CN220896537U - Inverter power supply heat dissipation mechanism - Google Patents
Inverter power supply heat dissipation mechanism Download PDFInfo
- Publication number
- CN220896537U CN220896537U CN202322549920.6U CN202322549920U CN220896537U CN 220896537 U CN220896537 U CN 220896537U CN 202322549920 U CN202322549920 U CN 202322549920U CN 220896537 U CN220896537 U CN 220896537U
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- heat dissipation
- power supply
- inverter power
- plate
- water cooling
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims 3
- 239000002826 coolant Substances 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 abstract description 4
- 239000003570 air Substances 0.000 description 22
- 230000000694 effects Effects 0.000 description 6
- 239000012080 ambient air Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Abstract
The application discloses an inverter power supply heat dissipation mechanism, and belongs to the technical field of power supply heat dissipation. The cooling rack is clamped on the inverter power supply, one side of the cooling rack is provided with a fan assembly, the cooling rack comprises a mounting plate, the inner side of the mounting plate is provided with a through groove penetrating through the mounting plate, and air flow blown out by the fan assembly dissipates heat of the inverter power supply through the through groove; the water cooling plate is arranged in the through groove, the inside of the water cooling plate is hollow, cooling liquid is poured into the water cooling plate, and air holes are formed in the water cooling plate. According to the inverter power supply heat dissipation mechanism, the water cooling plate is arranged, so that the device combines the modes of air cooling heat dissipation and liquid cooling heat dissipation, the temperature of a power supply is effectively reduced, and the problem that the traditional heat dissipation mechanism is only provided with air cooling and can not effectively dissipate heat of the power supply under the condition of high outdoor temperature is solved.
Description
Technical Field
The application relates to the technical field of power supply heat dissipation, in particular to an inverter power supply heat dissipation mechanism.
Background
An inverter power supply is a device that converts direct current into alternating current. It is generally composed of a rectifier, a filter, an inverter, a control circuit, and the like. The main function of the inverter is to convert a direct-current power source (such as a battery, a solar battery and the like) into an alternating-current power source so as to supply the alternating-current equipment. It can produce certain heat in the course of the work, in order to ensure stability and the life-span of power, need dispel the heat to inverter power through heat dissipation mechanism, guarantee the normal work of power.
The invention patent with publication number CN110475462A specifically discloses a heat radiation structure of a power supply, which is characterized in that a coaming is arranged on the upper surface of a cover plate, a protective cover net is fixed at the opening end of the coaming, an exhaust fan is arranged in an area surrounded by the coaming, the protective cover net and the cover plate, and the design of an air inlet duct, an air vent and the exhaust fan is used for realizing rapid and effective heat radiation of the power supply in the use process and solving the problem of difficult heat radiation of the existing power supply.
In the above-mentioned patent publication, the heat dissipation structure blows ambient air to the power supply through the fan to take away heat generated by the power supply, however, the conventional air-cooled heat dissipation structure has some problems, for example, the requirement on environment is high, the circulation of ambient air and the sufficiency of space need to be ensured, if the ambient temperature is too high or the space is narrow, the power supply may not be effectively dissipated, and the working effect and the service life of the power supply are affected;
Secondly, the heat dissipation effect of air cooling is limited by the performance of the fan, and may not meet the heat dissipation requirement of some high-power inverter power supplies, so it is necessary to provide an inverter power supply heat dissipation mechanism for overlapping liquid cooling and air cooling to solve the above problems.
It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and, therefore, it may contain information that does not constitute prior art.
Disclosure of Invention
Based on the above problems existing in the prior art, the present application aims to solve the problems: the utility model provides an inverter power supply cooling mechanism, solves traditional cooling mechanism and only is provided with the forced air cooling, the problem that the heat dissipation to the power can not be effectual under the higher circumstances of outdoor temperature.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides an inverter power supply cooling mechanism, includes the heat dissipation frame, this heat dissipation frame centre gripping is on inverter power supply, one side of heat dissipation frame is provided with the fan subassembly, the heat dissipation frame includes the mounting panel, the inboard of mounting panel is provided with the logical groove that runs through the mounting panel, the air current that the fan subassembly blows out dispels the heat to inverter power supply through logical groove; the water cooling plate is arranged in the through groove, the inside of the water cooling plate is hollow, cooling liquid is poured into the water cooling plate, and air holes are formed in the water cooling plate.
Further, water inlets and water outlets penetrating through the mounting plate are formed in two sides of the water cooling plate.
Further, the both sides of mounting panel are provided with the grip block, one side of grip block is provided with the inserted bar, the mounting panel is close to one side of inserted bar is provided with the through-hole, the through-hole with the size looks adaptation of inserted bar makes the inserted bar is suitable for to slide in the through-hole.
Further, the outside of inserted bar has cup jointed the spring, the one end fixed mounting of spring is on the mounting panel, keeps away from the one end fixed mounting of mounting panel is on the grip block.
Further, a filter screen is detachably arranged on one side, close to the fan group, of the through groove.
The beneficial effects of the application are as follows: according to the inverter power supply heat dissipation mechanism, the water cooling plates are arranged, so that the device combines the modes of air cooling heat dissipation and liquid cooling heat dissipation, the temperature of a power supply is effectively reduced, and the problem that the traditional heat dissipation mechanism is only provided with air cooling and can not effectively dissipate heat of the power supply under the condition of high outdoor temperature is solved.
In addition to the objects, features and advantages described above, the present application has other objects, features and advantages. The present application will be described in further detail with reference to the drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
In the drawings:
Fig. 1 is an overall schematic diagram of a heat dissipation mechanism for an inverter power supply according to the present application;
FIG. 2 is an enlarged schematic view of FIG. 1 at A;
FIG. 3 is a schematic diagram of a back structure of the heat dissipating mechanism of FIG. 1;
Wherein, each reference sign in the figure:
1. A heat dissipation frame; 2. a mounting plate; 21. a clamping plate; 211. a rod; 212. a spring; 22. a through groove; 3. a fan set; 4. a water cooling plate; 41. a water inlet; 42. a water outlet; 5. and (5) a filter screen.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
As shown in fig. 1-2, the application provides a heat dissipation mechanism of an inverter power supply, which comprises a heat dissipation frame 1, wherein the heat dissipation frame 1 is clamped on the inverter power supply, and meanwhile, a fan group 3 is installed on the back of the heat dissipation frame 1, and the fan group 3 is used for continuously blowing air to the inverter power supply so as to achieve the purpose of heat dissipation.
The heat dissipation frame 1 comprises a mounting plate 2, wherein clamping plates 21 are arranged on two sides of the mounting plate 2, an inserting rod 211 is arranged on one side of the clamping plates 21, a plurality of groups of through holes are formed on one side, close to the inserting rod 211, of the mounting plate 2, and the through holes are matched with the inserting rod 211 in size, so that the inserting rod 211 is suitable for sliding in the through holes;
Meanwhile, the protruding block is arranged at one end, close to the through hole, of the inserted bar 211, the size of the protruding block is larger than that of the opening of the through hole, so that the inserted bar 211 is blocked when sliding to the opening of the through hole, and further the inserted bar 211 cannot slide from the through hole during sliding, and reliability of the device is improved.
Meanwhile, the spring 212 is sleeved outside the inserted link 211, one end of the spring 212 is fixedly arranged on the mounting plate 2, the other end of the spring 212 is fixedly arranged on the clamping plate 21, the clamping plate 21 can clamp power supplies of different sizes through sliding of the inserted link 211, and the design can enable the heat dissipation frame 1 to be adaptively adjusted according to the size of the power supply, so that the power supply can be well fixed and dissipated.
Simultaneously, two groups of through grooves 22 are formed in the inner side of the mounting plate 2, air flow emitted by the fan group 3 flows to a power supply through the through grooves 22, meanwhile, water cooling plates 4 are fixedly arranged in the two groups of through grooves 22, and the two groups of water cooling plates 4 are communicated with each other;
The water cooling plates 4 are hollow and filled with cooling liquid, one side of one water cooling plate 4 is provided with a water inlet 41 penetrating through the mounting plate 2, the water inlet 41 is connected with an external water inlet pipeline, one side of the other water cooling plate 4 is provided with a water outlet 42, the water outlet 42 is connected with an external water outlet pipeline, and the cooling water inside the water cooling plates 4 circularly flows through the arrangement of the water inlet 41 and the water outlet 42;
In the application, a condenser (not shown in the figure) can be arranged on a pipeline for circulating cooling water so as to keep the temperature of the cooling water, thereby enabling the cooling effect of the power supply to be better;
Meanwhile, the water cooling plate 4 is provided with a plurality of groups of air holes, air flow emitted by the fan group 3 flows through the water cooling plate 4 and is blown to the power supply through the air holes, so that the cooling effect is better, and the design combines the modes of air cooling heat dissipation and liquid cooling heat dissipation, so that even if the temperature of the outside air is higher, the air can be cooled through the water cooling plate 4, the heat dissipation effect is improved, the power supply can better dissipate heat, and the normal working temperature is kept;
Through the circulation flow of the cooling liquid, the air flow blown out by the fan group 3 can effectively absorb and take away the heat generated by the power supply, thereby enabling the power supply to ensure stability and reliability under high load and long-term use.
As shown in fig. 3, a filter screen 5 is detachably installed outside the through groove 22 at one side of the mounting plate 2 near the fan set 3, and the filter screen 5 is used for preventing sundries from entering the water cooling plate 4;
In the process of radiating the inverter power source, the fan set 3 sucks ambient air and blows the air to the power source through the through groove 22, however, sundries such as dust, fine particles and the like may exist in the ambient air, if the sundries enter the through groove 22, the sundries may adhere to the water cooling plate 4 to block air flow and influence radiating effect, therefore, the sundries can be effectively blocked from entering the radiating frame 1 by installing the filter screen 5 outside the radiating frame 1, so that the radiating frame 1 is kept clean, meanwhile, the filter screen 5 can be conveniently cleaned and replaced, and long-term stable operation of the radiating frame 1 is kept.
In summary, the heat dissipation frame 1 can be clamped on power supplies with different sizes by the arrangement of the clamping plates 21, so that the flexibility of the device is improved, meanwhile, by the arrangement of the water cooling plates 4, the temperature of the power supply is effectively reduced by combining an air cooling heat dissipation mode and a liquid cooling heat dissipation mode, and the design ensures that even if the external environment temperature is higher, the air can be cooled by the water cooling plates, so that the heat dissipation effect is improved, and the normal working temperature of the power supply is kept.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (5)
1. The utility model provides an inverter power supply cooling mechanism, includes heat dissipation frame (1), and this heat dissipation frame (1) centre gripping is on inverter power supply, one side of heat dissipation frame (1) is provided with fan group (3), its characterized in that: the heat dissipation frame (1) comprises:
The fan assembly comprises an installation plate (2), wherein a through groove (22) penetrating through the installation plate (2) is formed in the inner side of the installation plate (2), and air flow blown out by the fan assembly (3) dissipates heat of an inverter power supply through the through groove (22);
The water cooling plate (4), water cooling plate (4) set up in logical inslot (22), the inside of water cooling plate (4) is hollow to pour into there is the coolant liquid therein, be provided with the gas pocket on water cooling plate (4).
2. The inverter power dissipation mechanism as defined in claim 1 wherein: the water cooling plate (4) is provided with a water inlet (41) and a water outlet (42) which penetrate through the mounting plate (2) on two sides.
3. The inverter power dissipation mechanism as defined in claim 1 wherein: clamping plates (21) are arranged on two sides of the mounting plate (2), a plug rod (211) is arranged on one side of the clamping plates (21), the mounting plate (2) is provided with a through hole at one side close to the inserted link (211), and the through hole is matched with the size of the inserted link (211) so that the inserted link (211) is suitable for sliding in the through hole.
4. An inverter power source heat dissipation mechanism as defined in claim 3 wherein: the outside of inserted bar (211) has cup jointed spring (212), the one end fixed mounting of spring (212) is on mounting panel (2), is kept away from the one end fixed mounting of mounting panel (2) is on grip block (21).
5. The inverter power dissipation mechanism as defined in claim 1 wherein: a filter screen (5) is detachably arranged on one side, close to the fan group (3), of the through groove (22).
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220896537U true CN220896537U (en) | 2024-05-03 |
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| GR01 | Patent grant |