CN212848327U

CN212848327U - Chip bonding equipment for contact type CPU production

Info

Publication number: CN212848327U
Application number: CN202022149494.3U
Authority: CN
Inventors: 陈海亮
Original assignee: Dongguan Liangbida Intelligent Technology Co ltd
Current assignee: Dongguan Liangbida Intelligent Technology Co ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2021-03-30
Anticipated expiration: 2030-09-25

Abstract

The utility model discloses a contact CPU production is with chip equipment of adhereing relates to the chip and binds technical field, including binding the frame, bind the left side fixed mounting of frame top surface and bind the workstation, bind the right side fixed mounting of frame top surface and store the box with the chip that the workstation is the symmetry and sets up with binding, bind the middle part fixed mounting of frame top surface and be located and bind workstation and chip and store the hydraulic lifting rod between the box. Above-mentioned scheme, hydraulic lifting rod, rotation seat, a style of calligraphy mounting bracket, first adsorption anchor clamps and second adsorb anchor clamps combination and constitute one set of uninterrupted alternate bonding feed mechanism, the effect of chip clamp and input integration has been reached, utilize the transmission motor of heat dissipation machine incasement portion to drive a style of calligraphy mounting bracket, first adsorption anchor clamps and second adsorption anchor clamps horizontal rotation, let first adsorption anchor clamps and second adsorption anchor clamps cooperation hydraulic lifting rod accomplish the operation of getting of chip in step, practice thrift the chip clamp and get the time of putting in, the efficiency that the chip binded has been improved.

Description

Chip bonding equipment for contact type CPU production

Technical Field

The utility model relates to a chip binds technical field, more specifically says, the utility model relates to a chip equipment of binding is used in contact CPU production.

Background

The contact type CPU card is one of integrated circuit cards, is a plastic card embedded with an integrated circuit chip, and has the shape and the size which conform to the international standard (ISO/IEC7816, GB/T16649); the chip generally adopts a nonvolatile memory (ROM, EEPROM), a protection logic circuit, even a CPU with a microprocessor, and the existing contact CPU adopts an intelligent mechanical arm to replace manual work to clamp and release the chip in the processing procedure of embedding and bonding the chip.

But current robotic arm is pressing from both sides when getting and put in the chip, and the operation is separately gone on with putting in the clamp of chip, and robotic arm shows that the clamp gets the chip, carries the chip of getting to the clamp again and binds the draw-in groove and put in, and the clamp of chip gets and puts in separately going on, has increased the operation time that the chip binds, has reduced work efficiency, and current robotic arm structure is complicated simultaneously, and the cost is expensive, great increase contact CPU card manufacturing cost's input.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a contact CPU production is with chip bonding equipment to solve current contact CPU production and bind the problem that equipment structure is complicated with the chip, and the cost is expensive, and work efficiency is low.

In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a chip bonding equipment for production of contact CPU, is including binding the frame, the left side fixed mounting who binds the frame top surface has the workstation of binding, bind the right side fixed mounting of frame top surface have with bind the chip that the workstation is the symmetry and sets up and store the box, the middle part fixed mounting who binds the frame top surface has and is located bind workstation and chip and store the hydraulic lifting rod between the box, the top fixed mounting of hydraulic lifting rod has the rotation seat, the transmission shaft fixed mounting who rotates the seat have with hydraulic lifting rod is swing joint's a style of calligraphy mounting bracket, the bottom surface fixed mounting of a style of calligraphy mounting bracket has and is located hydraulic lifting rod and the left first anchor clamps that adsorb of rotation seat, the bottom surface fixed mounting of a style of calligraphy mounting bracket has and is located hydraulic lifting rod and the second that rotates the seat right side adsorb anchor clamps, the equal fixed mounting in both ends about a style of calligraphy mounting bracket has the perpendicular to bind the laser projector of And mapping induction bases matched with the laser projectors are fixedly arranged on the left side and the right side of the top surface of the bonding base.

The first adsorption clamp and the second adsorption clamp are members with the same structure, and are respectively mounted right above the bonding workbench and the chip storage box in a suspended mode through the linear mounting frame.

The first adsorption fixture and the second adsorption fixture are composed of a straight cylinder mounting seat, a suction air pump, an adsorption clamping seat and a rubber filtering gauze, the suction air pump is fixedly mounted at the top of an inner cavity of the straight cylinder mounting seat, the adsorption clamping seat is fixedly mounted at the bottom end of the straight cylinder mounting seat, and the adsorption clamping seat is communicated with the suction air pump through the straight cylinder mounting seat.

Wherein, the quantity of straining the glue gauze is a plurality of, a plurality of strain the glue gauze and be the equidistance distribution side by side and be in the bottom of straight section of thick bamboo mount pad inner chamber, the top run-through of straight section of thick bamboo mount pad inlay in the middle part of a style of calligraphy mounting bracket support arm.

The rotating seat comprises a heat dissipation case, a transmission motor is fixedly mounted in the middle of the inner cavity of the heat dissipation case, and a transmission shaft of the transmission motor is fixedly connected with the connecting seat of the linear mounting frame.

The number of the laser projectors is two, the two laser projectors are respectively installed on the outer sides of the second adsorption fixture and the laser projectors, and the two laser projectors are distributed in a straight shape with the second adsorption fixture and the laser projectors.

The number of the mapping induction bases is two, the two mapping induction bases are fixedly installed on the outer sides of the bonding workbench and the chip storage box respectively, and the two mapping induction bases, the bonding workbench and the chip storage box are distributed in a straight line shape.

The utility model discloses a technological effect and advantage:

1. in the above scheme, hydraulic lifting rod, rotate the seat, a style of calligraphy mounting bracket, first adsorption anchor clamps and second adsorb anchor clamps combination and constitute one set of uninterrupted alternate bonding feed mechanism, the effect of chip clamp and input integration has been reached, utilize the transmission motor of heat dissipation machine incasement portion to drive a style of calligraphy mounting bracket, first adsorption anchor clamps and second adsorption anchor clamps horizontal rotation, let first adsorption anchor clamps and second adsorption anchor clamps cooperation hydraulic lifting rod accomplish the operation of getting of chip in step, the time of chip clamp and input has been practiced thrift, the efficiency of chip bonding has been improved, and whole device simple structure, low in cost, production cost's input has been reduced.

2. In the above scheme, laser projector and mapping response base cooperation have reached the chip and have put in the accurate effect of gluing, utilize two laser projectors to throw the location projection to gluing the frame in step, recycle two and map response base and map the location projection to make things convenient for the workman accurate to glue the chip in the mounting groove of card, improved the efficiency of chip installation, increased the practicality of device.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of a first adsorption jig and a second adsorption jig of the present invention;

FIG. 3 is a schematic view of the structure of the rotary seat of the present invention;

fig. 4 is a schematic structural view of the laser projector and the mapping induction base of the present invention;

the reference signs are: 1. bonding the base; 2. a bonding station; 3. a chip storage box; 4. a hydraulic lifting rod; 5. a rotating seat; 6. a linear mounting frame; 7. a first adsorption jig; 8. a second adsorption jig; 9. a laser projector; 10. mapping the induction base; 51. a heat dissipation case; 52. a drive motor; 71. a straight cylinder mounting base; 72. a suction gas pump; 73. adsorbing the card holder; 74. a rubber filtering gauze.

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 4, an embodiment of the present invention provides a contact type chip bonding apparatus for CPU production, including a bonding base 1, a bonding table 2 fixedly installed on a left side of a top surface of the bonding base 1, a chip storage box 3 symmetrically installed on a right side of the top surface of the bonding base 1, a hydraulic lifting rod 4 fixedly installed in a middle portion of the top surface of the bonding base 1 and located between the bonding table 2 and the chip storage box 3, a rotating base 5 fixedly installed on a top end of the hydraulic lifting rod 4, a linear mounting frame 6 movably connected to the hydraulic lifting rod 4 and fixedly installed on a transmission shaft of the rotating base 5, a first adsorption clamp 7 fixedly installed on a bottom surface of the linear mounting frame 6 and located on a left side of the hydraulic lifting rod 4 and the rotating base 5, a second adsorption clamp 8 fixedly installed on a bottom surface of the linear mounting frame 6 and located on a right side of the hydraulic lifting rod 4 and the rotating base 5, the left end and the right end of the linear mounting frame 6 are fixedly provided with a laser projector 9 which is vertical to the top surface of the binding machine base 1, and the left side and the right side of the top surface of the binding machine base 1 are fixedly provided with a mapping induction base 10 which is matched with the laser projector 9.

As shown in fig. 2 and 3, the first adsorption jig 7 and the second adsorption jig 8 are members having the same structure, and the first adsorption jig 7 and the second adsorption jig 8 are respectively mounted above the bonding table 2 and the chip storage box 3 in a suspended manner via the in-line mounting frame 6; the first adsorption fixture 7 and the second adsorption fixture 8 are respectively composed of a straight cylinder mounting seat 71, a suction air pump 72, an adsorption clamping seat 73 and a rubber filtering gauze 74, the suction air pump 72 is fixedly arranged at the top of the inner cavity of the straight cylinder mounting seat 71, the adsorption clamping seat 73 is fixedly arranged at the bottom end of the straight cylinder mounting seat 71, and the adsorption clamping seat 73 is communicated with the suction air pump 72 through the straight cylinder mounting seat 71; the number of the glue filtering gauze screens 74 is a plurality, the glue filtering gauze screens 74 are distributed at the bottom end of the inner cavity of the straight-tube installation seat 71 in parallel at equal intervals, and the top end of the straight-tube installation seat 71 is embedded in the middle of the support arm of the straight-line installation seat 6 in a penetrating manner; the rotating seat 5 comprises a heat dissipation case 51, a transmission motor 52 is fixedly installed in the middle of the inner cavity of the heat dissipation case 51, and a transmission shaft of the transmission motor 52 is fixedly connected with the connecting seat of the linear mounting frame 6.

Specifically, hydraulic lifting rod 4, rotate seat 5, a style of calligraphy mounting bracket 6, first absorption anchor clamps 7 and the combination of second absorption anchor clamps 8 constitute one set of uninterrupted alternate bonding feed mechanism, the effect of chip clamp and input integration has been reached, utilize the inside transmission motor 52 of heat dissipation machine case 51 to drive a style of calligraphy mounting bracket 6, first absorption anchor clamps 7 and the 8 horizontal rotation of second absorption anchor clamps, let first absorption anchor clamps 7 and the 8 synchronous completion chips of second absorption anchor clamps 8 cooperation hydraulic lifting rod 4 get the operation of putting, the time of chip clamp get with the input has been practiced thrift, the efficiency that the chip bonded has been improved, and whole device simple structure, therefore, the carrier wave prepaid electric energy meter is low in cost, the input of manufacturing cost is reduced.

As shown in fig. 2 and fig. 4, the number of the laser projectors 9 is two, the two laser projectors 9 are respectively installed at the outer sides of the second adsorption jig 8 and the laser projectors 9, and the two laser projectors 9, the second adsorption jig 8 and the laser projectors 9 are distributed in a straight line shape; the number of the mapping induction bases 10 is two, the two mapping induction bases 10 are respectively and fixedly installed at the outer sides of the bonding workbench 2 and the chip storage box 3, and the two mapping induction bases 10, the bonding workbench 2 and the chip storage box 3 are distributed in a straight line shape.

Specifically, laser projector 9 and mapping response base 10 cooperation have reached the chip and have put in the accurate effect of gluing, utilize two laser projector 9 synchronous to gluing frame 1 and throw the location projection, recycle two and map response base 10 and map the location projection to make things convenient for the accurate mounting groove of gluing the chip at the card of workman, improved the efficiency of chip installation, increased the practicality of device.

The working process of the utility model is as follows:

the hydraulic lifting rod 4, the rotating seat 5, the linear mounting frame 6, the first adsorption fixture 7 and the second adsorption fixture 8 are combined to form a set of non-intermittent alternative adhesion feeding mechanism, so that the effect of integrating chip clamping and feeding is achieved, the linear mounting frame 6, the first adsorption fixture 7 and the second adsorption fixture 8 are driven to horizontally rotate by the transmission motor 52 in the radiating case 51, the first adsorption fixture 7 and the second adsorption fixture 8 are matched with the hydraulic lifting rod 4 to synchronously complete chip taking and placing operation, the time for chip clamping and feeding is saved, the chip adhesion efficiency is improved, the whole device is simple in structure and low in manufacturing cost, and the production cost input is reduced;

laser projector 9 and mapping response base 10 cooperation have reached the chip and have put in the accurate effect of gluing, utilize two laser projector 9 synchronous to gluing frame 1 and throw the location projection, recycle two and map response base 10 and map the location projection to make things convenient for the workman accurate to glue the chip in the mounting groove of card, improved the efficiency of chip installation, increased the practicality of device.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a contact CPU production is with chip equipment of adhereing, is including binding frame (1), the left side fixed mounting who binds frame (1) top surface has and binds workstation (2), the right side fixed mounting who binds frame (1) top surface have with it is the chip that symmetry set up and stores box (3), its characterized in that to bind workstation (2): the middle of the top surface of the binding machine base (1) is fixedly provided with a hydraulic lifting rod (4) positioned between the binding workbench (2) and the chip storage box (3), the top end of the hydraulic lifting rod (4) is fixedly provided with a rotating base (5), a transmission shaft of the rotating base (5) is fixedly provided with a linear mounting frame (6) movably connected with the hydraulic lifting rod (4), the bottom surface of the linear mounting frame (6) is fixedly provided with a first adsorption clamp (7) positioned on the left sides of the hydraulic lifting rod (4) and the rotating base (5), the bottom surface of the linear mounting frame (6) is fixedly provided with a second adsorption clamp (8) positioned on the right sides of the hydraulic lifting rod (4) and the rotating base (5), the left end and the right end of the linear mounting frame (6) are fixedly provided with a laser projector (9) perpendicular to the top surface of the binding machine base (1), and mapping induction bases (10) matched with the laser projectors (9) are fixedly arranged on the left side and the right side of the top surface of the bonding machine base (1).

2. The contact type chip bonding apparatus for CPU production according to claim 1, wherein: the first adsorption clamp (7) and the second adsorption clamp (8) are members with the same structure, and the first adsorption clamp (7) and the second adsorption clamp (8) are respectively installed above the bonding workbench (2) and the chip storage box (3) in a suspended mode through the linear mounting frame (6).

3. The contact type chip bonding apparatus for CPU production according to claim 2, wherein: the first adsorption fixture (7) and the second adsorption fixture (8) are composed of a straight cylinder mounting seat (71), a suction air pump (72), an adsorption clamping seat (73) and a rubber filtering gauze (74), the suction air pump (72) is fixedly mounted at the top of an inner cavity of the straight cylinder mounting seat (71), the adsorption clamping seat (73) is fixedly mounted at the bottom end of the straight cylinder mounting seat (71), and the adsorption clamping seat (73) is communicated with the suction air pump (72) through the straight cylinder mounting seat (71).

4. The contact type chip bonding apparatus for CPU production according to claim 3, wherein: the quantity of straining glue gauze (74) is a plurality of, a plurality of strain glue gauze (74) and be parallel equidistance and distribute and be in the bottom of straight section of thick bamboo mount pad (71) inner chamber, the top of straight section of thick bamboo mount pad (71) run through the formula inlay in the middle part of a style of calligraphy mounting bracket (6) support arm.

5. The contact type chip bonding apparatus for CPU production according to claim 1, wherein: the rotating seat (5) comprises a heat dissipation case (51), a transmission motor (52) is fixedly mounted in the middle of an inner cavity of the heat dissipation case (51), and a transmission shaft of the transmission motor (52) is fixedly connected with a connecting seat of the linear mounting frame (6).

6. The contact type chip bonding apparatus for CPU production according to claim 1, wherein: the quantity of laser projector (9) is two, two laser projector (9) are installed respectively the outside of second absorption anchor clamps (8) and laser projector (9), and two laser projector (9) with second absorption anchor clamps (8), laser projector (9) are the style of calligraphy and distribute.

7. The contact type chip bonding apparatus for CPU production according to claim 1, wherein: the number of the mapping induction bases (10) is two, the two mapping induction bases (10) are respectively and fixedly installed on the outer sides of the bonding workbench (2) and the chip storage box (3), and the two mapping induction bases (10), the bonding workbench (2) and the chip storage box (3) are distributed in a straight line shape.