CN212812500U - Electronic component radiator with dustproof structure - Google Patents
Electronic component radiator with dustproof structure Download PDFInfo
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- CN212812500U CN212812500U CN202021921789.1U CN202021921789U CN212812500U CN 212812500 U CN212812500 U CN 212812500U CN 202021921789 U CN202021921789 U CN 202021921789U CN 212812500 U CN212812500 U CN 212812500U
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Abstract
The utility model discloses an electronic component radiator with dustproof construction, including base and heat dissipation casing, the base is inside to be fixed with the baffle, and is provided with the fixed block on the left of the baffle, settle in the fixed block left side has the spring, and the spring left end is connected with splint, the splint outer wall is fixed with the plectrum, the trench has been seted up to the base surface, the heat dissipation casing is settled in the base upper surface. This electronic component radiator with dustproof construction is provided with the connection casing, it passes through to constitute fixed connection between screw and the heat dissipation casing to connect the casing, the later stage of being convenient for is maintained the change through unscrewing the screw to the inside component of its heat dissipation casing, and connect the inside radiator fan that is provided with of casing, can effectively carry out further forced air cooling to the heat dissipation aluminum sheet and handle, the radiating effect of whole radiator has been improved greatly, and it is provided with the protection network to connect the casing upper surface, the convenience is carried out the separation to external dust and is prevented that it from causing the interference in getting into the radiator.
Description
Technical Field
The utility model relates to an electronic component radiator technical field specifically is an electronic component radiator with dustproof construction.
Background
Electronic components are the basis for forming electronic products, and commonly used electronic components are: along with the improvement of circuit integration technology, the size of electronic components is smaller and the power consumption is larger and larger, so that the heat dissipation problem is more and more serious, and the electronic component radiator with good heat dissipation performance is particularly important.
At present, the heat dissipation mode of electronic components on the market is mainly air cooling, but the air cooling heat dissipation efficiency is low, the internal dustproof effect is not ideal, and the heat dissipation treatment of high-power electronic components cannot be met.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic component radiator with dustproof construction to provide general novel electronic component radiator in solving above-mentioned background art, its radiating mode mainly is the forced air cooling, but the forced air cooling radiating efficiency is lower, and inside dustproof effect is not ideal, can't satisfy the problem of high-power electronic component's heat dissipation processing.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic component radiator with dustproof construction, includes base and heat dissipation casing, the base is inside to be fixed with the baffle, and is provided with the fixed block on the left of the baffle, settle in the fixed block left side has the spring, and the spring left end is connected with splint, the splint outer wall is fixed with the plectrum, the trench has been seted up to the base surface, the heat dissipation casing settles in the base upper surface, and the inside heat dissipation aluminum sheet that is fixed with of heat dissipation casing, heat dissipation aluminum sheet outer wall is fixed with the copper pipe, and the copper pipe outer end is connected with the water pipe, heat dissipation casing outer wall is fixed with first fixture block, the base upper surface is provided with the pivot, and pivot outer wall is connected with the second fixture block, settle heat dissipation casing top has the connection casing, and connects the.
Preferably, the partition plate and the base are vertically distributed, and a welding integrated structure is formed between the partition plate and the fixing block.
Preferably, be swing joint between splint and the base, and splint pass through to constitute elastic construction between spring and the fixed block.
Preferably, the trench is symmetrical about the vertical center line of base and is provided with four.
Preferably, the inner surface of the heat dissipation shell is uniformly distributed with heat dissipation aluminum sheets, and the heat dissipation aluminum sheets and the heat dissipation shell are vertically distributed.
Preferably, a welding integrated structure is formed between the copper pipe and the heat dissipation aluminum sheet, and the outer surface of the copper pipe is tightly attached to the outer surface of the heat dissipation aluminum sheet.
Preferably, the heat dissipation shell forms a fixed structure through the first fixture block and the second fixture block, and the second fixture block forms a rotating structure through the rotating shaft and the base.
Preferably, the connecting shell is fixedly connected with the heat dissipation shell, and the vertical center line of the connecting shell coincides with the vertical center line of the heat dissipation fan.
Compared with the prior art, the beneficial effects of the utility model are that: the novel electronic element radiator with the dustproof structure is provided with a clamping plate, the clamping plate is movably connected with a base, a shifting sheet is fixed on the outer wall of the clamping plate, the shifting sheet is convenient to shift so that the clamping plate can slide towards the inside of the base, a groove is formed in the outer surface of the base, the size of an opening of the groove can be effectively increased through the sliding clamping plate, semiconductor radiating fins of different specifications can be placed in the groove, because the clamping plate forms an elastic structure with a fixed block through a spring, the clamping plate can elastically clamp the semiconductor radiating fins in the groove through the spring so as to ensure the stability of the semiconductor radiating fins during heat radiation, four groove positions are arranged, different numbers of semiconductor radiating fins can be placed according to the heat radiation requirement of an electronic element for heat radiation treatment, the semiconductor radiating fins mainly utilize the Peltier effect of a semiconductor material, when direct current passes through a galvanic couple formed by connecting two, the two ends of the couple can respectively absorb heat and emit heat, thereby realizing the purpose of refrigeration;
the novel electronic element radiator with the dustproof structure is provided with radiating aluminum sheets, the radiating aluminum sheets are uniformly distributed on the inner surface of the radiating shell, the radiating aluminum sheets and the radiating shell are vertically distributed, the radiating aluminum sheets can effectively conduct heat to the attached semiconductor radiating fins, a welding integrated structure is formed between the copper pipe and the radiating aluminum sheets, the outer surface of the copper pipe is closely attached to the outer surface of the radiating aluminum sheets, a water source is conveniently led into the copper pipe through a water pipe, and therefore heat conducted by the radiating aluminum sheets is absorbed, the water cooling effect of the radiator is achieved, and the radiating effect of the radiating aluminum sheets is improved;
this novel electronic component radiator with dustproof construction is provided with the connection casing, it passes through to be connected the casing and constitutes fixed connection between screw and the heat dissipation casing, the later stage of being convenient for is maintained the change through unscrewing the screw to the inside component of its heat dissipation casing, and connect the inside radiator fan that is provided with of casing, can effectively carry out further forced air cooling to the heat dissipation aluminum sheet and handle, the radiating effect of whole radiator has been improved greatly, and it is provided with the protection network to connect the casing upper surface, the convenience is carried out the separation to external dust and is prevented that it from causing the interference in getting into the radiator.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of the copper tube structure of the present invention;
fig. 4 is a schematic structural view of the base portion of the present invention.
In the figure: 1. a base; 2. a partition plate; 3. a fixed block; 4. a spring; 5. a splint; 6. a shifting sheet; 7. a slot position; 8. a heat dissipating housing; 9. radiating aluminum sheets; 10. a copper pipe; 11. a water pipe; 12. a first clamping block; 13. a rotating shaft; 14. a second fixture block; 15. connecting the shell; 16. a heat radiation fan; 17. and (4) a protective net.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a kind of electronic component heat sink with dustproof structure, including the base 1 is fixed with the baffle 2 inside, and there are fixed blocks 3 on the left of the baffle 2, present the vertical distribution between base 1 and the baffle 2, and form the welding integrated structure between fixed block 3 and the baffle 2, because form the welding integrated structure between fixed block 3 and the baffle 2, the area of base 1 inside of the convenient separation, thus can meet the installation treatment of a plurality of semiconductor air-cooling fins;
the spring 4 is arranged on the left side of the fixed block 3, the clamp plate 5 is connected at the left end of the spring 4, the shifting piece 6 is fixed on the outer wall of the clamp plate 5, the groove 7 is formed in the outer surface of the base 1, the groove 7 is symmetrically distributed about the vertical central line of the base 1, four groove 7 are arranged, the clamp plate 5 is movably connected with the base 1, the clamp plate 5 forms an elastic structure with the fixed block 3 through the spring 4, the shifting piece 6 is fixed on the outer wall of the clamp plate 5, the clamp plate 5 can conveniently slide towards the inside of the base 1 through shifting the shifting piece 6, the groove 7 is formed in the outer surface of the base 1, the opening size of the groove 7 can be effectively increased through the sliding clamp plate 5, semiconductor cooling fins with different specifications can be placed in the groove 7, the elastic structure is formed between the clamp plate 5 and the fixed block 3 through the spring 4, and the clamp plate 5 can conveniently and elastically clamp the semiconductor cooling fins in the groove 7 through, the four slots 7 can be used for placing different numbers of semiconductor cooling fins for heat dissipation treatment according to the heat dissipation requirements of electronic elements, the semiconductor cooling fins mainly utilize the Peltier effect of semiconductor materials, and when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the aim of refrigeration is fulfilled;
the heat dissipation shell 8 is arranged on the upper surface of the base 1, a heat dissipation aluminum sheet 9 is fixed inside the heat dissipation shell 8, a copper pipe 10 is fixed on the outer wall of the heat dissipation aluminum sheet 9, the outer end of the copper pipe 10 is connected with a water pipe 11, the heat dissipation aluminum sheets 9 are uniformly distributed on the inner surface of the heat dissipation shell 8, the heat dissipation aluminum sheets 9 and the heat dissipation shell 8 are vertically distributed, a welding integrated structure is formed between the copper pipe 10 and the heat dissipation aluminum sheets 9, the outer surface of the copper pipe 10 is tightly attached to the outer surface of the heat dissipation aluminum sheets 9, the heat dissipation aluminum sheets 9 and the heat dissipation shell 8 are vertically distributed, the heat dissipation aluminum sheets 9 can effectively conduct heat to the attached semiconductor cooling fins, a welding integrated structure is formed between the copper pipe 10 and the heat dissipation aluminum sheets 9, the outer surface of the copper pipe 10 is tightly attached to the outer surface of the, thereby absorbing the heat conducted by the radiating aluminum sheet 9, achieving the water cooling effect and improving the radiating effect of the radiating aluminum sheet 9;
a first clamping block 12 is fixed on the outer wall of the heat dissipation shell 8, a rotating shaft 13 is arranged on the upper surface of the base 1, a second clamping block 14 is connected to the outer wall of the rotating shaft 13, the heat dissipation shell 8 forms a fixed structure through the first clamping block 12 and the second clamping block 14, and a rotating structure is formed through the rotating shaft 13 and the base 1, and the heat dissipation shell 8 forms a fixed structure through the first clamping block 12 and the second clamping block 14, and the second clamping block 14 forms a rotating structure through the rotating shaft 13 and the base 1, so that the heat dissipation shell is favorably and fixedly connected with the first clamping block 12 on the outer wall of the heat dissipation shell 8 through rotating the second clamping block 14;
the connection shell 15 is arranged above the heat dissipation shell 8, the heat dissipation fan 16 is arranged inside the connection shell 15, the protective net 17 is arranged on the upper surface of the connection shell 15, the connection shell 15 is fixedly connected with the heat dissipation shell 8, the vertical central line of the connection shell 15 coincides with the vertical central line of the heat dissipation fan 16, the connection shell 15 is fixedly connected with the heat dissipation shell 8 through screws, elements inside the heat dissipation shell 8 can be maintained and replaced conveniently by unscrewing the screws in the later stage, the heat dissipation fan 16 is arranged inside the connection shell 15, further air cooling treatment can be effectively carried out on heat dissipation aluminum sheets 9, the heat dissipation effect of the whole heat sink is greatly improved, the protective net 17 is arranged on the upper surface of the connection shell 15, and external dust is conveniently blocked to prevent the external dust from entering the heat sink to cause interference.
The working principle is as follows: when the electronic element radiator with the dustproof structure is used, firstly, the clamping plate 5 is movably connected with the base 1, the shifting sheet 6 is fixed on the outer wall of the clamping plate 5, the shifting sheet 6 is convenient to shift, so that the clamping plate 5 slides towards the inside of the base 1, the groove position 7 is formed in the outer surface of the base 1, the opening size of the groove position 7 can be effectively increased by the sliding clamping plate 5, semiconductor radiating fins with different specifications can be placed in the groove position 7, the clamping plate 5 forms an elastic structure through the spring 4 and the fixing block 3, the semiconductor radiating fins in the groove position 7 can be elastically clamped through the spring 4 conveniently by the clamping plate 5, so that the stability of the semiconductor radiating fins during heat radiation is ensured, the four groove positions 7 are arranged, different numbers of semiconductor radiating fins can be placed according to the heat radiation requirement of the electronic element for heat radiation treatment, and the semiconductor radiating fins mainly utilize the Peltier, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively to achieve the purpose of refrigeration, then heat dissipation aluminum sheets 9 are uniformly distributed on the inner surface of a heat dissipation shell 8, the heat dissipation aluminum sheets 9 and the heat dissipation shell 8 are vertically distributed, the heat dissipation aluminum sheets 9 can effectively conduct heat to the attached semiconductor heat dissipation fins, a welding integrated structure is formed between a copper pipe 10 and the heat dissipation aluminum sheets 9, the outer surface of the copper pipe 10 is tightly attached to the outer surface of the heat dissipation aluminum sheets 9, a water source is conveniently led into the copper pipe 10 through a water pipe 11, so that the heat conducted by the heat dissipation aluminum sheets 9 is absorbed, the water cooling effect is achieved, the heat dissipation effect of the heat dissipation aluminum sheets 9 is improved, then a fixed structure is formed between a first fixture block 12 and a second fixture block 14 of the heat dissipation shell 8, and a rotating structure is formed between the second, the heat dissipation structure is beneficial to being fixedly connected with the first clamping block 12 on the outer wall of the heat dissipation shell 8 by rotating the second clamping block 14, at last, the connecting shell 15 is fixedly connected with the heat dissipation shell 8 through screws, the elements inside the heat dissipation shell 8 can be maintained and replaced conveniently by unscrewing the screws in the later stage, the heat dissipation fan 16 is arranged inside the connecting shell 15, the heat dissipation aluminum sheet 9 can be effectively subjected to further air cooling treatment, the heat dissipation effect of the whole heat dissipation device is greatly improved, the protective screen 17 is arranged on the upper surface of the connecting shell 15, and external dust can be conveniently blocked to prevent the external dust from entering the heat dissipation device to cause interference.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides an electronic component radiator with dustproof construction, includes base (1) and heat dissipation casing (8), its characterized in that: the heat dissipation device is characterized in that a partition plate (2) is fixed inside the base (1), a fixed block (3) is arranged on the left side of the partition plate (2), a spring (4) is arranged on the left side of the fixed block (3), the left end of the spring (4) is connected with a clamping plate (5), a shifting sheet (6) is fixed on the outer wall of the clamping plate (5), a groove (7) is formed in the outer surface of the base (1), the heat dissipation shell (8) is arranged on the upper surface of the base (1), a heat dissipation aluminum sheet (9) is fixed inside the heat dissipation shell (8), a copper pipe (10) is fixed on the outer wall of the heat dissipation aluminum sheet (9), a water pipe (11) is connected to the outer end of the copper pipe (10), a first clamping block (12) is fixed on the outer wall of the heat dissipation shell (8), a rotating shaft (13) is arranged on the upper surface of the base (1, and a cooling fan (16) is arranged in the connecting shell (15), and a protective net (17) is arranged on the upper surface of the connecting shell (15).
2. The electronic component heat sink with a dustproof structure according to claim 1, wherein: the partition plate (2) and the base (1) are vertically distributed, and a welding integrated structure is formed between the partition plate (2) and the fixing block (3).
3. The electronic component heat sink with a dustproof structure according to claim 1, wherein: the clamping plate (5) is movably connected with the base (1), and the clamping plate (5) forms an elastic structure with the fixing block (3) through the spring (4).
4. The electronic component heat sink with a dustproof structure according to claim 1, wherein: the trench (7) is symmetrically distributed about the vertical center line of the base (1), and four trenches (7) are arranged.
5. The electronic component heat sink with a dustproof structure according to claim 1, wherein: the inner surface of the heat dissipation shell (8) is uniformly distributed with heat dissipation aluminum sheets (9), and the heat dissipation aluminum sheets (9) and the heat dissipation shell (8) are vertically distributed.
6. The electronic component heat sink with a dustproof structure according to claim 1, wherein: and a welding integrated structure is formed between the copper pipe (10) and the heat dissipation aluminum sheet (9), and the outer surface of the copper pipe (10) is tightly attached to the outer surface of the heat dissipation aluminum sheet (9).
7. The electronic component heat sink with a dustproof structure according to claim 1, wherein: the heat dissipation shell (8) forms a fixed structure through the first clamping block (12) and the second clamping block (14), and the second clamping block (14) forms a rotating structure through the rotating shaft (13) and the base (1).
8. The electronic component heat sink with a dustproof structure according to claim 1, wherein: the connecting shell (15) is fixedly connected with the heat dissipation shell (8), and the vertical center line of the connecting shell (15) is coincided with the vertical center line of the heat dissipation fan (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021921789.1U CN212812500U (en) | 2020-09-04 | 2020-09-04 | Electronic component radiator with dustproof structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021921789.1U CN212812500U (en) | 2020-09-04 | 2020-09-04 | Electronic component radiator with dustproof structure |
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| Publication Number | Publication Date |
|---|---|
| CN212812500U true CN212812500U (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021921789.1U Active CN212812500U (en) | 2020-09-04 | 2020-09-04 | Electronic component radiator with dustproof structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114259810A (en) * | 2021-11-09 | 2022-04-01 | 新沂市锡沂高新材料产业技术研究院有限公司 | Intelligent tail gas separation purifier of environmental protection |
-
2020
- 2020-09-04 CN CN202021921789.1U patent/CN212812500U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114259810A (en) * | 2021-11-09 | 2022-04-01 | 新沂市锡沂高新材料产业技术研究院有限公司 | Intelligent tail gas separation purifier of environmental protection |
| CN114259810B (en) * | 2021-11-09 | 2023-05-05 | 新沂市锡沂高新材料产业技术研究院有限公司 | Environment-friendly intelligent tail gas separation and purification device |
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