CN214046129U

CN214046129U - Thick copper circuit board of PCB

Info

Publication number: CN214046129U
Application number: CN202120056709.9U
Authority: CN
Inventors: 孙小丽; 李小华; 李鑫达
Original assignee: Shenzhen Jinchuang Yida Electronics Co ltd
Current assignee: Shenzhen Jinchuang Yida Electronics Co ltd
Priority date: 2021-01-11
Filing date: 2021-01-11
Publication date: 2021-08-24
Anticipated expiration: 2031-01-11

Abstract

The utility model discloses a thick copper circuit board of PCB, including the circuit board body, circuit board body upper end fixed mounting has a PCB base plate No. one, circuit board body lower extreme fixed mounting has No. two PCB base plates, No. one thick copper of PCB base plate upper end fixedly connected with, No. two thick copper of PCB base plate lower extreme fixedly connected with No. two, No. one thick copper upper end fixedly connected with protection portion, No. two thick copper lower extreme fixedly connected with radiating pieces, radiating piece lower extreme fixedly connected with installation department all around, a plurality of equidistant copper pipes that distribute of thick copper lower extreme fixedly connected with. The PCB thick copper circuit board of the utility model can improve the heat dissipation effect, ensure enough heat dissipation space and ensure the heat dissipation requirement required by the work of the circuit board by arranging the heat dissipation piece and the installation part; and the spraying layer, the solder resist ink layer and the covering film are arranged, so that the damage to the surface of the circuit board can be avoided, and the protective performance of the circuit board is improved.

Description

Thick copper circuit board of PCB

Technical Field

The utility model relates to a circuit board technical field, in particular to thick copper circuit board of PCB.

Background

With the rapid development of electronic and power communication technologies, some high-current and high-power supply products are more and more widely applied, the number of integrated functional elements on a circuit board is more and more, the requirements on the current conduction capability and the bearing capability of the circuit are higher and higher, and correspondingly, the copper thickness of the circuit board is thicker and thicker, so that the thick copper circuit board gradually becomes a circuit board with a wide market prospect; the thick copper circuit board often has the following problems in the use process: 1. the thick copper circuit board has strong current conduction capability and bearing capability to the circuit, and often emits a large amount of heat during operation, so that the circuit board is required to have good heat dissipation performance, and the circuit boards on the market are mostly directly mounted at present, have small heat dissipation area and cannot meet the heat dissipation requirement of the circuit board; 2. the existing circuit board is very easy to be damaged by impact in the using process, so that the service life of the circuit board is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a thick copper circuit board of PCB can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a PCB thick copper circuit board comprises a circuit board body, a first PCB substrate is fixedly arranged at the upper end of the circuit board body, the lower end of the circuit board body is fixedly provided with a second PCB substrate, the upper end of the first PCB substrate is fixedly connected with a first thick copper plate, the lower end of the second PCB substrate is fixedly connected with a second thick copper plate, the upper end of the first thick copper plate is fixedly connected with a protective part, the lower end of the second thick copper plate is fixedly connected with a heat radiating piece, the periphery of the lower end of the heat radiating piece is fixedly connected with a mounting part, the protective part, the first PCB substrate, the circuit board body, the second PCB substrate, the first thick copper plate and the second thick copper plate are all positioned at the inner side of the mounting part, the lower end of the first thick copper plate is fixedly connected with a plurality of copper pipes which are distributed at equal intervals, and the lower ends of the copper pipes sequentially penetrate through the middle part of the first PCB substrate, the middle part of the circuit board body and the middle part of the second PCB substrate and are fixedly connected with the upper end of the second thick copper plate.

Preferably, the heat dissipation member includes the radiating block, radiating block upper end fixed mounting has a plurality of equidistant distribution's insulating heat conduction post, the radiating block lower extreme is opened has a plurality of equidistant distribution's louvre.

Preferably, a plurality of insulating heat conduction post upper ends all run through No. two thick copper plate middle parts, No. two PCB base plate middle parts, circuit board body middle parts and No. one PCB base plate middle part in proper order and with a thick copper plate lower extreme fixed connection, radiating block upper end and No. two thick copper plate lower extreme fixed connection, it is a plurality of the inside superelevation packing of insulating heat conduction post has ceramic powder.

Preferably, the installation department includes the installing frame, the inboard lower part fixed mounting of installing frame has the support frame, fixed mounting has the installation ear around the installing frame outside, and all opens the mounting hole in installation ear upper end.

Preferably, the upper end of the support frame is fixedly connected with the lower end of the radiating block, the installation frame is of a rectangular frame structure, and the inner wall of the installation frame and the outer surface of the support frame are both coated with insulating coatings.

Preferably, the protection part includes the spraying layer, spraying layer upper end fixed mounting hinders and welds the printing ink layer, it has the cover film to hinder printing ink layer upper end fixed mounting, the spraying layer is located thick copper sheet upper end No. one.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) the utility model discloses in, the insulating heat conduction post that has ceramic powder through the packing can carry out high-efficient heat conduction to circuit board inside under the prerequisite of guaranteeing insulating nature, the heat of conduction passes through the radiating block and discharges, and the louvre on the radiating block can increase heat radiating area when lightening circuit board weight, improve the radiating effect, and the mounting hole on the installation department installs whole circuit board on erection equipment, avoid the circuit board back directly to paste tightly on erection equipment, guarantee sufficient heat dissipation space, thereby further guarantee the radiating effect.

(2) The utility model discloses in, through a thick copper sheet on the coating spraying layer with hinder the printing ink layer and can protect the copper line in the circuit board, avoid weing or short circuit phenomenon's appearance, and hinder the cover membrane that covers on the printing ink layer and can avoid the circuit board surface impaired, improve the barrier propterty of circuit board.

Drawings

Fig. 1 is a longitudinal sectional view of a thick copper circuit board of the PCB of the present invention;

fig. 2 is a longitudinal cross-sectional view of a heat sink of a thick copper PCB of the present invention;

FIG. 3 is a longitudinal sectional view of the mounting portion of a thick copper PCB of the present invention;

fig. 4 is an enlarged view of a position a in fig. 1 of a thick copper circuit board of the PCB of the present invention.

In the figure: 1. a first PCB substrate; 2. a circuit board body; 3. a heat sink; 4. an installation part; 5. a protective part; 6. a second PCB substrate; 7. a first thick copper plate; 8. a second thick copper plate; 9. a copper pipe; 31. an insulating heat-conducting column; 32. a heat dissipating block; 33. heat dissipation holes; 41. installing a frame; 42. a support frame; 43. mounting holes; 44. mounting lugs; 51. covering the film; 52. a solder resist ink layer; 53. and (4) spraying a coating.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in FIGS. 1-4, a PCB thick copper circuit board comprises a circuit board body 2, a first PCB substrate 1 is fixedly arranged at the upper end of the circuit board body 2, a second PCB substrate 6 is fixedly arranged at the lower end of the circuit board body 2, a first thick copper plate 7 is fixedly connected at the upper end of the first PCB substrate 1, a second thick copper plate 8 is fixedly connected at the lower end of the second PCB substrate 6, a protective part 5 is fixedly connected at the upper end of the first thick copper plate 7, a heat dissipation part 3 is fixedly connected at the lower end of the second thick copper plate 8, an installation part 4 is fixedly connected around the lower end of the heat dissipation part 3, the protective part 5, the first PCB substrate 1, the circuit board body 2, the second PCB substrate 6, the first thick copper plate 7 and the second thick copper plate 8 are all positioned inside the installation part 4, a plurality of copper pipes 9 distributed at equal intervals are fixedly connected at the lower end of the first thick copper plate 7, and the lower ends of the plurality of the copper pipes 9 sequentially penetrate through the middle part of the first PCB substrate 1, The middle part of the circuit board body 2 and the middle part of the second PCB substrate 6 are fixedly connected with the upper end of the second thick copper plate 8.

The heat dissipation member 3 comprises a heat dissipation block 32, a plurality of insulated heat conduction columns 31 distributed at equal intervals are fixedly mounted at the upper end of the heat dissipation block 32, a plurality of heat dissipation holes 33 distributed at equal intervals are formed at the lower end of the heat dissipation block 32, and the heat dissipation holes 33 can increase the heat dissipation area and improve the heat dissipation effect while reducing the weight of the circuit board; the upper ends of the insulating heat conduction columns 31 sequentially penetrate through the middle parts of the second thick copper plate 8, the second PCB substrate 6, the circuit board body 2 and the first PCB substrate 1 and are fixedly connected with the lower end of the first thick copper plate 7, the upper ends of the heat dissipation blocks 32 are fixedly connected with the lower end of the second thick copper plate 8, ceramic powder is super-filled in the insulating heat conduction columns 31, the insulating heat conduction columns 31 can conduct heat conduction operation on the interior of the circuit board on the premise of ensuring insulativity, and conducted heat is discharged through the heat dissipation blocks 32; the mounting part 4 comprises a mounting frame 41, a support frame 42 is fixedly mounted at the lower part of the inner side of the mounting frame 41, mounting lugs 44 are fixedly mounted at the periphery of the outer side of the mounting frame 41, mounting holes 43 are formed in the upper ends of the mounting lugs 44, and the mounting holes 43 can facilitate the rapid mounting of the whole circuit board; the upper end of the supporting frame 42 is fixedly connected with the lower end of the heat dissipation block 32, the mounting frame 41 is in a rectangular frame structure, and the inner wall of the mounting frame 41 and the outer surface of the supporting frame 42 are both coated with insulating coatings which can avoid the short circuit phenomenon of the circuit board; the protection part 5 comprises a spraying layer 53, a solder mask ink layer 52 is fixedly mounted at the upper end of the spraying layer 53, a covering film 51 is fixedly mounted at the upper end of the solder mask ink layer 52, the spraying layer 53 is located at the upper end of a thick copper plate 7, and the covering film 51 covering the upper end of the solder mask ink layer 52 can avoid the surface of the circuit board from being damaged, so that the protection performance of the circuit board is improved.

It should be noted that, the utility model relates to a PCB thick copper circuit board, this PCB thick copper circuit board can give off a lot of heat in the place of use by the circuit board, and a plurality of insulating heat conduction post 31 of installation on the radiating block 32 can run through No. two thick copper plates 8 in proper order, No. two PCB base plates 6, circuit board body 2 and PCB base plate 1 inside and be connected with a thick copper plate 7, make insulating heat conduction post 31 can carry out the heat conduction operation to the circuit board inside under the prerequisite of guaranteeing insulating nature, and the heat of conduction is discharged through radiating block 32, and louvre 33 on the radiating block 32 can increase heat radiating area when lightening circuit board weight, improve the radiating effect, in addition utilize installation department 4 to directly install whole circuit board on taking erection equipment, can effectively avoid the radiating effect that the radiating surface blocks up and lead to not good when installing; the spraying layer 53 and the solder resist ink layer 52 coated on the first thick copper plate 7 can protect copper circuits in the circuit board and avoid the phenomenon of moisture or short circuit, and the cover film 51 covered on the upper end of the solder resist ink layer 52 can avoid the surface of the circuit board from being damaged and improve the protection performance of the circuit board.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a thick copper circuit board of PCB, includes circuit board body (2), its characterized in that: the PCB structure comprises a circuit board body (2), wherein a first PCB substrate (1) is fixedly mounted at the upper end of the circuit board body (2), a second PCB substrate (6) is fixedly mounted at the lower end of the circuit board body (2), a first thick copper plate (7) is fixedly connected at the upper end of the first PCB substrate (1), a second thick copper plate (8) is fixedly connected at the lower end of the second PCB substrate (6), a protective part (5) is fixedly connected at the upper end of the first thick copper plate (7), a radiating part (3) is fixedly connected at the lower end of the second thick copper plate (8), an installation part (4) is fixedly connected around the lower end of the radiating part (3), the protective part (5), the first PCB substrate (1), the circuit board body (2), the second PCB substrate (6), the first thick copper plate (7) and the second thick copper plate (8) are all located on the inner side of the installation part (4), and a plurality of copper pipes (9) which are distributed at equal intervals are fixedly connected at the lower end of the first thick copper plate (7), and the lower ends of the copper pipes (9) sequentially penetrate through the middle parts of the first PCB substrate (1), the circuit board body (2) and the second PCB substrate (6) and are fixedly connected with the upper end of the second thick copper plate (8).

2. The PCB thick copper circuit board of claim 1, characterized in that: the heat dissipation piece (3) comprises a heat dissipation block (32), a plurality of insulating heat conduction columns (31) which are distributed at equal intervals are fixedly mounted at the upper end of the heat dissipation block (32), and a plurality of heat dissipation holes (33) which are distributed at equal intervals are formed in the lower end of the heat dissipation block (32).

3. The PCB thick copper circuit board of claim 2, characterized in that: a plurality of insulating heat conduction post (31) upper end all runs through thick copper (8) middle part No. two, PCB base plate (6) middle part No. two, circuit board body (2) middle part and PCB base plate (1) middle part in proper order and with thick copper (7) lower extreme fixed connection, radiating block (32) upper end and thick copper (8) lower extreme fixed connection No. two, it is a plurality of insulating heat conduction post (31) inside superelevation packing has ceramic powder.

4. The PCB thick copper circuit board of claim 1, characterized in that: installation department (4) are including installing frame (41), installing frame (41) inboard lower part fixed mounting has support frame (42), installing frame (41) outside fixed mounting all around has installation ear (44), and installation ear (44) upper end has all opened mounting hole (43).

5. The PCB thick copper circuit board of claim 4, characterized in that: support frame (42) upper end and radiating block (32) lower extreme fixed connection, installing frame (41) are rectangle frame structure, installing frame (41) inner wall and support frame (42) surface all coat and have insulating coating.

6. The PCB thick copper circuit board of claim 1, characterized in that: protection portion (5) are including spraying layer (53), spraying layer (53) upper end fixed mounting hinders and welds printing ink layer (52), hinder and weld printing ink layer (52) upper end fixed mounting and have cover film (51), spraying layer (53) are located thick copper sheet (7) upper end No. one.