CN214417943U

CN214417943U - Semiconductor laser welding equipment with heat dissipation dustproof construction

Info

Publication number: CN214417943U
Application number: CN202120235224.6U
Authority: CN
Inventors: 邓明伟
Original assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Current assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Priority date: 2021-01-28
Filing date: 2021-01-28
Publication date: 2021-10-19
Anticipated expiration: 2031-01-28

Abstract

The utility model provides a semiconductor laser welding equipment with heat dissipation dustproof construction relates to laser welding technical field. This semiconductor laser welding equipment with heat dissipation dustproof construction, including the board, board bottom fixedly connected with supporting leg, supporting leg inner wall fixedly connected with backup pad, backup pad top fixedly connected with dust proof box, the inside fixedly connected with laser of dust proof box. This semiconductor laser welding equipment with heat dissipation dustproof construction, through the objective table, first slide rail, the second slide rail, the installing frame, slide bar and slide, the second slide rail can be on first slide rail horizontal position removal, the installing frame can be on the second slide rail front and back position removal, the semiconductor material of different specifications of being convenient for adapt to, the practicality is higher, through dust proof box, ventilation hole, dust screen and chamber door, the ventilation hole is with inside heat effluvium, the dust screen prevents that the dust from the ventilation hole gets into the dust proof box in, dustproof radiating effect has been improved.

Description

Semiconductor laser welding equipment with heat dissipation dustproof construction

Technical Field

The utility model relates to a laser welding technical field specifically is a semiconductor laser welding equipment with heat dissipation dustproof construction.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and the laser welding of the semiconductor is an efficient and precise welding method which utilizes a laser beam with high energy density as a heat source and is widely used in the processing and welding of the semiconductor.

The existing semiconductor laser welding equipment with the heat dissipation dustproof structure cannot adapt to semiconductor materials of different specifications, is relatively troublesome in operation, causes the reduction of welding efficiency, has a common dustproof heat dissipation effect, is used for a long time to influence the service life of the equipment, brings certain economic loss, and is inconvenient to popularize and use.

Therefore, it is necessary to provide a semiconductor laser welding apparatus with a heat dissipation dustproof structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a semiconductor laser welding is equipped with heat dissipation dustproof construction to the semiconductor laser welding that current has heat dissipation dustproof construction who proposes in solving above-mentioned background art is equipped with the semiconductor material that can not adapt to different specifications and the general problem of dustproof radiating effect.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a semiconductor laser welding device with a heat dissipation and dust prevention structure comprises a machine table, wherein a supporting leg is fixedly connected to the bottom end of the machine table, a supporting plate is fixedly connected to the inner wall of the supporting leg, a dust-proof box is fixedly connected to the top end of the supporting plate, a laser is fixedly connected to the inner portion of the dust-proof box, a control box is fixedly connected to one side of the inner portion of the dust-proof box and located on the laser, a box door is movably connected to the outer surface of the dust-proof box, a ventilation hole is formed in the outer surface of the dust-proof box, a dust-proof net is fixedly connected to the inner wall of the ventilation hole, a carrier table is fixedly connected to the top end of the machine table, an emergency stop switch is arranged at the top end of the carrier table, a first slide rail is fixedly connected to one side of the top end of the carrier table and located on the emergency stop switch, a second slide rail is movably connected to the inner wall of the first slide rail, a mounting frame is fixedly connected to the inner portion of the mounting frame, the slide bar surface has cup jointed the slide, slide surface fixedly connected with fixed plate, fixed plate surface fixedly connected with mounting panel, mounting panel surface fixedly connected with send tin mechanism, the mounting panel surface just is located one side fixedly connected with deflector that send tin mechanism, the inside tin pipe that has followed up of deflector, deflector bottom end fixedly connected with optic fibre laser head, the objective table top just is located one side fixedly connected with bracing piece of first slide rail, bracing piece surface fixedly connected with controls the screen.

Preferably, laser machine, scram switch, send tin mechanism, optic fibre laser head and control the screen and all with control box electric connection, and control box and external power source electric connection.

Preferably, the bottom ends of the supporting legs are fixedly connected with rubber pads.

Preferably, the box door is connected with the dustproof box through a hinge, and a handle is fixedly connected to the outer surface of the box door.

Preferably, the second slide rail and the mounting frame are respectively connected with the first slide rail and the second slide rail through sliding blocks.

Preferably, the dustproof net is made of stainless steel.

(III) advantageous effects

The utility model provides a semiconductor laser welding is equipped with heat dissipation dustproof construction. The method has the following beneficial effects:

1. this semiconductor laser welding equipment with heat dissipation dustproof construction, pass through the objective table, first slide rail, the second slide rail, the installing frame, slide bar and slide, the second slide rail can be on first slide rail horizontal position removal, so that adapt to the semiconductor material of different length, the installing frame can be on the second slide rail around the position remove, be convenient for adapt to the semiconductor material of different width, the slide moves on the slide bar and can adjust the high position, be convenient for adapt to the semiconductor material of co-altitude not, the practicality is higher, the problem that can not adapt to the semiconductor material of different specifications has been solved.

2. This semiconductor laser welding equipment with heat dissipation dustproof construction through dust proof box, ventilation hole, dust screen and chamber door, and dust proof box and chamber door can protect equipment, prevent that the dust from getting into, and the ventilation hole can in time spill the inside heat, and the dust screen prevents that the dust from getting into the dust proof box from the ventilation hole simultaneously, and is simple high-efficient, has improved dustproof radiating effect, has solved the general problem of dustproof radiating effect.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side view of the present invention;

fig. 3 is a schematic rear view of the present invention;

fig. 4 is a schematic view of the top view structure of the present invention.

In the figure: 1. a machine platform; 2. supporting legs; 3. a support plate; 4. a dust-proof box; 5. a laser machine; 6. a control box; 7. a box door; 8. a vent hole; 9. a dust screen; 10. an object stage; 11. a scram switch; 12. a first slide rail; 13. a second slide rail; 14. installing a frame; 15. a slide bar; 16. a slide plate; 17. a fixing plate; 18. mounting a plate; 19. a tin feeding mechanism; 20. a guide plate; 21. a tin guide tube; 22. an optical fiber laser head; 23. a support bar; 24. and a control screen.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The embodiment of the utility model provides a semiconductor laser welding equipment with heat dissipation and dust prevention structure, as shown in figure 1-4, comprising a machine table 1, a supporting leg 2 is fixedly connected at the bottom end of the machine table 1, a supporting plate 3 is fixedly connected on the inner wall of the supporting leg 2, a dust-proof box 4 is fixedly connected at the top end of the supporting plate 3, a laser 5 is fixedly connected inside the dust-proof box 4, a control box 6 is fixedly connected inside the dust-proof box 4 and at one side of the laser 5, a box door 7 is movably connected on the outer surface of the dust-proof box 4, the dust-proof box 4 and the box door 7 can protect the equipment and prevent dust from entering, a vent hole 8 is arranged on the outer surface of the dust-proof box 4, a dust-proof net 9 is fixedly connected on the inner wall of the vent hole 8, the dust-proof net 9 prevents dust from entering the dust-proof box 4 from the vent hole, an objective table 10 is fixedly connected at the top end of the machine table 1, an emergency stop switch 11 is arranged at the top end of the objective table 10, a first slide rail 12 is fixedly connected to one side of the emergency stop switch 11 at the top end of the objective table 10, a second slide rail 13 is movably connected to the inner wall of the first slide rail 12, the second slide rail 13 can move horizontally on the first slide rail 12 so as to adapt to semiconductor materials with different lengths, a mounting frame 14 is movably connected to the inner wall of the second slide rail 13, the mounting frame 14 can move back and forth on the second slide rail 13 so as to adapt to semiconductor materials with different widths, a slide rod 15 is fixedly connected to the inside of the mounting frame 14, a slide plate 16 is sleeved on the outer surface of the slide rod 15, the slide plate 16 can move on the slide rod 15 to adjust the height position so as to adapt to semiconductor materials with different heights, a fixing plate 17 is fixedly connected to the outer surface of the slide plate 16, a mounting plate 18 is fixedly connected to the outer surface of the fixing plate 17, a tin feeding mechanism 19 is fixedly connected to the outer surface of the mounting plate 18, and a guide plate 20 is fixedly connected to one side of the outer surface of the mounting plate 18, which is located on the tin feeding mechanism 19, the inside tin pipe 21 that has followed closely of

deflector

20, 20 bottom fixedly connected with optic fibre laser heads 22 of deflector, one side fixedly connected with bracing piece 23 on objective table 10 top and lie in first slide rail 12, bracing piece 23 outer fixed surface is connected with controls screen 24, screen 24 is controlled in the operation, send tin mechanism 19 to carry external tin silk to the semiconductor material that objective table 10 bore via tin pipe 21, the laser that laser machine 5 produced shines the tin silk that send tin mechanism 19 to carry so that the tin silk melts via optic fibre laser heads 22 transmission, thereby weld semiconductor material.

The working principle is as follows: when the device is used, an external power supply is switched on, semiconductor materials are placed on the object stage 10, the second slide rail 13 can move horizontally on the first slide rail 12 so as to be suitable for the semiconductor materials with different lengths, the mounting frame 14 can move back and forth on the second slide rail 13 so as to be suitable for the semiconductor materials with different widths, the sliding plate 16 can move on the slide bar 15 so as to adjust the height position so as to be suitable for the semiconductor materials with different heights, the device has high practicability, the operation control screen 24 is operated, the tin feeding mechanism 19 conveys external tin wires to the semiconductor materials borne by the object stage 10 through the tin guide tube 21, laser generated by the laser machine 5 irradiates the tin wires conveyed by the tin feeding mechanism 19 through the transmission of the optical fiber laser head 22 so as to melt the tin wires, so that the semiconductor materials are welded, the dust-proof box 4 and the box door 7 can protect the device, dust is prevented from entering, the vent hole 8 can timely radiate internal heat, meanwhile, the dust screen 9 prevents dust from entering the dust-proof box 4 from the air vent, so that the dust-proof and heat-dissipation effects are improved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor laser welding is equipped with heat dissipation dustproof construction, includes board (1), its characterized in that: the machine table is characterized in that the bottom end of the machine table (1) is fixedly connected with supporting legs (2), the inner walls of the supporting legs (2) are fixedly connected with supporting plates (3), the top end of each supporting plate (3) is fixedly connected with a dustproof box (4), the interior of each dustproof box (4) is fixedly connected with a laser machine (5), one side of each dustproof box (4) which is positioned on the laser machine (5) is fixedly connected with a control box (6), the outer surface of each dustproof box (4) is movably connected with a box door (7), the outer surface of each dustproof box (4) is provided with a vent hole (8), the inner wall of each vent hole (8) is fixedly connected with a dustproof net (9), the top end of the machine table (1) is fixedly connected with an object stage (10), the top end of the object stage (10) is provided with an emergency stop switch (11), one side of the top end of the object stage (10) which is positioned on the emergency stop switch (11) is fixedly connected with a first sliding rail (12), the tin soldering machine is characterized in that a second sliding rail (13) is movably connected to the inner wall of the first sliding rail (12), an installation frame (14) is movably connected to the inner wall of the second sliding rail (13), a sliding rod (15) is fixedly connected to the inner portion of the installation frame (14), a sliding plate (16) is sleeved on the outer surface of the sliding rod (15), a fixing plate (17) is fixedly connected to the outer surface of the sliding plate (16), a mounting plate (18) is fixedly connected to the outer surface of the fixing plate (17), a tin feeding mechanism (19) is fixedly connected to the outer surface of the mounting plate (18), a guide plate (20) is fixedly connected to one side of the tin feeding mechanism (19) on the outer surface of the mounting plate (18), a tin guide pipe (21) is connected to the inner portion of the guide plate (20) in a penetrating mode, laser head optical fibers (22) are fixedly connected to the bottom end of the guide plate (20), and a supporting rod (23) is fixedly connected to one side of the first sliding rail (12) on the top end of the object stage (10), the outer surface of the supporting rod (23) is fixedly connected with a control screen (24).

2. The semiconductor laser welding equipment with the heat dissipation dustproof structure as claimed in claim 1, wherein: laser machine (5), scram switch (11), send tin mechanism (19), optic fibre laser head (22) and control screen (24) all with control box (6) electric connection, and control box (6) and external power source electric connection.

3. The semiconductor laser welding equipment with the heat dissipation dustproof structure as claimed in claim 1, wherein: the bottom end of the supporting leg (2) is fixedly connected with a rubber pad.

4. The semiconductor laser welding equipment with the heat dissipation dustproof structure as claimed in claim 1, wherein: the box door (7) is connected with the dust-proof box (4) through a hinge, and a handle is fixedly connected to the outer surface of the box door (7).

5. The semiconductor laser welding equipment with the heat dissipation dustproof structure as claimed in claim 1, wherein: and the second slide rail (13) and the mounting frame (14) are respectively connected with the first slide rail (12) and the second slide rail (13) through slide blocks.

6. The semiconductor laser welding equipment with the heat dissipation dustproof structure as claimed in claim 1, wherein: the dustproof net (9) is made of stainless steel.