CN212859731U - Blue membrane cutting device of silicon chip - Google Patents
Blue membrane cutting device of silicon chip Download PDFInfo
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- CN212859731U CN212859731U CN202021529942.6U CN202021529942U CN212859731U CN 212859731 U CN212859731 U CN 212859731U CN 202021529942 U CN202021529942 U CN 202021529942U CN 212859731 U CN212859731 U CN 212859731U
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Abstract
A silicon wafer blue film cutting device comprises a cuboid polytetrafluoroethylene block provided with a blade placing groove and a silicon wafer placing groove, wherein the blade placing groove is an inclined groove formed in the top surface and the front side surface of the cuboid polytetrafluoroethylene block, the edge from the center of the top surface of the cuboid polytetrafluoroethylene block to the front side surface is formed, and then the edge is obliquely cut to the right edge of the bottom surface; the silicon chip placing groove is an irregular groove formed in the left side face, the front side face and the rear side face of the cuboid polytetrafluoroethylene block, the slotting length on the left side face of the cuboid polytetrafluoroethylene block is from the middle of the left side face to the edge of the front side face, the slotting length on the front side face of the cuboid polytetrafluoroethylene block is from the blade placing groove to be communicated with the slotting of the left side face, and the slotting length on the rear side face of the cuboid polytetrafluoroethylene block is from the blade placing groove to the edge of the left side face; the utility model discloses can avoid cutting the in-process blade angle change and block and dun and cause silicon chip blue membrane edge to cut and produce cockscomb structure opening, effectively solve handheld blade and cut the problem that blue membrane brought.
Description
Technical Field
The utility model relates to the technical field of semiconductors, specific blue membrane cutting device of silicon chip that says so.
Background
In silicon substrate processing engineering in the semiconductor industry, most heavily doped silicon wafers need to be subjected to back sealing treatment of an LTO process, and an LTO layer on the edge of the silicon wafer after back sealing has various adverse effects on subsequent polishing and epitaxy, so that edge treatment is needed. The current mode of edge processing, through pasting blue membrane to the whole back of silicon chip, cut the blue membrane at silicon chip edge again, make the marginal LTO back of the body sealing layer of silicon chip spill, only keep the blue membrane at the back, however conventional blue membrane cuts the mode, through artifical handheld blade along the silicon chip edge, cut blue membrane, can incessantly alternate and block because of handheld blade angle in the cutting process, cause the opening that there are a large amount of cockscomb structure in blue membrane edge easily, the yield of direct influence cutting edge, in order to improve above-mentioned problem, the utility model provides a silicon chip blue membrane cutting device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the technical problem not enough, the utility model provides a blue membrane cutting device of silicon chip can avoid cutting in-process blade angle change and card and dun and cause the blue membrane edge of silicon chip to cut and produce cockscomb structure opening.
The utility model discloses a solve above-mentioned technical problem not enough and the technical scheme who adopts is: a silicon wafer blue film cutting device comprises a cuboid polytetrafluoroethylene block provided with a blade placing groove and a silicon wafer placing groove, wherein the blade placing groove is an inclined groove formed in the top surface and the front side surface of the cuboid polytetrafluoroethylene block, the edge of the front side surface is formed from the center of the top surface of the cuboid polytetrafluoroethylene block, and then the cuboid polytetrafluoroethylene block is obliquely cut to the right edge of the bottom surface; the silicon chip standing groove is set up irregular groove on left surface, leading flank, the trailing flank of cuboid tetrafluoro piece fluting length on the left surface of cuboid tetrafluoro piece is by the middle part of left surface to the border department of leading flank the fluting length on the leading flank of cuboid tetrafluoro piece by blade standing groove department until with the fluting intercommunication of left surface the fluting length on the trailing flank of cuboid tetrafluoro piece by blade standing groove department to the border department of left surface.
Further, the silicon chip placing groove is provided with 3 groups from top to bottom.
Furthermore, a supporting point for rotary cutting of the circular silicon wafer is formed at the position, where no groove is formed, of the left side surface of the cuboid polytetrafluoroethylene block.
Furthermore, a narrow groove exposing the cutting edge and facilitating separation of the scraps is formed in the front end of the blade placing groove, and the width of the narrow groove is smaller than that of the blade placing groove.
Further, the top surface of cuboid tetrafluoro piece is equipped with the screw hole, fixes the blade through twisting the screw.
The utility model has the advantages that:
the utility model discloses a silicon chip blue membrane cutting device is equipped with blade standing groove and silicon chip standing groove, is equipped with the screw hole next to the blade standing groove, realizes the fixed of blade through blade fixed screw, when the blade produces wearing and tearing, and can quick simple and convenient change blade, secondly is equipped with three silicon chip standing groove on cuboid tetrafluoro block, can realize utilizing to the different positions of blade, slows down the wearing and tearing of blade and the change frequency of blade;
the silicon wafer placing groove and the blade placing groove are communicated, the angle fixation of the silicon wafer and the blade is realized through the blade placing groove and the silicon wafer placing groove, a certain included angle is formed after the blade and the silicon wafer are placed, and the uniform cutting of the blade on a blue film at the edge of the silicon wafer can be realized by rotating the silicon wafer; through the utility model discloses a cutting device makes the silicon chip cut the in-process, and the contained angle of blade and silicon chip remains unchanged, and then avoids cutting the silicon chip edge that the in-process blade angle change caused with the card dun and cuts and produce cockscomb structure opening, can effectively solve handheld blade and cut the problem that blue membrane brought.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a silicon wafer blue film cutting device;
FIG. 2 is a schematic diagram of the front side structure of a silicon wafer blue film cutting device;
FIG. 3 is a schematic diagram of a rear side view of a silicon wafer blue film cutting device;
FIG. 4 is a schematic top view of a silicon wafer blue film cutting device;
FIG. 5 is a schematic structural diagram of the left side of the silicon wafer blue film cutting device;
FIG. 6 is a schematic diagram of the structure of the silicon wafer used in the cutting device;
reference numerals: 1. blade standing groove, 2, silicon chip standing groove, 3, cuboid tetrafluoro piece, 4, circular silicon chip, 5, fulcrum, 6, narrow groove, 7, screw hole.
Detailed Description
The following provides specific embodiments, which will further clearly, completely and specifically explain the technical solutions of the present invention. The present embodiment is the best embodiment based on the technical solution of the present invention, but the scope of the present invention is not limited to the following embodiments.
A silicon wafer blue film cutting device is shown in figure 1 and comprises a cuboid tetrafluoro block 3 provided with a blade placing groove 1 and a silicon wafer placing groove 2, as shown in figures 1 and 4, the blade placing groove 1 is an inclined groove formed in the top surface and the front side surface of the cuboid tetrafluoro block 3, the edge of the front side surface is formed in the center of the top surface of the cuboid tetrafluoro block 3, the edge is obliquely cut to the right edge of the bottom surface, a screw hole 7 is formed in the top surface of the cuboid tetrafluoro block 3, a blade is fixed by screwing in a screw, and when the blade is worn, the blade can be quickly, simply and conveniently replaced;
as shown in fig. 1, the silicon wafer placing groove 2 is provided with 3 groups from top to bottom, so that different positions of the blade can be utilized, and the abrasion of the blade and the replacement frequency of the blade are reduced; as shown in fig. 2, 3 and 5, the silicon wafer placing groove 2 is an irregular groove formed on the left side surface, the front side surface and the rear side surface of the rectangular parallelepiped tetrafluoro block 3, the length of the groove on the left side surface of the rectangular parallelepiped tetrafluoro block 3 is from the middle of the left side surface to the edge of the front side surface, the length of the groove on the front side surface of the rectangular parallelepiped tetrafluoro block 3 is from the blade placing groove 1 to the groove communication with the left side surface, and the length of the groove on the rear side surface of the rectangular parallelepiped tetrafluoro block 3 is from the blade placing groove 1 to the edge of the left side surface;
the utility model discloses a intercommunication between silicon chip standing groove 2 and blade standing groove 1, realize the angle of circular silicon chip 4 and blade through blade standing groove 1 and silicon chip standing groove 2 and fix, as shown in FIG. 6, the left surface of cuboid tetrafluoro block 3 does not form fulcrum 5 when fluting department forms circular silicon chip 4 and rotates the cutting, has certain contained angle after putting into blade and circular silicon chip 4 in blade standing groove 1 and silicon chip standing groove 2 respectively, rotates circular silicon chip 4 and can realize that the blade cuts the even cutting of circular silicon chip 4 edge blue membrane, makes silicon chip blue membrane edge cut out like the general cutting off of peeling skin;
as shown in fig. 4, a narrow groove 6 exposing a cutting edge and facilitating chip detachment is formed in the front end of the blade placing groove 1, the width of the narrow groove 6 is smaller than that of the blade placing groove 1, and the dropped chips are detached from the blade placing groove 1 through the narrow groove 6, so that the phenomenon that the cutting efficiency is affected by chip accumulation is avoided;
through the utility model discloses a cutting device makes the silicon chip cut the in-process, and the contained angle of blade and silicon chip remains unchanged, and then avoids cutting the silicon chip edge that the in-process blade angle change caused with the card dun and cuts and produce cockscomb structure opening, can effectively solve handheld blade and cut the problem that blue membrane brought.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. The silicon wafer blue film cutting device is characterized by comprising a cuboid tetrafluoro block (3) provided with a blade placing groove (1) and a silicon wafer placing groove (2), wherein the blade placing groove (1) is an inclined groove formed in the top surface and the front side surface of the cuboid tetrafluoro block (3), the edge of the front side surface is formed from the center of the top surface of the cuboid tetrafluoro block (3), and then the edge is obliquely cut to the right edge of the bottom surface; silicon chip standing groove (2) are for seting up groove on the left surface, leading flank, the trailing flank of cuboid tetrafluoro piece (3) fluting length on the left surface of cuboid tetrafluoro piece (3) is located by the middle part of left surface to the border of leading flank fluting length on the leading flank of cuboid tetrafluoro piece (3) by blade standing groove (1) department until with the fluting intercommunication of left surface fluting length on the trailing flank of cuboid tetrafluoro piece (3) by blade standing groove (1) department to the border department of left surface.
2. The silicon wafer blue film cutting device according to claim 1, wherein the silicon wafer placing groove (2) is provided with 3 groups from top to bottom.
3. The silicon wafer blue film cutting device according to claim 1, wherein a supporting point (5) for rotary cutting of the circular silicon wafer (4) is formed at the position where no groove is formed on the left side surface of the cuboid tetrafluoro block (3).
4. The silicon wafer blue film cutting device according to claim 1, wherein a narrow groove (6) exposing a cutting edge and facilitating chip separation is formed at the front end of the blade placing groove (1), and the width of the narrow groove (6) is smaller than that of the blade placing groove (1).
5. The silicon wafer blue film cutting device as claimed in claim 1, wherein the top surface of the cuboid tetrafluoro block (3) is provided with a screw hole (7), and the blade is fixed by screwing in the screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021529942.6U CN212859731U (en) | 2020-07-29 | 2020-07-29 | Blue membrane cutting device of silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021529942.6U CN212859731U (en) | 2020-07-29 | 2020-07-29 | Blue membrane cutting device of silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212859731U true CN212859731U (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021529942.6U Active CN212859731U (en) | 2020-07-29 | 2020-07-29 | Blue membrane cutting device of silicon chip |
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| Country | Link |
|---|---|
| CN (1) | CN212859731U (en) |
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2020
- 2020-07-29 CN CN202021529942.6U patent/CN212859731U/en active Active
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