearl of thermoelectric separation formula belongs to the technical field of LED lamp. The utility model discloses a high-power paster plush copper LED lamp pearl of thermoelectric separation type includes support, chip, support pin and wire, sets up the heat dissipation bottom plate on the support, the heat dissipation bottom plate includes upper surface and lower surface, the upper surface and the lower surface of heat dissipation bottom plate all expose for the support, the chip sets up the upper surface in the heat dissipation bottom, the support pin is fixed in the support and extends to two outsides of support, the wire is used for connecting chip and support pin, support pin and heating panel disconnect-type set up, set up plush copper lens on the support. The utility model discloses a high-power paster plush copper LED lamp pearl radiating effect of thermoelectric separation formula is good, and luminous colour is diversified and luminance is high, long service life, and projection distance is far away, can be applied to stage lamp, photography luminaire, landscape lamp, or be applied to some special fields that need multiple colour as sign or instruction application.

Description

Thermoelectric separation type high-power surface-mounted LED raised head lamp bead

Technical Field

The utility model relates to a technical field of LED lamp, in particular to high-power paster plush copper LED lamp pearl of thermoelectric separation formula.

Background

At present, the demand for brightness of wall washing lamps, landscape lamps and stage lamps in the market is very high, the high-power specification is generally selected and used, and meanwhile, the great demand is also placed on the diversity of colors. The existing RGB lamp beads cannot meet landscape requirements for the diversity of colors, and the generated heat is large, so that the service life of the lamp beads is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high-power paster plush copper LED lamp pearl of thermoelectric separation formula can solve one or more among the prior art problem.

The utility model discloses a high-power paster plush copper LED lamp pearl of thermoelectric separation formula, including support, chip, support pin and wire, set up the heat dissipation bottom plate on the support, the heat dissipation bottom plate includes upper surface and lower surface, and the upper surface and the lower surface of heat dissipation bottom plate all expose for the support, and the chip sets up the upper surface in the heat dissipation bottom, and the support pin is fixed in the support and extends to two outsides of support, and the wire is used for connecting chip and support pin, and the support pin sets up with the heating panel disconnect-type, sets up plush copper lens on the support.

By adopting the technical scheme, the heat dissipation area and the electric area are mutually independent, so that the heat dissipation area is increased; the heat dissipation bottom plate is exposed, so that heat can be dissipated to the outside, and the service life of the lamp bead is prolonged; the raised head lens can improve the luminous brightness of the LED lamp bead and increase the projection distance.

In some embodiments, the upper surface of the heat dissipation bottom plate is provided with one RGB area and two W areas, the RGB area is located between the two W areas, the RGB area is provided with a red light chip, a green light chip and a blue light chip, and the two W areas are provided with a white light chip.

Through adopting above-mentioned technical scheme, the luminous colour of LED lamp pearl is diversified.

In some embodiments, the bracket pins are ten and are symmetrically disposed on both sides of the bracket.

By adopting the technical scheme, the installation and the connection of the LED lamp beads are facilitated.

In some embodiments, the chip is attached to the upper surface of the heat dissipation base plate by using a thermally conductive die bond adhesive.

By adopting the technical scheme, the thermal resistance is reduced, and the heat conduction of the chip is accelerated.

In some embodiments, the lower surface of the heat-dissipating base plate is used to be fixedly connected with an external PCB board through a heat-dissipating pad.

By adopting the technical scheme, the heat generated by the chip is conducted to the external PCB board through the heat dissipation bottom plate and the heat dissipation welding disc to be dissipated.

In some embodiments, the bracket pins are electrically connected to the PCB board through pin pads.

Through adopting above-mentioned technical scheme, realize support pin and PCB board electric connection.

In some embodiments, the wires are gold wires.

Through adopting above-mentioned technical scheme, the chip passes through the gold thread and realizes the electric conduction with the support pin, and the gold thread has stable performance's characteristics simultaneously, and the long service life of wire improves the life of LED lamp pearl.

The utility model discloses a high-power paster plush copper LED lamp pearl radiating effect of thermoelectric separation formula is good, and luminous colour is diversified and luminance is high, long service life, and projection distance is far away, can be applied to stage lamp, photography luminaire, landscape lamp, or be applied to some special fields that need multiple colour as sign or instruction application.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of a thermoelectric separation type high-power surface-mounted raised head LED lamp bead of the present invention;

fig. 2 is a schematic view of a top view structure of the thermoelectric separation type high-power surface mount device raised head LED lamp bead of the present invention;

fig. 3 is a schematic view of the thermoelectric separation type high-power chip mounting raised head LED lamp bead in the bottom view;

fig. 4 is a schematic view of a sectional structure of a thermoelectric separation type high-power surface mount device raised head LED lamp bead of the present invention;

fig. 5 is the utility model discloses a sectional structure schematic diagram when high-power paster plush copper LED lamp pearl of thermoelectric separation formula is installed on outside PCB board.

Reference numerals in the drawings indicate: the LED chip comprises a support 1, a chip 2, support pins 3, a lead 4, a heat dissipation bottom plate 5, an upper surface 51, RGB (red, green and blue) regions 511, a W region 512, a lower surface 52, heat conduction solid crystal glue 6, a red light chip 7, a green light chip 8, a blue light chip 9, a white light chip 10, an external PCB (printed circuit board) 11, a heat dissipation welding disc 12, a pin welding disc 13 and a raised head lens 14.

Detailed Description

To facilitate understanding of the present invention by those skilled in the art, the present invention will be further described with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the invention, are given by way of illustration only.

Fig. 1 to 5 schematically show according to the utility model discloses a high-power paster plush copper LED lamp pearl of thermoelectric separation formula.

As shown in fig. 1 to 5, the thermoelectric separation type high-power surface mounted device raised head LED lamp bead of the present invention comprises a support 1, a chip 2, a support pin 3 and a wire 4.

The support 1 is provided with a heat dissipation bottom plate 5, the heat dissipation bottom plate 5 comprises an upper surface 51 and a lower surface 52, and both the upper surface 51 and the lower surface 52 of the heat dissipation bottom plate 5 are exposed relative to the support 1. The chip 2 is disposed on the upper surface 51 of the heat-dissipating substrate 5. The heat generated by the chip 2 is radiated outward through the heat-radiating bottom plate 5. Preferably, the chip 2 is attached to the upper surface 51 of the heat dissipation base plate 5 by using a thermally conductive die bond 6. The heat-conducting solid crystal glue 6 can reduce the thermal resistance and accelerate the heat conduction of the chip 2. Preferably, the thermally conductive die bond paste 6 is selected from silver paste or tin paste. The heat generated by the chip 2 is conducted to the heat dissipation bottom plate 5 through the heat conduction die bond 6 and dissipated outwards. The chip 2 includes a red chip 7, a green chip 8, a blue chip 9, and a white chip 10. The upper surface 51 of the heat-dissipating substrate 5 is provided with an RGB area 511 and two W areas 512. The RGB area 511 is located between the two W areas 512. The red chip 7, the green chip 8, and the blue chip 9 are disposed in the RGB area 511. The white chips 10 are disposed in the W regions 512. The white light chips 10 in the two W regions 512 may emit the same light color, or may emit white light with different color temperatures, so that the light emitting colors of the LED lamp beads are more diversified. Preferably, the red chip 7, the green chip 8, the blue chip 9 and the white chip 10 may adopt a high power specification. The holder 1 is also provided with a raised-head lens 14. The raised-head lens 14 may be encapsulated by an injection molding process. The raised head lens 14 can improve the brightness of the LED lamp bead and increase the projection distance.

The bracket pins 3 are fixed in the bracket 1 and extend to the two outer sides of the bracket 1. The support pins 3 are connected to the chip 2 by wires 4. From this, realize support pin 3 and radiating bottom plate 5's disconnect-type setting, make electric region and heat dissipation region mutually independent, increase heat radiating area, prolong the life of lamp pearl. The bracket pins 3 are ten and symmetrically arranged on both sides of the bracket 1. Therefore, the LED lamp beads are convenient to install and connect. Preferably, the wire 4 adopts the gold thread, and the gold thread has stable performance's characteristics, makes the long service life of wire 4 to improve the life of LED lamp pearl.

Further, the lower surface 52 of the heat dissipation bottom plate 5 is used for connecting the LED lamp beads with the external PCB 11. Specifically, the lower surface 52 of the heat-dissipating base plate 5 is fixedly connected to the external PCB 11 through the heat-dissipating pad 12. Thus, the heat generated by the chip 2 is conducted through the heat dissipation substrate 5 and the heat dissipation pad 12 to the external PCB 11 and dissipated. Because outside PCB board 11 is bulky, the heat gives off sooner to improve LED lamp pearl's life. Preferably, the support pins 3 are electrically connected to the external PCB board 11 through the pin pads 13, so that the support pins 3 are electrically conducted to the external PCB board 11.

What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.

Claims

1. The utility model provides a high-power paster plush copper LED lamp pearl of thermoelectric separation formula, includes support, chip, support pin and wire, its characterized in that: the support is provided with a heat dissipation bottom plate, the heat dissipation bottom plate comprises an upper surface and a lower surface, the upper surface and the lower surface of the heat dissipation bottom plate are exposed relative to the support, the chip is arranged on the upper surface of the heat dissipation bottom plate, the support pins are fixed in the support and extend towards the two outer sides of the support, the wires are used for connecting the chip and the support pins, the support pins and the heat dissipation bottom plate are arranged in a separated mode, and the support is provided with a raised head lens.

2. The thermoelectric separation type high-power surface-mounted raised-head LED lamp bead as claimed in claim 1, wherein: the upper surface of the heat dissipation bottom plate is provided with an RGB area and two W areas, the RGB area is located between the two W areas, the RGB area is provided with a red light chip, a green light chip and a blue light chip, and the two W areas are provided with white light chips.

3. The thermoelectric separation type high-power surface-mounted raised-head LED lamp bead as claimed in claim 2, wherein: the support pins are ten and are symmetrically arranged on two sides of the support.

4. The thermoelectric separation type high-power surface-mounted raised-head LED lamp bead as claimed in claim 1, wherein: the chip is connected to the upper surface of the heat dissipation bottom plate through heat conduction solid crystal glue.

5. The thermoelectric separation type high-power surface-mounted raised-head LED lamp bead as claimed in claim 1, wherein: the lower surface of the heat dissipation bottom plate is fixedly connected with an external PCB through a heat dissipation pad.

6. The thermoelectric separation type high-power surface-mounted raised-head LED lamp bead as claimed in claim 5, wherein: the support pins are electrically connected with the PCB through pin bonding pads.

7. The thermoelectric separation type high-power surface-mounted raised-head LED lamp bead as claimed in claim 1, wherein: the wire is a gold wire.