CN212840871U - Can be wantonly bent remove encapsulation LED lamp area - Google Patents

Can be wantonly bent remove encapsulation LED lamp area Download PDF

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Publication number
CN212840871U
CN212840871U CN202021797663.8U CN202021797663U CN212840871U CN 212840871 U CN212840871 U CN 212840871U CN 202021797663 U CN202021797663 U CN 202021797663U CN 212840871 U CN212840871 U CN 212840871U
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China
Prior art keywords
led chip
circuit board
flexible circuit
led
heat dissipation
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CN202021797663.8U
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Chinese (zh)
Inventor
吴迪
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Shenzhen Xinshengyuan Optoelectronic Co ltd
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Shenzhen Xinshengyuan Optoelectronic Co ltd
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Priority to CN202021797663.8U priority Critical patent/CN212840871U/en
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Publication of CN212840871U publication Critical patent/CN212840871U/en
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Abstract

The utility model relates to the technical field of lighting, in particular to a de-packaging LED lamp strip capable of being bent at will, which comprises a flexible circuit board and an LED chip, wherein LED chip pads and resistance pads are distributed on the flexible circuit board in a staggered manner, the LED chip pads are welded with the LED chip, and the resistance pads are welded with resistors, so that the resistors are communicated with the circuit of the flexible circuit board, the device is electrified, the LED chip is covered with protective silica gel, the back surface of the flexible circuit board is provided with heat dissipation aluminum gum, the heat dissipation aluminum gum is double-sided aluminum gum, the back surface of the flexible circuit board is provided with a heat dissipation plate, the LED chip is arranged under the LED chip to play a role of protecting the LED chip, and the heat generated during the work of the LED chip is guided into the heat dissipation plate through the flexible circuit board, the utility model saves the packaging link of an LED lamp bead, and forms a protective, the trouble of installing the packaging support is saved, and the blocking of the packaging support to the luminous light is avoided.

Description

Can be wantonly bent remove encapsulation LED lamp area
Technical Field
The utility model relates to the field of lighting technology, the more specifically remove encapsulation LED lamp area that says so can bend wantonly.
Background
The existing LED lamp strip basically adopts a surface-mounted SMDLED lamp bead, and after the LED lamp bead is packaged, the LED lamp bead can shield part of the luminous light of the LED chip due to the fact that the support of the LED lamp bead has a certain height, so that the luminous angle of a product is influenced, and the product effect is limited.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a what bend wantonly goes encapsulation LED lamp area to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a can be bent wantonly go encapsulation LED lamp area, includes flexible circuit board and LED chip, staggered distribution has LED chip pad and resistance pad on the flexible circuit board, and the welding has the LED chip on the LED chip pad, and the welding has resistance on the resistance pad to make the circuit intercommunication of resistance and flexible circuit board, for this device circular telegram, the LED chip coats and is stamped protective silica gel, and protective silica gel is the hemisphere, and flexible circuit board's the back is provided with heat dissipation aluminium gum, flexible circuit board's the back sets up the heating panel, and the LED chip is arranged in under the LED chip, plays the effect of protection LED chip, and the produced heat of LED chip during operation is via the leading-in heating panel of flexible circuit board.
Further: the resistor is a chip resistor.
Further: and positive and negative contact pads are symmetrically arranged at two ends of the flexible circuit board and are used for being connected with an external lead and a power supply.
Further: the heat dissipation plate is located between the flexible circuit board and the heat dissipation aluminum back glue.
Further: the heat dissipation aluminum gum is double-sided aluminum gum, and the middle material of the gum is pure aluminum.
Adopt the technical scheme provided by the utility model, compare with prior art, have following beneficial effect: in the embodiment of the utility model, the utility model provides an in, the utility model discloses saved LED lamp pearl encapsulation link, through set up protective silica gel on the LED chip, formed the silica gel protection body, saved the trouble of installation encapsulation support, avoided the encapsulation support to blockking of light, the lamp pearl that significantly reduces uses quantity and improves the product luminous effect for LED lamp area overall structure is more reasonable, and manufacturing cost is lower, and manufacturing efficiency is higher.
Drawings
Fig. 1 is a schematic structural diagram of a de-encapsulated LED strip that can be bent at will.
The reference numerals in the schematic drawings illustrate: 1-a flexible circuit board; 2-LED chip; 3-resistance; 4-protective silica gel; 5-a heat dissipation plate; 6-heat dissipation aluminum back glue.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention, and the following embodiments are combined to further describe the present invention.
Example 1
Referring to fig. 1, in an embodiment of the present invention, an arbitrarily bendable unpackaged LED light strip includes a flexible circuit board 1 and LED chips 2, where LED chip pads and resistor pads are alternately distributed on the flexible circuit board 1, the LED chips 2 are welded on the LED chip pads, so that the LED chips 2 are in circuit communication with the flexible circuit board 1, resistors 3 are welded on the resistor pads, so that the resistors 3 are in circuit communication with the flexible circuit board 1, the resistors 3 are chip resistors, the resistance of the resistors is adjusted according to current requirements, positive and negative contact pads are symmetrically arranged at two ends of the flexible circuit board 1, the positive and negative contact pads are used for connecting external wires and are connected with a power supply, for the device to be powered on, the LED chips 2 are covered with protective silica gel 4, the protective silica gel 4 is hemispherical, the LED chips 2 are protected by the protective silica gel 4, and blocking of luminescent light by a package support is avoided, the using quantity of lamp beads is greatly reduced, the luminous effect of a product is improved, the cost of a bracket gold thread and the like in the packaging process is avoided, the manufacturing cost is lower, the manufacturing efficiency is higher, the damage of external force to the LED chip 2 is avoided, fluorescent powder is mixed in the protective silica gel 4, and when the LED chip 2 emits light, the white light with different color temperatures is generated by being excited by the fluorescent powder in the protective silica gel 4;
the flexible circuit board 1 is a single-sided or double-sided copper-clad flexible board designed in an S shape or a great wall shape, the back of the flexible circuit board 1 is provided with a heat dissipation aluminum back adhesive 6, the heat dissipation aluminum back adhesive 6 is double-sided aluminum back adhesive, and the middle material of the back adhesive is pure aluminum.
Example 2
In the embodiment of the utility model, the LED lamp strip capable of being bent at will and without package comprises a flexible circuit board 1 and LED chips 2, LED chip pads and resistor pads are distributed on the flexible circuit board 1 in a staggered manner, the LED chips 2 are welded on the LED chip pads, so that the LED chips 2 are communicated with the circuit of the flexible circuit board 1, resistors 3 are welded on the resistor pads, so that the resistors 3 are communicated with the circuit of the flexible circuit board 1, the resistors 3 are chip resistors, the resistance value of the resistors is adjusted according to the current requirement, positive and negative contact pads are symmetrically arranged at two ends of the flexible circuit board 1 and are used for connecting external leads and are connected with a power supply, for the device to be electrified, the LED chips 2 are covered with protective silica gel 4, the protective silica gel 4 is hemispherical, the LED chips 2 are protected by the protective silica gel 4, and the blocking of a package support to the luminous, the using quantity of lamp beads is greatly reduced, the luminous effect of a product is improved, the cost of a bracket gold thread and the like in the packaging process is avoided, the manufacturing cost is lower, the manufacturing efficiency is higher, the damage of external force to the LED chip 2 is avoided, fluorescent powder is mixed in the protective silica gel 4, and when the LED chip 2 emits light, the white light with different color temperatures is generated by being excited by the fluorescent powder in the protective silica gel 4;
the flexible circuit board 1 is the single face of S-shaped or great wall shape design or the two-sided flexbile plate that covers copper, and the back of flexible circuit board 1 is provided with heat dissipation aluminium gum 6, and heat dissipation aluminium gum 6 is two-sided aluminium gum, and the middle material of gum is pure aluminium, the back of flexible circuit board 1 sets up heating panel 5, and heating panel 5 is located between flexible circuit board 1 and heat dissipation aluminium gum 6, and the material of heating panel 5 is aluminium, copper or other metal material, and LED chip 2 is arranged in under LED chip 2, plays the effect of protection LED chip 2, and LED chip 2 during operation produced heat via flexible circuit board 1 leading-in heating panel 5, utilizes heating panel 5 to play radiating effect, and heat dissipation aluminium gum 6 is two-sided aluminium gum, and the middle material of gum is pure aluminium, and supplementary heating panel 5 disperses the heat.
It needs to explain very much, flexible circuit board 1 and LED chip 2 are prior art's application in this application, and protection silica gel, heating panel are the innovation point of this application, and it has effectively solved current LED lamp area and must encapsulate the lamp pearl when the preparation, influence the product and give off light, problem with higher costs.
The present invention and its embodiments have been described above schematically, and the description is not limited thereto, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching of the present invention, without departing from the inventive spirit of the present invention, the person skilled in the art should also design the similar structural modes and embodiments without creativity to the technical solution, and all shall fall within the protection scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (5)

1. A de-encapsulated LED lamp strip capable of being bent at will comprises a flexible circuit board (1) and an LED chip (2), it is characterized in that LED chip bonding pads and resistance bonding pads are distributed on the flexible circuit board (1) in an interlaced manner, LED chips (2) are welded on the LED chip bonding pads, resistors (3) are welded on the resistance bonding pads, thereby the resistor (3) is communicated with the circuit of the flexible circuit board (1), the device is electrified, the LED chip (2) is covered with protective silica gel (4), the back of the flexible circuit board (1) is provided with a heat dissipation aluminum back adhesive (6), the back of flexible circuit board (1) sets up heating panel (5), LED chip (2) are arranged in under LED chip (2), play the effect of protection LED chip (2), and LED chip (2) produced heat is via flexible circuit board (1) leading-in heating panel (5) during operation.
2. The free-bendable de-encapsulation LED strip according to claim 1, wherein the resistor (3) is a chip resistor.
3. The free-folding de-encapsulated LED strip according to claim 2, wherein the flexible circuit board (1) is symmetrically provided with positive and negative contact pads at two ends, and the positive and negative contact pads are used for connecting an external lead and a power supply.
4. The free-bendable de-encapsulated LED strip according to claim 1, wherein the heat dissipation plate (5) is located between the flexible circuit board (1) and the heat dissipation aluminum backing (6).
5. The free-folding de-encapsulated LED strip according to claim 4, wherein the heat-dissipating aluminum back adhesive (6) is a double-sided aluminum back adhesive, and the middle material of the back adhesive is pure aluminum.
CN202021797663.8U 2020-08-25 2020-08-25 Can be wantonly bent remove encapsulation LED lamp area Active CN212840871U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021797663.8U CN212840871U (en) 2020-08-25 2020-08-25 Can be wantonly bent remove encapsulation LED lamp area

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021797663.8U CN212840871U (en) 2020-08-25 2020-08-25 Can be wantonly bent remove encapsulation LED lamp area

Publications (1)

Publication Number Publication Date
CN212840871U true CN212840871U (en) 2021-03-30

Family

ID=75141069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021797663.8U Active CN212840871U (en) 2020-08-25 2020-08-25 Can be wantonly bent remove encapsulation LED lamp area

Country Status (1)

Country Link
CN (1) CN212840871U (en)

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