CN212851185U

CN212851185U - Multilayer PCB board convenient to heat dissipation

Info

Publication number: CN212851185U
Application number: CN202022016951.1U
Authority: CN
Inventors: 汪杰
Original assignee: Shenzhen Jianfa Technology Electronics Co ltd
Current assignee: Shenzhen Jianfa Technology Electronics Co ltd
Priority date: 2020-09-15
Filing date: 2020-09-15
Publication date: 2021-03-30
Anticipated expiration: 2030-09-15

Abstract

The utility model belongs to the field of circuit boards, in particular to a multilayer PCB board convenient for heat dissipation, which comprises a top layer circuit board, a power supply layer, a ground layer and a bottom layer circuit board which are sequentially arranged at intervals from bottom to bottom, and also comprises a bearing mechanism and a heat dissipation mechanism, wherein the bearing mechanism comprises an upper fixed plate and a lower fixed plate, and the upper fixed plate is positioned above the top layer circuit board; when the installation, according to specific mounting height, adjust heat dissipation mechanism, during the regulation, two backup pads in the heat dissipation mechanism with corresponding position department remove to both sides, intubate and inserted bar carry out the relative slip, when removing and adjusting to suitable distance, insert the spacing downthehole of corresponding position department with the spacer pin on the intubate, it is spacing to carry out two backup pads, when adjusting, folding hose stretches out and draws back thereupon, guarantee the intercommunication to gas, when guaranteeing the air current cooling, realize the regulation of distance between two backup pads, in order to satisfy more installation demands.

Description

Multilayer PCB board convenient to heat dissipation

Technical Field

The utility model relates to a circuit board field specifically is a multilayer PCB board convenient to heat dissipation.

Background

The PCB is called as a Printed Circuit Board (PCB) because of the adoption of electronic printing technology, is called as a PCB, is an important electronic component, is a support body of the electronic component, is a carrier for the electrical connection of the electronic component, avoids the error of manual wiring because of the consistency of the same kind of printed boards after the electronic equipment adopts the printed boards, can realize the automatic insertion or mounting, automatic tin soldering and automatic detection of the electronic component, ensures the quality of the electronic equipment, improves the labor productivity, reduces the cost and is convenient to maintain, and when the multilayer PCB is installed and operated, the generated heat is larger, so that the PCB needs to be effectively radiated to ensure the stable performance of the multilayer PCB.

Chinese patent discloses a heat dissipation type PCB multiply wood, (No. CN211128395U grants), and this patent technique can realize the heat dissipation of each layer circuit board, does benefit to the life of extension PCB multiply wood body, but, the structure of its spacing frame is comparatively fixed, can't carry out the regulation of interval, and personnel need consider the influence of spacing frame space to electronic components when the installation, prevent to cause and interfere, and the use has certain limitation. Accordingly, one skilled in the art provides a multi-layer PCB board facilitating heat dissipation to solve the problems set forth in the above background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer PCB board convenient to heat dissipation to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a multi-layer PCB board convenient for heat dissipation comprises a top layer circuit board, a power supply layer, a grounding layer and a bottom layer circuit board which are sequentially arranged from bottom to bottom at intervals, and further comprises a bearing mechanism and a heat dissipation mechanism, wherein the bearing mechanism comprises an upper fixing plate and a lower fixing plate, the upper fixing plate is positioned above the top layer circuit board, the lower fixing plate is positioned below the bottom layer circuit board, the heat dissipation mechanism is respectively arranged between the top layer circuit board, the power supply layer, the grounding layer and the bottom layer circuit board, the heat dissipation mechanism is mutually connected through a connecting pipe, the heat dissipation mechanism comprises two symmetrically arranged supporting plates, the four corners of one surface of each of the two supporting plates, which are opposite to each other, are fixedly connected with output pipes, the two output pipes which are mutually corresponding are connected through folding hoses, the spray heads are fixedly connected on the, the utility model discloses a solar energy heating device, including backup pad, connecting pipe, output tube, upper fixed plate, conveyer pipe, electric heating membrane and external power source electric connection, backup pad is mutually the equal fixedly connected with connecting pipe in one side four corners back to the body, the connecting pipe with the output tube intercommunication is located the top the connecting pipe with upper fixed plate fixed connection is located the bottom the connecting pipe with lower fixed plate fixed connection, four conveyer pipes of upper fixed plate's top surface fixedly connected with, upper fixed plate's top surface intermediate position department fixedly connected with takes over, four the conveyer pipe all with take over fixed connection outward, take over outward and be connected with external fan, the connecting pipe respectively with four conveyer pipe intercommunication, electric.

As a further aspect of the present invention: an embedding groove is formed in the periphery of the side face of the supporting plate, a heat insulation layer is fixedly bonded on the inner wall of the embedding groove, and the electric heating film is embedded in the inner wall of the heat insulation layer.

As a further aspect of the present invention: the heat insulation layer is made of glass fiber cotton.

As a further aspect of the present invention: the adjusting mechanism comprises an insertion pipe and an insertion rod which is inserted into the inner wall of the insertion pipe in a sliding mode, a limiting pin is inserted into one end, close to the insertion rod, of the insertion pipe, a plurality of limiting holes are formed in the insertion rod in the length direction at equal intervals, the limiting holes correspond to the limiting pin, the top end of the insertion pipe is fixedly connected with the supporting plate above the insertion pipe, and the bottom end of the insertion rod is fixedly connected with the supporting plate below the insertion pipe.

As a further aspect of the present invention: the shower nozzle is the slope and arranges, just the incline direction of shower nozzle all faces the backup pad.

As a further aspect of the present invention: the thickness of the heat insulation layer is two millimeters.

As a further aspect of the present invention: the length of the cannula is greater than the length of the cannula.

Compared with the prior art, the beneficial effects of the utility model are that:

when the device is installed, the heat dissipation mechanism is adjusted according to the specific installation height, the distance between the two support plates is adjusted to meet the installation requirement, when the device is adjusted, the two support plates in the heat dissipation mechanism at the corresponding positions are moved towards two sides, the insertion pipe and the insertion rod slide relatively, when the device is adjusted to a proper distance, the limiting pin on the insertion pipe is inserted into the limiting hole at the corresponding position to limit the two support plates, the folding hose is stretched along with the two support plates during adjustment to ensure the communication of gas, when the air flow cooling is ensured, the adjustment of the distance between the two support plates is realized to meet more installation requirements, the applicability is higher, when the device is used, the electric heating film is opened, the electric heating film is electrified to generate heat, insects cannot pass through the electric heating film and cannot climb to the top layer circuit board, the power layer, the ground layer and the bottom layer circuit board, prevent short circuit and further improve safety.

Drawings

FIG. 1 is a schematic structural diagram of a multi-layer PCB board for facilitating heat dissipation;

FIG. 2 is an enlarged view of the point A in FIG. 1;

FIG. 3 is a schematic diagram illustrating the location distribution of connecting pipes in a multi-layer PCB for heat dissipation;

FIG. 4 is a schematic diagram illustrating the distribution of output tubes in a multi-layer PCB for heat dissipation;

fig. 5 is a schematic view illustrating a mounting position of an electric heating film in a multi-layer PCB for facilitating heat dissipation.

In the figure: 1. a carrying mechanism; 11. an upper fixing plate; 12. a lower fixing plate; 13. a connecting pipe; 14. a delivery pipe; 15. an external connection pipe; 2. a heat dissipation mechanism; 201. embedding a groove; 21. a support plate; 22. an output pipe; 23. folding the hose; 24. a spray head; 25. electrically heating the film; 26. a thermal insulation layer; 3. an adjustment mechanism; 31. inserting a tube; 311. a spacing pin; 32. inserting a rod; 321. a limiting hole; 4. a top layer circuit board; 5. a power layer; 6. a ground plane; 7. a bottom layer circuit board.

Detailed Description

Referring to fig. 1-5, in an embodiment of the present invention, a multi-layer PCB board convenient for heat dissipation includes a top circuit board 4, a power layer 5, a ground layer 6, a bottom circuit board 7, a carrying mechanism 1 and a heat dissipation mechanism 2, which are sequentially arranged from bottom to bottom at intervals, the carrying mechanism 1 includes an upper fixing plate 11 and a lower fixing plate 12, the upper fixing plate 11 is located above the top circuit board 4, the lower fixing plate 12 is located below the bottom circuit board 7, the heat dissipation mechanism 2 is installed between the top circuit board 4, the power layer 5, the ground layer 6 and the bottom circuit board 7, the heat dissipation mechanism 2 is connected with each other through a connecting pipe 13, the heat dissipation mechanism 2 includes two symmetrically arranged support plates 21, output pipes 22 are fixedly connected to four corners of the opposite surfaces of the two support plates 21, the two corresponding output pipes 22 are connected through a folding hose 23, and a spray head, adjustment mechanism 3 is all installed in the four corners between two backup pads 21, backup pad 21 is the equal fixedly connected with in one side four corners connecting pipe 13 of carrying on the back mutually, connecting pipe 13 and output tube 22 intercommunication, connecting pipe 13 and the 11 fixed connection of upper fixed plate on top, connecting pipe 13 and the 12 fixed connection of bottom plate on bottom, four conveyer pipes 14 of the top surface fixedly connected with of upper fixed plate 11, the top surface intermediate position department fixedly connected with of upper fixed plate 11 takes over 15 outward, four conveyer pipes 14 all take over 15 fixed connection with outward, it is connected with outside fan to take over 15 outward, connecting pipe 13 communicates with four conveyer pipes 14 respectively, electrical heating membrane 25 is installed to backup pad 21's lateral wall a week, electrical heating membrane 25 and external power source electric connection.

In this embodiment: when in use, the external fan is conveyed into the connecting pipe 13 through the external connecting pipe 15 and the conveying pipe 14, then conveyed into the output pipe 22 of each heat dissipation mechanism 2 through the connecting pipe 13, and then sprayed out through the spray head 24 on the output pipe 22, and then sprayed and conveyed onto the top layer circuit board 4, the power supply layer 5, the ground layer 6 and the bottom layer circuit board 7, and the temperature of the top layer circuit board 4, the power supply layer 5, the ground layer 6 and the bottom layer circuit board 7 is reduced, when in installation, various electronic components are installed on the top layer circuit board 4, the power supply layer 5, the ground layer 6 and the bottom layer circuit board 7, the heights of the electronic components are different, the heat dissipation mechanisms 2 are adjusted according to specific installation heights, the distance between the two support plates 21 is adjusted to meet installation requirements, when in adjustment, the two support plates 21 in the heat dissipation mechanisms 2 at corresponding, insert the spacing hole 321 of corresponding position department with spacer pin 311 on the intubate 31 in, it is spacing to carry out two backup pad 21, in the time of regulation, folding hose 23 stretches out and draws back thereupon, guarantee the intercommunication to gas, in the time of guaranteeing the air current cooling, realize the regulation of distance between two backup pad 21, in order to satisfy more installation demands, the suitability is higher, when using, open electrical heating membrane 25, electrical heating membrane 25 circular telegram generates heat, the insect can't pass through electrical heating membrane 25, can not climb and attach to top layer circuit board 4, power layer 5, ground plane 6 and bottom circuit board 7, prevent to cause the short circuit, further improve the security.

In fig. 5: the side a week of backup pad 21 has been seted up and has been inlayed and establish groove 201, and the inner wall bonding of inlaying groove 201 is fixed with insulating layer 26, and electrical heating membrane 25 inlays and establishes at insulating layer 26 inner wall, and when electrical heating membrane 25 heated, insulating layer 26 can insulate against heat to it, prevents on heat conduction to backup pad 21, and insulating layer 26's material is the glass fiber cotton, and thermal-insulated effect is better, and insulating layer 26's thickness is two millimeters, guarantees its effectual thermal-insulated effect.

In fig. 1 and 2: the adjusting mechanism 3 comprises an inserting pipe 31 and an inserting rod 32 inserted in the inner wall of the inserting pipe in a sliding manner, a limiting pin 311 is inserted in one end of the inserting pipe 31 close to the inserting rod 32, a plurality of limiting holes 321 are formed in the inserting rod 32 along the length direction and arranged at equal intervals, the limiting holes 321 correspond to the limiting pins 311, the top end of the inserting pipe 31 is fixedly connected with the upper supporting plate 21, the bottom end of the inserting rod 32 is fixedly connected with the lower supporting plate 21, the inserting pipe 31 and the inserting rod 32 slide relatively, when the inserting rod is moved to a proper distance, the limiting pins 311 on the inserting pipe 31 are inserted into the limiting holes 321 at corresponding positions to limit the two supporting plates 21, the spray heads 24 are arranged in an inclined manner, the inclined directions of the spray heads 24 face the supporting plates 21, the top layer circuit board 4, the power layer 5, the ground layer 6 and the bottom layer circuit board 7 can be cooled better, and, so that the insertion rod 32 can be completely and slidably inserted into the insertion tube 31, and the adjustment range is larger.

The utility model discloses a theory of operation is: when in use, the external fan is conveyed into the connecting pipe 13 through the external connecting pipe 15 and the conveying pipe 14, then conveyed into the output pipe 22 of each heat dissipation mechanism 2 through the connecting pipe 13, and then sprayed out through the spray head 24 on the output pipe 22, and then sprayed and conveyed onto the top layer circuit board 4, the power supply layer 5, the ground layer 6 and the bottom layer circuit board 7, and the temperature of the top layer circuit board 4, the power supply layer 5, the ground layer 6 and the bottom layer circuit board 7 is reduced, when in installation, various electronic components are installed on the top layer circuit board 4, the power supply layer 5, the ground layer 6 and the bottom layer circuit board 7, the heights of the electronic components are different, the heat dissipation mechanisms 2 are adjusted according to specific installation heights, the distance between the two support plates 21 is adjusted to meet installation requirements, when in adjustment, the two support plates 21 in the heat dissipation mechanisms 2 at corresponding, insert the spacing hole 321 of corresponding position department with spacer pin 311 on the intubate 31 in, it is spacing to carry out two backup pad 21, in the time of regulation, folding hose 23 stretches out and draws back thereupon, guarantee the intercommunication to gas, in the time of guaranteeing the air current cooling, realize the regulation of distance between two backup pad 21, in order to satisfy more installation demands, the suitability is higher, when using, open electrical heating membrane 25, electrical heating membrane 25 circular telegram generates heat, the insect can't pass through electrical heating membrane 25, can not climb and attach to top layer circuit board 4, power layer 5, ground plane 6 and bottom circuit board 7, prevent to cause the short circuit, further improve the security.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A multi-layer PCB convenient for heat dissipation comprises a top layer circuit board (4), a power supply layer (5), a ground layer (6) and a bottom layer circuit board (7) which are sequentially arranged from bottom to bottom at intervals, and is characterized by further comprising a bearing mechanism (1) and a heat dissipation mechanism (2), wherein the bearing mechanism (1) comprises an upper fixing plate (11) and a lower fixing plate (12), the upper fixing plate (11) is positioned above the top layer circuit board (4), the lower fixing plate (12) is positioned below the bottom layer circuit board (7), the heat dissipation mechanism (2) is respectively arranged between the top layer circuit board (4), the power supply layer (5), the ground layer (6) and the bottom layer circuit board (7), the heat dissipation mechanism (2) is mutually connected through a connecting pipe (13), and the heat dissipation mechanism (2) comprises two support plates (21) which are symmetrically arranged, two equal fixedly connected with output tube (22) in the one side four corners that backup pad (21) is relative, two output tube (22) that correspond each other are connected through folding hose (23), equal fixedly connected with shower nozzle (24) on output tube (22), adjustment mechanism (3) are all installed in the four corners between two backup pad (21), the equal fixedly connected with connecting pipe (13) in one side four corners that backup pad (21) carried on the back mutually, connecting pipe (13) with output tube (22) intercommunication, be located the top connecting pipe (13) with upper fixed plate (11) fixed connection, be located the bottom connecting pipe (13) with bottom fixed plate (12) fixed connection, the top surface fixedly connected with four conveyer pipes (14) of upper fixed plate (11), top surface intermediate position department fixedly connected with external pipe (15) of upper fixed plate (11), four conveyer pipe (14) all with take over (15) fixed connection outward, take over outward (15) and be connected with outside fan, connecting pipe (13) respectively with four conveyer pipe (14) intercommunication, electric heating film (25) are installed to lateral wall a week of backup pad (21), electric heating film (25) and external power source electric connection.

2. The PCB convenient for heat dissipation according to claim 1, wherein an embedding groove (201) is formed on a periphery of a side surface of the supporting plate (21), a heat insulation layer (26) is fixedly bonded on an inner wall of the embedding groove (201), and the electric heating film (25) is embedded on an inner wall of the heat insulation layer (26).

3. The PCB convenient for heat dissipation according to claim 2, wherein the thermal insulation layer (26) is made of glass fiber cotton.

4. The multilayer PCB convenient for heat dissipation according to claim 1, wherein the adjusting mechanism (3) comprises an insertion tube (31) and an insertion rod (32) inserted in the inner wall of the insertion tube in a sliding manner, a limit pin (311) is inserted into one end of the insertion tube (31) close to the insertion rod (32), a plurality of limit holes (321) arranged at equal intervals are formed in the insertion rod (32) along the length direction, the limit holes (321) correspond to the limit pins (311), the top end of the insertion tube (31) is fixedly connected with the supporting plate (21) above, and the bottom end of the insertion rod (32) is fixedly connected with the supporting plate (21) below.

5. The PCB facilitating heat dissipation according to claim 1, wherein the nozzles (24) are arranged obliquely, and the oblique direction of the nozzles (24) is towards the supporting plate (21).

6. The PCB facilitating heat dissipation of claim 2, wherein the thickness of the thermal insulation layer (26) is two millimeters.

7. The PCB facilitating heat dissipation of claim 4, wherein the length of the insertion tube (31) is greater than the length of the insertion rod (32).